TWI250621B - Semiconductor package singulating system and method - Google Patents

Abstract

IC chips are fabricated with multiple IC chips being typically arranged on a single substrate singulated to obtain individually separated packages of IC chips. Generally, the packages forming the substrate are separated using a saw, a dicing saw or the like cutting devices. The substrate is often supported on a rubber pad interfacing the substrate and a saw jig or the like support. Air is then extracted through holes in the rubber pad for creating a vacuum. The vacuum secures the substrate to the saw jig both before and after the packages are separated and during the sawing. Besides to the use of vacuum, typical methods and systems use adhesive pads for further securing the substrate. However, these conventional methods and systems suffer from an additional step of substrate removal. The invention discloses a saw jig for supporting a substrate on a compressible support pad. A clamp is mountable onto the saw jig for clamping the substrate without impeding access of a saw blade to the substrate. Vacuum through channels in the support pad and saw jig generates suction forces for positionally immobilising the substrate in combination with the clamping forces of the clamp during singulation.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention generally relates to a semiconductor cutting system, and more particularly to a topology for elastically applying force on a cutting structure (-y A semiconductor packaged semiconductor cutting system with a flat surface. [Prior Art] A dental shell circuit (IC) wafer is assembled from a plurality of 1 c wafers typically arranged on a single substrate. In the conventional IC wafer process, silicon dies are initially bonded via die bonding, wire b〇nding or flip-chip bonding (f 1 ip cip mount 1 ng ). Bonded to the liner of the leadframe, then encapsulated in a molding compound to obtain a single substrate, and finally cut to obtain a separate IC package from which to be separated. The formation of the substrate is usually separated by a cutting machine (say), a wafer cutter U1C1ng saw or such a cutting device. The substrate is typically supported by a rubber pad or support such that the rubber pad engages the substrate fish. The air is then evacuated through a plurality of holes formed in the rubber mat, thereby creating a vacuum. The vacuum allows the substrate to be securely attached to the cutter fixture before and after the separation package, as well as during cutting. U.S. Patent Nos. 6, 6 3 8, 7 9 1 B2 (Tleber 丨), 6 1 87 79 1 B1 (Tieber 2), 6, 165, 232 (Tleber 3) and 6, 21; 39 B1 (ROBERTS) Vacuum fixing method. 'T i e b e r 2 and T i e b e r 3 indicate the use of a kind of agglomerated alpha element. The nested array unit has a plurality of pedestals arranged in a table shape. Through the grid formed in each of the pedestals

INVENT20040901PI50.ptd 1250621 V. INSTRUCTIONS (2) The plate is firmly fixed on the nesting unit for subsequent grain cutting. The ROBERTS describes a similar fixing system that does not require the use of a retaining plate to remove the substrate from the nesting unit.

As the size of semiconductor packages shrinks, the need for smaller packages has increased. However, the above-mentioned conventional methods of achieving vacuum via rubber pads, such as those disclosed by Tieber 1, Tieber 2, Tieber 3, and Roberts, no longer cater to the robust needs of these smaller packages. Although the package is reduced in size, the cutting force introduced during separation (such as the die cutting process) remains unchanged. Grain cutting is a contact cutting process that produces tremendous forces, such as tangential or lateral forces. Therefore, the holding force of the substrate to be fixed to the cutter jig and the frictional force provided between the rubber pad and the individual package must overcome the side cutting force of the cutting blade to prevent the package from moving during cutting. When the size of the package is reduced, the actual area where the friction is generated is also reduced, thereby causing the die cutting process to fail due to the movement or flying away of the package. In order to improve the friction on the rubber mat, U.S. Patent Nos. 6, 3 4 4, 4 〇 2 B1 (Sekiya) and 6, 5 94, 8 9 〇 β2 (Red) disclose the use of a rubber mat to replace the adhesive. pad.

Arai s brothers use an adhesive pad in which pores are formed. Place

The semiconductor wafer on the Ϊ I 不仅 is not only supported by the adhesive force of the adhesive ,, but also by the suction of the vacuum generated by the pores, the steps of the other heaters, the spleen needles, and the other conductors. The wafer is separated from the adhesive. Heat the pad to a preset temperature to make

SeUya explains the use of a combination of tape and vacuum to make the semiconductor crystal

INVENT20040901PI50.ptd Page 9 1250621 V. Description of invention (3) Adhesive to the frame. However, in the disclosure of S e k i y a, an additional step is required to use a gas stream to deflect the cut semiconductor wafer out of the frame, which is emitted from the surface which was originally created as a vacuum. In addition, the use of an adhesive or tape to fix the semiconductor package is ineffective. Subsequent processing of the diced semiconductor package requires another step to cleanly remove the adhesive or tape from each of the diced semiconductor packages. U.S. Patent No. 3,9,7,8,8,8 (Cuomo) describes a device for maintaining the positioning of a semiconductor wafer during the cutting process. The device has a flat crystal with a groove formed along the plane of the receiving area. The pedestal unit is used to support the semiconductor wafer above it. The base unit further has a plurality of channels formed therein to create a vacuum. Cuomo further describes a cover having a plurality of ribs, each rib being provided with a compressible material. Each pair of adjacent ribs are spaced apart from one another to make the cutting blade easier to pass between them. Because the semiconductor wafer is typically planar, fragile, and essentially a flat surface topology, the base unit of the Cuomo is flat and sturdy. The containment area is designed to ensure a vacuum seal and prevent fragile wafer bending. However, if such a device is applied to semiconductor package cutting, especially a quad flat no-lead (QFN) package or such a small package with a copper lead frame, the warpage of such a semiconductor package substrate (war -page ) will cause the vacuum to leak along the interface of the semiconductor package and the hard and flat receiving area of the base unit.

INVENT20040901PI50.ptd Page 10 1250621 V. INSTRUCTIONS (4) ..., can be removed so that the cross section of each rib is thickened to ensure that the structure is sufficiently rigid to have a longer spacing. However, a typical cutting blade assembly has a V-shaped bushing and is entrained between the v-shaped bushings. Since the cutting blade is radially thinner, the sum of the cutting blades that protrude radially from each pair of adjacent ribs is small. Therefore, extending too far through the cutting blades of each pair of adjacent ribs will cause the V-shaped bushing to collide with the ribs. Therefore, in (:11〇111〇, the portion of the rib facing outward toward the compressible material is chamfered to conform to and accommodate the v-shaped bushing to prevent damage caused when the cutting blade is inserted between the mother and the opposing ribs. Compared with plaque micro-semiconductors, the ribs are relatively large in size, so the ribs with V-shaped chamfered surfaces are not suitable for use in the cutting of micro-semiconductor packages. In addition, the Cu〇mo base unit is not suitable. A recess must be formed to allow the cutting blade to pass over the semiconductor crystal and toward the base unit when the wafer is being diced, and making the recess in the base unit is time consuming and costly. Therefore, there is a clear need for an improved semiconductor package. The present invention is directed to providing a combination of suction and clamping force to secure a substrate during cutting. The substrate is supported by a compressible support pad having a vacuum and The suction force is introduced into the passage of the substrate. The support jaw is coupled to a base plate. When the clamp member is placed on the cutter jig to hold the substrate therebetween, the clamping force is applied to the substrate. "I [ϊ,ΐ 本 the first object of the present invention] discloses a semiconductor package cutting system comprising: - cutting: a machine fixture having a support substrate with a suction applied to the substrate to fix the substrate in the cutting On the cool, ί

INVENT20040901PI50.ptd

Page 11 1250621, the substrate and the second cutter are clamped on the substrate substrate into the substrate, and the substrate is stopped by the substrate on the cutting board, and the substrate is applied with a holding force without applying a cutting force to the base in the cutting blade. The first step of the invention is applied to the removal of the tamper-evident invention: the support has a support for the support fixture of the cutter, and the substrate member and the cutting force are applied to the substrate at the substrate. Holding the pad; applying the suction force elastically to recover the at least one portion of the first jig ply plate to be clamped to the plate at least by the cutting blade; and cooperate to further clamp the upper portion The first portion of the cut at least one blade is introduced into the base suction force and the suction force of the clamp. 5. (5) The pad is an elastic restoring force. The substrate comprises a first portion, and the clamping clamp member will be a lost clamp. The upper and lower obstructions are cut according to this, and a part of the displacement, in which the substrate or part of the displacement is according to this method 'includes to provide a substrate by the cutter fixture, for half The body seal enables the clamping member to be applied to the clamp without hindering the cutting blade. In the second part, the portion is a semiconductor package and the substrate is clamped therein to fix the substrate to the cutter fixture and the missing component; The board is separated from the first and the first force to substantially prevent the step from acting on the yoke portion or at least one of the semiconductor package cutting square cutter fixtures; and the substrate is fixed on the substrate to fix the substrate to the tangential force substrate At least one partial portion and a second portion are used to sandwich the substrate therebetween, and the clamping step is to make the substrate firmly between the cutter clip cutter and the clamping member, and the partial portion is introduced into the substrate to separate The first, the first and the third force and the clamping force generally avoid the displacement

1250621 5. The invention (6), wherein the suction applied to the substrate further prevents at least one portion of the first portion or the second portion of the substrate from being displaced when the clamping member acts on or is removed from the substrate. According to a third object of the present invention, a semiconductor cutting system includes: a cutter fixture including a support pad supporting a substrate, the cutter fixture applying a suction force on the substrate to fix the substrate to the cutter fixture, and the support pad is The elastic restoring force and the substrate comprises: a first semiconductor package; a second semiconductor package not separated from the first semiconductor package; and a first dividing line formed between the first semiconductor package and the second semiconductor package; a first clamping member cooperates with the cutter fixture to sandwich the substrate therebetween, and the first clamping member applies a clamping force to the substrate to further fix the substrate to the cutter fixture without being clamped on the substrate Holding between the cutter clamp and the clamping member, obstructing the cutting blade from entering at least one portion of the substrate; thereby, when substantially cutting along the first dividing line to separate the first semiconductor package from the second semiconductor package, in cutting When the force is introduced into the substrate by the cutting blade to separate the substrate, the suction force and the clamping force applied to the substrate substantially avoid the displacement thereof, wherein, in the first Since the second suction semiconductor package separate semiconductor package, is further applied to the substrate holding member acts to prevent the substrate or from the first semiconductor package and the second semiconductor remove their displacement.

INVENT20040901PI50.ptd Page 13 1250621 V. INSTRUCTION DESCRIPTION (7) [Embodiment] A semiconductor package system as described later can solve the aforementioned problems. ΐ: The first embodiment is a semiconductor package cutting system, the perspective view of the semiconductor cutting system is shown in the first figure a, and the partial cross-sectional view of the semiconductor package cutting system (2G) is shown in the second figure. The semiconductor package cutting system (20), as shown in the first figure 3, includes a T machine clamp (22) and a clamping member (24). The cutter jig (22) is replaced by a substrate (26). The cutter clamp (22) includes a == (28) as a support substrate (26) and a support pad (3Q) as a joint

Earth plate (26) and base plate (28). The support pad (3 〇) has an elastic restoring force and applies a frictional grip to the substrate (26). As shown in the first diagram a and the more detailed second diagram, the support pad (3 inch) package includes a plurality of pad channels (32) extending from the first side of the support pad (3 turns) to the first side. The support pad (30) is generally planar with a first side and a second side facing outward. When the substrate (26) is supported by the cutter jig (22) and the substrate (26) is adjacent to the first side of the support pad (30), vacuum is generated via the plurality of channels (32) to substantially cause the substrate (2β) and Support pad (3 〇) vacuum combination. The base plate (28) includes a recess (3 6 ) formed therein and a plurality of plates

Channel (38). The plate passage (38) extends from the recess (36) of the base plate (28) toward the plate surface (40). When the support pad (3) is combined with the base plate (28), the plate surface (40) of the base plate (28) is in close contact with the second surface of the support pad (30). Each plate channel (38) is aligned with the corresponding pad channel (32) to facilitate gas communication between the recess (36) and the pad channel (32). The substrate (26) includes a lead frame (42) and a plurality of uncut semiconductors

1250621 DESCRIPTION OF THE INVENTION (8) _ Package (44a), which has a topology (4 6 ). In the following, the semiconductor surfaces are arranged and classified into sections.

Flat No-Pin (QF N) Package | The Upper Sense Cutting System (20) is applied to a four-sided flat application and is not limited to only three. However, a part of the package (44a) of the semiconductor package cutting system, from: ^ lead frame (42) The lead frame (42) forming the uncut QFN and only extends from the periphery of AH6). After that, mention the part. The exposed shape and size extending around each QFN smear/U.S. section U6) is an H semiconductor device. The lead frame (42) is typically (46). 3 On the one hand, the arrow shown in (10) is arranged and divided into sections (not shown). The package (44a) can be grouped into only - molding, whereby the package has been molded by two people. It is obtained, for example, that the polymer (26) is a grain in which the plane H has been bonded to the lead frame (4). The substrate support 塾 (30) is made of rubber, one of the materials of the restoring force or a combination thereof. The force is not only provided along the plane of the friction (2 6 ) is compressed during the adaptation zone support pad (30) using the adhesive (28) )on. The support pad (30) defines a section (46). Therefore all sections of the pad (3〇) are supported (4 6 ). On the other hand, more than one support pad supports the substrate. The size and area of each support pad are the corresponding segments (46). Elastomers, polymers and these are made of elastic. The elastic recovery resistance of the support pad (30) can also be elastically deformed to have a topography and warpage in the substrate section (46). Or such a bonding tool is mounted on a receiving area of the base plate to place the substrate (26) in a size according to the accommodating substrate (26) or as shown in the first figure b. When more than one support pad is used, a substrate positioning pin (48 a) extending only from the substrate (26) extends from the substrate plate (28) and is formed on the substrate.

INVENT20040901PI50.ptd Page 15 1250621 V. Invention description (9) (2 6 ) The positioning holes (4 8 b ) or notches (not shown) in the lead frame (4 2 ) correspond to each other. When each of the substrate positioning pins (48 a) passes through the corresponding positioning holes, the substrate (26) is aligned with the cutter miss (2 2 ), and the substrate (26) is aligned with the cutter clamp (22). The section (46) of the substrate (26) can be aligned with the support pad (3 turns). The cutter clamp (2 2 ) is mounted on a cutting table (50) that is structurally supported. The vacuum pump (not shown) is preferably integrally formed with the cutting table (5 〇) and joined to the recess (36) of the base plate (28) via a vacuum crucible (52) as shown in the second figure. The function of the recess (36) in the substrate (28) is the point of convergence of the air between the plate channel (38) and the vacuum port (52) to which it is coupled. Thus the vacuum pump can be operated to create a vacuum in the recess (36) and subsequently through the plate channel (38) and the channel (32). According to the second, fourth, and fourth figures, the cutter clamp (2 2 ) further cooperates with the clamping members (24) to hold the substrate (26) therebetween. The cutter clamp (22) j clamp member (24) applies a clamping force to at least a portion of the substrate (26) to be fixed in step f. The clamping member (24) includes a flange (58) that is shaped and dimensioned to extend the rib (6 〇) extending the lead frame (the outer eye of (2) and a row from the flange (9)). A gap (6 2 ) is formed in each section (46) of each of the adjacent substrates (26) between adjacent pairs of ribs (60), and the uncut QFN package 々= is set as a grid structure, including as the fifth The rows and columns shown in the figure. Month, 60) corresponds to the -row or column in the grid construction row. The row and column definitions of the grid construction are r 〆 , Ω Ω λ . The x-separation line on the substrate (26) section (46) =) and the y-separation line (66b). Referring to Figures 5, 6, 7, and 8, the & section (46) of the substrate () is preferably cut along the χ-divide line (66a) to obtain

INVENT20040901PI50.ptd Page 16 1250621 DESCRIPTION OF THE INVENTION (10) Dividing the wire to obtain a cut) A QFN package (44b) that is substantially half-cut with a y-divider (6 6 b), followed by a QFN package (44c) °x - Separation lines (66a are perpendicular to each other.

The holding member (24) is provided by bolts, spring-type fixing members, hydraulic fixing members, rolling-type fixing members, electromagnets, 5 gold-powered magnets, or the like. The wearing can be set in the (4) machine clamp (22) ± . The clamping member (24) further includes a holder positioning pin (not shown) passing through the corresponding positioning passage (66c) formed in the clamping member (24) and formed in the cutter fixture (22) Positioning channel "Μ". The clamping locating pin cooperates with the positioning channel (66c, 66d) to align the clamping with the cutter clamp (22). When the clamping member (24) is placed on the cutter fixture (2 2 ) While the substrate (26) is held therebetween, each rib (6 〇) presses one of the cut QFN packages (4 4 a ) onto the support pad (3 q ). The ribs (60) are further molded. Formed as a concave surface (67), as shown in the third figure, to accommodate the section (46) of the substrate back (26) when the clamp (24) is placed in the cutter clamp (2 2 ). As illustrated in the second figure, the shape of the gap (6 2 ) and the ruler $ are such that the cutting blade (68) can pass therethrough. Further, the gap (62) is such that the χ - dividing line (66a) or the y - dividing line ( 6 6b) One of the exposed to the cutting blade (68) is aligned. ^

The holding member (24) is generally divided into two types 'i.e., the X-clamping member (70a) as shown in the ninth figure and the y-clamping member (7〇b) as shown in the first figure. The member (7〇a) has a gap (62)' aligned in such a manner that the 1 dividing line (66a) is exposed, and y - the holding member (70b) is aligned in such a manner that the y-dividing line (66b) is exposed Clearance (62). The sections (46) of the substrate (26) are disposed along an axis parallel to the substantially parallel X-dividing lines (66a). Therefore, each of the X-clamps (7〇a)

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A rib (60) extends out of the longer section of the section, in contrast to each section (4 6) of the y-clamping member (7〇b). 'Exceeding all sections (4 6 ribs (60) extend only beyond an X~ clamp (7 Oa) is relatively light # rn, 丄 is structurally weak. x-missed parts are too suspended, laterally extended The rib (60) of the struts (/bar 3 one or more strips, as shown in the ninth figure. The column (72) to support and strengthen the ribs (26) ί ίί: when the clamping member (24) The substrate is placed on the cutting machine center (22), and the substrate is placed together to form a clamping member plane (74), a flange plane 76) and a supporting plane (78). The clamping member (24), any ' Clamping piece

