TWI246620B - A thin film transistor for liquid crystal display and a method for manufacturing the same - Google Patents
A thin film transistor for liquid crystal display and a method for manufacturing the same Download PDFInfo
- Publication number
- TWI246620B TWI246620B TW085110952A TW85110952A TWI246620B TW I246620 B TWI246620 B TW I246620B TW 085110952 A TW085110952 A TW 085110952A TW 85110952 A TW85110952 A TW 85110952A TW I246620 B TWI246620 B TW I246620B
- Authority
- TW
- Taiwan
- Prior art keywords
- insulating layer
- layer
- film transistor
- gate electrode
- array substrate
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 30
- 239000010409 thin film Substances 0.000 title claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 239000004973 liquid crystal related substance Substances 0.000 title abstract description 5
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 150000002500 ions Chemical class 0.000 claims abstract description 19
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 19
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 229920005591 polysilicon Polymers 0.000 claims description 17
- 229910004205 SiNX Inorganic materials 0.000 claims description 7
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 6
- 230000006866 deterioration Effects 0.000 claims description 5
- 239000007943 implant Substances 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 4
- 239000004576 sand Substances 0.000 claims description 3
- 238000005496 tempering Methods 0.000 claims description 3
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 2
- 239000010408 film Substances 0.000 claims 2
- 239000011810 insulating material Substances 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 1
- 230000015556 catabolic process Effects 0.000 abstract description 4
- 238000006731 degradation reaction Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 2
- 230000004913 activation Effects 0.000 abstract 1
- 238000005468 ion implantation Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0312—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
- H10D30/0314—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral top-gate TFTs comprising only a single gate
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6731—Top-gate only TFTs
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- High Energy & Nuclear Physics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Liquid Crystal (AREA)
- Chemical & Material Sciences (AREA)
- Electromagnetism (AREA)
- Crystallography & Structural Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mathematical Physics (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950035200A KR100188090B1 (ko) | 1995-10-12 | 1995-10-12 | 액정 표시 장치용 박막 트랜지스터 기판의 및 그 제조방법 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWI246620B true TWI246620B (en) | 2006-01-01 |
Family
ID=19430017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW085110952A TWI246620B (en) | 1995-10-12 | 1996-09-07 | A thin film transistor for liquid crystal display and a method for manufacturing the same |
Country Status (3)
| Country | Link |
|---|---|
| JP (3) | JP3774278B2 (enExample) |
| KR (1) | KR100188090B1 (enExample) |
| TW (1) | TWI246620B (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3318285B2 (ja) | 1999-05-10 | 2002-08-26 | 松下電器産業株式会社 | 薄膜トランジスタの製造方法 |
| KR101781175B1 (ko) * | 2015-08-31 | 2017-09-22 | 가천대학교 산학협력단 | 초박막 저결정성 실리콘 채널을 갖는 무접합 전계효과 트랜지스터 및 그 제조방법 |
| JP6864158B2 (ja) * | 2018-06-22 | 2021-04-28 | 住友重機械工業株式会社 | 半導体装置のレーザーアニール方法およびレーザーアニール方法 |
| CN109920731B (zh) * | 2019-03-20 | 2021-03-19 | 上海华虹宏力半导体制造有限公司 | 多晶硅薄膜晶体管及其制作方法 |
| CN115497816B (zh) * | 2022-10-19 | 2023-10-17 | 弘大芯源(深圳)半导体有限公司 | 一种半导体场效应集成电路及制备方法 |
-
1995
- 1995-10-12 KR KR1019950035200A patent/KR100188090B1/ko not_active Expired - Lifetime
-
1996
- 1996-09-07 TW TW085110952A patent/TWI246620B/zh not_active IP Right Cessation
- 1996-10-14 JP JP27048196A patent/JP3774278B2/ja not_active Expired - Fee Related
-
2005
- 2005-06-13 JP JP2005172379A patent/JP4312741B2/ja not_active Expired - Fee Related
-
2008
- 2008-09-10 JP JP2008232509A patent/JP2009048199A/ja not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009048199A (ja) | 2009-03-05 |
| JP3774278B2 (ja) | 2006-05-10 |
| JP4312741B2 (ja) | 2009-08-12 |
| JPH09133928A (ja) | 1997-05-20 |
| KR100188090B1 (ko) | 1999-07-01 |
| KR970024303A (ko) | 1997-05-30 |
| JP2005326867A (ja) | 2005-11-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |