TWI238447B - Apparatus and method for sticking substrate - Google Patents

Abstract

The present invention provides a stuck substrate manufacturing apparatus capable of preventing a lateral slipping of substrates when the substrates are stuck to each other. First and second substrates are held to a pressurization plate and a table disposed opposite to each other in a chamber by pressure difference suction and electrostatic attraction. A third holding surface consisting of a frictional resistance material is formed on the substrate holding surface of the table; i.e., frictional resistance further holds the second substrate. Thereby, a lateral slipping of the substrates can be prevented by reaction force of working pressure applied to the substrates when the substrates are stuck to each other.

Description

1238447 发明 Description of the invention: [^^ Minghujin is a cold shell. FIELD OF THE INVENTION The present invention relates to a bonded substrate manufacturing device and a bonded substrate manufacturing method. BACKGROUND OF THE INVENTION The present invention relates to a bonded substrate manufacturing apparatus and a bonded substrate manufacturing method. Specifically, the present invention relates to manufacturing a substrate (panel) to which two substrates such as a liquid crystal display device (Liquid 10 Crystal Display; LCD) are bonded. ), A bonded substrate manufacturing apparatus and a bonded substrate manufacturing method that can be suitably used. In recent years, flat panel display panels such as LCDs have become larger and lighter (thinner), and at the same time, requirements for lower costs have been increased. Therefore, in order to manufacture two panels by bonding two substrates, it is required to increase the yield to improve productivity. The liquid crystal display panel is arranged by an array substrate (TFT substrate) and a color wave filter substrate (CF substrate) facing each other at an extremely narrow interval (about several μm), and is manufactured by filling the two substrates with> The array substrate is formed with a plurality of TFTs (thin film transistors), and the color-cut filter substrate is formed with color filters (red, green, blue), a light-shielding film, and the like. The light-shielding film is for twisting, contrasting, and is a light-shielding TFT to prevent the generation of light leakage current, and the user. The substrate and the CD substrate are made of a sealing material containing thermosetting resin (adhered to each other. &Quot; Sword). In this liquid crystal display panel manufacturing process, the liquid crystal is filled between the glass substrates facing 4 20 1238447. Generally speaking, the liquid crystal filling project uses the drip injection method, that is, for example, dropping a predetermined amount of liquid crystal on a surface of a frame inner substrate forming a frame-shaped sealing material around the TFT substrate and bonding in a vacuum. TFT substrate and CF substrate for liquid crystal filling. 5 In the past, this type of bonding of two substrates was performed by a substrate pressurization process using a pressing device as a bonding device. This pressurizing device is provided with two holding plates arranged opposite to each other in the processing chamber. One side precisely maintains the parallelism of the two holding plates, and the other maintains the state of the thickness interval between the substrates uniformly. The substrates are brought close to each other for bonding. 10 A conventional technique related to such a pressurizing device is disclosed in, for example, Patent Document 1 (Japanese Patent Application Laid-Open No. 2002-229044). In addition, in recent years, as the size of the panel has increased, the size of the substrates to be bonded has also increased. When two substrates are bonded by a pressurizing device, the load value added to the two substrates also increases. That is, at the time of bonding, a load corresponding to 丨 processing X substrate area per unit area} is applied to the two base 15 plates, and this weight value increases in proportion to the substrate area. Therefore, there is a problem that the substrate is laterally slipped due to the processing pressure added to the two substrates during bonding, which causes a mismatch in the positions of the substrates to be bonded. The deviation of the position of the substrate is the cause of the poor display of uneven light leakage from the light-shielding part, and the important reason for lowering the yield. [Abstract] This invention is made to solve the above disadvantages The purpose is to provide a 1238447 bonded substrate manufacturing apparatus and a bonded substrate manufacturing method so that the substrate can be prevented from laterally slipping during bonding. According to the present invention, there is provided a substrate manufacturing apparatus which holds a first substrate and a second substrate in a fifth holding plate and a second holding plate which are arranged in a processing chamber and face each other, so that the first and second substrates are Those who are close to each other to attach two substrates are characterized in that: the first and second holding plates hold at least one of a history difference adsorption and an electrostatic adsorption to respectively hold the first and second substrates; At least one of the first and second holding plates has a base 10 plate holding surface of each holding plate formed with a friction resistance material, which further holds the first and second substrates by friction resistance, respectively. This prevents lateral slippage of the substrates under the reaction force of the processing pressure added to the two substrates during bonding. In other words, it is possible to prevent positional displacement between the two substrates at the time of bonding, and to perform bonding with high accuracy. 15 According to the invention of claim 2 in the patent application range, the frictional resistance material is partially formed in the substrate holding surface. This structure can maintain the flatness of the holding plate with higher accuracy than when the frictional resistance is formed on the entire surface of the substrate holding surface. According to the invention of claim 3, the friction resistance material is partially formed along a peripheral portion of the substrate holding surface. According to this structure, the frictional resistance on the outer peripheral surface of the substrate can be increased, and the effect of preventing lateral slippage can be further improved compared with the case where the frictional resistance material is formed inside the holding plate. According to the invention described in item 4 of the scope of patent application, the aforementioned friction resistance material 1238447 is formed on the four corners of the substrate holding surface. 10 15 According to the invention described in claim 5 of the scope of the patent application, the substrate holding surface is formed with a first holding surface including a pressure difference adsorption surface, a second holding surface including an electrostatic adsorption surface, and a third holding surface. It contains a south friction surface formed of a friction resistance material having a friction coefficient higher than the aforementioned first and second holding surfaces. According to this structure, by partially disposing the first holding surface having a high friction surface on the substrate holding surface, the configuration of the electrostatic adsorption surface and the like required to suppress the lateral sliding of the substrate in the substrate holding surface can be reduced. area. As a result, the substrate can be easily held even with a small adsorption holding force. According to the invention described in the application section 6, 1G, the package contains-a pressure mechanism 'which is connected to at least one of the aforementioned-and second holding plates' and pressurizes the connected Keep the board. This pressurizing mechanism is designed to be able to pressurize preferentially corresponding to the position of the turning resistance