1252496 九、發明說明： 【發明所屬之技術領域】 本發明係一種過電流保護元件之製造方法及 其構造’尤指一種結構簡單、成本低之表面黏著 型過電流保護元件的製造方法及裝置者。 【先前技術】 按’一般傳統之表面黏著型電氣元件，如第 1A圖所示之公告第41 5624號專利案，其主要揭 露有一薄板型電阻元件，0、第一導電構件彳2a、 第二導電構件12b、第一絕緣膜14a、第二絕緣膜 1扑、以16與20構成的第一電極、以及，以切與 22構成的第二電極；其電阻元件1〇之兩端面並分 別形成凹入13、15 (如第1B圖所示）；俾藉由表 面黏+著技術將該電氣元件安裝於印刷電路板上時 ’該第-電極16、f二電極18可分別電氣連接於 該電路板之正、負極上，使透過該電氣元件之薄 板型電阻元件10降低通過該電路板之電流量，避 免過電流造成該電路板上其他元件之損壞。 又有如第2圖所示之公告第585341號專利案 *其揭露有一電阻元件5、一上電極片52、一； 二53、一上絕緣層54、-下絕緣層55、一左 一 L.、一右通道57、一左導電金屬薄膜561、 泠電金屬薄膜571、一上隔離臈8、以及一下 1252496 隔離臈9 ·，俾將嗜雷名一从 電軋兀件安裝於印刷電路板上 ,^弘極片52、下電極片53將分別與該電路 貞極電氣連接，令透過該電氣元件之電 =5降低通過該電路板之電流量，避免過電 成该電路板上其他元件之損壞。 •惟，上述習知之電氣元件，均存在以下缺失 • 、、 /1 .凡件結構上均形成有貫通元件本體的通 道或形成於侧面的凹入，而通道與凹入的壁面 $均被覆導電材料，以致於使其結構複雜，製 造程序增加，產品良率也隨著減低。 2 .由於習見之上述電氣元件，因元件結構上 形成通道與凹入而導致結構複雜，製造程序增加 ，故热可避免的，在材料上，製造之人工成本上 均大為增加提高。 •【發明内容】 發明人有鑑於前述先前技術之缺點，乃依其 從事各種被動元件之製造經驗和技術累積，針 對上述缺失悉心研究各種解決的方法，在經過 不斷的研究、實驗與改良後，終於開發設計出 本發明之一種全新過電流保護元件之製造方法 及其構造之發明’以期能搏除先前技術所產生 之缺失。 1252496 本發明之一目的，伤趄 件之製造方法，該方過電流保護元 中央處，設置一八子:糸於一絕緣基板頂面近1252496 IX. Description of the Invention: [Technical Field] The present invention relates to a method for manufacturing an overcurrent protection element and a structure thereof, and more particularly to a method and apparatus for manufacturing a surface-adhesive overcurrent protection element having a simple structure and low cost. . [Prior Art] According to the 'generally conventional surface-adhesive-type electrical component, as disclosed in the publication No. 41 5624 of FIG. 1A, it mainly discloses a thin-plate type resistive element, 0, a first conductive member 彳 2a, a second The conductive member 12b, the first insulating film 14a, the second insulating film 1 , the first electrode composed of 16 and 20, and the second electrode formed by cutting 22; the resistive elements 1 〇 are formed on both end faces and respectively formed Recesses 13, 15 (as shown in FIG. 1B); when the electrical component is mounted on the printed circuit board by surface adhesion technology, the first electrode 16, the f electrode 18 can be electrically connected to the The positive and negative electrodes of the circuit board reduce the amount of current passing through the circuit board through the thin-plate type resistive element 10 of the electrical component, thereby preventing damage to other components on the circuit board caused by overcurrent. There is also a publication No. 585,341, which is shown in Fig. 2, which discloses a resistive element 5, an upper electrode sheet 52, a second 53, an upper insulating layer 54, a lower insulating layer 55, and a left L. a right channel 57, a left conductive metal film 561, a tantalum metal film 571, an upper spacer 臈8, and a lower 1252496 isolation 臈9, which are mounted on the printed circuit board from the electric rolling element. The second electrode 52 and the lower electrode 53 are respectively electrically connected to the drain of the circuit, so that the electric current passing through the electrical component reduces the amount of current passing through the circuit board, thereby avoiding over-currenting into other components on the circuit board. damage. • However, the above-mentioned conventional electrical components have the following defects: •, /1. Each of the structures is formed with a passage through the body of the element or a recess formed on the side, and the channel and the recessed wall are both covered and electrically conductive. The material is so complex that its structure is increased, manufacturing processes are increased, and product yield is also reduced. 