TWI244226B - Manufacturing method of flip-chip light-emitting device - Google Patents

Manufacturing method of flip-chip light-emitting device Download PDF

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Publication number
TWI244226B
TWI244226B TW093133779A TW93133779A TWI244226B TW I244226 B TWI244226 B TW I244226B TW 093133779 A TW093133779 A TW 093133779A TW 93133779 A TW93133779 A TW 93133779A TW I244226 B TWI244226 B TW I244226B
Authority
TW
Taiwan
Prior art keywords
light
flip
substrate
emitting diode
manufacturing
Prior art date
Application number
TW093133779A
Other languages
English (en)
Chinese (zh)
Other versions
TW200616250A (en
Inventor
Jen-Shyan Chen
Chung-Zen Lin
Original Assignee
Chen Jen Shian
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chen Jen Shian filed Critical Chen Jen Shian
Priority to TW093133779A priority Critical patent/TWI244226B/zh
Priority to JP2004378605A priority patent/JP4841836B2/ja
Priority to US11/029,387 priority patent/US7629188B2/en
Priority to KR1020050093319A priority patent/KR100843884B1/ko
Application granted granted Critical
Publication of TWI244226B publication Critical patent/TWI244226B/zh
Publication of TW200616250A publication Critical patent/TW200616250A/zh
Priority to US11/798,511 priority patent/US7652298B2/en
Priority to US11/896,778 priority patent/US7795626B2/en
Priority to US12/071,616 priority patent/US7646030B2/en
Priority to US12/700,853 priority patent/US8120052B2/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
TW093133779A 2004-05-11 2004-11-05 Manufacturing method of flip-chip light-emitting device TWI244226B (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
TW093133779A TWI244226B (en) 2004-11-05 2004-11-05 Manufacturing method of flip-chip light-emitting device
JP2004378605A JP4841836B2 (ja) 2004-11-05 2004-12-28 フリップチップ式発光ダイオードの発光装置製造方法
US11/029,387 US7629188B2 (en) 2004-11-05 2005-01-06 Flip chip type LED lighting device manufacturing method
KR1020050093319A KR100843884B1 (ko) 2004-11-05 2005-10-05 플립 칩 유형의 ｌｅｄ 조명 장치 및 그의 제조 방법
US11/798,511 US7652298B2 (en) 2004-11-05 2007-05-15 Flip chip type LED lighting device manufacturing method
US11/896,778 US7795626B2 (en) 2004-11-05 2007-09-06 Flip chip type LED lighting device manufacturing method
US12/071,616 US7646030B2 (en) 2004-05-11 2008-02-25 Flip chip type LED lighting device manufacturing method
US12/700,853 US8120052B2 (en) 2004-11-05 2010-02-05 Flip chip type LED lighting device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093133779A TWI244226B (en) 2004-11-05 2004-11-05 Manufacturing method of flip-chip light-emitting device

Publications (2)

Publication Number Publication Date
TWI244226B true TWI244226B (en) 2005-11-21
TW200616250A TW200616250A (en) 2006-05-16

Family

ID=34465029

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093133779A TWI244226B (en) 2004-05-11 2004-11-05 Manufacturing method of flip-chip light-emitting device

Country Status (4)

Country Link
US (5) US7629188B2 (enExample)
JP (1) JP4841836B2 (enExample)
KR (1) KR100843884B1 (enExample)
TW (1) TWI244226B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103137833A (zh) * 2013-03-15 2013-06-05 深圳市瑞丰光电子股份有限公司 一种led封装方法及结构

