TW200620517A - Method for testing a substrate and a common clamp used for the method - Google Patents

Method for testing a substrate and a common clamp used for the method

Info

Publication number
TW200620517A
TW200620517A TW093138764A TW93138764A TW200620517A TW 200620517 A TW200620517 A TW 200620517A TW 093138764 A TW093138764 A TW 093138764A TW 93138764 A TW93138764 A TW 93138764A TW 200620517 A TW200620517 A TW 200620517A
Authority
TW
Taiwan
Prior art keywords
substrate
common clamp
testing
chip
opening
Prior art date
Application number
TW093138764A
Other languages
Chinese (zh)
Other versions
TWI250602B (en
Inventor
Yen-Kun Chi
Chun-Hao Huang
Tzung-Lin Chuang
Chi-Feng Hung
Chiu-Ping Huang
Hsiu Chin Wang
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW93138764A priority Critical patent/TWI250602B/en
Application granted granted Critical
Publication of TWI250602B publication Critical patent/TWI250602B/en
Publication of TW200620517A publication Critical patent/TW200620517A/en

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Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

According to a method for testing a substrate, a substrate and a common clamp are provided. On an upper surface of the substrate, at least a chip had been disposed. The common clamp has a opening and an elastic protection ring around the opening. When testing, the common clamp and its elastic protection ring are pressed against the upper surface of the substrate, the opening is aligned with the chip to avoid damage of the chip by pressing the common clamp. When the other component is disposed on the upper surface of the substrate, the elastic protection ring can protect the component without damage caused by pressing, and ensure that the plurality of contacts on a bottom surface of the substrate are connected by probes.
TW93138764A 2004-12-14 2004-12-14 Method for testing a substrate and a common clamp used for the method TWI250602B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93138764A TWI250602B (en) 2004-12-14 2004-12-14 Method for testing a substrate and a common clamp used for the method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93138764A TWI250602B (en) 2004-12-14 2004-12-14 Method for testing a substrate and a common clamp used for the method

Publications (2)

Publication Number Publication Date
TWI250602B TWI250602B (en) 2006-03-01
TW200620517A true TW200620517A (en) 2006-06-16

Family

ID=37433081

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93138764A TWI250602B (en) 2004-12-14 2004-12-14 Method for testing a substrate and a common clamp used for the method

Country Status (1)

Country Link
TW (1) TWI250602B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI678747B (en) * 2018-10-01 2019-12-01 點序科技股份有限公司 Testing device and chip carrier board thereof
CN111312606A (en) * 2019-11-29 2020-06-19 尚越光电科技股份有限公司 Safe and reliable high-voltage-resistant testing equipment for flexible CIGS solar module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI678747B (en) * 2018-10-01 2019-12-01 點序科技股份有限公司 Testing device and chip carrier board thereof
CN111312606A (en) * 2019-11-29 2020-06-19 尚越光电科技股份有限公司 Safe and reliable high-voltage-resistant testing equipment for flexible CIGS solar module
CN111312606B (en) * 2019-11-29 2023-06-02 尚越光电科技股份有限公司 Safe and reliable flexible CIGS solar module high-voltage-resistant test equipment

Also Published As

Publication number Publication date
TWI250602B (en) 2006-03-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees