JP2007232835A - Stuck substrate manufacturing apparatus and stuck substrate manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a stuck substrate manufacturing apparatus which can be made compact by simplifying a constitution wherein relative alignment of two substrates is performed. <P>SOLUTION: In a stuck substrate manufacturing method, when positioning of an upper substrate (a CF substrate) and a lower substrate (an array substrate) before they are stuck is performed, driving voltage is applied to a plurality of electrodes of first and second positioning driving devices 10A to 10D provided on the holding surface 8a of a lower holding plate 8 on the basis of detection of positional deviation of the lower substrate from the upper substrate, electrostatic force is generated between each electrode and a conductive film (having a prescribed resistance value since a plurality of TFTs are formed in a matrix shape) provided to the lower substrate and the lower substrate is moved in any of directions X, Y and θ(rotational direction) to perform positioning. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  INDUSTRIAL APPLICABILITY The present invention is suitable for use in manufacturing a laminated substrate (panel) in which two substrates used for a flat panel display (FPD) such as liquid crystal or plasma are laminated, and a laminated substrate manufacturing apparatus and a lamination which are suitable for use. The present invention relates to a substrate manufacturing method.

  A panel of a liquid crystal display includes, for example, an array substrate (TFT substrate) in which a plurality of TFTs (thin film transistors) are formed in a matrix, and a color filter substrate (CF) in which color filters (red, green, blue), a light-shielding film, and the like are formed. The substrate is provided to face each other at a very narrow distance (several μm), the liquid crystal is sealed between the two substrates, and the two substrates are bonded to each other with a sealing material (adhesive) containing a photocurable resin. Manufactured.

  It is necessary to align each other at the time of bonding the two substrates. Therefore, in the bonding apparatus which manufactures a bonding board | substrate, the position alignment mechanism which moves the at least one position of the bonding board | substrate and performs fine adjustment of an arrangement position is provided.

For example, the laminating apparatus shown in Patent Document 1 has an upper holding plate for holding an upper substrate and a lower holding plate for holding a lower substrate, and the lower holding plate is placed on X and Y on the holding surface. An alignment mechanism (second movement mechanism in the literature) that moves in the direction and rotation direction is provided. An alignment mark for alignment is provided on each of the upper substrate and the lower substrate. When it is detected that a positional deviation has occurred based on the alignment marks of these both substrates, the alignment mechanism detects that both substrates are aligned. The lower holding plate holding the lower substrate is moved to correct the misalignment.
Japanese Patent Laid-Open No. 2002-229044

  By the way, in recent LCDs and the like, further enlargement of the screen is required, and the size of the bonded substrate is increased. Thereby, it is necessary to enlarge the upper holding plate and lower holding plate which hold | maintain a board | substrate also in a bonding apparatus.

  For this reason, in the alignment mechanism, it is necessary to increase the mechanical strength in consideration of not only the weight increase associated with the increase in size of the lower substrate but also the increase in weight associated with the increase in the size of the lower holding plate. The size is increased, and as a result, the entire laminating apparatus is increased in size. In addition, there is a concern that the cost will become very high with the increase in size.

  The present invention has been made in order to solve the above-mentioned problems, and the object thereof is bonding that can simplify the configuration for performing the relative alignment of two substrates and reduce the size of the apparatus. It is in providing a board | substrate manufacturing apparatus and a bonded substrate board manufacturing method.

  In order to solve the above-mentioned problem, the invention described in claim 1 holds the upper substrate and the lower substrate by correcting the relative displacement between the upper holding plate and the lower holding plate facing each other in the processing chamber. A bonded substrate manufacturing apparatus for manufacturing a bonded substrate for pressing and bonding the substrate between the upper holding plate and the lower holding plate after positional deviation correction, and holding the lower substrate of the lower holding plate A first positioning driving device provided on a holding surface and configured by connecting a plurality of electrodes in parallel in a first direction and connecting electrodes of each phase to apply a driving voltage of a plurality of phases; and the lower holding plate A second positioning unit configured to connect a plurality of electrodes in a second direction different from the first direction and connect the electrodes of each phase to apply a driving voltage of a plurality of phases. The driving device and the lower substrate include a conductive film, and the upper substrate of the lower substrate And a drive voltage of each phase to each electrode connected to each phase of the first and second positioning drive devices based on the detection of the position shift detection means. Is applied to induce a charge of opposite polarity in the conductive film of the lower substrate, and after the charge induction, the driving voltage or polarity applied to each of the electrodes is switched to generate a static electricity generated between each of the electrodes and the conductive film. And a control device that controls to move the lower substrate in one of the first and second directions and a direction in which each direction is combined with electric power to correct the positional deviation of the lower substrate. The gist.

