TWI250602B - Method for testing a substrate and a common clamp used for the method - Google Patents

Abstract

According to a method for testing a substrate, a substrate and a common clamp are provided. On an upper surface of the substrate, at least a chip had been disposed. The common clamp has a opening and an elastic protection ring around the opening. When testing, the common clamp and its elastic protection ring are pressed against the upper surface of the substrate, the opening is aligned with the chip to avoid damage of the chip by pressing the common clamp. When the other component is disposed on the upper surface of the substrate, the elastic protection ring can protect the component without damage caused by pressing, and ensure that the plurality of contacts on a bottom surface of the substrate are connected by probes.

Description

1250602

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate testing method and its use. In particular, it relates to a substrate open/short circuit for tapping a plurality of components on a substrate before sealing in a semiconductor packaging process. testing method. [Prior Art] Conventional semiconductor products require specific test tests during the packaging process, such as open/short test, to confirm the yield of individual seals and avoid unsuitable materials. After being misused, it is still packaged by 2 performances. The conventional substrate is subjected to an open/short test after the die bonding and before the sealing, to test whether the connection state of the wafer and the substrate is good, and to prevent the electrically connected wafer from being sealed by the sealant. In addition, passive components or other small protrusions are additionally provided on the substrate to increase electrical protection, electrical functions or special applications to meet different needs of semiconductor package products. Referring to FIG. 1, a substrate 10 has an upper surface η and a lower surface. At least a wafer 2A and a passive component 40 are disposed on the distal surface 11, and the lower surface 12 of the substrate 10 is provided. A plurality of connecting ends 13 are formed. The active surface of the wafer 20 is formed with a plurality of solder pads 2 ^. The wafer 20 is adhered to the upper surface 丨j of the substrate 1 by a die bonding material 22, and is electrically connected by a plurality of bonding wires 30. The pads 21 are to the substrate 1 . An open/short test is usually performed before the seal is applied. As shown in FIGS. 1 and 3, the substrate 10 is placed on a test board 5 of a test machine, and a platen 100 is pressed against the substrate 1A above the substrate 1 to avoid the platen. The wafer 20 and the passive component 4 are crushed, and the pressure plate 1 is formed with at least one opening.

1250602 V. DESCRIPTION OF THE INVENTION (2) Port 110 having a size greater than the size of the wafer 20 and the passive component 40 to prevent the i-chip 2 from being crushed when the platen 1 is pressed against the substrate 10 Hey, . The conductive wire 30 is connected to the passive component 4, and the passive component 4 is changed according to the product. Therefore, the pressure plate 1 needs to be provided with a larger size of the opening 110 to match the passive The possible positional change of component 4. Referring to Figures 2 and 3, since the opening 11 of the platen 1 is large in size, the platen 1 does not uniformly touch the substrate 1 and the upper surface 11 during the test. Resulting that the lower surface 12 of the substrate 1 cannot be flatly pressed onto the plurality of detecting members 5 on the test board 5, resulting in a portion of the connecting ends 13, particularly in the opening 11 The connecting ends 13' are not able to be detected by the detecting members 51 of the test board 50, and the electrical disconnection makes the result of the pay-open/open-circuit test unbreakable. The current improvement is to design individual platens for different types of semiconductor package products according to the positional changes of the passive components, and different platens have small recesses corresponding to the position of the passive components to enable the above-mentioned openings for aligning the wafers. The size can be effectively reduced, so that although the detection error can be prevented, in the diversified product, the agricultural process, the pressure plate for the specific product should be replaced frequently, which will reduce the test efficiency. In addition, once the platen is incorrectly installed or forgotten for replacement, the entire batch of products is often damaged, resulting in a decrease in production yield. This is a problem currently encountered. SUMMARY OF THE INVENTION In order to solve the above problems, the main object of the present invention is to provide a substrate testing method and a universal pressure plate used in the method, which provides a substrate, and one of the upper surfaces of the substrate is provided with at least one surface. crystal