material formed on the substrate surface. In this case, the place where the friction resistance material is formed under pressure can be preferentially pressed, and the substrate can be bonded while being flexed, thereby improving the lateral sliding prevention effect. According to the invention described in claim 7, item u, the frictional resistance material is formed on the substrate holding surface of at least one of the plurality of holding portions when the holding plate is divided into the plurality of holding portions. . A plurality of these divided holding portions can be connected to and pressurized each holding weight pressing mechanism for bonding. This structure can reduce the weight value applied to the two substrates at the time of pressurization, and at the same time, the pressure can be increased by pressing from the holding portion formed with the frictional resistance material, and the horizontal cross-county can be further improved. According to the invention described in item 8 of the scope of the patent application, the plurality of holding 丄 238447 'are divided into at least the central portion and the peripheral portion, and among the substrates on the substrate holding surface, the frictional resistance material maintains the foregoing The holding portion of the base portion can be formed on the substrate by holding the substrate around the substrate. According to this configuration, the frictional resistance on the outer peripheral surfaces of the two substrates is effective. According to the invention described in item 9 of the patent π, the friction resistance material is attached to the substrate holding surface of the holding portion. , More partially formed. When the dagger constitutes the case where the frictional resistance material is formed on the holding surface of the substrate 10 in the holding portion, the flatness of the stern plate can be maintained with higher accuracy. Brief Description of Drawings Fig. 1 is a schematic configuration diagram of a bonded substrate manufacturing apparatus. Fig. 2 is a schematic configuration diagram of a pressurizing device of the first embodiment. Fig. 3 is a block diagram for explaining a control mechanism of the pressurizing device. 15 FIG. 4 is an explanatory diagram showing an example of a platform configuration of the first embodiment. 5 (a) to 5 (b) are explanatory views showing the second embodiment, (a) is a side view of the pressurizing mechanism, and (b) is an explanatory view of the pressurizing area. Fig. 6 is a schematic configuration diagram showing a pressurizing device according to a third embodiment. Fig. 7 is an explanatory view showing a configuration example of a pressure plate of the third embodiment. Figure 8 is an explanatory diagram showing a configuration example of another pressure plate. C. Embodiment 3 Detailed Description of a Preferred Embodiment A 1238447 embodiment of the present invention will be described below with reference to Figs. 1 to 4. FIG. 1 is a schematic configuration diagram of a bonded substrate manufacturing device used in an example of a liquid crystal injection and bonding process in a manufacturing process of a liquid crystal display device. The bonded substrate manufacturing apparatus 11 seals liquid crystal between the two supplied five substrates W1 and W2 to manufacture a crystal display panel. In addition, the liquid crystal display panel to be produced in this embodiment is, for example, a dynamic matrix column type liquid crystal display panel; the first substrate W is a color wave substrate (CF substrate) on which a color thickener, a light shielding film, and the like are formed, The substrate is an array substrate (TFT substrate) on which TFTs and the like are formed. The first and second substrates W1,-are manufactured and supplied by respective processes. The bonded substrate manufacturing device 11 includes: a control device 12; and a sealing drawing device 13, a liquid crystal dropping device 14, a bonding device 15, and an inspection device 16 controlled by the control device 12. The bonding device 15 is composed of a pressure device 17 and a hardening device 18, and each device 17, 18 is controlled by the aforementioned control device 12. 15 Further, the bonded substrate manufacturing apparatus 11 is provided with conveying devices 19a to 19d, which are used to transport the supplied first and second substrates W2, W2, or a bonded substrate manufactured by bonding them together. Each of the transport devices 19a to 19d is controlled by the aforementioned control device 12. The first and second substrates W1 and W2 are first supplied to a seal drawing device 201. The seal drawing device 13 applies a sealing material to a predetermined position along the periphery of the substrate on either one of the first and second substrates W1 and W2 to form a frame. In this embodiment, a sealing material is applied on, for example, the second substrate W2, which is a TFT substrate. As the sealing material, an adhesive containing at least 10 1238447 hardening adhesive can be used. After the sealing material is applied, the first and second substrates W1 and W2 are transferred to the liquid crystal dropping device 14 by the transfer device 19a. The liquid crystal dropping device 14 then drips the liquid crystal onto a plurality of predetermined positions on the substrate W2 coated with the sealing material among the transported rain substrates W, W2. After the liquid crystal is dripped, the first and second substrates W1 and W2 are transported to a bonding device 15 (specifically, a pressurizing device 17) as a substrate pressing process by a transporting device 19b. The pressurizing device 17 is provided with a small chamber serving as a processing chamber. Two small and ten holding plates for holding and holding the first and second substrates W1 and W2 are respectively provided in the small chamber. After the first substrate W1 and the second substrate W2 that have been carried in are adsorbed and held on the upper holding plate (first holding plate) and the lower holding plate, respectively, the pressurizing device 17 evacuates the small room. The pressurizing device 17 then supplies a given gas into the cell. The gas to be supplied is, for example, a replacement gas including a reactive gas such as an excitation gas for PDP (Plasma Display Panel), an inert gas such as a nitrogen gas, and clean dry air. With these gases, the impurities and products adhering to the surface of the substrate and the display element are exposed to a reaction gas or a replacement gas for a predetermined period of time, and pretreatment is performed. This treatment is used to maintain and stabilize the properties of the 20-side lamination that cannot be opened after lamination. The first and second substrates W1 and W2 are formed by forming a film such as an oxide film on their surfaces, or by adhering to the floating matter in the air to change the state of the surface. Changes in this state vary from substrate to substrate, making it impossible to manufacture stable panels. Therefore, these processes can suppress the formation of a film and the adhesion of impurities. Furthermore, the state of the substrate surface is suppressed by processing the attached impurities, and the quality of the panel 1238447 is stabilized. The pressing device 17 then uses an alignment mark to optically non-contact (at least the lower surface of the first substrate W1 does not contact the sealing material on the upper surface of the second substrate W2) to perform the alignment of the two substrates W1, W2. 5 Pressurizing device 17, then apply a given pressure to the two substrates W1, W2, and release the atmosphere in the small room after being pressurized to a given substrate interval (at least the sealing material is adhered to the interval between the two substrates W, W2). Thereby, the two substrates W1'W2 are compressed to the final substrate interval which is a given unit interval under the pressure difference between the atmospheric pressure and the pressure between the substrates W1, W2. 10. The control device 12 is configured to monitor the first and second substrates.

The time from carrying in the pressurizing device 17 of W1, W2 passes, and controls the time (time from carrying in to bonding) when the two substrates W1, W2 are exposed to the gas supplied to the chamber. Thereby, the properties of the bonding surface that cannot be opened after the bonding is stabilized are maintained. 15 The conveying device 19c, then the bonded substrate is taken out from the pressurizing device 17, and is conveyed to the curing device 18. In detail, the control device 12 monitors the time elapsed after the two substrates W1 and W2 are pressurized. When a predetermined time elapses, the conveying device 19c is driven and the bonded two substrates w are fed to the curing device 18 together. . 20) The hardening device 18 then irradiates light having a given wavelength to the two substrates Wi, W2 after bonding to harden the sealing material. Specifically, the liquid crystals filled into the substrates W2 and W2 diffuse due to pressure and atmospheric release. The hardening device 18, that is, the end of the diffusion of the liquid crystal, that is, before the liquid crystal diffuses to the sealing material, it hardens the Φ sealing material. 12 1238447 In addition, the two substrates W1 and W2 are deformed due to processing pressure during pressurization during bonding. Since the two substrates W1, W2 carried by the transporting device are not cured, the stress remaining on the substrates W1, W2 is released during the transportation. Thereby, the positional displacement of the substrate can be suppressed when the sealing material from the curing device 18 is hardened. The two substrates W1, W2 (liquid crystal panel) whose sealing material is hardened are transported to the inspection device 16 by the transport device 19d. The inspection device 16 then measures the positional deviation (direction and amount of displacement) of the liquid crystal panel substrates W1 and W2 that have been transported, and outputs the measured values to the control device 12. 10. The control device 12 then corrects the alignment of the pressurizing device 17 based on the inspection result of the inspection device 16. That is, the offset amount of the two substrates W1, W2 in the liquid crystal panel where the sealing material is hardened is shifted in advance in the position shift direction and the opposite direction, thereby preventing the position shift of the liquid crystal panel manufactured next time. 15 Next, the configuration of the pressurizing device 17 will be described below. Fig. 2 is a schematic configuration diagram showing the configuration of a pressurizing device that performs the bonding of the first and first substrates W1 'and W2 from a side perspective. The pressurizing device 17 includes a base plate 21 and a support frame 22 fixed to the base plate 21. The base plate 21 and the support frame 22 are each formed of a material having a very high rigidity. Guides 23a, 23b are installed on the inner side of the support frame 22 on both sides; and the guide rails 24a, 24b can be supported by the guide rails 23a, 23b so as to be movable in the up and down direction (Z direction). First and second support plates 25, 26 are set up between each linear guide device 24a, 24b; the first support plate 25 is supported by a third support plate 13 1238447, and the third support plate 28 is It moves up and down according to the drive of the motor 27 mounted on the upper part of the support frame 22. A ball wire 29 'is rotatably coupled to the output shaft of the motor 27, and a nut 30 provided on the third support plate 28 is screwed to the ball wire 29'. Therefore, 'when the motor 27 is driven and the ball wire 29 rotates forward and backward', the second support plate moves up and down. The third support plate 28 is a chevron shape, and a nut 30 is provided on a plate on the upper side thereof. On the lower plate of the third support plate 28, a plurality of load sensors 31 (in this embodiment, for example, FIG. 4) are provided, and the load sensor 10 above the load sensor 31 is in contact with the first support surface 25. Below. The pressurizing device 17 is provided with a small chamber 32 serving as a processing chamber inside the pillar portion of the support frame 22. The cell 32 is divided into upper and lower portions, and is composed of an upper container 32a and a lower container 32b. An o-ring (not shown) is provided at the opening of the cell 32, that is, where the upper container 32a and the lower container 32b are in contact with each other, to seal the space between them, and to maintain the airtightness of the cell 32. In this chamber 32, pressure plates 33a (first holding plates) and platforms 33b (second holding plates) facing each other are provided, wherein the pressure plates 33a and the platforms 33b are respectively used to adsorb and hold the first substrate W1. And the second substrate W2. According to this embodiment, the pressure plate 33a is used to hold the first substrate W1 (CF substrate), and the flat plate 33b is used to hold the second substrate 32b (TFT) substrate. Then, as described later, the pressure plate 33a and the platform 33b are made to cause at least one of pressure difference adsorption and electrostatic adsorption to act, thereby adsorbing and holding the first substrate W1 and the second substrate W2, respectively. The pressure plate 32a is suspended and supported on the second support plate 26. In detail, 14 1238447 supports a plurality of (for example, four) pillars 34 'on the second support plate 26, and the lower end of the pillar 34 is mounted on the pressure plate 33a. Therefore, the pressure plate 33a is suspended and supported on the second support plate 26 through the four pillars 34. In this embodiment, a pressure mechanism for adding two substrates W1 and W2 is formed, which is a motor 27. The third support plate 28, the first support plate 25, the linear guides 24a, 24b, and the second support plate 26 which are moved up and down according to the driving of the motor 27, and the support plate 33a is suspended from the second support plate. The post 34 'is used to press the two substrates wi, W2. Between the second support plate 26 and the upper container 32a, an elastic wind Ime 35 'is provided for keeping the airtightness of the cell 32 surrounding each pillar 34. The bellows 35 is provided with o-rings (not shown) at the edges of both ends, and the o-rings are used to seal the space between the second support plate 26 and the upper container 32a. Therefore, the upper container 32 a is suspended and supported by the second support 26 through the bellows 35. The platform 33b is supported by a positioning table 36 as a driving mechanism. In other words, the positioning table 36 is fixedly provided with a base plate 21, and supports the platform 33b through a plurality of pillars 37 standing on the table 36. The positioning table 36 has a mechanism for moving the platform 33b in the horizontal direction (X direction and γ direction) and a mechanism for horizontal rotation (0 direction). Between the positioning table 36 and the lower container 32b, a bellows 38 'is provided as an elastic body for keeping the airtightness of the cell 32 surrounding each pillar. Similarly to the description of the month, the bellows 38 is provided with o-rings (not shown) at the flange portions at both ends, and the zero-ring is used to seal the space between the positioning table 36 and the lower container 32b. Below the lower container 32b, a plurality of support members 39 standing on the base plate 21 15 1238447 are mounted. Therefore, the lower container 32b is supported by the positioning table 36 through the bellows 38 and is supported by the base plate 21 through the support member 39. A level adjustment section 40 is provided at the upper end of each of the pillars 34, which is used to fix each pillar 34 to the second support plate 26, thereby adjusting the level of the pressure plate 33a used to suspend the support 5. . The level adjustment unit 40 is, for example, a nut screwed with a screw formed on the pillar 34, that is, the level of the pressure plate 33a is adjusted by rotating each of the pillars forward and backward to adjust the level of the pressure plate 33a. When the pressure device 17 is configured to drive the third support plate up and down by the motor 27, the first support plate 25 supported by the support plate 10 28 through the load sensor 31 moves up and down, and the linear guide device 24a, 2 Then it moves up and down along the guides 23a, 2 讣 as it moves up and down. Then, the second support plate 26 moves up and down with the movement of the linear guides 24a, 24b, thereby supporting the hanging support to the second support plate 26 The pressure plate 33 & and the upper container 32a move up and down. 15 Therefore, if the motor 27 is rotationally driven in the downward direction of the linear guides 24a, 24b, the upper container 32a and the pressure plate 33a are lowered, and the upper container 32a and The lower container 32b closes the small chamber 32. Then, if the motor 27 is further rotated and driven in the downward direction of the linear guides 24a and 24b from this state, the aforementioned air box 35 is compressed, and only the pressure plate 33a is added. Lowering. With this, the pressurizing device 17 applies processing force to the two substrates W1 and W2 to perform bonding. At that time, the four load sensors 31 detect the tB bonding by the pressure received by the first support plate 25. At the time, the load detection result is output to the control device 4 and the control device 4 receives 16 1238447 from each load sensor and receives the electrical signal output as the result of the load detection, and calculates the total value of the load based on these signals. Here, when the inside of the cell 32 is in a decompressed state (vacuum state), the total load value becomes: the weight (from 5 weights) A of the first support plate 25 and the components supported by it, and the break with each pillar 34 The area is proportional to the total value (A + B) of the large pressing pressure B of the pressure plate 33a. At this time, the members supported by the first support plate 25 refer to the linear guides 24a, 24b , The second support plate 26, the pillar 34, the level adjustment portion 40, the pressure plate 33a, and the first base plate W1. 