2. Because of the above-mentioned electrical components, the structure is complicated due to the formation of channels and recesses in the structure of the components, and the manufacturing process is increased, so that the heat can be avoided, and the labor cost of the manufacturing is greatly increased. • [Invention] In view of the shortcomings of the prior art mentioned above, the inventors have been engaged in the manufacturing experience and technical accumulation of various passive components, and have carefully studied various solutions for the above-mentioned deficiencies, and after continuous research, experiment and improvement, finally The invention has been devised to design a novel overcurrent protection element manufacturing method and its construction of the present invention in order to eliminate the defects caused by the prior art. 1252496 An object of the present invention is a method for manufacturing a scar member, wherein a central portion of the overcurrent protection element is provided with an eight-piece: a top surface of an insulating substrate
π刀子正溫度係數材料（PPTC 再於該電阻板之端面上、該絕緣 :π面面J ?兒阻板之—側邊、與該侧邊相鄰 二端面相鄰之底面-側邊包覆-π knife positive temperature coefficient material (PPTC is further on the end face of the resistor plate, the insulation: the side surface of the π face J 儿 阻 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 -
板頂面再於该電阻板頂面上、該絕緣基 扳頂面相鄰電ρ且％ > s 相邱” 側邊、與該另-側邊 另端面、及與該另一端面相鄰之底面 =側邊包覆—第二電極層，㈣於該絕緣基 '面上包復—層絕緣保護層，即可得到成品 :i°:床製造出之成品，結構簡單’因此簡化 衣4¾序，亚大幅降低製造成本。 本發月之另—目的，係提供一種過電流保護 =之構仏’其主要設有一絕緣基板，該絕緣 板員面近中央處設有一向分子正溫度係數材 :(pptc)之電阻板，該絕緣基板在該電阻板 端面上、沿其頂面相鄰電阻板之一側邊、與該 側邊相鄰之端面、及與該端面相鄰之底面二側 邊設置-第-電極層’並於該電,阻板頂面上、 沿該絕緣基板頂面相鄰電阻板之另一側邊、與 該另-側邊相鄰之另一端面、及與該另一端面 相鄰之底面另一侧邊，設置一第二電極層，該 1252496 絕緣基板頂面上並包覆一層絕緣保護層；如此 ，本發明保護元件之結構，僅包含絕緣基板、 ppyc電阻板、第一電極層、第二電極層、絕鍊 保濩層等元件，因此結構相當簡單，故可簡化 其製造程序，並大幅降低製造成本及人力。The top surface of the board is further on the top surface of the resistor board, and the insulating base top surface is adjacent to the side of the electric ρ and % > s phase, adjacent to the other side of the other side, and adjacent to the other end surface The bottom surface = side cladding - the second electrode layer, (4) covering the insulating layer - the layer of insulating protective layer, the finished product: i °: the finished product of the bed, the structure is simple 'so the simplified clothing 43⁄4 In order to reduce the manufacturing cost, the other purpose of this month is to provide an overcurrent protection = structure which is mainly provided with an insulating substrate, which is provided with a direct molecular positive temperature coefficient material near the center of the insulating plate. a resistor board of (pptc), the insulating substrate is on an end surface of the resistor board, a side edge adjacent to the resistor board along a top surface thereof, an end surface adjacent to the side edge, and a bottom surface adjacent to the end surface </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> and the other side of the adjacent side of the insulating substrate a second electrode layer is disposed on the other side of the bottom surface adjacent to the other end surface, and the top surface of the 1252496 insulating substrate is The insulating protective layer is covered with the insulating protective layer; thus, the structure of the protective component of the present invention comprises only the insulating substrate, the ppyc resistor plate, the first electrode layer, the second electrode layer, the absolute chain protection layer and the like, so the structure is relatively simple, so that the structure can be simplified Its manufacturing process and significantly reduced manufacturing costs and manpower.
為便貝審查委員能對本發明之目的、形狀 、構造裝置特徵及其功效，做更進一步之認識 與瞭解，茲舉實施例配合圖式，詳細說明如下 【實施方式] 本發明乃有關一種「過電流保護元件之製造 方法及其構造」，請參閱第3、4圖所示，該方法 係與該構造互相配合，其中該方法包含下列步 驟： —第一步驟：首先，在一絕緣基板41 (於本In order to further understand and understand the purpose, shape, structure and function of the present invention, the present invention will be described in detail below with reference to the following embodiments. For the method of manufacturing the current protection element and its construction, please refer to Figures 3 and 4, the method is compatible with the configuration, wherein the method comprises the following steps: - First step: First, on an insulating substrate 41 ( Yu Ben
只加例中為冑曼基板’但本發明在實際實施時 ’亚不限於此）頂面近中央處，設置一高分子 正溫度係數材料（PPTC)之電阻板42，該電阻 板42係以黏㈣（如：絕緣膠）黏合於該絕緣 基板41上； 弟-步驟：於該電阻板42端面上、沿該絕 緣基板41頂面相鄰電阻板42之—側邊、與該側 邊相鄰之端面、及與該端面相鄰之底面一側邊 1252496 包覆一第一電極層43 (該第一電極層43可為導 • 電係數佳之金屬層（如：金、銀、銅、鐵層）） 第三步驟：於該電阻板42頂面上、沿該絕 緣基板41頂面相鄰電阻板42之另一側邊、與該 另一側邊相鄰之另一端面、及與該另一端面相 鄰之底面另一側邊包覆一第二電極層44 (該第 二電極層44可為導電係數佳之金屬層（如：金 • 、銀、銅、鐵層））； 第四步驟：於該絕緣基板41頂面上包覆一 層絕緣保護層45 (如：塑膠材質之保護層）σ 藉由上述之步驟，即可製出本發明之成品。 如此，製造出之成品，僅包含絕緣基板4 ] 、P PTC電阻板42、第一電極層43、第二電極層 4 4、絕緣保護層4 5等元件，因此結構相當簡單 φ ’故可簡化製造程序，並大幅降低製造成本及 人力。 再者，請參照第4、5圖所示，一種過電流 保護元件之構造，其主要係為配合上述方法之 裝置，該裝置包含有： 一絕緣基板41 (如：陶瓷基板）； 一高分子正溫度係數材料（PPTC)之電阻 板42 ’係設於該絕緣基板41頂面近中央處； 9 1252496 一第一電極層43，係沿該絕緣基板41之表 • 面，設於該絕緣基板41頂面相鄰電阻板42之一 ， 側邊、與該側邊相鄰之端面、及與該端面相鄰 之底面一側邊上，並與該PPTC電阻板42之端面 連接； 一第二電極層44，係沿該絕緣基板41之表 面，設於該絕緣基板41頂面相鄰電阻板42之另 _ 一側邊、與該另一側邊相鄰之另一端面、及與 該另一端面相鄰之底面另一側邊上，並與該 PPTC電阻板42之頂面連接，令該第一電極層43 與该第二電極層44分別連接於該ppTC電阻板 4 2之端面及頂面，而互相不導通； 一層絕緣保護層45，係包覆於該絕緣基板 41頂面上，以避免外物（如··水分、灰塵··等 )進入本體中。 • 藉由上述構件之組成，當將本發明過電流保 護元件安裝於一印刷電路板上，並使該第一電 極層43、該第二電極層44分別與該印刷電路板 上之正、負極電路電氣連接時，該印刷電路板 上之電流可由第一電極層43流入，通過PPTC 電阻板42後，再由第二電極層44流回該印刷電 路板，令該電流在通過p p 丁 C電阻板4 2後，可藉 該PPTC電阻板42之阻抗降低其電流值，因此流 1252496 回該印刷電路板上之電流不致過大，故可避免 過大（或突然過大）之電流造成該印刷電路板 上其他元件之損壞，達成保護其他元件之功效 0 如此’本發明保護元件之結構，僅包含絕緣 基板41、PPTC電阻板42、第一電極層43、第 二電極層44、絕緣保護層45等元件，因此結構 相當簡單，故可簡化製造程序，並大幅降低製 造成本及人力。 另’該第一電極層43設有一導電段431及一 連接段432，其中該導電段431位於該絕緣基板 41頂面相鄰電阻板42之一側邊以及與該側邊 相鄰之端面，而該連接段432則位於該絕緣基板 41之底面；而該第二電極層44並設有一導通段 441及一相接段442，其中該導通段441位於該 絕緣基板41頂面相鄰電阻板42之另一側邊以 及與該另一側邊相鄰之另一端面，而該相接段 442則位於該絕緣基板41之底面，俾將該過電 流保護元件安裝於該印刷電路板上時，該連接 段432、該連接段432將分別與該印刷電路板上 之正、負極電路電氣連接，又，由於本發明之 過電流保護元件體積小，因此可使用表面黏著 技術（SMT)，將該連接段432、該連接段432 11 1252496 接合於該印刷電路板上之正、負極電路上。 據上所述，本發明之一種「過電流保護元 件之製造方法及其構造」，在產業上具有很大之 利用價值，且可改良習用技術之各種缺點，在 使用上能增進功效，合於實用，充份符合發明 專利之要件，實為一理想之創作，故申請人爰 依專利法之規定，向鈞局提出發明專利申 δ月’並懇請早曰賜准本案專利，至感德便。 以上所述，僅為本發明最佳具體實施例，惟 本舍明之構造特徵並不侷限於此，任何熟悉該 項技藝者在本發明領域内，可輕易思及之變化 或修飾，皆可涵蓋在以下本案之專利範圍。 【圖式說明】 第1 Α圖〜第1Β圖為一種台灣專利公告第 41 5624號專利案之說明圖。 第2圖為另一種台灣專利公告第585341號專 利案之說明圖。 第3圖為本發明之製造流程圖。 =4圖為本發明過電流保護元件之剖面示意圖（ 第5圖為本發明過電流保護元件之立體圖。 12 1252496 【圖式中元件名稱與符號對照】In the only example, the 胄man substrate is used. However, in the actual implementation of the present invention, the sub-surface is near the center, and a resistive plate 42 of a polymer positive temperature coefficient material (PPTC) is disposed. Adhesive (4) (eg, insulating glue) is adhered to the insulating substrate 41; Step--step: on the end surface of the resistor board 42 along the top surface of the insulating substrate 41 adjacent to the side of the resistor board 42 The adjacent end face and the bottom side edge 1252496 adjacent to the end face are covered with a first electrode layer 43 (the first electrode layer 43 can be a metal layer with good electric conductivity) (eg, gold, silver, copper, iron) Layer)) a third step: on the top surface of the resistor board 42, along the other side of the resistor board 42 adjacent to the other side of the insulating substrate 41, the other end surface adjacent to the other side, and The other side