1230430 玖、發明說明 (發明說明應紋明：發明所屬之技術領域、先前技術、内容、實施方式及圖式簡單說明） 【發明所屬技術領域】 發明領域 本發明係有關一種用於半導體製造設備之支撐台。 5 【先前技術】 發明背景 一半導體製造設備係相當沈重，並需要許多接頭連接 各種設施。如此致使半導體製造設備係設計成具有一顯著 的主框架，其中設備或是設施接頭與配線（歧管與類似物） 10通常係模組化，並於地板上方之高度連接到該主框架。如 此作法貫現了各設施以及該設備的支撐部件之快速維修通 道，但是卻使設備變得相當笨重，並難以將其安裝於一製 造設施之中，且接頭通常會變得相當凌亂。此設備之一典 型範例（所謂的「單箱」系統）係顯示於EP-A_u〇7288號之 15中，其中能夠特別參考第5、6、7、8、12、ΐ3、ΐ4、15、 16與18圖。 雙箱」系統，其中加工系1230430 发明 Description of the invention (Invention description should be clearly stated: the technical field to which the invention belongs, prior technology, content, embodiments and drawings are brief descriptions) [Technical Field to which the Invention belongs] The present invention relates to a semiconductor manufacturing equipment Support platform. 5 [Prior Art] Background of the Invention A semiconductor manufacturing equipment is quite heavy and requires many joints to connect various facilities. This has resulted in semiconductor manufacturing equipment designed to have a significant main frame, where the equipment or facility joints and wiring (manifolds and the like) 10 are typically modular and connected to the main frame at a height above the floor. In this way, fast repair channels for facilities and supporting parts of the equipment have been realized, but the equipment has become quite bulky, it is difficult to install it in a manufacturing facility, and the joints often become quite messy. A typical example of this equipment (the so-called "single box" system) is shown in EP-A_u07288 No.15, among which special reference can be made to 5, 6, 7, 8, 12, ΐ3, ΐ4, 15, 16, With 18 figure. "Double box" system, in which the processing system
一種另擇方式係為所謂的 統係分成一主系統以及一第二 是加以壁掛，該第二機箱包 6 1230430 玖、發明說明 【明内^L 3 發明概要 本發明之一觀點係在於一 裝於一無塵室中的支撐台 種用以將半導體製造設備安 該支擇台包括： 5 -基底框架，用以安置於_井式樓板上；及 設施接頭，當將設備置於支撐台上時，該設備能夠立 即與其連接，且其中該等設施接頭係位於支撐台之周圍， 或是跨過該支撐台的―部份表面，藉以在該周圍中界定出 一服務區域。 1〇 纟一高品質之無塵室中，其地板通常係為一升高或是 懸吊式地板’其係支撐於支柱之上，該等支柱係位於一有 孔的構造支架（熟知為井式樓板）上方。如此係容許層流式 空氣流通過該懸韦式或是升高的地板，穿過該等井式樓板 ，並進入下方之回流空氣空間，該空氣接著係再循環回到 15空调设備。井式樓板與升高地板之間的空隙（典型為600毫 米）通常無法充分加以利用。然而，對於特別沈重之設備 而言，其已經分配數個用以將負荷直接傳遞到井式樓板之 柱基，但是大多數之製造設備係支撐於升高地板上。 在現行支撐台之較佳實施例中，該支撐台之尺寸係適 20合女裝於井式樓板與升高或懸吊式地板之間的空間中，以 致於其覆蓋區不會顯著增加，且超過製造設備所需要的覆 蓋區。因為沒有設施接頭之模組等等圍繞該製造設備，故 接著會使其覆蓋區減少。然而，支撐台之覆蓋區並不需要 與設備相繫，且能夠較大或較小。 1230430 玖、發明說明 專σ之幵乂式為一開放框架（諸如一箱型框举杜 且其《地具有-基底該基底框架與開 ’且藉由支架腿互相連接。 開放框架構造能夠從位於井式樓板平面下方之空氣空 5間，透過基底框架而獲得通道，並因此能夠立即對設施供 應或接頭實行維修，且從而以特別便利之方式於設備下方 提供確實的通道。 支架腳之長度較佳能夠加以調整，以便能夠使支撐框 架水平，此水平尤其注重使上支撐框架與地板等高。支撐 1〇框杀與δ又備之間能夠提供進一步的調整，以便能夠準確保 持垓没備之水平，以致於使重力垂直作用於設備中進行處 理的晶圓。 上框架能夠界定出數個位置，用以安裝懸吊或升高式 地板。基底框架能夠支撐一地板，且該地板能夠便利地構 15 成一滴水托盤。 設施接頭能夠群聚於圍繞框架之位置，以便容許複數 個加工模組之「接落（drop on)」連接。 支撐台能夠方便地容納額外的物品，諸如真空果、冷 媒循環器、熱交換器、電源供應器、控制系統與其他輔助 20 設備，但其應以一種方式加以佈置，以便容許服務通道暢 通，且其本身較佳係能夠從服務區域立即觸及。 本發明之另一觀點係在於一種用於一無塵室中之半導 體製造設備的開放框架支撐台，使用上該支稽台係安裝於 一井式樓板上’並承載設施接頭且/或辅助設備。 1230430 玖、發明說明 本發明之另一觀點係在於一種用於半導體製造之無塵 室，其具有一井式樓板、一位於該井式樓板上方之升高式 地板，以及一如以上所界定之支撐台，該支撐台係裝於井 式樓板上，並位於該井室樓板與升高式地板之間。 5 除了已經提到之優點以外，對於半導體設備之採購者 而言其具有顯著的經濟優點。目前，半導體設備係趨向於 單一設施加以組裝，且如此趨勢係位於世界上的高薪區域 ’因為a又備的整體複雜度如此之高，故在組裝與測試程序 方面必須利用技術熟練且知識豐富的工程師。然而，如文 1〇中所提出者，該支撐台係相對容易製造，並能夠在技術甚 低之工廠以及工資成本較便宜的區域加以製造。因此該支 撐台提供了顯著降低製造成本的機會。 另外使用者能夠在設備交運之前將支撐台裝入其無塵 室中，從而降低設備安裝與委託製作之時間。或者使用者 15能夠保養支撐台，同時以不同來源測試設備，或是更換製 造設備之一零件。 儘管以上已經界定本發明，理解到的是其包括以上或 是以下說明中所提特性之任何創造性組合。 圖式簡單說明 20 本發明能夠以各種方式加以實行，如同現在即將藉由 範例並參考所附圖式加以說明之特定實施例，其中： 第1圖係為在一無塵室中安置於一支撐台上的半導體 設備之一簡圖； 第2圖係為該支撐台之另擇形式的詳圖。 123043ο 玖、發明說明 I[實施方式】 較佳實施例之詳細說明 在第1圖中，一地板1係藉由支架（未顯示）升高於一井 式樓板2上方。一開放框架支撐台3係安裝於該井式樓板上 5 ，且係位於地板1與井式樓板2之間的空間中。該支撐台支 撐半導體製造設備（其簡單地以4加以顯示）。設施接頭（例 如冷卻水、加工液體、擷取管路、電源供應等等）概括係 以5加以表示，且能夠連接到岐管6，其需要多個接頭連接 到一特定服務。能夠見到的是，接頭5與岐管6係能夠透過 10地板立即觸及，且如此能夠立即進行保養。岐管6實質上 延伸跨過支樓台3之上表面的部件，且因此並不會妨礙通 往服務區域之通道。 然而，第2圖中係顯示較佳之佈置，其中該等設施基 本上係圍繞框架3之周圍加以佈置。能夠見到的是液體、 15真空與氣體岐管以及電線佈線（其概括以7加以表示）係圍繞 支撐台之内部或外部周圍延伸。輔助設備（諸如7a所示）亦 能夠安置於框架3之上。 支撐台3本身可為一箱型框架之形式，其具有一基底 框架3a、一上支撐框架3b與支架腳3c。此開放構造加強了 20懸掛管路以及類似工作之能力，同時並增加服務通道。使 用一基底框架3a具有額外之優點。首先，其能夠安裝於井 式樓板層之任何位置上’而無須顧慮支架腳3〇可能會對準 井式樓板層中的孔。再者，其提供一通道孔，該通道孔穿 過圍繞支撐台或是系統基底鋪設之調整地板，且其對於將 10 1230430 玖、發明說明 一地板8置於基底框架3a之中而言係尤其便利，其亦能夠 作為一滴水托盤’以降低液體夾帶於層流空氣中或是污染 井式樓板區域之可能性。 固疋器9係可滑動地設置於此框架3a之上，以致於使 其位置能夠加以調整，以便承載支撐該井式樓板層之橫樑。 支撐框架3b(設備4係靠在其上，參看第丨圖）能夠具有 外部周圍凸緣10，用以支撐升高地板！之地板片。 第1圖中所示之設備4事實上並不完整，因為其僅顯示 主要中央單元，其能夠包含晶圓處理設備、控制設備等等 。客戶選擇之加工模組接著係圍繞該中央單元乜加以佈置 ’以便透過槽閥4b通到晶圓。這些模組之服務接頭能夠方 便地群集於圍繞框架3之適當位置，與該等模組附接到中 央單元4a之位置相對齊。此一接頭之陣列係以11加以顯示。 【圖式簡單說明】 第1圖係為在一無塵室中安置於一支撐台上的半導體 設備之一簡圖； 第2圖係為該支撐台之另擇形式的詳圖。 【圖式之主要元件代表符號表】 1 ·..地板 5...設施接頭 2…井式樓板 6…歧管 3·.·支撐台 7a...輔助設備 3a·••基底框架 7...佈線 3b·.·支撐框架 8...地板 3c-·支架腳 9...固定器 4···半導體製造設備 10...凸緣 4a·.·中央單元 11…接頭陣列 4b···槽閥An alternative method is to divide the so-called system into a main system and a second one to be wall-mounted. The second case package 6 1230430 发明, description of the invention [明 内 ^ L 3 Summary of the invention An aspect of the present invention lies in a package A support table in a clean room is used to install semiconductor manufacturing equipment. The optional table includes: 5-a base frame for placement on a well floor; and a facility joint when the equipment is placed on the support table At this time, the equipment can be immediately connected to it, and the facility joints are located around the support platform or across a part of the surface of the support platform, thereby defining a service area in the surrounding. In a high-quality clean room, the floor is usually a raised or suspended floor, which is supported on pillars, which are located in a perforated structural support (well known as a well Floor). In this way, laminar air flow is allowed to pass through the suspended or raised floor, pass through the well floors, and enter the return air space below, and the air is then recirculated back to the 15 air-conditioning equipment. The gap between the well floor and the raised floor (typically 600 mm) is often underutilized. However, for particularly heavy equipment, several pillar foundations have been allocated to directly transfer loads to the well floor, but most manufacturing equipment is supported on raised floors. In a preferred embodiment of the current support platform, the size of the support platform is suitable for the space between the well floor and the raised or suspended floor, so that its coverage area does not increase significantly. And beyond the coverage area required for manufacturing equipment. Since there is no facility connection module or the like surrounding the manufacturing equipment, its coverage area is then reduced. However, the coverage area of the support table need not be tied to the equipment and can be larger or smaller. 1230430 发明, the description of the invention σ is an open frame (such as a box-shaped frame and its base has a base-the base frame is open and connected to each other through the support legs. The open frame structure can be located from There are 5 air spaces below the floor plane of the well floor, and the channel is obtained through the base frame. Therefore, the facility supply or joint can be repaired immediately, and the actual channel is provided under the device in a particularly convenient way. It can be adjusted so that the support frame is level, and this level is particularly focused on making the upper support frame and the floor equal. The support 10 frame can be further adjusted between δ and δ to prepare to accurately maintain the oblivion. Level so that gravity acts vertically on the wafer being processed in the equipment. The upper frame can define several locations for installing suspended or raised floors. The base frame can support a floor, and the floor can conveniently Structure 15 into a drip tray. Facility joints can be clustered around the frame to allow multiple processing modules "Drop on" connection. The support table can easily accommodate additional items such as vacuum fruit, refrigerant circulator, heat exchanger, power supply, control system and other auxiliary equipment, but it should be in a way It is arranged so as to allow the service passage to be unobstructed, and is preferably itself accessible immediately from the service area. Another aspect of the present invention is an open frame support table for semiconductor manufacturing equipment in a clean room, which is used The supporting platform is installed on a well floor and carries the facilities joints and / or auxiliary equipment. 1230430 发明 Description of the invention Another aspect of the present invention is a clean room for semiconductor manufacturing, which has a well Floor, a raised floor above the well floor, and a support platform as defined above, the support platform is mounted on the well floor and is located between the well floor and raised floor 5 In addition to the advantages already mentioned, it has significant economic advantages for buyers of semiconductor equipment. At present, semiconductor equipment systems tend to A facility is assembled, and this trend is located in a high-paying area in the world. 'Because the overall complexity of a is so high, it is necessary to use skilled and knowledgeable engineers in the assembly and test procedures. However, as in Article 1 As proposed in 〇, the support platform is relatively easy to manufacture and can be manufactured in factories with very low technology and areas with lower wage costs. Therefore, the support platform provides an opportunity to significantly reduce manufacturing costs. In addition, users can Before the equipment is delivered, the support platform is installed in its clean room, thereby reducing the time for equipment installation and commissioning. Or the user 15 can maintain the support platform, test the equipment from different sources at the same time, or replace a part of the manufacturing equipment. Although the invention has been defined above, it is understood that it includes any creative combination of the features mentioned in the above or in the following description. BRIEF DESCRIPTION OF THE DRAWINGS The invention can be implemented in various ways, as it is now about to use examples and refer to the The specific embodiments illustrated in the drawings are as follows: FIG. One schematic view of the semiconductor device is disposed on a support table; a second supporting table for the system of FIG. Choose another form of detail. 