Or the ribs (60) of the y-clamping member (70b) are adjacent to each other along the clamping member J (, section (4)). The flange plane (the upper support flange (58) faces the concave surface (67) and the face of the cutter clamp (22) is formed. The section (46) of the substrate (26) is along the support plane (78) ) is adjacent to the support pad (3〇). The shape and size of the ribs (60) of the clamping member (24) further spatially replace the clamping member plane (74) and the flange plane (76). The plane (, 7 8 ) is formed between the flange plane (76) and the clamping member plane (74). The space between the clamping member=face (74) and the flange plane (76) is mutually displaced to the substrate. (2 6 ) is more easily cut off so that the cutting blade (68) is inserted through each gap (62) and separated along the X-separation line (66a) & y-dividing line (66b) The cut QFN package (44a) is not in contact with the flange (58). § The cutting blade (6 8 ) is inserted into each gap (6 2 ) of the holder (2 4 ) to cut the corresponding portion of the substrate (26) Cutting blade (68) and support when section (46)

1250621

5. Invention Description (12) (3 0 ) Overlap to cut off one part. Referring to the tenth figure, the semiconductor package cutting system (20) is used to perform the semiconductor package cutting method (1 0 0 ) 'semiconductor package cutting method (1 〇〇), the substrate (2 6 ) is in the step < 1 1 0 &gt First, it is positioned on the support cymbal (30) of the cutter clamp (2 2 ), preferably using a pick-and-place device (not shown). The pick and place device is used for picking up, processing, and finally releasing the substrate (2 6 ). When the substrate (26) is picked up for transfer to the cutter jig (2 2 ), a positioning tool (not shown) on the pick and place device is engaged with the substrate (2β) to cause the substrate (26) to be grasped Unit alignment. The pick and place device is pre-aligned with the cutter clamp (2 2 ). Therefore, when the pick-and-place device positions the substrate (26) on the support pad (30) in step <1 1>, the substrate (26) has been aligned with the support pad (3). In the next step <11 2> after the step <1 10>, the vacuum pump is activated to grasp the substrate (26) to the cutter jig (2 2 ). Next, in step <1 1 3 >, the substrate (26) is partially cut by the cutting blade (68) to separate the lead frame (42) from the section (46) of the substrate (26). After the step < 1 1 3 >, in step <1 1 4 >, the 'X-clamping member (70a) is placed on the cutter jig (22) to sandwich the substrate (26) therebetween. Once the leadframe (42) is separated from the section (46), a space is created between each pair of adjacent sections (46) to X-clamp in step <1<1> 7 0 a) When placed on the cutter clamp (2 2 ), it better accommodates the corresponding strut (72) of the X-clamp (70 a). On the other hand, when the substrate (26) contains only one of the segments (46) (not shown) and more than one segment has a reduced peripheral spacing, the X-clamping member (70a) does not require a post (72). When the X-clamping member (70a) does not have the support (72), the step of cutting the substrate (26) in advance <1 1 3 > can be skipped.

INVENT20040901PI50.ptd Page 19 1250621 V. Description of the invention (13) to allow the step < 1 1 4 > to be performed in the step < 1 1 2 > Once the substrate (26) is firmly clamped between the cutting; the clamp (22) and the r piece (70 a), in the step <1 1 6 >, the cut treasure, the shuang s holding σ blade (6 8 ) is guided, s through each gap (62) of the x-clamp (70a). V through 'through each gap Γ Fi ?, the cutting blade (68) is first loaded into the uncut qFn package (44a)', a ' along the z-axis (80), and then along the X-divide (66a) to,. QFN package (44b).卞 彳 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The introduced cutting force is separated from its pre-positioning position. Therefore, the shape and size of the rib (60) of the X-clamping member (7 〇 ΑΑ丄 / /, ^, inch WUa) can be selected to be like a finger (82). ), extending from a clamping member (7〇a) strut (72) and pressing only one portion of each section (4 6 ) of the substrate (26) as shown in FIG.每一When each uncut _package (44a) is substantially not miniaturized, the 基板_clamping member (7〇a) may be used to clamp the substrate when cutting along the X-dividing line (66a) (26) However, each uncut QFN package (44a) must be sized to allow vacuum to generate suction through the pad channel (32) and to traverse the structurally intact portion of the substrate (26) to uncut y _ The dividing line (66b) substantially fixes the substrate (26) during cutting of the cutting blade (68). Although in this case the x_missing member (7〇a) may not be used, it is still necessary to use the y-clamping member. (70b) to cut along the y-divider line (66b). After the half-cut QFN package (44b) is taken, the step <118>-clamping member (7〇a) is detached from the cutter jig (22). Then in step <12〇>,

1250621 V. INSTRUCTION DESCRIPTION (14) A y-clamp (70b) is placed on the cutter jig (22) to hold the half-cut QFN package (44b) therebetween. The cutting blade (68) is then inserted into the half-cut qf? N package (4 4 b ) in step <122 &gt; to the z-axis (8 0 ), and then taken along each y-divider line (66b) Cut qfn package. The suction from the pad channel (32) and the clamping force from the y-clamp (7〇b) are cut into the cutting force when cutting along the 乂-dividal line (66b), avoiding the half-cut QFN package (4) 4 b ) can move and leave. The z-axis (80) is generally perpendicular to the X-dividing line (66a) and the [dividing line (66b). Since the support 塾(3 〇) has elastic restoring force, the cutting of the uncut QFN package (4 4 a ) in the step &lt; 1 丨 6 &gt; and the cutting of the half-cut QFN in the step &lt; 1 2 2 &gt; are reduced. During the encapsulation (44b), the cutting blade (68) is deflected by the cutting force of the cutting blade (68) when it is guided along the z-axis (8 turns) to the support pad (30). In the step &lt;124&gt;, the Υ-clamping member (70b) is detached from the cutter jig (22) to expose the cut QFN package (44c). The suction from the pad channel (32) further prevents the cut QFN package (44(:) from being displaced during and after the removal of the ¥-clamp (7〇b) from the cutter jig (2 2 ). Semiconductor package cutting method ( 100) Step &lt;114&gt; to Step &lt;124&gt; Description Cutting along the ^ dividing line (66a) before cutting along the y-dividing line (66b) to take the cut by the uncut QFN package (44a) QFN package (4 4 c ). However, the 'steps &lt; 1 1 4 &gt; to step &lt; 1 2 4 &gt; can be rearranged to make the y_clamps cut along the y-divider line (6 6b) It is arranged to take the cut QFN package (44c) before the X-clamp member cut along the χ_ separation line (66a). When the substrate first uses the y_clamping member along the y-separation line (66b) When cutting, since the struts (7 2 ) are not formed on the y-lost piece (7 〇b),

INVENT20040901PI50.ptd Page 21 1250621 V. DESCRIPTION OF THE INVENTION (15) The step of cutting the substrate &lt;1 1 3 &gt; can be omitted, so that it is not necessary to be adjacent to the segment (4 6 ) in the step &lt; Π 3> The space created between them makes room adjustments. Once the substrate (26) is cut along the y-dividing line (6 6 b ), the lead frame (42) between the segments (46) before the substrate (26) is cut along the X-dividing line (66a) The water that was introduced was washed away. After the step &lt; 1 2 4 &gt;, the grab unit of the pick-and-place device (not shown) in step &lt; 1 2 6 &gt; engages and grabs the cut qF N package. Then the vacuum pump is no longer operated in step &lt; 1 2 8 &gt;, after which the gripper removes the cut QFN package (44c) from the cutter clamp (22) in step &lt;1 3 0 &gt; Follow-up processing. In step &lt;130&gt;, the gripper places the cut QFN package (44c) in a frame. The frame and its internally cut q F N package (4 4 c ) are initially in the rinsing process to remove debris and dust, followed by a drying process. The cleaned, cut Q F N package (4 4 c) is sorted and placed in a pedestal, gantry or such semiconductor package storage assembly. Kind as the thousand

Second embodiment of the present invention

The body package cutting system consists of three main components: a cutter clamp (22) ‘ a clamping member (24) formed with a plurality of ribs (6 turns). The first substrate (2 6 ), the base plate (28), the pad channel (32), the plurality of ribs (6〇), and the 2-axis (8〇) associated with the first &amp; The structural composition and the positional relationship of each other are explained as follows. In the first bead yoke, the female rib (β Q ) comprises a solid beam (g 2 and a compressible layer (94). The solid beam (92) comprises a cutting member (24) placed in the cutting The machine clamp is (2 2 ), and the inner surface (96) of the support pad (30) faces the outer and outer π ^ L. The compressible layer (9 4) 杲, ; 兮 | 兮 μ mw , the inner surface (g6) of the sturdy beam (92)

1250621 i 'Inventive description (16). Shape or combination with it. The compressible layer (9 4 ) is made of rubber, elastomer, polymer or such elastic recovery material. When the substrate (26) is held between the clamping; (24) and the cutter clamp (22), the compressible layer (94) forms a joint between the solid beam (92) and the substrate (26). The missing member plane (γ4) is generally formed along the joint between the compressible layer (94) and the substrate (26). Although only QFn is discussed in this embodiment of the present invention, the body-package cutting system and the semiconductor cutting method are not arranged, the clothing, the tomb, and the other forms of semi-conductive crystal.

In the foregoing practice, the absence of a granulating system and apparatus for a bulk encapsulation method is well known in the art or modifications without departing from the two semiconductor package cutting dicings according to the present invention. Although the present invention clearly exemplifies the implementation of the conventional processing in accordance with the scope and spirit of the disclosed invention, only two implementations are described.

1250621 Brief description of the diagram [Simplified illustration of the diagram. Figure 1 a. A semiconductor package cutting system has an exploded view of a single support pad. A y-clamp is placed on the cutter fixture and the substrate. First b diagram: The semiconductor package cutting system of the first diagram has a three-dimensional split diagram of a plurality of support pads. Second: A partial cross-sectional view of the semiconductor package cutting system of the first figure, with an X-clamp placed on the cutter jig to hold the half-cut QF N package therebetween. Figure 3: A partial cross-sectional view of the semiconductor package cutting system of the first figure. a四之图· is the view of the y-clamp of the figure i. The fourth b-picture is a partial front view of the 'A' in the y-clamp of the fourth figure a. Figure 5: A partial plan view of an uncut QFN package forming a segment of the first a substrate, having an X-divider line and a y-divider line. Figure 6: X-cut along the uncut QFN package of Figure 5. A partial plan view of a half-cut QFN package obtained by dividing the wire. Figure 7 · Partial plan view of the cut QF N package taken along the y-divider cut of the half-cut QFN package in Figure 6. Figure 8 is a partial cross-sectional view of the second embodiment of the semiconductor package cutting system with an X-clamp placed in the cutter jig to hold the cut QFN package therebetween.

Page 24 INVENT20040901PI50.ptd 1250621 Schematic description of the ninth figure: for the second picture edge extension, the tenth picture: the first semiconductor can be eleventh picture: for the ninth as the finger twelfth picture: for the first A plan view of the X-clamp having ribs on the self-convex structure and supported by the struts. The semiconductor package cutting system of Figure a performs a flow chart of the package cutting method. Figure X - Plan view of the gripping member, the shape of the rib extending from at least one of the flange or post. A partial cross-sectional view of the semiconductor package cutting system of Figure a, wherein each rib is formed with a solid beam and a compressible layer. Main component symbol description] (2 2) Cutter fixture (2 6) Substrate (30) Support pad (36) Recess (40) Plate surface (44a) Not &quot;t knife damage|J's QFN I inch (44c) cut QFN package (4 8 a) substrate positioning pin (50) cutting table (5 8) flange (6 2 ) gap (6 6 b ) y - dividing line (6 7 ) concave surface (70a) x - Clamping member (20) Semiconductor package cutting system (24) Clamping member (28) Base plate (32) Pad channel (38) Plate channel (42) Lead frame (44b) Half-cut QFN package (4 6 Section (4 8 b) positioning hole (52) vacuum 埠 (60) rib (6 6 a) X - dividing line (66c, 66d) positioning channel (6 8) cutting blade

INVENT20040901PI50.ptd Page 25 1250621 Brief description of the diagram (7 2 ) Pillar (7 6 ) Flange plane (8 0 ) z - Axis (9 2 ) Solid beam (9 6 ) Inner surface <1 1 0 &gt; Positioning substrate &lt ; Π 3 &gt; pre-cut substrate (70b) y-clamping member (74) clamping member plane (78) supporting plane (8 2 ) fingers. (9 4 ) compressible layer (1 0 0 ) semiconductor package Cutting method &lt; 1 1 2 &gt; Start vacuum pump &lt; 1 1 4 &gt; Place X - grip on the cutter jig &lt; 1 1 6 &gt; Cut along the X-separation line &lt; 1 1 8 &gt ; Remove the X-clamp _ &lt; 1 2 0 &gt; Place the y - the holder on the cutter jig &lt; 1 2 2 &gt; Cut along the y - divider line &lt; 1 2 4 &gt; Unload y - Clamping piece &lt;126> Grab and cut QFN package &lt;128> Stop vacuum pump &lt;130> Remove the cut QFN package from the cutting machine fixture for subsequent processing

INVENT20040901PI50.ptd第26页

Claims (1)

1250621 六, 1 · A semi- and one-cutting machine for applying suction pads for elastic recovery. The substrate contains the first and the cutting parts as the clamps, which hinder the cutting and the application of the film. The conductor package cutting jig includes a cutting blade that is displaced from the substrate when the substrate is held between the cutters. 2. Cutting machine board, support 3. Support 塾 持 垫 大 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 申请 申请 申请 如 如 申请 申请 申请 申请The clamp is clamped without the cutting blade being applied to the base substrate between the substrates to prevent the patented step-by-step pad from combining the elasticity and the patented surface supporting the flat surface and the substrate is vacuumed to make the base substrate and the second cooperation force The substrate enters a system for absorbing a separate suction substrate, and the support substrate is fixed to at least a portion; the clamp member, the force of the clamped plate and the clamp first and further at least include: the support of the plate is cut The machine part is such that the base is further removed from the cutting machine by a portion of the second part of the clamping member or the pad, the cutting machine loses Mh to support the semiconductor package and the plate is clamped therebetween to fix the substrate For the clamp and the missing part; preventing the displacement from acting on the substrate or at least the second part when the cutting force is applied: the semiconductor package cutting system described in Item 1, :f ΐ Engaging the substrate with the substrate pad friction plus her grip on the substrate. The 暮 暮 私 ¥ ¥ 体 体 体 体 体 体 第 第 第 第 第 第 第 第 体 体 体 体 体 体 体 体 体 ^ 体 体 体 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ 〃夂k and the first and second complexes of the substrate and the support pad are only ii, bitter i, which is generated so that the substrate is substantially Mocking INVENT20040901PI50.ptd Page 27 1250621 VI. Patent application scope support pad vacuum combination 4. The semi-conductive package bottom plate described in claim 3 includes: ° system, base is formed in the recess in the base plate; The plate channel extending from the concave plate from the base plate surface, when the base plate is combined, the base plate surface and the support pad are--, the wide support pad and each plate channel are aligned with the corresponding pad channel to make the groove: The lawsuit is consistent, gas communication is easier; a cutting table is placed between the pad channels to place the cutter jig thereon; the month b that can be created in the recess is combined with the recess of the base plate and the vacuum vacuum is applied. 〃 2 5. The semiconductor 奘^ support pad according to item 2 of the patent application is made of rubber, elastomer or polymer. The cutting guide system, 6 · The semi-conductive clamping member according to item 2 of the patent application scope includes: a cow body package cutting system, the first part of the substrate and the second rib are compressed by each of the plurality of ribs A rib is respectively associated with the adjacent rib: "The shape and size of each of the gaps a formed between each pair of adjacent ribs allows the cutting blade to pass therethrough. B, ,, and the gap of the parent's 7' ht ^ #利围The six-part semi-conducting ribs are shaped and sized according to the sealable, 丨 system, and the at least one soil holding member of the substrate can be placed on the cutter jig. The semiconductor is concave. The clamping member can be combined with the cutter fixture, &quot;/ 切 糸 , , 口 口 , INV INV INV INV INVENT20040901PI50.ptd 1250621 = shape and size between at least one portion of the support pad. Supporting pad 9. The clamping member of claim 8 further comprises: a carcass encapsulation cutting system, a flange, the plurality of ribbed plates At least one portion extends to extend, and when the flange is along the substrate, the substrate supported by the support is exposed to the cutter clamp assembly 1. As described in claim 9 to! f;:; i^ λ y, J 〇 ' The flange is ° flat: the profit; the description: Lr is equipped with a cutting system, and the t-plate is full "support one clip: between 1 and 2, a flange plane faces outward at the flange One of the cutter clamps is formed such that the support pad coincides with the flange plane and the substrate abuts the support pad along a support plane, and the cutting blade coincides with the support pad to thereby cut a portion when the substrate is cut. ^ 2 · The semiconductor package cutting system described in claim 11 of the patent application. The shape and size of the plurality of ribs and the support pad are spatially displaced from each other to the plane of the clamping member and the plane of the flange, and the supporting plane is formed between the plane of the flange and the plane of the clamping member, wherein the plane and the convex portion of the clamping member The mutual replacement of the spaces between the edge planes makes the substrate easier to cut so as to separate the first and second portions of the cutting blade between each pair of ribs without being in contact with the flange. 1 3 · As claimed in claim 12, the semiconductor package cutting system, each rib comprises: INVENT20040901PI50.ptd Page 29 1250621 « '--- VI. Apply for a patented range of solid beams, with one on the inside of the support ^^^~ on the support pad; on the face of the cutter fixture - the compressible layer, Along the sturdy beam, the compressible layer is made of or bonded to rubber, elastomer or polymer, and the substrate is held in the holder, and the compression layer is formed between the solid beam and the substrate. Between the clamps, the body can be formed along the joint surface between the compressible layer and the substrate to form a furnace=face, and the clamping member is large. 14 The semiconductor sealing base plate according to the second aspect of the patent application includes: a knife cutting system, a plurality Only the substrate positioning pins correspond to the middle members formed in the substrate, each positioning component is a hole or a notch, and each of the positioning groups corresponding to the positioning pins cooperates to align the substrate with the cutting device and a semiconductor device. The package cutting method comprises the following: + a device for mounting a cutter holder with a support pad; 夕 ^. positioning a substrate on the support pad; applying a suction force on the substrate by the cutter clamp to make the cutter clamp The pad is elastically restorative, the second substrate is fixed to the semiconductor package and the substrate includes the first and second portions; and the portion is used to cooperate with the cutter fixture to apply the substrate holder Clamping force on the substrate to further two /, between, clamp fixture, but not IA 铋 从 + from the soil plate 疋 切割 on the cutting machine (three) in the substrate is lost in the cutter clip 1 梏 梏 夕 夕 阻碍 阻碍 阻碍 阻碍 阻碍When the blade enters between at least one portion of the substrate, the suction and the holding force on the substrate are substantially prevented from being displaced when the blade is diced and the substrate is separated to separate the first and second portions. 1250621 6. Patent application scope----, wherein the suction force applied to the substrate further prevents the first part or the second part of the substrate from being displaced or removed from the substrate; the substrate portion Displacement. V ~ 1 6 · The method of positioning the substrate on the support pad according to the semiconductor package of the fifth paragraph of the patent application includes the following steps: A base plate is mounted on the cutter fixture to bond the support pad, the support pad engages the substrate and the base plate, the support pad is elastic and applies a frictional grip force on the substrate; and the soil positions the substrate on the support pad at a plurality of The first surface of the support pad extends above the pad channel of the second surface, the support pad is substantially planar and the first side and the second side face outward; accordingly, the substrate is supported by the cutter fixture and the substrate and the support pad When the first side is adjacent, vacuum is created through the plurality of channels to substantially vacuum bond the substrate to the support pad, wherein the support pad is made of rubber, elastomer, or polymer. 1 7 - The semiconductor package cutting method according to claim 16 of the invention claims the step of mounting a substrate plate on the cutter jig further comprising the steps of: forming a recess in the base plate; forming the complex number only from the recess a plate passage extending to the base plate surface. When the support jaw is combined with the base plate, the base plate surface is in close contact with the second surface of the support pad, and each plate channel is aligned with a corresponding one of the corresponding channels to allow the recess and the channel The gas flow between the two is easier; place the cutter fixture on the cutting table; join a vacuum pump to the base plate recess and operate in the recess INVENT20040901PI50.ptd Page 31 1250621 6. Apply for a patent to create a vacuum. 18·If the patent application scope is 16th, the clamping member and the cutting machine are clamped by one person for the 11-ton body sealing method, forming a plurality of self-clamping; = "including" steps: shape and size forming a loss a force-bearing strip, at least a portion of the concave surface of the rib-shaped plate; the first and second portions of the cutting device holder can be used to press the substrate with a corresponding rib. Each rib is spaced apart from the adjacent rib; (4) 4! The gap is formed between each pair of adjacent ribs, and the shape and size of each gap is such that the cutting blade can pass therethrough. Parent gap 1 9 · As claimed in claim 18 a step-cutting method in which the top and the cymbal cooperate with the cutter fixture, and the clamping member is coupled to the cutter to the at least one portion of the cutter, the rib and the support pad, "at least" the substrate The shape and size of the temple; the shape of the temple is adapted to make the plurality of ribs substantially along the fold. Among them, the plurality of ribs are from a convex surface::: the surface is adjacent to the substrate; at least one portion of the periphery of the base plate extends ^The edge is a plane and the base supporting the support pad when combined The plate is exposed; &quot;piece and cutter fixture, according to this, when at least one of the clamping members and the cutting == Α between at least one portion of the support pad and at least one of the eccentric soil plates being lost w The kneading surface is formed on the flange facing outwards of the cutter fixture - Τ 、, ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, According to the item Fengdao μ j H #千¥ body package cutting method, INVENT20040901PI50.ptd Page 32 1250621 VI. Patent application scope The steps of cooperation between the clamping member and the cutter fixture further include the following steps: The shape and size of the plurality of ribs and the support pad are spatially interchangeable with each other. a flange plane, the support plane is formed between the flange plane and the plane of the missing member; the support pad is shaped and dimensioned to conform to a cutting blade to thereby cut a portion during cutting of the substrate; wherein the clamping member The mutual replacement of the space between the plane and the plane of the flange makes it easier to cut the substrate, whereby the first and second portions are separated without touching the flange when the cutting blade is inserted between each pair of ribs. 2 1. The semiconductor package cutting method according to claim 20, wherein the step of forming the plurality of ribs further comprises the steps of: forming a plurality of ribs, wherein each rib comprises: a solid beam having a clip The inner surface of the support pad is placed on the cutter jig; a compressible layer is formed along the inner surface of the solid beam or combined with the inner surface of the solid beam, and the compressible layer is made of rubber, elastomer or polymer; When the substrate is held between the clamp and the cutter clamp, the compressible layer forms a joint between the solid beam and the substrate and the clamp plane is generally formed along the interface between the compressible layer and the substrate. 22. The semiconductor package cutting method according to claim 20, wherein the step of cooperating the clamping member with the cutter jig to sandwich the substrate therebetween comprises the steps of: mounting a plurality of substrates on the substrate plate only formed thereon a substrate positioning pin; providing a plurality of positioning components formed only in the substrate, each positioning group INVENT20040901PI50.ptd Page 33 1250621 Sixth, the application of the scope of the patent to become a hole or pin corresponding; so that the substrate of each of the substrate and the cutting semiconductor machine with a strong mouth suction, the support pad is a first semiconductor The first half is not formed in the first half of the notch; the complex number is only 2 3 . A cutting cutter clamp is applied to the positioning component machine to the package cutting 'including the positioning component and the complex σ I number, the substrate positioning and the corresponding substrate The positioning pins are aligned. Interacting with the system, comprising: supporting the substrate on the substrate to fix the substrate on the substrate _ sexual restoring force and the substrate is wrapped in the cutter lost package; the conductor package conductor package pad, the tangential line; a first clamping member A clamping member is applied to the clamping device to block the time-dependent portion between the cutting members; accordingly, when the body is packaged from the first plate, the application of the clamping force to the substrate and the cutting machine is not applied. The blade enters the suction force along the first body package