10 This is the sum of the weights when the two substrates Wb W2 are brought close together for bonding , Because its processing pressure acts as a reaction force and gradually decreases. The clothes set 41 is based on the load detection result output from each load sensor 31 to detect the decrease of the aforementioned total load value, so as to recognize the processing pressure added to the two substrates W1 and W2 during bonding. 15 Control device 41 '— Calculate the processing pressure added to the two substrates W1, W2 as described above' Generate a motor drive signal based on the calculated value, make the processing fortification added to the two substrates W1, W2 _ fixed, and then this motor drive signal The controller (not shown) is output to the motor driver 42. The motor driver 42 then generates a pulse signal of a given number in response to a motor driving signal from its control device 41, and then outputs the pulse signal of the given number To the motor 27, the motor 27 is then rotationally driven in response to its pulse signal. A linear scale 43a '43b for detecting the position of the pressure plate 33a is provided in each linear guide device 24a' 24b 'which moves up and down according to the driving of such a motor 27. This linear scale 43a, 43b, then detect the position of the linear guides 24a, 24b moving along the guide rail ❿, 17 1238447 23b, thereby detecting the position of the pressure plate 33a relative to the platform 33b, and detecting it The result is output to the display 44. Specifically, on the display 44, the reference surface sensor 5 provided on the pressure plate 33a is used to memorize the position of the pressure plate 33a as the origin position in advance. The position is a position when the distance between the pressure plate 33a and the platform 33b becomes "thickness of the two substrates W1, W2 + cell interval during bonding (final substrate interval)". With this, the display 44 calculates the position of the pressure plate 33a (the relative position of the pressure plate 10 33a corresponding to the origin position) based on the detected values output from the linear scales 43a and 43b, and outputs the relative position data To control device 41. The control device 41 then monitors the position of the pressure plate 33a by using its relative position data to determine whether the relationship between the interval between the two substrates W1 and W2 at the time of bonding and the processing pressure of the substrates W1 and W2 added at the time is appropriate. The relationship between the substrate interval and the processing pressure at the time of bonding is obtained by experiments in advance. The control device 15 41 judges that there is an abnormality and terminates the processing when the appropriate value of the experimental load exceeds a given allowable range (for substrate W1) , W2 is pressurized). Next, referring to Fig. 3, the control mechanism of the pressurizing device will be described in detail. In addition, the same components as those in Fig. 2 are assigned the same reference numerals, and a detailed description thereof is omitted. 20 The control device 41, as described above, sums the wheel outputs from the load sensors to calculate the total load value, and outputs a motor drive signal generated based on the reduction of the total load to the motor driver 42. The motor driver 42 cries, and then outputs the motor drive signal generated in response to the pressure plate motor 27, thereby driving the motor 27 to rotate in the direction of raising or lowering the pressure plate 33a. As shown by the dotted line in FIG. 3, the calculation device 46 which calculates the total load value based on the load detection result from each load 31 may be provided between each load sensor 31 and the control device 41 in another way. According to this structure, the control device 5 performs only the determination operation of whether to drive the pressurizing up and down motor 27 based on the output of the different operation device 46. Therefore, the delay of the response time of the control device 41 can be avoided, and the drive control of the motor 27 can be performed more accurately. In addition, the control device 41 then drives the motor to the motor driver 49, where the driving signal is used by the user to drive the 10 positioning table motor based on the output signal from the image processing device. To put it in detail, the pressurizing device Π is provided with a CCD camera 50 for imaging when the substrates are bonded to align the alignment marks of the two substrates W1 and W2. This CCD camera 50 outputs alignment data formed on the substrates Wi and W2 during imaging and bonding, and outputs the image data to the image processing device 47. 15 Control device 41, and then output the motor drive signal generated by the calculation result (position offset calculation data) of its image processing device to motor driver 49, and the motor driver will then generate a given number in response to it The pulse signal is output to the positioning table motor 48. According to the rotational driving of this motor 48, the positioning table 36 for supporting the platform 33b is driven and driven, whereby the alignment of the two substrates 20 W1, W2 is performed. Next, the structure of the platform 33b of this embodiment will be described with reference to FIG. As shown in Fig. 4, the substrate holding surface (contact surface with the back surface of the second substrate W2) of the platform 33b in this embodiment is composed of three third to third holding surfaces 61 to 63. 19 1238447 Diyi Baofu Noodle 61 _ _ ㈣ material empty card fresh attraction. And attached ', the pressure difference suction surface of the second base; the second simple grip, with the static electricity such as the electric chuck borrowed from Tao, the second substrate w2 ^ electric suction surface. The third holding surface 63, has For example, a high-friction surface formed by a high-friction material (friction resistance material) of Viton Rubber. In this embodiment, a first holding surface 61 is formed in the center of the platform 33b; and a first-holding surface 61 is formed. A second holding surface 62 is provided, and a first holding surface 61 and a third holding surface 63 are alternately formed at the feet of the second holding surface 62 along the peripheral portion of the platform 33b. In addition to the electrostatic adsorption surface, a pressure difference adsorption surface may be provided. In addition, in the third holding surface 63, in addition to a high friction surface, a pressure difference adsorption surface may be provided. That is, the pressure The differential adsorption surface may be formed on the substrate holding surface of the platform 33b in an all-round way. The platform 33b configured in this way can be used on the second substrate due to the reaction force of 15 Wl and W2 added to the two substrates during bonding ...] The force acting in the lateral direction (horizontal direction) is also caused by the distance between the back surface of the substrate W2 and the high-friction surface. Friction resistance can prevent the substrate W2 from sliding laterally. In addition, the first to second holding surfaces 61 to 63 in the platform 33b are configured as long as {static adsorption force (+ pressure difference adsorption force) + The frictional resistance} 20 may be greater than the lateral force acting on the second substrate W2, and is not limited to the arrangement shown in Fig. 4. In addition, in this embodiment, although a high friction surface is provided on the platform 3, However, as for the pressure plate 33a, as long as it has the minimum adsorption force required to maintain the weight of the first substrate W1, for example, a high friction 20 1238447 rubbing surface may be provided as in FIG. 4. That is, 'the pressure plate 33a and The platforms 33b are respectively provided with the rubbing surfaces as shown in FIG. 4 to prevent lateral slippage of the two substrates Wi and W2 during bonding. As described above, according to this embodiment, the following effects are exhibited. 5 (1) The platform 33b for holding the second substrate W2 is composed of a first holding surface 61 having a pressure difference suction surface, a second holding surface 62 having an electrostatic suction surface, and a third holding surface having a rubbing friction surface. 63. The second substrate W2 is transmitted through a friction resistance material The high-friction surface is maintained on the platform 33b, thereby preventing the lateral sliding of the second substrate W2 under the counterforce of the processing pressure added to the two substrates W1 and W2 during bonding, thereby preventing the sticking. Two boards at the right time