1250602_____ V. Invention Description (3) """"""" ----- The sheet has an opening that can be aligned with the wafer and a = guard ring ^ The periphery of the opening is formed with a notch, and the elastic protection ring is disposed on the notch. Therefore, the universal pressure plate and the elastic protection test press the upper surface of the substrate, so that the connection pad on the lower surface of the substrate can It is probed by a plurality of detectors of a test board for proper open/break test. In addition, the use of the resilient guard ring in the recess prevents passive components or other components on the substrate from being directly damaged by the pressure plate. A second object of the present invention is to provide a substrate testing method, wherein a substrate is provided with a first component and a second component, wherein the first component is preferably higher than the second component, and A 10,000-type pressure plate is provided on the substrate, wherein the universal pressure plate has at least one opening and an elastic protective glue, and a periphery of the opening is formed with a recessed portion, and the elastic adhesive is disposed in the recessed area. The universal pressure plate touches the substrate, the first component is aligned in the opening of the universal pressure plate, and the second component is elastically pressed by the elastic protective rubber, so that the opening can be small The substrate is uniformly pressed under the conditions, and the platen does not need to be frequently replaced during the test. According to the substrate testing method of the present invention, a substrate is provided, the substrate having an upper surface and a lower surface, at least one wafer is disposed on the upper surface of the substrate, and the lower surface of the substrate is formed with a plurality of connections Carrying the substrate to a test board; and providing a 10,000-type pressure plate on the base f, wherein the universal pressure plate has at least one opening and a spring protection %' The elastic protection ring is disposed on the far-notch; the universal pressure plate and the elastic protection ring thereof are pressed onto the substrate

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The surface is such that the terminals of the germanium substrate are routed to the test board and the wafer is aligned within the opening of the universal press plate. [Embodiment] Referring to the drawings, the present invention will be described by way of the following embodiments: Figures 4 to 6 are related to the present invention disclosed in the first embodiment = a substrate testing method, which can be applied In the semiconductor packaging process, and after the bonding step and before the sealing step. First, referring to Fig. 4, a substrate 10 having an upper surface u and a lower surface 12 is provided. In this embodiment, the substrate has a two-way conductive structure and can be a collection of a plurality of cells (not shown). For each cell, at least one of the wafers is bonded. The crystal material 22 is disposed on the upper surface 11 of the substrate 10. In the embodiment, it is a first component on the substrate 1 , and a plurality of bonding wires 30 or other electrically conductive components are electrically connected. A plurality of pads 21 of the wafer 20 are bonded to the substrate. In addition, at least one passive component 40 or other smaller protruding component is also disposed on the upper surface 11 of the substrate, which is a second component on the substrate 1 , wherein the passive component 40 should be lower than The wafer 20 is either lower than the arc height of the bonding wires 3 . Further, a lower surface 12 of the substrate 10 is formed with a plurality of connecting ends 13, such as pads. Then, please refer to FIG. 5, the substrate 10 is transported to the test board 50 of a test machine. The test board 50 has a plurality of detecting members 5, for example, probes for detecting the substrate 10. The connecting end 13 is provided with a pressing plate 200 on the substrate 1 , see FIGS. 5 and 7 , wherein the universal pressing plate 20 0 has at least one opening 2 10 and an elastic protection ring 22〇. ,