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TWI241042B (en) * 2004-03-11 2005-10-01 Chen-Lun Hsingchen A low thermal resistance LED device
TWI244226B (en) * 2004-11-05 2005-11-21 Chen Jen Shian Manufacturing method of flip-chip light-emitting device
US7951721B2 (en) * 2004-11-10 2011-05-31 Landsberger Leslie M Etching technique for creation of thermally-isolated microstructures
DE112005002889B4 (de) 2004-12-14 2015-07-23 Seoul Viosys Co., Ltd. Licht emittierendes Bauelement mit einer Mehrzahl Licht emittierender Zellen und Baugruppen-Montage desselben
WO2006095949A1 (en) 2005-03-11 2006-09-14 Seoul Semiconductor Co., Ltd. Led package having an array of light emitting cells coupled in series
TWI274430B (en) * 2005-09-28 2007-02-21 Ind Tech Res Inst Light emitting device
CN100499188C (zh) * 2005-10-10 2009-06-10 财团法人工业技术研究院 发光装置
US9660153B2 (en) 2007-11-14 2017-05-23 Cree, Inc. Gap engineering for flip-chip mounted horizontal LEDs
US9640737B2 (en) 2011-01-31 2017-05-02 Cree, Inc. Horizontal light emitting diodes including phosphor particles
US9754926B2 (en) 2011-01-31 2017-09-05 Cree, Inc. Light emitting diode (LED) arrays including direct die attach and related assemblies
US8138027B2 (en) 2008-03-07 2012-03-20 Stats Chippac, Ltd. Optical semiconductor device having pre-molded leadframe with window and method therefor
TWI419357B (zh) * 2008-03-12 2013-12-11 Bright Led Electronics Corp Manufacturing method of light emitting module
TWI423421B (zh) * 2009-01-17 2014-01-11 佰鴻工業股份有限公司 A light emitting device and a manufacturing method thereof
KR101047603B1 (ko) * 2009-03-10 2011-07-07 엘지이노텍 주식회사 발광 소자 패키지 및 그 제조방법
US8610156B2 (en) 2009-03-10 2013-12-17 Lg Innotek Co., Ltd. Light emitting device package
US9385285B2 (en) * 2009-09-17 2016-07-05 Koninklijke Philips N.V. LED module with high index lens
US9502612B2 (en) * 2009-09-20 2016-11-22 Viagan Ltd. Light emitting diode package with enhanced heat conduction
US9631782B2 (en) * 2010-02-04 2017-04-25 Xicato, Inc. LED-based rectangular illumination device
KR101766719B1 (ko) * 2010-03-25 2017-08-09 엘지이노텍 주식회사 발광 다이오드 및 이를 포함하는 발광 소자 패키지
US9240526B2 (en) 2010-04-23 2016-01-19 Cree, Inc. Solid state light emitting diode packages with leadframes and ceramic material
US9070851B2 (en) 2010-09-24 2015-06-30 Seoul Semiconductor Co., Ltd. Wafer-level light emitting diode package and method of fabricating the same
US9673363B2 (en) * 2011-01-31 2017-06-06 Cree, Inc. Reflective mounting substrates for flip-chip mounted horizontal LEDs
US9401103B2 (en) 2011-02-04 2016-07-26 Cree, Inc. LED-array light source with aspect ratio greater than 1
CN205944139U (zh) 2016-03-30 2017-02-08 首尔伟傲世有限公司 紫外线发光二极管封装件以及包含此的发光二极管模块
JP7231809B2 (ja) * 2018-06-05 2023-03-02 日亜化学工業株式会社 発光装置
TWI662724B (zh) * 2018-06-06 2019-06-11 海華科技股份有限公司 覆晶式發光模組

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103137833A (zh) * 2013-03-15 2013-06-05 深圳市瑞丰光电子股份有限公司 一种led封装方法及结构

Also Published As

Publication number Publication date
TW200616250A (en) 2006-05-16
US7646030B2 (en) 2010-01-12
US7652298B2 (en) 2010-01-26
US20060097276A1 (en) 2006-05-11
US20070257344A1 (en) 2007-11-08
JP2005101665A (ja) 2005-04-14
JP4841836B2 (ja) 2011-12-21
KR20050115829A (ko) 2005-12-08
US20080001164A1 (en) 2008-01-03
US20080142818A1 (en) 2008-06-19
US8120052B2 (en) 2012-02-21
US7629188B2 (en) 2009-12-08
KR100843884B1 (ko) 2008-07-03
US7795626B2 (en) 2010-09-14
US20100133558A1 (en) 2010-06-03

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