TW200620517A - Method for testing a substrate and a common clamp used for the method - Google Patents
Method for testing a substrate and a common clamp used for the methodInfo
- Publication number
- TW200620517A TW200620517A TW093138764A TW93138764A TW200620517A TW 200620517 A TW200620517 A TW 200620517A TW 093138764 A TW093138764 A TW 093138764A TW 93138764 A TW93138764 A TW 93138764A TW 200620517 A TW200620517 A TW 200620517A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- common clamp
- testing
- chip
- opening
- Prior art date
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
According to a method for testing a substrate, a substrate and a common clamp are provided. On an upper surface of the substrate, at least a chip had been disposed. The common clamp has a opening and an elastic protection ring around the opening. When testing, the common clamp and its elastic protection ring are pressed against the upper surface of the substrate, the opening is aligned with the chip to avoid damage of the chip by pressing the common clamp. When the other component is disposed on the upper surface of the substrate, the elastic protection ring can protect the component without damage caused by pressing, and ensure that the plurality of contacts on a bottom surface of the substrate are connected by probes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93138764A TWI250602B (en) | 2004-12-14 | 2004-12-14 | Method for testing a substrate and a common clamp used for the method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93138764A TWI250602B (en) | 2004-12-14 | 2004-12-14 | Method for testing a substrate and a common clamp used for the method |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI250602B TWI250602B (en) | 2006-03-01 |
TW200620517A true TW200620517A (en) | 2006-06-16 |
Family
ID=37433081
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW93138764A TWI250602B (en) | 2004-12-14 | 2004-12-14 | Method for testing a substrate and a common clamp used for the method |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI250602B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI678747B (en) * | 2018-10-01 | 2019-12-01 | 點序科技股份有限公司 | Testing device and chip carrier board thereof |
CN111312606A (en) * | 2019-11-29 | 2020-06-19 | 尚越光电科技股份有限公司 | Safe and reliable high-voltage-resistant testing equipment for flexible CIGS solar module |
-
2004
- 2004-12-14 TW TW93138764A patent/TWI250602B/en not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI678747B (en) * | 2018-10-01 | 2019-12-01 | 點序科技股份有限公司 | Testing device and chip carrier board thereof |
CN111312606A (en) * | 2019-11-29 | 2020-06-19 | 尚越光电科技股份有限公司 | Safe and reliable high-voltage-resistant testing equipment for flexible CIGS solar module |
CN111312606B (en) * | 2019-11-29 | 2023-06-02 | 尚越光电科技股份有限公司 | Safe and reliable flexible CIGS solar module high-voltage-resistant test equipment |
Also Published As
Publication number | Publication date |
---|---|
TWI250602B (en) | 2006-03-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |