TW200537215A - Micro-display module for decreasing stress - Google Patents

Abstract

A micro-display module for decreasing stress comprises a display panel and a module substrate. The display panel comprises a silicon chip and a glass substrate with a transparent electrode layer. The glass substrate of the display panel has a sidewall next to the silicon chip. The module substrate has a compound area. A sealing compound and a buffer compound is formed on the compound area for covering a plurality of bonding pads, a plurality of connecting pads and a plurality of bonding wires. The buffer compound is formed between the sealing compound and the sidewall of the glass substrate for decreasing the sealing compound causing stress on the display panel. The buffer compound is also fixed easily and doesn't drain away.

Description

200537215 V. Description of the invention (1) " " '-[Technical field to which the invention belongs] The present invention relates to a miniature display module, and particularly to a miniature display module for reducing stress. [Prior art] A silicon Republic of China Patent Bulletin No. 50 596 5 "LC0S backplane junction reveals a kind of convention! ^^ Cell chamber (LC0s panel), which contains the chip 'The silicon A transparent glass substrate is arranged on the wafer, and a liquid crystal layer is formed between the glass substrate and the silicon wafer. The conventional LC0S cell is obviously unable to be directly mounted on the projection display. It should be assembled into an LC0S micro display module first. In order to ensure the protection, thermal and flatness of the LC0s cell, the LC0S cell and a module substrate in the LCOS micro display module often have different thermal expansion coefficients due to their own coefficients, or used to seal multiple After curing, one of the fresh lines of dielectric thermosetting adhesive may cause stress to the LCOS cell due to its shrinkage, resulting in a change in the thickness of the liquid crystal layer and improper dry light radiation, resulting in Newton ring defects. , Republic of China Patent Bulletin No. 549571 "LC0S (Liquid Crystal Silicon Substrate) Miniature Display Module for Reducing Stress Gradient" is a type of viscous crystal that reduces the stress gradient of LCOS panel. For colloidal applications, a viscose glue system is used to bond an LCOS cell to a module substrate. The viscose glue system is dot-bonded at the center or periphery of the bottom surface of the module substrate, and the area covered by the viscous gel Must be less than 25% of the bottom area of the module substrate, preferably less than 10% of the bottom area, to improve the difference in thermal expansion coefficient between the LCOS cell and the module substrate and reduce the LCOS cell Stress gradient to avoid Newton's ring phenomenon, but it still cannot improve the sealing of multiple welding wires.

Page 7 Therefore, it is still possible to produce Newton 200537215 V. Description of the invention (2) One of the plastic materials produces a stress ring phenomenon on the LCOS cell. At present, a miniature display module is sealed in a plastic compound, which can be distinguished according to the hardness characteristics after curing. If the hard glue is used to seal the bonding wires, the hard wires are contracted and the hard glue shrinks after a large stress. There is a Newton's ring phenomenon; however, if the hardness of the soft rubber after curing is insufficient, it may not be possible and the viscosity of the soft rubber is thinner than that of the hard rubber, which is not easy to determine. Therefore, the soft rubber in the manufacturing process of the micro display module is Not enough to meet demand. [Summary of the invention] The main purpose of the present invention is to provide a display module, which is filled with a buffer glue and a sealed area, wherein the buffer glue fills between a side of a glass substrate of a panel To reduce the stress on the display panel, to avoid the second object of the present invention is to provide a display module 'which is coated with a buffer glue and a seal on an adhesive area, wherein the sealant is a covering pad The characteristics of the module substrate's multiple connection pads and the sealant are harder than the buffer rubber after curing to protect it. Another object of the present invention is to provide one of several bonding wires used as a hard glue and a soft glue. After the hard glue is cured, it is easy to be torn off and will produce a glue to seal a glass substrate. The welding wires are effectively protected. The welding wires, the application range of the soft glue, the use of the hard glue alone is a kind of reducing the glue covering, the sealing is reducing the dense Newton ring, and the reducing glue covering is reduced on a stone substrate. The force micro-display module module adhesive and a display sealant are generated after curing. Force micro display A module substrate with a plurality of welding ·, using the protection of these dense bonding wires to reduce the stress of the micro display

Page 8 200537215 V. Description of the invention (3) No 2 module 'It is covered with a buffer glue and a sealant on the glue coating area of a module substrate, and the sealant is used to cover the periphery of the glue coating area. In order to form a wall, the buffer glue is filled in between to protect a plurality of bonding wires and keep the buffer glue in the glue coating area without overflowing the glue coating area. According to the present invention, a stress-reducing miniature display module includes a display panel, a module substrate, a sealant, and a buffer adhesive. The display panel includes a silicon wafer and a glass substrate. The wafer system has an upper dislocation portion which does not overlap the glass substrate. The upper dislocation portion ^ is formed with a plurality of solder pads. The glass substrate system has a side surface adjacent to the upper dislocation portion. The module substrate system has an adhesive coating. Area, a plurality of connection pads are formed in the glue coating area, and a plurality of bonding wires are electrically connected to the pads of the silicon wafer. The sealant and the buffer rubber cover the glue coating area, and the sealant To cover the bonding pads, the connection pads and the bonding wires, the buffer rubber is formed between the sealant and the side of the glass substrate, and preferably, it further includes a cover for bonding The module substrate. [Embodiment] Referring to the drawings, the present invention will enumerate the following embodiments: According to the first specific embodiment of the present invention, please refer to FIG. 1, a miniature display module 10 for reducing stress 0, which includes a display panel Π 0 and a module substrate 120. The display panel 11 〇 may be an LC0s φ (Liquid Crystal On Silicon) panel, which includes a Shi Xi wafer 111, a glass The substrate 11 2 and a liquid crystal 1 1 3 between the silicon wafer 1} 1 and the glass substrate Π 2 are shown in FIG. 2 and FIG. 3. The Shixi wafer 1 11 has a glass substrate 11 2 Overlap dislocation 11 4

Page 9 200537215 V. Description of the invention (4) ------- A plurality of solder pads 115 are formed in the U4 system of the position portion. In addition, a plurality of integrated circuit elements (not shown) are formed on the silicon. In the overlapping portion of the wafer U1 and the glass substrate ι2, the bonding pads 115 are electrically connected to the integrated circuit components, and the glass substrate 1 1 2 has an upper surface 丨 6 and an adjoining upper dislocation 114 The side surface 117 and a lower dislocation portion 118 that does not overlap the silicon wafer U1. The lower dislocation portion 118 is covered with a transparent electrode layer 119, such as an ITO conductive film (indium tin oxide, indium tin oxide), and the module substrate 12 〇 has a plurality of lines 121 and a glue-coated area 122, the end of the lines 121 is formed with at least one solder bump 123, a plurality of connection pads 124 are formed in the glue-coated area 1 22, using a The viscous colloid 1 3 1 bonds the display panel 丨 丨 〇 and the module substrate 1 2 0, and electrically connects the connection pads 124 of the module substrate 120 and the stone chip ill with a plurality of bonding wires 1 3 2 The solder pads 115 and a sealant 14 1 are formed on the glue coating area 1 22 of the module substrate 1 20 and covered. The bonding pads 11 of the Shi Xi chip 11 1, the connection pads 124 and the bonding wires 132 of the module substrate 120, and the bonding pads 123 of the module substrate 120 are passed through a conductive adhesive. 1 3 3 The transparent electrode layer 119 electrically connected to the glass substrate 11 2 〇 The glass transition temperature (Tg) of the sealant 141 is higher than 25 ° C, and it is a kind of intermediary with a buffer glue 142 Dielectric thermosetting compound, • The height of the sealant 141 does not exceed the upper surface 116 of the glass substrate 112, and the glass transition temperature of the buffer glue 142 is lower than 25 ° C, which is formed in the 畲Between the sealant 1 41 and the side surface 11 7 of the glass substrate 11 2 and in contact with the sealant 141, the height of the buffer glue 142 is not higher than the seal

Page 10 200537215 V. Description of the invention (5) '-glue 141, preferably, the micro display module 100 series includes a cover 150, the cover 150 has a window 151, the window 151 Corresponding to the overlapping portion of the Shixi aa sheet 1 1 1 and the glass substrate 1 12, the cover 1 $ q is combined with the module substrate 120 to construct a practical micro display module 100. ° On the glued area 1 2 2 of 4 module substrate 120, the sealant 141 is used to be harder than the buffer rubber 142 after curing to maintain the protection of the fresh wires U2. The buffer rubber 42 reduces the stress on the display panel 110 caused by the shrinkage after curing, and avoids the occurrence of Newton's rings. FIG. 4 is a cross-sectional view of a stress-reducing miniature display module 2000 according to a second embodiment of the present invention. The miniature display module 2000 includes a display panel 210 and a module substrate 220. The display panel 2 10 and the module substrate 2 20 are equivalent to the display panel 110 and the module substrate 1 20 of the first embodiment. Please refer to FIG. 5, the display panel 21 0 includes a stone chip. 2 11. A glass substrate 2 1 2 and a liquid crystal 2 1 3 between the silicon wafer 2 1 1 and the glass substrate 2 1 2. The silicon wafer 211 has one that does not overlap the glass substrate 2 1 2 The upper dislocation portion 2 1 4 is formed with a plurality of solder pads 215. The module substrate 220 has a glue application area 222, and a plurality of connection pads 224 are formed in the glue application area 222. A viscous colloid 231 bonds the display panel 21 and the module substrate 220, and electrically connects the connection pads 224 of the module substrate 22 with the bonding pads 224 of the module substrate 220 with a plurality of bonding wires 232. The bonding pads 21 5 and a sealant 241 are formed around the glue coating area 222 of the module substrate 2 20. The height does not exceed one upper surface 216 of the glass substrate 212. A buffer glue 242 is formed on the sealant 241.

Page 11 200537215 V. Description of the invention (6) Between the side surface 2 1 7 of the glass substrate 2 1 2 and surrounded by the sealant 2 41 and the side surface 2 1 7 of the glass substrate 2 1 2 The pads 2 1 5 covering the broken chip 2 11, the connection pads 2 2 4 and the front lines 2 3 2 of the module substrate 2 2 0, the height of the buffer rubber 2 4 2 is not higher than The sealant 2 4 1 and, in addition, at least 'fresh 2 2 3' at the end of the plurality of lines 221 formed on the module substrate 220 are electrically connected to the glass substrate 2 via a conductive adhesive 2 3 3 1 2 is a transparent electrode layer 219 of the lower dislocation part 218. Preferably, the micro display module 200 includes a cover 250, and the cover 250 corresponds to the stone evening chip 211 with a window% 2 51 In the overlapping portion of the glass substrate 21 2, the cover body 2 50 is combined with the side module substrate 2 2 0 ′ to build a structure- ^ a practical and practical micro display module 20 0. Utilizing the characteristic that the sealant 241 is harder than the buffer rubber 242, the sealant 241 is formed on the periphery of the rubber coating area 222 to protect a wall, and then the buffer rubber 242 is filled in the sealant 241 and the glass. Between the side surfaces 217 of the substrate 212, the bonding wires 232 are protected and the buffer glue 242 is maintained in the remote glued area 2 2 2 without overflowing the glued area 2 2 2. The scope of protection of the present invention shall be determined by the scope of the appended patent application. 'Anyone skilled in the art and any changes and modifications made without departing from the spirit and scope of the present invention shall fall within the protection scope of the present invention. .

Page 12 200537215 Brief description of the drawings [Simplified description of the drawings] Figure 1 • According to the first specific embodiment of the present invention ?, — A three-dimensional exploded view of a miniature display module to reduce stress; Figure 2 ... The first specific embodiment of the invention, a cross-sectional view of a ^ -reduced micro display module; Figure 3 • According to the first specific embodiment of the present invention, the top view of the reduced-micro display module No. 4 FIG. 5 is a cross-sectional view of a micro-type display module with reduced stress according to a second specific embodiment of the present invention; and FIG. 5 is a diagram illustrating the type of reduced stress according to a second embodiment of the present invention. Top view of the monitor module 〇 Simple explanation of component symbols! 100 Mini display module 110 Display panel 111 Silicon wafer 112 Glass substrate 113 Liquid crystal 114 Dislocation part 115 Welding pad 116 Surface 117 Side 118 Lower dislocation 119 Transparent electrode layer 120 Module substrate 121 Circuit 122 Adhesive area 123 Solder pad 124 Connection pad • 131 Crystalline gel 132 Fresh line 133 Conductive glue 141 Sealant 142 Buffer 150 Cover 151 Window 200 Mini display module

Page 13 200537215

Page 14 Simple illustration

210 Display panel 211 Silicon wafer 212 Glass substrate 213 Liquid crystal 214 Upper dislocation 215 Solder pad 216 Upper surface 217 Side 218 Lower dislocation 219 Transparent electrode layer 220 Module substrate 221 Circuit 222 Adhesive area 223 Solder bump 224 Connection pad 231 Sticky crystal Gel 232 Welding wire 233 Conductive glue 241 Sealant 242 Buffer buffer 250 Cover 251 Window V

Claims (1)