portion, and the first semiconductor package further prevents the suction of the first substrate from being formed in the clamping member by the second semiconductor package, such as the application for the patent plate or the base range. The second half of the knife and the first - the main. - limb package; and the brother-+conductor package, a separation fixture cooperates to clamp the substrate onto the substrate to further cause it to be deviated from the cutter fixture and the at least one of the substrate The wire cuts the substrate such that the first semi-distribution 'cutting force is substantially prevented from being displaced by the cutting blade introduction base and the clamping force, and after the two semiconductor packages are separated, the application side; the displacement of the semiconductor package and the second semiconductor package board during removal . , the semiconductor package cutting system, INVENT20040901PI50.ptd Page 34 1250621 The scope of the patent application further includes a partitioning piece between the substrate and the forming substrate, and a second clamping member between the cutting machine clamps; accordingly, when the body is packaged from the first plate, the application is in the second The suction of the substrate and the third semi-conductive displacement. 2 5 ·If the cutting machine fixture is a base support pad for the elastomer or the polymer composite pad only is generally flat and generally semi-conductive to the substrate semiconductor progressive body package, please patent further plate to form a self-supporting surface and The first step of the cutter cutter collaborating to hold the substrate therebetween includes: τ a third semiconductor package separated by the second semiconductor package; j the second separation line between the first semiconductor package and the third semiconductor package is substantially The first dividing line is vertical; the holding member applies a holding force on the substrate to advance the substrate to be fixed without being rubbed on the substrate to be clamped to the cutter jig and the clamping member cutting blade into the second dividing line and the substrate at least One portion/cutting the substrate next to the first dividing line to separate the second semiconductor package, the cutting force is substantially prevented from being displaced by the suction force and the clamping force introduced into the substrate by the cutting blade, and the package is applied after the third semiconductor package is separated. The semiconductor package is cut to prevent the first semiconductor package and the second semiconductor package from being removed from or removed from the substrate during the removal of the substrate. The system comprises: a H-supporting pad supporting the substrate and the base plate, adding a frictional force to the substrate, the support pad being made of rubber, a bullet and comprising: a pad channel extending from the first side to the second side, the support surface and the first surface The face is facing outward, and the base plate contains INVENT2004090lPi50.ptci Page 35 1250621 a recess formed in the base plate; a plurality of plate passages extending only from the recess to the base plate surface, and the surface of the bottom plate of the US base plate is in contact with the base plate and the second two seals of the support pad, each The plate channel is aligned with a corresponding pad channel to facilitate gas flow between the recess and the pad channel; + accordingly, when the substrate is supported by the cutter jig and the substrate is adjacent to the first side of the support pad, the vacuum passes through the plurality Only the channels are created to generally vacuum bond the substrate to the support pad. ' 2 6 · The semiconductor package cutting system according to claim 23, further comprising: a cutting table for placing the cutter fixture; a vacuum pump coupled to the recess of the base plate, operable A vacuum is created in the recess. The semiconductor package cutting system of claim 23, wherein the clamping member comprises: a plurality of ribs, each of the first semiconductor package, the second semiconductor package and the second semiconductor package of the substrate are provided by a corresponding rib Pressing onto at least one of the support pads, the support pad is deformable to fit the shape and size of the substrate, the plurality of ribs being spaced apart from the adjacent ribs, the shape and size of which are placed in the cutting member and placed in the cutting a concave surface of at least one portion of the substrate when the fixture is clamped; A plurality of gaps formed in each pair of adjacent ribs and the size of the gap can be %, ^ ^ ^ . 4 a cutting blade passes through the middle teeth, INVENT 20040901 Pl50.ptd Page 36 1250621 VI. Patent application-Flange, the plurality of ribs extending from the flange, the flange extending along at least a portion of the periphery of the base plate to enable the clamping member to engage the cutter clamp The substrate supported by the support pad is exposed to the plurality of ribs. 2. The semiconductor package cutting system according to claim 27, further comprising: a substantially planar surface of the clamping member formed along a joint surface between the plurality of ribs and the substrate; and at least one clamping member is coupled to the cutter fixture When the substrate is clamped between at least one portion of the support pad and the at least one rib, a flange plane is formed on the flange surface of the flange facing outward on the face of the cutter fixture, and the support pad coincides with the plane of the flange; The joint surface between the substrate and the support pad forms a support plane, and the shape and size of the plurality of ribs and the support pad are spatially mutually displaced to replace the plane of the clamp and the plane of the flange, and the support plane is formed on the plane and the flange of the flange Between the planes of the holding members and parallel thereto; wherein the spaces between the clamping plane and the plane of the flanges are mutually displaced, thereby making it easier to cut the substrate, thereby separating the first and second when the cutting blade is inserted between each pair of ribs Part of it does not touch the flange, and the cutting blade coincides with the support pad to cut a portion during cutting of the substrate. 2 9. The semiconductor package cutting system of claim 28, wherein each rib comprises: a solid beam having an inner surface facing the support pad when the clamping member is placed on the cutter fixture; a layer formed along or integrated with the inner surface of a solid beam INVENT20040901PI50.ptd Page 37 1250621 VI. Scope of Application * The compressible layer is made of rubber, elastomer or polymer; wherein the compressible layer is strong when the substrate is held between the clamp and the cutter fixture A joint surface is formed between the beam and the substrate, and the plane of the clip is formed substantially along the joint surface between the compressible layer and the substrate. _ 3 0. The semiconductor package cutting system according to claim 28, wherein the base plate comprises: a plurality of substrate positioning pins corresponding to a plurality of positioning components formed in the substrate, each positioning component being a hole or a gap Each positioning assembly cooperates with a corresponding substrate positioning pin to align the substrate with the cutter clamp. INVENT20040901PI50.ptd Page 38