of the bottom surface adjacent to the other end surface is coated with a second electrode layer 44 (the second electrode layer 44 may be a metal layer with good conductivity (eg, gold, silver, copper, iron layers)); Step: coating an insulating protective layer 45 on the top surface of the insulating substrate 41 (for example, a protective layer of plastic material) The above-described steps, the finished product can be prepared according to the present invention. Thus, the manufactured product includes only the insulating substrate 4], the P PTC resistor plate 42, the first electrode layer 43, the second electrode layer 44, the insulating protective layer 45, and the like, so that the structure is relatively simple, so that it can be simplified Manufacturing procedures and significantly reduce manufacturing costs and manpower. Furthermore, please refer to the structure of the overcurrent protection component shown in FIGS. 4 and 5, which is mainly a device which cooperates with the above method, and the device comprises: an insulating substrate 41 (eg, a ceramic substrate); A resistive plate 42' of a positive temperature coefficient material (PPTC) is disposed near the center of the top surface of the insulating substrate 41; a first electrode layer 43 is disposed along the surface of the insulating substrate 41 on the insulating substrate. 41, one of the top adjacent resistor plates 42, a side edge, an end surface adjacent to the side edge, and a bottom surface side adjacent to the end surface, and connected to an end surface of the PPTC resistor plate 42; The electrode layer 44 is disposed along the surface of the insulating substrate 41 on the other side of the top surface of the insulating substrate 41 adjacent to the resistor plate 42 and the other end adjacent to the other side, and the other end The other side of the bottom surface adjacent to one end surface is connected to the top surface of the PPTC resistor plate 42 such that the first electrode layer 43 and the second electrode layer 44 are respectively connected to the end faces of the ppTC resistor board 42 a top surface that is non-conductive to each other; a layer of insulating protective layer 45 overlying the insulating layer Surface 41 to prevent foreign objects (·· moisture, dust ·· etc.) into the body. • The overcurrent protection component of the present invention is mounted on a printed circuit board by the composition of the above components, and the first electrode layer 43 and the second electrode layer 44 are respectively connected to the positive and negative electrodes on the printed circuit board. When the circuit is electrically connected, the current on the printed circuit board can flow from the first electrode layer 43 and pass through the PPTC resistor plate 42 and then flow back to the printed circuit board by the second electrode layer 44, so that the current passes through the pp-butyl resistor. After the board 4 2, the current value can be reduced by the impedance of the PPTC resistor board 42, so that the current flowing back to the printed circuit board is not excessive, so that an excessive (or suddenly too large) current can be prevented from causing the printed circuit board. The damage of other components achieves the effect of protecting other components. Thus, the structure of the protective component of the present invention includes only the insulating substrate 41, the PPTC resistor plate 42, the first electrode layer 43, the second electrode layer 44, and the insulating protective layer 45. Therefore, the structure is quite simple, so that the manufacturing process can be simplified and the manufacturing cost and labor can be greatly reduced. The first electrode layer 43 is provided with a conductive segment 431 and a connecting portion 432. The conductive segment 431 is located on a side of the insulating substrate 41 adjacent to one side of the resistor plate 42 and an end surface adjacent to the side edge. The connecting portion 432 is located on the bottom surface of the insulating substrate 41. The second electrode layer 44 is provided with a conductive portion 441 and a connecting portion 442. The conductive portion 441 is located on the top surface of the insulating substrate 41. The other side of the other side of the insulating substrate 41 is disposed on the printed circuit board. The connecting section 432 and the connecting section 432 are respectively electrically connected to the positive and negative circuits on the printed circuit board. Further, since the overcurrent protecting component of the present invention is small in size, surface adhesion technology (SMT) can be used. The connecting section 432 and the connecting section 432 11 1252496 are bonded to the positive and negative circuits on the printed circuit board. According to the above, the "method of manufacturing an overcurrent protection element and its structure" of the present invention has great utility value in the industry, and can improve various disadvantages of the conventional technology, and can improve the efficiency in use. Practical, fully in line with the requirements of the invention patent, is an ideal creation, so the applicant in accordance with the provisions of the Patent Law, filed a patent for the invention of the invention δ月' and asked for the patent of the case as soon as possible. . The above description is only the best embodiment of the present invention, and the structural features of the present invention are not limited thereto, and any change or modification that can be easily considered by those skilled in the art can be covered. In the following patent scope of this case. [Description of the Drawings] The first drawing to the first drawing is an explanatory diagram of a patent of Japanese Patent Publication No. 41 5624. Fig. 2 is an explanatory diagram of another Taiwan Patent Publication No. 585341. Figure 3 is a manufacturing flow diagram of the present invention. 4 is a schematic cross-sectional view of the overcurrent protection component of the present invention (Fig. 5 is a perspective view of the overcurrent protection component of the present invention. 12 1252496 [Comparison of component names and symbols in the drawing]
薄板型電阻元件·· 1 〇 第一導電構件：1 2 a 第一絕緣膜：1 4a 第一電極：1 6、20 凹入：1 3、1 5 上電極片：52 上絕緣層：54 左通道：56 左導電金屬薄膜·· 561 右導電金屬薄膜·· 571 上隔離膜· 8 絕緣基板：41 第一電極層：43 導電段：431 導通段·· 441 第二導電構件：12b 第二絕緣膜·· 1 4b 第二電極：1 8、22 電阻元件：5 下電極片：53 下絕緣層：55 右通道：57 下隔離膜：9 PPTC電阻板：42 第二電極層：4 4 連接段·· 432 相接段：442 13Thin plate type resistive element · 1 〇 First conductive member: 1 2 a First insulating film: 1 4a First electrode: 1 6, 20 Recessed: 1 3, 1 5 Upper electrode sheet: 52 Upper insulating layer: 54 Left Channel: 56 left conductive metal film · 561 right conductive metal film · 571 upper isolation film · 8 insulating substrate: 41 first electrode layer: 43 conductive segment: 431 conduction segment · 441 second conductive member: 12b second insulation Membrane ·· 1 4b Second electrode: 1 8、22 Resistive element: 5 Lower electrode piece: 53 Lower insulation layer: 55 Right channel: 57 Lower isolation film: 9 PPTC resistance plate: 42 Second electrode layer: 4 4 Connection segment ·· 432 Connecting section: 442 13