Page 11 1250602 V. INSTRUCTIONS (5) Elastic protection ring 2 The 20 series can be made of silicone. The elastic protection ring 22 has a recessed portion on the lower surface thereof. In the embodiment, the recessed portion is formed by a notch 2 3 0 around the opening 210, and the elastic protection ring 2 2 The tether is disposed in the gap 230. Please refer to FIG. 6 , in the course of a test, it is an open/short measurement minus or a universal pressure plate 200 and its elastic protection ring 2 2 〇 to touch the upper surface 11 of the substrate 1 , The connection terminals 13 of the substrate 1 can be pressed and guided to the remote test pieces 51 of the 4 test boards 50 to perform the on/off test. The 'where' or wafer 20 and the bonding wires 3 are aligned in the opening 210 of the universal platen 200, and the elastic protection ring 220 elastically presses the passive component 40 to avoid the universal use. The pressure plate 200 crushes the passive component 4〇. Therefore, the universal pressure plate 20 has an elastic protection ring 220 around the opening 21 且 and in the notch 230, when the universal pressure plate 2 〇〇 and the elastic protection ring 220 touch the substrate 10 The surface u, the agitating element 4〇 and the bonding wires 30 are not directly pressed by the hard body of the universal platen 2 to reduce damage. In addition, please compare the conventional housing plate as shown in FIG. 3 with the universal pressure plate 2 of the first embodiment of the present invention, and the universal pressure plate 2 〇〇 ^ opening 210 can be closer to the wafer 3 The size of the crucible is somewhat larger than the size of the wafer 30, so that it can be smaller than the opening crucible size of the conventional platen to increase the lamination area. At the same time, with the auxiliary elastic compression of the elastic protection ring 22〇, a uniform pressing force is achieved, so that the connecting ends 13 of the substrate 1 are reliably detected by the detecting member 51 of the test board 50 to perform positive " Read open/open circuit test. § The substrate test method of the present invention is embodied in a semiconductor package process, and can be performed after a wafer setting step and in a glue

Page 12 V. Invention Description (6) 10 Ξ ί 4 ί ί ί ί ί ί ί ί ί ί ί ί 以 ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί In the case of the substrate 10, 'even if the passive component 40 is disposed in a different position. To replace the universal pressure plate 200 in the process, the substrate test method of the present invention can be solved in addition to the conventional method. The detection of the 懕1 open/open circuit test is not true and the passive element 1=1 problem can be used in the substrate test of different package types. According to a second embodiment of the present invention, a substrate is provided. The substrate 310 has an upper surface 311 and a lower surface 312. The earth plate 31 0 is a flexible circuit board, a ceramic circuit board or a A printed circuit board. The upper surface 3 11 of the substrate 3 10 is provided with at least a first component 320 and a second component 330, wherein the first component 32 is higher than the second component 330. In this embodiment, the first component 32 is a flip chip, which is bonded to the substrate 31 by bumps 321; and the second component can be a fresh ball, a bump, or other protrusion. In addition, a plurality of connecting ends 313 may be formed on the lower surface 312 of the substrate 31. During the test, a ten thousand pressing plate 40 is first provided on the substrate 310, wherein the universal pressing plate 4 is There is at least one opening 41 对应 corresponding to the first component 320 and an elastic protective adhesive 420. The periphery of the opening 410 is formed with a recessed area 43. The elastic protective adhesive 420 is disposed in the recessed area 430. The enamel platen 400 and the elastic protective adhesive 420 are pressed against the/upper surface 311 of the substrate 3, at which time the first component 320 is aligned The universal platen 4 is in the opening 41 0, and the second element 3 3 0 is the elastic protective adhesive 4 2 〇

1250602

V. Description of invention (7) Elastic pressure contact; ♦ z, flute-Du Jian to evenly press the substrate 31〇 during testing and avoid the damage of the ^ ^ The universal board 40 0 can be applied to the second The substrate 310 is not placed in a different position, and in the semiconductor packaging process of the substrate testing process and the substrate testing operation, there is no need to replace the pressure plate. The scope of the present invention is defined by the scope of the appended claims. Any changes and modifications made without departing from the spirit and scope of the present invention are protected by the present invention. range.

1250602 r —-— Brief description of the drawing [Simplified description of the drawing] Fig. 1: In the conventional substrate test method + sectional view; , a picture · In the conventional substrate test method, J input 2 open / short circuit test Section 3: FIG. 3 is a schematic view of a conventional substrate test method; FIG. 4 is a cross-sectional view of a substrate provided in the substrate measurement according to the present invention; FIG. 5: substrate test according to the present invention A schematic cross-sectional view of the test apparatus; 'Fig. 6 is a schematic cross-sectional view of the substrate test method according to the present invention; Fig. 7 is a schematic view of the bottom surface of the substrate test method according to the present invention; and Fig. 8: Substrate test according to the present invention In the method, a substrate is pressed by a 10,000-plate substrate in a test state, and a substrate in a test machine is pressed on a bottom surface of a press plate provided by a press plate. In the first embodiment, the substrate is transported to a substrate. The test plate of the test state is provided as a schematic cross-sectional view of the second body embodiment when forced. Brief description of component symbols: 10 13 Substrate Connection end 11 Upper surface 20 Wafer 21 Solder pad 30 Bond wire 40 Passive component 50 Test board 51 Probe 12 Lower surface 22 Adhesive

Page 15 1250602 Schematic description 1 0 0 Platen 110 Opening 200 230 million Platen notch 210 Opening 220 Elastic protection ring 310 Substrate 311 Upper surface 312 Lower surface 313 330 Connection end Second element 320 First element 321 Bump 400 430 Universal pressure plate recessed area 410 opening 420 elastic protective rubber Φ

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Claims (1)

1250602 VI. Patent Application Range [Application Patent Scope] 1. A substrate testing method comprising: providing a substrate having an upper surface and a lower surface, at least one wafer being disposed on the upper surface of the substrate, the substrate One of the lower surface is formed with a plurality of connecting ends; the substrate is transported to a test board; and a 10,000 pressure plate is provided on the substrate, wherein the universal pressure plate has at least one opening and an elastic protection ring, the periphery of the opening Forming a notch 'the elastic protection ring is disposed on the notch; and pressing the upper surface of the substrate with the universal pressure plate and the elastic protection ring thereof to guide the connection ends of the substrate to the test board, And the system is placed in the opening of the universal pressure plate. The substrate testing method of claim 1, further comprising: performing an open/short test on the substrate and the wafer by the guiding of the test board. . > 3. The substrate test method of claim 2, wherein after the open/short test, a gel step is additionally included. 4. For the substrate test method described in claim 1, the elastic protection ring is made of silicone. The substrate test method of claim 1, wherein the upper surface of the substrate in the basin is provided with at least one passive component. The substrate test method of claim 5, wherein in the pressing step, the elastic protection ring is pressed against the passive component. 7. The substrate testing method according to claim 1, wherein the surface of the substrate is provided with a plurality of bonding wires electrically connected to the substrate and the substrate. The substrate test method of claim 7, wherein the opening of the universal pressure plate is larger than the wafer, so that the wafer and the bonding wires can be accommodated in the universal pressure plate. Inside the opening. 9. A universal pressure plate suitable for substrate testing, for pressing a substrate provided with at least one wafer, the universal pressure plate having at least one opening and an elastic protection ring, wherein a periphery of the opening is formed with a notch, An elastic protection ring is disposed in the gap. 1 . The universal pressure plate according to claim 9 , wherein the elastic protection ring is made of silicone rubber. 11. A substrate testing method comprising: providing a substrate, the substrate being provided with at least a first component and a second component; and providing a universal pressure plate on the substrate, wherein the universal pressure plate has at least one opening and An elastic protective adhesive, the periphery of the opening is formed with a recessed area, wherein the elastic protective adhesive is disposed in the recessed area; In the test, the universal pressing plate presses the substrate, and the first component is aligned and received in the opening of the universal pressure plate, and the second component is elastically pressed by the elastic protective adhesive. 1 . The substrate testing method according to claim 2, further comprising: performing an open/short test on the substrate (〇pen/sh〇rt test). 1 3 'A substrate test method as described in the scope of the patent application, wherein Page 18 1250602 _________ VI. Scope of Application After the open/short test, another step is included. 1 . The substrate testing method as claimed in claim 3, wherein the protective elastic adhesive is made of Shishijiao. The substrate testing method of claim 1, wherein the first component is a wafer. The substrate testing method according to claim 1 or claim 5, wherein the second component is selected from the group consisting of passive components, solder balls, and bumps - 〇, as in the scope of the patent application The substrate testing method of item, wherein the first component is higher than the second component. Page 19