TWI237734B - Imaging device and manufacturing method - Google Patents

Abstract

The invention provides an imaging device and manufacturing method. An integral formation composing step is provided for producing a mirror base with a mirror cone part and a base part for receiving a lens, an imaging device. A step of forming a wiring design format from the junction face to the inner circumferential face is provided to the base part for receiving the imaging device. Further, the edge of imaging face of imaging device is configured with a wire bonding pad to enable the imaging face of the imaging device to be opposite to the lens along the optical axis in a substantially vertical manner and to contact the wiring design format, thereby minimizing the size of the imaging device and greatly reducing the cost.

Description

1237734 V. Description of the invention (1) 1. Technical field to which the invention belongs The present invention is applied to a home video camera (video camera), a camera device of a camera element, and the field of manufacturing technology. 2. Prior art to Tao: Yes The camera element is packaged with ceramics. The value 2f has a gold wire combined with a carrier sheet b. —G gas-connected terminals. In addition, there are mechanical and electrical films on the outside and the substrate (wire bonding is provided) The combination of gold wire and the pottery encapsulating the ceramic element and the camera element "encapsulates the ceramic element, and then adds -layer glass, even if it is finished ::：：：: step by step in ceramic element packaging similar to the ceramic terminals described above, Is there a wiring design format? ==: The two are using the aforementioned mirrors, which are fixed on the plastic plate of the material F to do the combination. In addition, the lens is on the main substrate. Mg # ， ## 镜 4 In addition, the lens is equipped with a lens. When sawing the brigade-Γ, use screws or other means to fix it, and I will complete the camera device. Make sure that the position is based on the above-mentioned traditional filming silly dreams, and therefore the required elements; and system; ㊁ :: Component income is similar in ceramic seals All of them will be complicated, and they will be made into _ In addition, when the traditional camera elements are fixed on the main substrate, ceramics are used for τ, and when the thickness is to be fixed, the lens barrel will follow ^ ^ The camera element packaged by the ceramic package inside the lens barrel is integrated, so the camera device will be ::: The lens barrel must face the main substrate. V. Description of the invention (2) Adding to the above problems, there is another conventional The camera device is produced. The camera element in iif is not directly packaged with ceramics, but the direct surname: Enter Φ if 'other than this', the lens barrel will cover the camera element, straight; 庠 According to this structure, parts can be reduced And the manufacturing process = sequence '+ the ceramic transformer package and terminals described above are required. Second, the camera mounting substrate needs to be connected with gold wires. As the complexity increases, the camera components used in the conventional camera substrate and The position deviation of the lens junction lens, the focus of the light lens, the conventional photography, the large-scale combination of the carrier film, the camera element's contact time, and the imaging center needs to be installed in the device. The camera parts will affect the image device. The problem is that (the continuation point of the wire is increased and the correct image element and the front position of the lens are the same. It cannot be light and cannot be solved. In addition, because of the bonding, it is necessary. In addition to this, the lens is connected to the main substrate and the lens cover to the camera. Yuan Yidi's correction is determined by the combination of the main camera element Pad), the combination of the light and the focal point to image the correct parts, the thick part of the substrate and the main base for electrical engineering, and the camera position alignment, part, main, 3 mini centers and translucent. = The problem of the present invention is to solve the aforementioned problems, maintain product quality, reduce material and production costs, miniaturize the camera device, and further "provide easier adjustment of the imaging element imaging center and The focal point of the lens' light-the resulting imaging device and its manufacturing method. 3. Summary of the Invention The main object of the present invention is to provide an imaging device and a manufacturing method for reducing parts and manufacturing processes. A secondary object of the present invention is to provide a substantial reduction in volume,

V. Description of the invention (3) Small camera device The present invention and the facilitation of the present invention Imaging Center # Method. In order to achieve 1, use the i of the component, melt the mirror stage, and combine the 3 with the camera. 4. Filter the light 5. Then, combine the lens cover with " In this way, the optical device, the one-piece component, the number of pieces, and the manufacturing method will be described in detail. = Another object is to provide an imaging device and a manufacturing method capable of manufacturing processes. The purpose of 9 is to provide a camera device and a manufacturing method that can adjust the position of light, dots, and dots with higher and higher precision. The method of the present invention includes the following steps: It is equipped with a camera port seat and a mirror barrel. The base unit uses hot air to return the weight (using the high temperature of the steam = and immediately solidifies) to form most wiring design grids: the inner bottom surface of the base unit has a larger width. The wide contact part. The side of the imaging surface of the element is provided with a combination support sheet, and at the same time, the imaging center of the imaging surface of the element is aligned with the focal point of the light, and the device is adhered to the lens barrel of the lens base. The mirror is embedded in the lens stage The base has been inserted into the lens barrel portion of the filter, and then the lens base is fitted and fitted. That is, the combined imaging camera device is composed of a lens cover, a lens, and a mirror base having a lens barrel portion and a base portion. It does not need to use the previous ceramic packaging method, and can reduce the fabrication process. Other features and specific embodiments can be further understood with the accompanying drawings below.

Page 7 1237734 V. Description of the invention (4) IV. Please refer to FIG. 1 for the implementation. The camera device 1 according to the first embodiment of the present invention includes: a lens cover 2, a lens 3, a filter 4, a mirror stand 5 And an imaging element 7, wherein a circle 2 1 is provided at the center of the 5 mysterious mirror cover 2 and the inside thereof, as shown in FIG. 2, is provided with a first fitting recess 2 2 capable of inserting the lens 3 and a mirror opening seat 5 The second fitting concave portion 2 3 in which the upper lens barrel portion 51 is fitted. The fitting side of the lens 3 and the first fitting concave portion 22 is formed in a flat shape (above the lens 3), and is in contact with the imaging element 7 The part facing the opposite side is convex (below the gray of the lens 3), but the lens 3 shown in Figure 2

The shape of the first fitting recess 22 is only an example, and various other shapes may be adopted. This filter 4 is generally a rectangular filter, and is then installed on the filter support portion 5 4 of the mirror base 5. Furthermore, the shape of the filter 4 is not limited to a rectangle, and any suitable shape can be used. . Therefore, it is the same as the upper size of 1 as the inset bottom support part, the tube part, 5 part, and the groove 6 is the same as the lens stand part, the lens tube part edge is 5 2.尔 狗 5 1 is made of a plastic material 5 5 which is the same as the extension of the mirror of the lens barrel part 3 and the filter is integrated into the communication hole image element and the mirror cover 2. 2 3 is fitted and the base part cover 2 The inner supporting part of the 5th 1 has 5 convex lips, so the lighter support type is connected to the upper part of the mirror receiving part 5 and the second part 3, and the supporting part 5 4 and the middle part 5 and 5 fi, here a recessed edge in the lens barrel filter, optical device 4 central hole 5 camera seat 5 5 camera element tube shape, shape 5 1 filter, then inside the element, close

1237734 V. Description of the invention (5) 6, the focal point of the light of the camera element 0C is slightly similar to the electric ore or hot air return format 6 formed around the imaging peripheral surface 5 8; in addition, the camera element accommodating portion 6 not only extends to the solid 8 And a wide base part 5 5 is formed on the bottom surface of the base part. Near the end of the imaging element 7 1 'reuse multiple knots before the wiring design format, please dreamer 6 Figure 1 step: the camera, 5 3 Steps: The camera and the vertical posture element of the bottom 7 of the composite part are joined. In the aforementioned manner, the figure 5 is the complaint element obtained from 5 6 with the contact part peripheral surface method 7 of i. In the center, and it is generally used for carrying. The position of 6 is the receiving stage of the camera element. The seating surface 7 1 and the image element on the opposite surface 5 7 form the bottom surface of the second figure. The joint surface 5 forms 6 1 That should form. Partially forming a joint surface part 5 6 5 called a bump sheet to form a connection, the benefit is shown in the joint diagram of the component mounted by the camera unit. In addition, 7 is also a special contact. The part is opposite to the plural arrow A of the imaging surface 5 7 where the parts are joined, and the wiring extends to the surface 5 7 of the 6 1 series lens 3, the inside of the element, and the inner peripheral surface of the design format is viewed from the wiring design direction. The bottom part extends to the imaging surface 7 1, and the conductive sheet 7 2 is combined with the conductive member on the imaging surface (B_ρ), and the manufacturing process is as follows: 57 and the inner peripheral surface 58 are used as a separate lens support part. The bonding surface 5 7 and the inner peripheral surface 5 8 of the first imaging element are molded. Bottom: 'Wiring design format 6 using plating or hot air reflow method. At this time, a wide contact is formed on the table surface. Department 6

Page 9 I237734 V. Description of the invention ⑹ Step-~ Step: The imaging surface 7 of the imaging element 7 η 卞 (photographing the imaging surface 7 1 of the imaging center and the light focus black occupy 0c-after the 'determined' of the imaging element 7 Position, and then use a method called wire bonding pad (a wire bonding pad) to make a knot · a eight retreat, d σ, in these ways, first of all = The carrier sheet 7 2 is connected to the wiring designer 6 ', and then the conductive adhesive with different directions is injected between the camera element 7 and each wiring :: format 6, and then sealed. ^ ^ ^ T The ruthenium anti-adhesive hardens and shrinks, so that the camera element 7 and the wiring design format 6 form a physical fixation. Therefore, in the implementation form, X Tianren: • ',-do not use umbrella wire to bond the carrier sheet (wire bonding pad) ^ ^ m v., ru. Ό α) and use Flip Chip Bonding (Flip Chip Bonding). The fourth step and fifth step π ut method can convert the lens mount 5 of the camera element 7 into automated production. The filter holder 4 of the holder 5 is pasted. The pressing part 54 is embedded in the light filter. Mirror 3, and then the mirror is shown in this way, the combined camera equipment ii ~ it is composed of the mirror cover 2, the lens I, the mirror 3, the light cries 4, the middle part 5 of the picture 4 and the base part 5 5 Mirror stage photo-body molding has the number of mirrors and the manufacturing process. The method of light sealing can reduce the number of zeros. Furthermore, the camera element 7 does not need to be combined with the wiring design format 6 and designed on the pedestal =, as long as the '丄 邵Bottom surface, and this wiring design

1237734 V. Description of the invention (7) Format 6 Because the camera element 7 is attached to the carrier plate 7 2 using a conventional printed circuit board, this is also the planning of camera equipment ^ Small = the main factor, especially as shown in Figure 3 ' Since the contact portion 61 of the wiring design format 6 is partially formed on the bottom surface of the pedestal portion, it is not necessary to have a structure like this. The printed circuit board with the mirror pedestal 5 attached to the imaging device shows the focus of miniaturization of the imaging device 1 of the present invention. . Since the imaging device i and wiring design format 6 are followed by FUP Chlp Bonding, the process is automated and simplified. ^ More than that, the position of the imaging element 7 and the focal point of the light are tight. The accuracy of the position closeness depends on the joint between the imaging element 7 and the pedestal portion 5 5 and the lens cover 2 1 outside the lens barrel 2 and the inside. Since the position of the mirror 3 is two, compared with the past, the position of the imaging sensor (Image Sensor) and the position of the light focus oc can be adjusted with higher accuracy. Please refer to FIG. 5 again, 'the center MC of the mirror base does not match the focus of the light oc'. However, this part has been reserved in advance, so that the camera element 7 can determine the correct position of the center MC of the mirror base. The imaging center of the imaging element 7 is in the same manner as the light focal point OC, but the design of the center of the mirror pedestal μ C and the light focal point OC can also be made consistent from the beginning. Moreover, in this implementation form, the descriptions of the individual formation of the mirror cover 2 and the mirror base 5 have been given as examples, but it is not limited to this example, but only to declare that the mirror cover 2 and the mirror base 5 can be formed in one body. In such a situation, the lens 3 is first adhered to the integrally formed mirror cover and the mirror base, and then the wiring design format 6 is completed on the mirror base.

Page 11 1237734 V. Description of the invention (8) Please refer to the inner perimeter which will not be repeated here because of the first and the first, and then the mirror cover 5 1 1 with a fixed design, the same effect, and the improvement of 1 Traditional components, because of their novelty, are shown in Figure 7 according to the method. In the embodiment of the device, the second is not used in the second, and the mirror cover 2 is structured and described as described above. In addition to the excellent invention, which is the same as the implementation of the first embodiment of the present invention, and adjusted to the relative view, adjusting the focus reveals a package, which reduces the market competition profit application. This example is set in the lens barrel cover. The mirror system has a competitive effect with the innovative glass cover device. 2 The implementation uses a phase mirror pedestal meter, while the section 5 1 and the tube section 5 are the same. The embodiment of the camera equipment and beer volume has a production type, the same symbol, so in the lens barrel portion 5 1 of 5 is the lens 3 directly outside the design of the threaded portion 1 as the thread lock 1 embodiment type phase And manufacturing method, structure and manufacturing cost of printed circuit board, etc.

Page 12 1237734 Brief description of the drawings V. Brief description of the drawings [Illustration of the first diagram is the second diagram is the third diagram is the fourth diagram is the fifth diagram is the sixth diagram is the seventh diagram It is [Illustration of drawing number 1, photo 2, mirror 2 2, 3, transparent 5, lens 5 1 1, screw 5 2, upper 5 4, filter 5 6, photo 5 7, photo 5 8, inner 6, matching 7. Photo 7 2 Description of statement] The exploded view of the schematic structural elements of the first embodiment of the present invention corresponds to the combined sectional view of FIG. 1. A perspective view of the first embodiment of the present invention. Corresponds to the sectional view of Figure 3. A bottom view of the mirror base in the first embodiment of the present invention. The flowchart of the manufacturing method of the first embodiment of the present invention. A combined sectional view of a second embodiment of the present invention. -] Imaging device cover-fitting recessed mirror stage pedestal edge edge light support part image element receiving part image element joint surface peripheral surface line design format image element and carrier sheet 1, aperture 3, second fitting recess 4, filter Holder 1, lens barrel section 3, mirror support section 5, pedestal section _ 7 connection, the image surface

Page 13 1237734 Schematic illustrations M C, Center of Mirror Stand 〇c, Focus of Light Page 14

Claims (1)

1237734. Six, apply for a patent range meter format and extend to the inner peripheral surface to complete the wiring design format project, the end of the imaging surface of the camera element is provided with a joint bearing sheet, and the receiving part of the mirror base is combined to make the joint carrier sheet and wiring Contact the design format, and then place the filter and lens into the lens pedestal, so that the lens is slightly perpendicular to the camera element along the optical axis to complete the assembly process of the lens pedestal, and then cover the lens cover with the aperture. On the mirror stage after the assembling process is completed, as in the aforementioned process of assembling the mirror stage, the manufacturing method of the imaging device featuring the above features. 7. A method for manufacturing an image pickup device, a process consisting of a joint surface of the image pickup element and an image pickup element accommodating portion surrounding the inner peripheral surface of the image pickup element, a mirror pedestal integrated with the mirror accommodating portion, and an aperture, and mounting the lens In the engineering of the mirror base, the interface with the imaging element, the inner peripheral surface of the storage part, and the bottom of the mirror base, the process of forming the wiring design format, and the imaging element on the side of the imaging surface that is composed of a combined carrier sheet The image plane of the camera element is slightly perpendicular to the lens along the optical axis. In order to contact the wiring design format, the assembly process of mounting on the joint surface of the lens base and the assembly process of mounting the lens on the lens base are Its characteristics. 8. A method for manufacturing an imaging device, the imaging surface of the imaging element is opposed to the lens along the optical axis in a slightly vertical direction, and the joint V plane of the imaging element and the imaging element surrounding the inner peripheral surface of the imaging element are housed. The part and the mirror housing part are the construction work of the mirror stage, the joint surface with the mirror housing part and the inner peripheral surface of the imaging element, and the bottom part included in the mirror housing base, forming the wiring design format, and the The side by the knot Page 16 1237734 6. The scope of the patent application for the imaging element composed of the carrier sheet 'in order to contact the wiring design format, the assembly process of mounting on the joint surface of the lens base and the assembly process of installing the lens on the lens base, and the lens The assembling process of the lens cover attached with the aperture, and the assembling process of the lens cover and the mirror stand are its characteristics. 9. The manufacturing method of the imaging device according to item 6, 7, or 8 of the applied patent, wherein the assembling process of the imaging element is to design the wiring according to flip chip bonding (F i 1 p C hi ρ Β ο nding) Format and camera components connection engineer. 10. The method of manufacturing an imaging device according to item 6, 7, or 8 of the applied patent, wherein a filter is provided between the lens in the mirror pedestal and the imaging element. Page 17