  In the present invention, at the time of positioning the substrates before substrate bonding, the plurality of electrodes of the first and second positioning drive devices provided on the holding surface of the lower holding plate are detected based on the detection of the positional deviation of the lower substrate with respect to the upper substrate. A driving voltage is applied to generate an electrostatic force between each electrode and the conductive film provided on the lower substrate, and the lower substrate is combined with the first direction, the second direction different from the first direction, and each direction. Positioning is performed by moving it in either direction. That is, since the lower substrate is positioned by directly driving the lower substrate by each positioning driving device provided on the holding surface of the lower holding plate, the lower holding for holding the lower substrate to position the lower substrate Compared with the conventional configuration for driving the entire plate, the configuration for positioning the lower substrate can be simplified and reduced in size.

  According to a second aspect of the present invention, in the bonded substrate board manufacturing apparatus according to the first aspect, the holding surfaces of the substrate and the lower holding plate are rectangular, and the first positioning driving device is the holding device. The gist of the present invention is that the second positioning drive device is provided in pairs on at least a diagonal position on the surface, and the second positioning drive device is provided on the holding surface in a pair at a diagonal position different from at least the first positioning drive device. To do.

  In the present invention, the first positioning drive device is provided in a pair at least in a diagonal position on the holding surface, and the second positioning drive device is provided in a pair at a diagonal position different from at least the first positioning drive device on the holding surface. Provided. As a result, the positioning drive devices are arranged at the four corners of the rectangular lower substrate, and the positioning drive devices having the same driving direction are arranged diagonally, so that the lower substrate drive at the time of positioning can be stably performed. It can be carried out.

  The invention according to claim 3 is the bonded substrate manufacturing apparatus according to claim 1 or 2, wherein the second direction is set to a direction orthogonal to the first direction, and the lower substrate is The gist is that the displacement is corrected by moving in one of the first and second directions and the rotation direction on the holding surface of the lower holding plate.

  In the present invention, the first positioning driving device drives the lower substrate in the first direction, the second positioning driving device drives the lower substrate in the second direction orthogonal to the first direction, and each positioning driving device. Is driven at a predetermined drive timing to drive the lower substrate in the rotation direction on the holding surface. Accordingly, the lower substrate can be driven efficiently, and the position correction of the lower substrate can be performed efficiently, so that the time required for positioning the lower substrate can be shortened.

  Invention of Claim 4 is a bonded substrate manufacturing apparatus of any one of Claims 1-3, The said control apparatus is a voltage value or application time of the said drive voltage applied to each said electrode. The gist is to control.

In the present invention, since the voltage value or the application time of the drive voltage applied to each electrode is controlled by the control device, for example, the distance for moving the lower substrate can be minutely controlled.
Invention of Claim 5 is a bonded substrate manufacturing apparatus of any one of Claims 1-4. WHEREIN: The said bonded substrate is used for a flat panel display, The said lower substrate is, The gist of the invention is an array substrate in which a plurality of thin film transistors are formed in a matrix to form the conductive film.