The position shift between Wl ′ W2 allows the two substrates W1 and W2 to be bonded with high accuracy. (2) The second substrate W2 holds the platform 33b through a high-friction surface, thereby preventing the sealing material and the second substrate 12 from applying a shear force during bonding, and preventing lateral slip. (3) A third holding surface 63 having a high friction surface is provided along the peripheral edge portion of the platform 33b. With this configuration, compared with the case where the high-friction surface is formed inside the platform 33b, the prevention effect of the lateral sliding of the second substrate W2 can be improved. 20 (4) The third holding surface 63 having a high-friction surface Partially formed in the platform 33b. With this configuration, it is possible to maintain the flatness of the platform 33b with higher accuracy than in the case where the high-friction surface is formed on the entire surface. (5) A high friction surface is formed on the platform 33b, thereby reducing the electrostatic adsorption surface formed on the platform. That is, even in order to restrain the second substrate W2 from moving in the horizontal direction 21 1238447, it is possible to easily maintain the movement of the substrate and reduce the electrostatic adsorption force that was originally necessary. Plate 0 (the second embodiment) describes the second embodiment of the present invention. Below the shape, according to Figure 5, the 5 10 15 state. Benbei is the "additional device I" of the first embodiment. The platform 33b used as the second holding plate is changed to the platform 7 shown in Fig. 5 and the needle table 71 ^ T is added. Upward miscellaneous pressurization mechanism 72