123043ο 发明, description of the invention I [Embodiment] Detailed description of the preferred embodiment In the first figure, a floor 1 is raised above a well floor 2 by a bracket (not shown). An open frame support platform 3 is installed on the well floor 5 and is located in the space between the floor 1 and the well floor 2. This support table supports semiconductor manufacturing equipment (which is shown simply at 4). Facility connections (such as cooling water, process fluids, piping, power supply, etc.) are summarized at 5 and can be connected to manifold 6, which requires multiple connections to a specific service. It can be seen that the joint 5 and the manifold 6 are immediately accessible through the 10 floor, and thus can be immediately maintained. The manifold 6 extends substantially across the components on the upper surface of the mezzanine 3 and therefore does not impede access to the service area. However, Fig. 2 shows a preferred arrangement, in which these facilities are basically arranged around the periphery of the frame 3. What can be seen is that the liquid, 15 vacuum and gas manifolds, and the wiring of the wires (which is generally indicated by 7) extend around the inside or outside of the support table. Ancillary equipment (such as shown in 7a) can also be placed on the frame 3. The support base 3 itself may be in the form of a box-shaped frame, which has a base frame 3a, an upper support frame 3b, and support legs 3c. This open construction enhances the ability of 20 suspension pipes and similar work while increasing service access. The use of a base frame 3a has additional advantages. First of all, it can be installed at any position of the floor slab 'without worrying that the bracket foot 30 may be aligned with the hole in the floor slab. Furthermore, it provides a passage hole, which passes through the adjustment floor laid around the support base or the system base, and it is particularly important for placing 10 1230430 玖, invention description a floor 8 in the base frame 3a. Conveniently, it can also be used as a drip tray to reduce the possibility of liquid being entrained in laminar air or polluting well floor areas. The anchor 9 is slidably disposed on the frame 3a so that its position can be adjusted so as to carry a beam supporting the well floor. The support frame 3b (on which the device 4 rests, see figure 丨) can have an outer peripheral flange 10 to support the raised floor! Flooring. The equipment 4 shown in Figure 1 is in fact incomplete because it only shows the main central unit, which can contain wafer processing equipment, control equipment, etc. The processing module selected by the customer is then arranged around the central unit 以便 so as to pass through the tank valve 4b to the wafer. The service connectors of these modules can be conveniently clustered in a suitable position around the frame 3, aligned with the locations where these modules are attached to the central unit 4a. The array of this connector is shown at 11. [Brief description of the drawings] FIG. 1 is a schematic diagram of a semiconductor device placed on a supporting table in a clean room; FIG. 2 is a detailed diagram of another form of the supporting table. [Representative symbols for the main components of the drawing] 1 ··· floor 5 ... facility joint 2 ... well floor 6 ... manifold 3 ... support base 7a ... auxiliary equipment 3a · •• base frame 7. .. Wiring 3b ... Support frame 8 ... Floor 3c -... Stand feet 9 ... Holder 4 ... Semiconductor manufacturing equipment 10 ... Flange 4a ... Central unit 11 ... Connector array 4b ... ·· Slot valve