In the present invention, the configuration for positioning the array substrate used in the flat panel display can be simplified, and the configuration can be reduced in size.
According to a sixth aspect of the present invention, the upper holding plate and the lower holding plate facing each other in the processing chamber are used to correct the relative positional deviation to hold the upper substrate and the lower substrate, and after the positional deviation correction, the upper holding plate A bonded substrate manufacturing method for manufacturing a bonded substrate that presses and bonds the substrate between the lower holding plate and is provided on a holding surface that holds the lower substrate of the lower holding plate, A first positioning driving device configured by connecting electrodes in each phase so that electrodes are juxtaposed in a first direction and applying a driving voltage of a plurality of phases; and a plurality of electrodes provided on a holding surface of the lower holding plate, And a second positioning driving device configured by connecting electrodes of each phase to apply a driving voltage of a plurality of phases in parallel in a second direction different from the first direction, The substrate is provided with a conductive film, and detection of displacement of the lower substrate relative to the upper substrate is performed. Based on this, the drive voltage of each phase is applied to each electrode connected to each phase of the first and second positioning drive devices to induce a reverse polarity charge in the conductive film of the lower substrate, The lower substrate is combined with the first and second directions by the electrostatic force generated between the electrodes and the conductive film by switching the drive voltage or polarity applied to the electrodes after charge induction. The gist of the present invention is to correct the positional deviation of the lower substrate by moving it in any direction, and perform bonding after correcting the positional deviation.

  Also in this invention, as in the invention described in claim 1 above, for the configuration in which the lower substrate is positioned by directly driving the lower substrate by each positioning driving device provided on the holding surface of the lower holding plate, The configuration can be simplified and the size can be reduced.

  Therefore, according to the above-described invention, it is possible to simplify a configuration for performing relative alignment of two substrates and to provide a bonded substrate manufacturing apparatus and a bonded substrate manufacturing method capable of downsizing the apparatus. can do.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, an embodiment of the invention will be described with reference to the drawings.
FIG. 1 shows a bonded substrate manufacturing apparatus for manufacturing a bonded substrate (panel) used for a liquid crystal display. A stage 2 is disposed on the base plate 1, and a lower container 3 that opens upward is supported on the stage 2. A support frame 4 is fixed to the base plate 1, and an upper drive mechanism 5 is supported on the upper end portion of the support frame 4.

  An upper container 6 that opens to face the lower container 3 is supported on the lower side of the upper drive mechanism 5, and the upper container 6 is supported by the upper drive mechanism 5 so as to be movable up and down. When the lower end opening of the upper container 6 is lowered until it contacts the upper end opening of the lower container 3, a processing chamber (vacuum chamber) 7 is formed in a space sealed by the upper container 6 and the lower container 3. It has become so. Incidentally, a sealing material is attached to the opening end surface of the lower container 3 so as to ensure the airtightness of the processing chamber 7 formed with the upper container 6.

  A lower holding plate 8 having a rectangular holding surface 8a corresponding to the size of a rectangular lower substrate W2 (see FIG. 2) to be placed on the bottom surface in the lower container 3 is disposed. Has been. The lower container 3 supports a substrate lifting / lowering device 9 so that it can be lifted / lowered. The lifting / lowering driving device 9a lifts / lowers the substrate when the lower substrate W2 is carried in and bonded to the upper substrate W1. The Incidentally, in FIG. 1, the substrate lifting device 9 is in a position protruding from the lower holding plate 8, and is stored below the holding surface 8 a on the upper surface of the lower holding plate 8 when bonding the substrates shown in FIG. 2.

  At the four corners of the holding surface 8a of the lower holding plate 8, as shown in FIG. 3, four positioning drive devices 10A to 10D for correcting the position of the lower substrate W2 and electrostatic holding are provided at corresponding positions. It has been. The first positioning driving devices 10A and 10C provided in pairs at diagonal positions are driving devices that move the lower substrate W2 placed on the holding surface 8a of the lower holding plate 8 in the X direction, and are first positioning drive. The second positioning drive devices 10B and 10D provided in pairs at diagonal positions different from the devices 10A and 10C are drive devices that move the lower substrate W2 in the Y direction orthogonal to the X direction. Further, the lower substrate W2 can be rotated in the rotation direction (θ direction) on the lower holding plate 8 by driving at a predetermined driving timing in which the first and second positioning driving devices 10A to 10D are combined. It has become.

  As shown in FIG. 4, the first and second positioning drive devices 10 </ b> A to 10 </ b> D are configured by pulse drive induced charge type drive devices. Specifically, a plurality of (for example, nine) electrodes a to i are built in the main bodies of the first and second positioning drive devices 10A to 10D, and each of the electrodes a to i moves the lower substrate W2. That is, the first positioning drive devices 10A and 10C are arranged in parallel in the X direction, and the second positioning drive devices 10B and 10D are arranged in parallel in the Y direction. Of the electrodes ai, every two electrodes a, d, g are connected to the first power supply terminal T1, the electrodes b, e, h are connected to the second power supply terminal T2, and the electrodes c, f , I are connected to the third power supply terminal T3. That is, the electrodes a to i of the respective phases are connected to the power terminals T1 to T3. Then, drive voltages (+ V, −V, and 0 V) corresponding to each phase are applied to the power supply terminals T1 to T3 through the driver circuit 21 from the control device 20 illustrated in FIG.

  Here, the bonded substrate W of the present embodiment is a panel used in a liquid crystal display, and the upper substrate W1 is a color filter substrate (CF substrate) on which a color filter (red, green, blue) and a light-shielding film are formed, The lower substrate W2 is an array substrate (TFT substrate) in which a plurality of TFTs (thin film transistors) are formed in a matrix. This means that the conductive film 15 having a predetermined resistance value is formed on the upper surface of the lower substrate W2, which is an array substrate.

  In order to move the lower substrate W2, first, as shown in FIG. 4A, driving voltages of + V, −V, and 0V are applied to the power terminals T1, T2, and T3, respectively. Then, a positive charge is generated on the electrodes a, d, and g, and a negative charge is generated on the electrodes b, e, and h. As shown in FIG. 4B, the electrodes a, d, and g are formed on the conductive film 15 of the lower substrate W2. Charges having opposite polarities to those of g, b, e, and h are induced, and the charge patterns of the electrodes a, d, g, b, e, and h are transferred to the conductive film 15. At this time, the lower substrate W <b> 2 is held on the lower holding plate 8 by a suction force (holding force) by electrostatic force more than the frictional force between them.

  Next, at a timing when a predetermined amount or more of the charge transferred to the conductive film 15 on the lower substrate W2 remains, as shown in FIG. 4C, the drive voltages applied to the power supply terminals T1, T2, and T3 are set to −V, Switching to + V and -V causes a negative charge on the electrodes a, d and g, a positive charge on the electrodes b, e and h, and a negative charge on the electrodes c, f and i. Then, the charges transferred to the conductive film 15 of the lower substrate W2 and the charges generated at the electrodes a, d, g and the electrodes b, e, h are repelled with each other, and the levitation force is exerted on the lower substrate W2. Arise. In addition, since the charge transferred to the conductive film 15 of the lower substrate W2 and the charge generated in the next electrodes a to i in the moving direction have opposite polarities, an attractive force is generated in the next electrodes a to i in the moving direction, The suction force becomes a driving force in the moving direction of the lower substrate W2. Thus, the lower substrate W2 on which the levitation force and the driving force act is moved by one of the electrodes a to i as shown in FIG.

  Next, since the charge transferred to the conductive film 15 of the lower substrate W2 is going to disappear gradually, as shown in FIG. 4E, the drive voltages applied to the power supply terminals T1, T2, T3 are set to 0V, + V, As −V, the charge transferred to the conductive film 15 of the lower substrate W2 is recharged. That is, the first and second positioning drive devices 10A to 10D are set in the same state as in FIG. 4B, and thereafter the steps are repeated by shifting the drive voltage applied to the electrodes a to i by one phase. The lower substrate W2 is moved by a predetermined amount. Further, if the driving voltages applied to the electrodes ai are in reverse phase, the lower substrate W2 can be moved in the reverse direction.

  Here, an alignment mark is provided on each of the upper substrate W1 and the lower substrate W2. This alignment mark is photographed by the CCD camera 22 shown in FIG. 5 attached to a predetermined part of the manufacturing apparatus, and photographing data from the CCD camera 22 is input to the control device 20 via the image processing device 23. The control device 20 calculates whether the lower substrate W2 is displaced in the X, Y direction or θ direction with respect to the upper substrate W1 based on the imaging data, and based on the calculation result, the lower substrate The first and second positioning drive devices 10A to 10D are controlled so as to correct the position shift of W2.

  As shown in FIG. 1, an upper holding plate 11 is disposed above the lower holding plate 8, and the upper holding plate 11 is supported by the upper drive mechanism 5 so as to be movable up and down. The upper holding plate 11 has a vacuum chuck function and an electrostatic chuck function for attracting the upper substrate W <b> 1, and these functions are controlled by the control device 20. Then, after correcting the position of the lower substrate W 2, the upper holding plate 11 descends toward the lower holding plate 8 in the vacuum processing chamber 7, and the upper holding plate 11 and the lower holding plate 8 move upward. A substrate W1 (CF substrate) and a lower substrate W2 (TFT substrate) are sealed with liquid crystal and bonded together with an adhesive (a sealing material containing a photocurable resin).

  At this time, the load cell 24 provided in the upper drive mechanism 5 detects the applied pressure (load) of the upper holding plate 11, and the control device 20 shown in FIG. The pressure is calculated. Then, the control device 20 drives the pressure plate up / down motor 26, which is a drive portion of the upper drive mechanism 5, so as to generate a pressing force necessary for bonding the upper substrate W1 and the lower substrate W2 based on the calculation result. Control is performed through the circuit 27.

  Incidentally, the control device 20 includes the first and second positioning driving devices 10A to 10A, so that the holding force by the electrostatic force is generated on the lower substrate W2 as shown in FIG. 4B and FIG. 10D is controlled to suppress the positional deviation on the lower holding plate 8 of the positioned lower substrate W2. That is, the first and second positioning drive devices 10A to 10D also have an electrostatic chuck function.

  Then, a bonded substrate W in which the upper substrate W1 and the lower substrate W2 are bonded together is manufactured in this way, and the inside of the processing chamber 7 is returned to atmospheric pressure as the upper holding plate 11 is raised by the upper drive mechanism 5. The bonded substrate stack W is transported to the next step after the substrate lifting device 9 is lifted.

Next, characteristic actions and effects of the present embodiment will be described.
(1) In the present embodiment, when positioning the upper substrate W1 (CF substrate) and the lower substrate W2 (array substrate) before bonding the substrates, based on the detection of the displacement of the lower substrate W2 with respect to the upper substrate W1, A conductive film provided on each electrode ai and the lower substrate W2 by applying a driving voltage to the plurality of electrodes ai of the first and second positioning drive devices 10A-10D provided on the holding surface 8a of the lower holding plate 8. 15 (a conductive film having a predetermined resistance value is formed by forming a plurality of TFTs in a matrix), and the lower substrate W2 is placed in any of the X, Y, and θ directions. The positioning is performed by moving it. In other words, since the lower substrate W2 is directly driven by the positioning driving devices 10A to 10D provided on the holding surface 8a of the lower holding plate 8 to position the lower substrate W2, the lower substrate W2 is positioned to be positioned. Compared with the conventional configuration for driving the entire lower holding plate for holding the lower substrate, the configuration for positioning the lower substrate W2 can be simplified and reduced in size, and the entire manufacturing apparatus can be reduced in size.

  (2) In the present embodiment, the first positioning drive devices 10A and 10C are provided in pairs at diagonal positions on the holding surface 8a, and the second positioning drive devices 10B and 10D are the first positioning drive devices on the holding surface 8a. 10A and 10C are provided in pairs at different diagonal positions. As a result, the positioning driving devices 10A to 10D are arranged at the four corners of the rectangular lower substrate W2, and the positioning driving devices 10A to 10D having the same driving direction are arranged diagonally. The substrate W2 can be driven stably.

  (3) In the present embodiment, the first positioning drive devices 10A and 10C drive the lower substrate W2 in the X direction, and the second positioning drive devices 10B and 10D drive the lower substrate W2 in the Y direction orthogonal to the X direction. Further, the positioning substrate 10A to 10D is driven at a predetermined driving timing to drive the lower substrate W2 in the rotation direction on the holding surface 8a. Accordingly, the lower substrate W2 can be driven efficiently, and the position correction of the lower substrate W2 can be performed efficiently, so that the time required for positioning the lower substrate W2 can be shortened.

  (4) In this embodiment, since the positional deviation of the lower substrate W2 is detected in a non-contact manner by the photographing of the CCD camera 22 and its image processing, the upper substrate W1 and the lower substrate of the means for detecting the positional deviation. Contact with W2 etc. can be prevented.

The embodiment of the present invention may be modified as follows.
In the above embodiment, the lower substrate W2 is directly held on the holding surface 8a of the lower holding plate 8. However, a porous sheet (porous sheet) is provided on any of the holding surfaces 8a with which the lower substrate W2 comes into contact. May be laid. In this way, it is possible to suppress the lower substrate W2 from being damaged by dust or the like, for example. Further, since the static frictional resistance for holding the lower substrate W2 is increased, it is possible to more suitably suppress the positional deviation of the lower substrate W2.

  In the above embodiment, the first positioning drive devices 10A and 10C for driving in the X direction and the second positioning drive devices 10B and 10D for driving in the Y direction are used. However, the drive direction is not limited to this, and the first , A configuration in which the driving direction of the second positioning driving device is set to different directions (first and second directions) other than orthogonal may be used.

  In the above embodiment, the positioning drive devices 10A to 10D are arranged at the four corners of the holding surface 8a of the lower holding plate 8. However, the number and arrangement of the positioning drive devices may be changed as appropriate. For example, in addition to the positioning drive devices 10A to 10D at the four corners, a positioning drive device may be added to the central portion or the like. Moreover, you may arrange | position a positioning drive apparatus in places other than four corners. Also, the first positioning drive devices 10A and 10C for driving in the X direction are arranged in pairs at diagonal positions, and the second positioning drive devices 10B and 10D for driving in the Y direction are the first positioning drive devices 10A and 10C. Although the two diagonal positions are arranged in pairs, the combination of the arrangement of the first positioning drive device for driving in the X direction and the second positioning drive device for driving in the Y direction may be changed as appropriate.

  In the embodiment described above, the electrodes a to i of the positioning drive devices 10A to 10D are nine, but the number of electrodes is not limited to this, and may be eight or less or ten or more. Moreover, although each electrode ai was connected to the three power supply terminals T1-T3, respectively, and it was set as the structure which applies a three-phase drive voltage, it is good also as a drive voltage except three phases.

  In the above embodiment, the drive voltage applied to each of the electrodes a to i is any of + V, −V, and 0V (switching between polarity and on / off), but the voltage of the drive voltage applied to each of the electrodes a to i The value or application time may be controlled. In this way, for example, the distance by which the lower substrate W2 is moved can be finely controlled.

  In the above embodiment, the CCD camera 22 is used for non-contact detection as a means for detecting the positional deviation of the lower substrate W2. However, other non-contact type detection means and contact type detection means may be used. Good.

  In the above embodiment, the manufacturing apparatus manufactures a bonded substrate used for a liquid crystal display, but may be a manufacturing apparatus that manufactures a bonded substrate used for another flat panel display such as plasma. In this case, the substrate having the conductive film is held by the lower holding plate.

It is a schematic block diagram which shows the bonded substrate manufacturing apparatus in this Embodiment. (A) (b) is explanatory drawing for demonstrating a bonding board | substrate. It is a top view of the lower holding plate which has a positioning drive device. (A)-(e) is explanatory drawing for demonstrating operation | movement of a positioning drive device. It is a block diagram for demonstrating the electrical structure of a bonded substrate manufacturing apparatus.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 7 ... Processing chamber, 8 ... Lower holding plate, 8a ... Holding surface, 10A, 10C ... 1st positioning drive device, 10B, 10D ... 2nd positioning drive device, 11 ... Upper holding plate, 15 ... Conductive film, 22 ... Position CCD camera constituting deviation detection means, W ... bonded substrate, W1 ... upper substrate, W2 ... lower substrate, ai ... electrodes.