By. In addition, about the same components as the first 訾, 訾, 耶, and vvS, the same symbols are attached, and detailed descriptions are omitted. … As shown in Figure 5 (a), the substrate holding surface of the platform 71 is similar to the first embodiment, and is composed of the first to third holding surfaces 61 to 63, which is different from the platform 3 shown in the first paragraph. The reason is that the third holding surface 63 having a high friction surface is formed at the four corners of the platform 71.

As shown in FIG. 5 (a), the flat port 71 is supported by four pillars 37 in the container container below the chamber ^, and each branch is supported on the positioning table 36 in the same manner as the first embodiment. That is, the platform 71 is horizontally movable in the XΥΘ direction by the driving of the positioning table ^. Since Benbez complained, the pressure table 72 was installed in four places of the positioning table 36. Each pressing mechanism 72 pushes the platform 71 held in J to 32 from below to above by a driving mechanism (not shown), and adds the second substrate W2 to the first substrate W1 during bonding. Pressure. Specifically, as shown in FIG. 5 (b), each pressurizing mechanism 72 is respectively arranged to correspond to the four friction surfaces formed at the four corners of the platform 71 (third security 22 1238447 holding surface 63). The position becomes a pressurizing area 73 in the third holding surface 63 that is pressurized from below the platform 71. During bonding, the high-friction surface on the platform 71 is pushed downward by such a pressing mechanism 72, and at the same time is pressed against the first substrate 5 W1 opposite to the second substrate | 2, thereby making the second The frictional resistance between the back surface of the substrate W2 and the stage 71 increases. As described above, according to the present invention, the following effects are exhibited. (1) The high-friction surface formed on the platform 71 is configured to be pressurized by a pressure mechanism 72 provided below the platform 71. As a result, the portion with high frictional resistance is pressurized first, thereby increasing the frictional resistance between the second substrate | 2 and the platform 71 at the time of bonding. Therefore, compared with the first embodiment, the lateral slip prevention effect of the substrate boundary 2 can be improved. (Third embodiment) Hereinafter, a fifteenth embodiment in which the present invention is embodied will be described with reference to Figs. 6 and 7. This embodiment is a description of another embodiment of the pressurizing device 17 of the first embodiment. In addition, the same components as those in the first embodiment are denoted by the same symbols, and a detailed description thereof is omitted. FIG. 6 is a schematic view of the mechanism 20 of the pressurizing device according to this embodiment as viewed from the side. This pressurizing device 81 is provided with a first support frame 83, and a second support frame 84 is provided inside the first support frame 83. Here, the second support frame 84 is provided with a linear guide device 86 'which is provided to be movable up and down along a guide rail 85 mounted on the first support frame. That is, the second support frame 84 is set so that the first support frame 83 can be moved up and down with respect to 23 1238447. A plurality of (because of two) pressurizing motors are provided in the first support frame 83. The ballast wires 88 which are driven by each of the pressurizing motors 87 can support the support plate 89 up and down privately. In addition, the support board 89 supports the second support frame material through a majority of five (four in the figure) load sensors 9 (). A second support frame 91 supported by the aforementioned support plate 89 is provided in the center of the second support frame 84. Here, the third support frame 91 is provided with a linear guide device 93 which is provided so as to be movable up and down along a guide 92 mounted on the support plate 89. That is, the third support plate 91 is provided to be movable up and down with respect to the support plate 89, that is, the second 10 support frame 84. The support plate 89 is provided with a pressure motor 94, and the support member 96 can move up and down, and the ball wire 95 supported by the pressure motor 94 to rotate and drive is supported. The third support frame 91 is supported by a plurality of (two in the figure) load sensors 97 to support the support member 96 here. 15 The pressurizing device 81 is located below the second and third support frames 84 and 91, and is provided with a small chamber 100 as a processing chamber. This small chamber 100 is divided into upper and lower sides, and an upper container 100a And the lower container 100b. At the opening of the cell 100, that is, where the upper container 100a and the lower container 100b are in conflict, an o-ring 100d is provided to seal the airtightness of the cell 20 100 in between. The upper container 100a is provided with a positioning hole 100f, which is fitted into a positioning pin 100e provided in the lower container 100b. So closed the small

[In the case of the CliS chamber 100, the positioning lOOe is fitted into the positioning hole 100f, whereby the upper container 100a is positioned in the lower container 100b. In this cell 100, pressure plates 101 and platforms 102 serving as the first and second holding plates 24, 1238447, which are opposed to each other, are provided to adsorb and hold the two substrates W1, W2, respectively. In this embodiment, the pressure plate 101 is used to hold the first substrate W1 (CF substrate), and the stage 102 is used to hold the second substrate W2 (TFT substrate). 5 The pressure plate 101 and the stage 102 are similar to the first embodiment in that at least one of the pressure difference adsorption and the electrostatic adsorption is made to adsorb and hold the first substrate W1 and the second substrate W2, respectively. As shown in FIG. 7, the pressing plate 101 is composed of a central pressing portion 101 a serving as a plurality of holding portions, and a peripheral pressing portion 101 b provided away from the periphery of the central pressing portion 101a 10. . The peripheral pressurizing portion 10lb is suspended and supported by a plurality of (two in the picture) pillars 103 integrally connected to the second support frame 84, and the central pressurizing portion 10la is integrally connected to the first A plurality of (two in the picture) pillars 104 of the three support frames 91 are suspended and supported. In addition, the press mechanism 15 for pressurizing the two substrates W1 and W2 in this embodiment is a pressurizing motor 87, a support plate 89 that moves up and down according to the driving of the motor 87, a linear guide 86 and a first The second support frame 84 and the pillar 103 (the second support frame 84 is suspended from the peripheral pressure part 10lb supporting the pressure plate 10b). Between the second support frame 84 and the upper container 100a, there is provided a wind phase 105 serving as an air-tight elastic effect for holding the cell 100 (enclosing each of the aforementioned pillars 103) by 20. The bellows 105 is provided with o-rings at its flange portions at both ends to seal between the second support frame 84 and the upper container 100a. Between the third support frame 91 and the upper container recess, there is provided a bellows 106 for airtight elastic body 25 1238447 which also serves to maintain the rigidity of the cell (surrounding the aforementioned pillars 104). Similarly, the bellows 106 is provided with 0 rings at the flanges at both ends, and the 0 ring is used to seal between the third support frame 91 and the upper container 100a. The platform H) 2 is located in the lower side volume, which is cut into horizontal movement (direction of χγ 5) and horizontal rotation_direction by using it as the positioning platform 1 () 7 of the driving domain structure company. . In detail, the positioning table 107 is set to be driven in the direction of XYZ and is integrally connected to the base plate 支持 supporting the frame. According to the driving of this positioning table 107, the platform ι〇2 is horizontal. Move with the lower valley device 100b and return. On the platform 102, ultraviolet irradiation units 109 and U0 are respectively provided at a position facing the central pressure part i0ia of the pressure plate 101 and a position facing the peripheral pressure part. Each of these mechanisms 109, 110 'moves up and down in accordance with the driving of the cylinder, and irradiates ultraviolet rays to the sealing material when the first and second substrates are bonded. Thereby, the sealing material is hardened, and the two substrates W1, W2 are temporarily fixed. 15 On the outer periphery of the upper surface of the platform 102, there is a lifting plate 113 whose surface is in contact with the surface of the platform 102 which is attracted. This lifting plate 113 is placed in a state where the S part protrudes outward from the platform H2, and is provided from the platform 102 by a lifting mechanism 114 located below it. When the pressurizing device 8 such as the support plate 89 moves up and down according to the drive of the pressurizing horse 20 Dada 87, the second support frame 84 supported by the support plate 89 is the first support frame 83. Move up and down. At the same time, the third support frame 91 supported by the support member% connected to the support plate 89 by the transparent ball wire 95 is moved up and down with the second support frame 84. In addition, if the support member 96 moves up and down 26 1238447 according to the driving of the pressure motor 94, 筮 ± ± λ supported by the support member 96 in the second support frame 91, that is, for the support plate 89, that is, 苐The second support frame 84 moves up and down. Therefore, the 'pressurizing device 81 can move the second support frame 84 and the third support frame 91 up and down independently of the first support frame 83. That is, the Gabor device 5 81 can hold and hold the second substrate ... at the center of the pressurizing plate, and the peripheral pressurizing portion 101a and the peripheral pressurizing portion b, so that the peripheral pressurizing portion 101b and the central pressurizing portion 101Mf stand up and down respectively mobile. In such a pressurizing device 17, each of the load sensors 90, 97 detects the pressure of 10 pressures acting on each of the load sensors in the same manner as in the first embodiment, and outputs the detection result to the pressurizing device 81. Control device (not shown). Then, the control device detects the processing pressure at the time of bonding of the two substrates W1 and W2 from the decrease of the total load based on the detection results of the load sensors 90 and 97. Although the control mechanism of the pressurizing device 81 is omitted in FIG. 6, the control device controls the driving of the motors 87 and 94 based on the outputs of the load sensors 90 and 97 in the same manner as in the first 15th embodiment. During bonding, the processing pressure applied to the two substrates W1 and W2 is made constant. Similarly, as illustrated in FIG. 3, according to the output signal from the image processing device, the positioning table 10 is driven to perform alignment of the two substrates W1 and W2, where the image processing device is used to take 20-one camera Align the marked CCD camera image data for image processing. Next, the structure of the substrate holding surface of the substrate 101 of the pressure plate 101 according to this embodiment will be described. As shown in FIG. 7, the pressure plate 101 of this embodiment is formed with a second holding surface 62 having an electrostatic suction surface at a central pressure portion 101 a thereof, and the pressure portions around the pressure plate are alternately formed at 27 1238447. A first holding surface 61 having a pressure difference suction surface and a third holding surface 63 having a high friction surface are formed. It is also possible that X 'spot-state "Same state" may have a pressure difference adsorption surface on the second holding surface 62 and the third holding surface. 5 The right side is to use the pressure plate 1 configured in this way (3. Bonding by a pressure device. First, the first substrate W1 and the second substrate W2 are adsorbed and held on the pressure plate 101 and the platform 102, respectively, and then evacuated. In the cell 100, the two substrates W1 and W2 are aligned in a non-contact manner.