200537215 VI. Scope of patent application ^ '— "-[Scope of patent application] 1. A stress-reducing miniature display module, comprising: a display panel, which includes a silicon wafer and a glass substrate with a transparent electrode layer, The silicon wafer is provided with a plurality of fresh pads formed on the dislocation part which does not overlap with the glass substrate, and the glass substrate has a side surface adjacent to the upper dislocation part; a module substrate, It has a glue coating area, and a plurality of connection pads are formed in the glue coating area; a plurality of bonding wires are electrically connected to the connection pads of the module substrate and the welding pads of the Shixi chip; Lu Yi sealant is formed on the glue coating area and covers the bonding pads, the connection pads and the bonding wires; and a buffer sealant is formed on the side of the sealant and the glass substrate. between. 2. The stress-reducing miniature display module described in item 1 of the scope of the patent application, wherein the glass transition temperature (Tg) of the buffer adhesive is lower than 25 ° C. 3. The stress-reducing miniature display module described in item 1 of the scope of the patent application, wherein the glass transition temperature (g 1 ass tr ans 丨 t 丨 〇ri temperature, Tg) of the sealant is higher than 25 ° C. Call 4. The stress-reducing miniature display module described in item 1 of the scope of the patent application, wherein the display panel is an Lc0s (Li quid Crystal On Si 1 icon) panel. 5. Miniature Display for Stress Reduction Page 15 200537215 VI. Scope of patent application *------ η module ′ where the Rong glass substrate has an upper surface, and the Gaul of the sealant does not exceed the upper surface of the glass substrate. X 6. The stress-reducing miniature display module according to item 5 of the scope of the patent application, wherein the height of the buffer adhesive is not higher than the sealant. For example, the stress-reducing miniature display module ′ described in item 丨 of the patent application range, wherein the buffer rubber is in contact with the sealant. $. The stress-reducing miniature display core set described in item 丨 of the patent application scope, wherein the glass substrate has a lower dislocation portion that does not overlap the silicon wafer, and the transparent electrode layer system extends to the lower dislocation portion. 9. The stress-reducing miniature display module according to item 8 of the scope of the patent application, wherein the module substrate is formed with at least one solder bump, which is electrically connected to the transparent electrode layer of the lower dislocation portion. 10. The stress-reducing miniature display module 'as described in item 1 of the scope of patent application, which further includes a cover, which is combined with the module substrate, and the cover system has a window, which corresponds to the silicon The overlapping part of the wafer and the glass substrate. 11. A miniature display module for reducing stress, comprising: a display panel including a silicon wafer and a glass substrate with a transparent electrode layer, the silicon wafer having a dislocation portion that does not overlap with the glass substrate ' The upper dislocation portion is formed with a plurality of welding pads, and the glass substrate spring has a side surface adjacent to the upper dislocation portion; a module substrate has a glue coating area, and a plurality of connection pads are formed on the glue coating Area; a plurality of bonding wires, which are electrically connected to the connection pads of the module substrate Page 16 200537215 _ __ __________ — One ——— 6. The scope of patent application and the pads of the silicon wafer; a sealant formed on the side of the glued area; and a buffer adhesive, which is It is formed between the sealant and the side of the glass substrate, and covers the bonding pads, the connection pads and the bonding wires. 1 2. The stress-reducing miniature display module described in item 11 of the scope of patent application, wherein the glass transition temperature of the buffer rubber is lower than 25 ° C. 1 3. The stress-reducing miniature display module described in item 11 of the scope of patent application, wherein the glass transition temperature of the sealant is higher than 25 ° C. 14. The stress-reducing miniature display module according to item 11 of the scope of patent application, wherein the display panel is an LCOS (Liquid Crystal On Lu Si 1 icon) panel. 15. The stress-reducing micro-display module according to item i i of the scope of patent application, wherein the buffer adhesive is surrounded by the sealant and the side of the glass substrate. 16. The stress-reducing micro-display module according to item 丨 丨 of the scope of patent application, wherein the glass substrate has an upper surface, and the height of the sealant does not exceed the upper surface of the glass substrate. 17. The stress-reducing micro-display module according to item 16 of the scope of patent application, wherein the height of the buffer adhesive is not higher than the sealant. 18. The stress-reducing miniature display _ module as described in item 11 of the scope of the patent application, wherein the glass substrate has a lower dislocation portion that does not overlap the silicon wafer, and the transparent electrode layer system extends to the lower dislocation. unit. 19. The stress-reducing miniature display module described in item 8 of the scope of the patent application, wherein the module substrate is formed with at least one zinc block, which is electrically connected. Page 17 200537215__ VI. Scope of patent application The transparent electrode layer connected to the lower dislocation. 20. The stress-reducing miniature display module according to item 11 of the scope of patent application, further comprising a cover body, which is coupled to the module substrate, and the cover system has a window, which corresponds to the silicon The overlapping part of the wafer and the glass substrate. Page 18