Claims (6)

The upper holding plate and the lower holding plate facing each other in the processing chamber are used to correct the relative positional deviation to hold the upper substrate and the lower substrate, and after the positional deviation correction, between the upper holding plate and the lower holding plate, It is a bonded substrate manufacturing apparatus for manufacturing a bonded substrate for pressing and bonding a substrate,
Provided on a holding surface for holding the lower substrate of the lower holding plate, and configured by connecting a plurality of electrodes in parallel in a first direction and connecting electrodes of each phase to apply a driving voltage of a plurality of phases. A first positioning drive device;
Provided on the holding surface of the lower holding plate, a plurality of electrodes are juxtaposed in a second direction different from the first direction, and electrodes of each phase are connected to apply a driving voltage of a plurality of phases. A second positioning drive device,
The lower substrate comprises a conductive film, and a displacement detection means for detecting displacement of the lower substrate relative to the upper substrate;
Based on the detection of the displacement detection means, the drive voltage of each phase is applied to each electrode connected to each phase of the first and second positioning drive devices to reverse the conductive film of the lower substrate. Polarity charges are induced, and after the charge induction, the driving voltage or polarity applied to each electrode is switched, and the lower substrate is moved to the first and second by electrostatic force generated between each electrode and the conductive film. And a control device that controls to correct the positional deviation of the lower substrate by moving in any one of the directions and the directions in which the directions are combined. In the bonded substrate manufacturing apparatus according to claim 1,
The holding surfaces of the substrate and the lower holding plate have a rectangular shape,
The first positioning drive device is provided in pairs at least at diagonal positions on the holding surface,
The bonded substrate manufacturing apparatus, wherein the second positioning drive device is provided in pairs on the holding surface at a diagonal position different from at least the first positioning drive device. In the bonded substrate manufacturing apparatus of Claim 1 or 2,
The second direction is set to a direction orthogonal to the first direction,
The bonded substrate manufacturing apparatus according to claim 1, wherein the lower substrate is moved in one of the first and second directions and the rotation direction on the holding surface of the lower holding plate to correct a positional shift. In the bonded substrate manufacturing apparatus of any one of Claims 1-3,
The said control apparatus controls the voltage value or the application time of the said drive voltage applied to each said electrode, The bonded substrate manufacturing apparatus characterized by the above-mentioned. In the bonded substrate manufacturing apparatus of any one of Claims 1-4,
The bonded substrate is used for a flat panel display,
The bonded substrate manufacturing apparatus, wherein the lower substrate is an array substrate in which a plurality of thin film transistors are formed in a matrix to constitute the conductive film. The upper holding plate and the lower holding plate facing each other in the processing chamber are used to correct the relative positional deviation to hold the upper substrate and the lower substrate, and after the positional deviation correction, between the upper holding plate and the lower holding plate, A bonded substrate manufacturing method for manufacturing a bonded substrate to be bonded by pressurizing the substrate,
Provided on a holding surface for holding the lower substrate of the lower holding plate, and configured by connecting a plurality of electrodes in parallel in a first direction and connecting electrodes of each phase to apply a driving voltage of a plurality of phases. A first positioning drive device;
Provided on the holding surface of the lower holding plate, a plurality of electrodes are juxtaposed in a second direction different from the first direction, and electrodes of each phase are connected to apply a driving voltage of a plurality of phases. A second positioning drive device,
The lower substrate is provided with a conductive film, and based on detection of positional deviation of the lower substrate with respect to the upper substrate, each phase is connected to each electrode connected to each phase of the first and second positioning driving devices. Applying the driving voltage to induce a charge of opposite polarity in the conductive film of the lower substrate, and switching the driving voltage or polarity applied to the electrodes after the charge induction between the electrodes and the conductive film The position of the lower substrate is corrected by moving the lower substrate in one of the first and second directions and the direction in which each direction is combined by the electrostatic force generated in step 1, and the bonding is performed after the position deviation is corrected. A method for producing a bonded substrate, comprising:

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