Next, the edge pressing portion 10 lb is lowered, and the peripheral portions of the first and second substrates 10 and 2 are bonded. Next, the suction of the peripheral pressurizing section is turned off, the peripheral pressurizing section 101b is raised, and then the central pressurizing section 101 is lowered, and the central portions of the first and second substrates wi, W2 are bonded. Then, the adsorption of the central pressurizing part 101a is turned off, and after the central pressurizing part 101a is raised, the atmosphere in the cell 100 is released, and the bonding is performed until the given early element interval of I5.

In addition, this kind of bonding engineering is described as an example. First, the central pressing portion 101a is lowered to perform the bonding of the two substrates W1 and W2, and then the peripheral pressing portion 10lb is lowered to perform two steps. The peripheral portions of the substrates W1 and W2 may be bonded together. As described above, according to this embodiment, the following effects are exhibited. (!) The present embodiment is a pressurizing device 81 having a pressurizing mechanism capable of pressurizing the peripheral portions and the central portions of the two substrates W1 and W2, respectively, and the central pressurizing portion l0 of the pressurizing plate 101. 1a forms the second holding surface 62, and alternately constitutes the first holding surface 61 and the third holding surface 63 at the peripheral pressurizing portion 10lb. This structure 28 is 1238447%. At the time of bonding, the load value of the two substrates W1 and W2 can be reduced. At the same time, the part with high friction resistance of the pressure plate 101 can be selected to press, so the bonding can be improved. The lateral slip preventing effect of the second substrate W1 at this time. (2) In the present embodiment, firstly, the peripheral edge 5b with high friction surface 101b is pressurized first to adhere the peripheral portions of the two substrates W1 and W2, and then the center having static electricity and the attached surface is pressurized. The pressing portion 101a is bonded to the center portions of the two substrates W1 and W2. With this, first, the peripheral portions of the two substrates W1 and W2 can be temporarily fixed, so that the occurrence of positional displacement can be suppressed. The above embodiments may be implemented in the following manner. • In the platform 102 of the third embodiment, a configuration similar to the platform 33b of the first embodiment may be applied. • In the third embodiment, a pressurizing mechanism 72 similar to the second embodiment is applied, and both substrates wi and W2 may be pressed from above and below during bonding. • In the third embodiment, a pressurizing mechanism is provided, that is, the 15 platform 102 is divided into a plurality of pieces in the same manner as the pressurizing plate 101, and only a high-friction surface is formed in the divided platform. A pressurizing mechanism for selectively pressurizing a part thereof is also possible. • The pressure plate 101 of the third embodiment may be changed to the general structure shown in FIG. 8. That is, the pressure plate 121 shown in the eighth is divided into first to third pressure portions 122 to 124 serving as a plurality of holding portions. The first pressing portion 122 is formed of a first holding surface 61 having a pressure difference suction surface. The second pressing portion 123 is constituted by a second holding surface 62 having an electrostatic attraction surface. The third pressing portion 124 is composed of a second holding surface 62 having an electrostatic suction surface and a third holding surface 63 having a high friction surface. When the 29 1238447 pressure plate 121 is to be used, the pressure device 81 shown in the third embodiment is changed and a pressure mechanism is used in which each pressure portion 122 to 124 can be independently pressurized. During bonding, the third pressing portion 124 having a high friction surface is preferentially pressed. When the pressure plate 121 is divided into three or more as described above, the load value of 5 at the time of bonding can be made smaller, and the effect of preventing lateral slip of the first substrate W1 can be further improved. • In terms of the platform 33b of the first embodiment, the platform 71 of the second embodiment, the pressure plate 101 of the third embodiment, and the pressure plate 121 shown in FIG. 8, the high friction surface made of the same material is comprehensive. The ground may be formed on the respective holding surface. As described in detail above, according to the present invention, it is possible to provide a bonded substrate manufacturing apparatus and a bonded substrate manufacturing method capable of preventing lateral slippage of a substrate during bonding. [Brief description of the drawings] 15 FIG. 1 is a schematic configuration diagram of a bonded substrate manufacturing apparatus. Fig. 2 is a schematic configuration diagram of a pressurizing device according to the first embodiment. Fig. 3 is a block diagram for explaining a control mechanism of the pressurizing device. Fig. 4 is an explanatory diagram showing an example of a platform configuration of the first embodiment. 5 (a) to 5 (b) are explanatory views showing the second embodiment, (a) 20 is a side view of the pressurizing mechanism, and (b) is an explanatory view of the pressurizing area. Fig. 6 is a schematic configuration diagram showing a pressurizing device according to a third embodiment. Fig. 7 is an explanatory diagram showing a configuration example of a pressure plate of the third embodiment. Fig. 8 is an explanatory diagram showing a configuration example of another pressure plate. 30 1238447 [Representative symbols for main components of the drawings] 11 ... Laminated substrate manufacturing devices 32, 100 ... Small chambers 33a, 101, 121 for processing chambers ... Pressure plates 33b, 71, 102 for first holding plates ... as a platform 61 for the second holding plate ... first holding surface 62 ... second holding surface

63 ... third holding surface 72 ... pressurizing mechanism W1 ... first substrate W2 ... second substrate

31

Claims (1)

1238447 Patent application park: ι ·-a laminated substrate manufacturing device, which holds the first substrate and the second substrate in a first holding plate and a second holding plate which are arranged in a processing chamber and face each other, Those who bring the first and second substrates close to each other to attach two or five substrates are characterized in that the first and second holding plates are at least one of a dragon force difference rhyme and an electrostatic adsorption to respectively hold the foregoing. The first and second substrates; the holding plate of at least one of the first and second holding plates Each of the substrate holding surfaces' is formed with a frictional resistance material, which is connected to the first and second substrates by 1 10 by friction. 2. The device for manufacturing a bonded substrate as described in the oldest in the scope of the patent application, characterized in that the ~ symbol is partially formed in the surface of the substrate and the friction resistance material. 15 3. The manufacturing of laminated substrates as described in item i of Shenqing Patent Qianwei is characterized by: The frictional resistance material is partially formed along the substrate holding surface. Qiao Edge 4. The device for manufacturing a bonded substrate as described in Item 丨 of the patent claim 20 is characterized by the following: The corner of the frictional resistance material. 'It is formed in the aforementioned substrate Baocai Temple-a kind of bonded substrate manufacturing device, and it maintains the first substrate and the second substrate in the processing chamber. The second one facing each other = 32 5. 1238447 6. lo 15 20 A second holding plate that brings the first and second substrates close to each other to attach two substrates to each other, wherein the second holding plate is formed on a substrate holding surface of at least one of the first and second holding plates. There are: a first holding surface including a pressure difference adsorption surface; a second holding surface including an electrostatic adsorption surface; and a third holding surface containing a frictional resistance material having a friction coefficient higher than the aforementioned first and second holding surfaces A high friction surface. The bonded substrate manufacturing device according to any one of claims 1 to 5 in the scope of the patent application, characterized in that the electric device includes a pressurizing mechanism connected to at least one of the first and second holding plates. The holding plate is pressed, and the connected holding plate is pressurized. The aforementioned pressurizing mechanism is configured to preferentially press the position corresponding to a frictional resistance material formed on the substrate holding surface. The bonded substrate manufacturing device according to any one of the scope of application for patent No. 丨 to item 5, characterized in that: ^ the holding plate of at least one of the first and second holding plates is divided into a number of J The holding part is connected to a pressing mechanism that presses the divided holding parts separately; the friction resistance material is formed as a substrate holding surface of the holding parts to the holding parts. . Levy I: The bonded substrate manufacturing device described in item 7 of the patent scope, which specifically mentions a plurality of holding portions, which are at least divided into pieces, and the wire holding is held at the center portion of the substrate holding surface 33 1238447 and Peripheral portion; The frictional resistance material is a substrate holding surface formed as a holding portion for holding a peripheral portion of the substrate. 9. The bonded substrate manufacturing device according to item 7 of the full-time application, wherein the aforesaid friction resistance material is formed in the substrate holding surface of the holding portion and is formed more partially. 10. A method for manufacturing a bonded substrate, wherein the first substrate and the second substrate are held in a first holding plate and a second holding plate which are arranged in a processing chamber and face each other, so that the first and second substrates are The substrates are close to each other to adhere the two sheets of substrates, which are characterized in that: a portion corresponding to the friction resistance material is preferentially pressed to perform the bonding of the two sheets of substrates, wherein the friction resistance material is formed in Then, the substrate holding surface of at least one of the first and second holding plates is described. 15 11.-Guanhe substrate manufacturing method, wherein the first substrate and the second substrate are separately held in a first holding plate and a second holding plate which are arranged in the processing chamber and face each other, so that the first and The two substrates are close to each other to adhere the two substrates, which are characterized in that at least one of the first and second holding plates is a ten-minute holding portion that is divided into a plurality of holding portions. A frictional resistance material is formed on the substrate holding surface of at least one of the holding portions, and the plurality of holding portions are selectively moved up and down and pressurized to adhere the two substrates. ^ 2. The method for manufacturing a bonded substrate as described in item u of the scope of patent application, characterized in that 34 1238447 is characterized in that: after preferentially pressing the holding portion formed with the frictional resistance material among the plurality of holding portions, applying The holding portion where the frictional resistance material is not formed is pressed to perform the bonding of the two substrates. 35