JP3884190B2 - Semiconductor factory - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor factory.
[0002]
[Prior art]
The factories for semiconductors and liquid crystals, etc., have a two-layer structure in accordance with the advancement of supply utilities to manufacturing equipment (increase in types and increase in quantity), with the lower floor on the utility floor and the upper floor on which manufacturing equipment is installed. Is taking the structure. And the structure which penetrates the floor which divides them, starts up various utilities, piping, and a duct, and connects to a manufacturing apparatus is common.
[0003]
In addition, the manufacturing floor where the manufacturing equipment is installed has a structure with high vibration control characteristics as processing becomes finer. That is, the beam formation is and 80cm approximately waffle slab, RyoNaru becomes isobaric equipment provided with also the beams the 120~180cm pitch etc. 70～100Cm, has a complicated structure together with the aforementioned utilities through.
For this reason, usually, a structure is adopted in which a space of 10 to 60 cm is provided on the floor for suppressing vibration, and a panel made of aluminum die cast or the like that is easy to penetrate is spread all over.
[0004]
[Problems to be solved by the invention]
However, this structure has a problem that the cost increases and the floor height increases.
The present invention has been made to solve such conventional problems, and an object of the present invention is to rationally construct the floor structure of the manufacturing floor of a factory for semiconductors, liquid crystals, etc. (short construction period / low cost).
[0005]
[Means for Solving the Problems]
The invention according to claim 1 includes a manufacturing floor on which main manufacturing equipment is installed, and piping, electric cables and ducts for supplying utilities (electricity, cooling water, gas, etc.) to the main manufacturing equipment below the manufacturing floor. A floor that divides the utility floor to be installed is provided, and the floor is made of reinforcing steel (RC or SRC) reinforced with reinforcing bars and / or steel frames , and a space surrounded by large beams in four directions or 3 A small space that controls vibration in a space that is surrounded by a large beam and whose direction is surrounded by a small beam, or a large beam that is arranged in parallel, and a space that is orthogonal to and parallel to these large beams. Beams and one or more panels are installed alternately, and the panels are pipes, electric cables and ducts that supply utilities (electricity, cooling water, gas, etc.) to the main manufacturing equipment. The main manufacturing equipment is installed on the floor with a load support leg having a level adjustment mechanism or placed on a table having a level adjustment mechanism. It is characterized by being connected to piping, an electric cable, and a duct which supply utilities (electricity, cooling water, gas, etc.) to the main manufacturing equipment .
[0006]
According to a second aspect of the present invention, in the semiconductor factory according to the first aspect, the floor includes a manufacturing facility floor provided with a floor or a rail for traveling of humans or a device for transporting products and materials. It is characterized by being arranged .
According to a third aspect of the present invention, in the semiconductor factory according to the first aspect, the small beam has a T-shaped cross section or a trapezoidal shape .
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described based on embodiments shown in the drawings.
[0010]
1 to 4 show a semiconductor factory 1 according to a first embodiment of the present invention (corresponding to claims 1, 2, and 3 ).
The semiconductor factory 1 has a two-layer structure in which the upper floor is a clean room (manufacturing floor) 11 in which main manufacturing equipment 13 is installed, and the lower floor is a utility floor 12. Then, pipes, electric cables and ducts 13a that supply utilities (electricity, cooling water, gas, etc.) to the main manufacturing equipment 13 through the floor panel 18 of the manufacturing floor 10 that divides them are started up. The structure is connected to the manufacturing equipment 13.
[0011]
The floor 10 for manufacturing floors has a T-shaped child beam 17 and a floor panel 18 for controlling vibration alternately in the same plane in a space 16 surrounded by four beams 15 provided in the semiconductor factory 1 in four directions. It is formed by installing.
Here, the small beams 17 are 300 mm × 700 to 900 mm, and are installed between the large beams 15 facing each other at an interval of 1200 mm. A set panel receiving material such as a panel support angle is disposed on the step portion 17a on which the floor panel 18 is placed.
[0012]
Further, the upper surface 17b of the small beam 17 has the RC surface smoothed by self-leveling or the like, and is floored or painted.
The floor panel 18 is a normal floor panel. The floor panel 18 is formed with a pipe for supplying utilities (electricity, cooling water, gas, etc.) to the main manufacturing equipment 13 and a hole penetrating the electric cable or duct 13a. Pipes, electric cables, and ducts 13 a for supplying utilities (electricity, cooling water, gas, etc.) to 13 are connected to the manufacturing equipment 13.
[0013]
Moreover, the large beam 15 is about 450 mm x 900-1000 mm, for example.
Further, in a portion where the floor panel 18 is not installed, a wire mesh 14 of about 100 mesh for preventing fall is attached.
The main manufacturing equipment 13 is provided with a load support leg 31 having a level adjustment mechanism (height adjuster such as an adjuster as shown in FIG. 7) 31a. The main production equipment 13 is installed on the production floor 10 in the power zone area (maintenance area) 30 via the load support legs 31.
In addition, a panel floor (manufacturing equipment floor) 33 used for traveling of a transport device (for example, AGV (automatic guided vehicle)) 32 connected to the main manufacturing equipment 13 or for human walking is clean manufactured. It is provided in the area 34.
[0014]
The panel floor 33 is installed on the production floor 10 through the load support legs 35.
An FFU (fan filter unit) 36 is attached to the upper side of the clean area 34.
According to the semiconductor device 1 according to the present embodiment configured as described above, the panel floor 33 is first placed on the production floor 10 in the clean production area 34. Next, the apparatus 32 for conveyance is mounted on the panel floor 33. Thereafter, the level adjusting mechanism 31a of the load support leg 31 of the main manufacturing device 13 is adjusted so that the delivery ports of the main manufacturing device 13 and the transporting device 32 coincide.
[0015]
As described above, according to the semiconductor device 1 according to the present embodiment, a floor of about 80% can be manufactured with a simple finish (a floor that does not require much floor accuracy), and a significant cost reduction can be achieved.
Moreover, according to the floor 10 for manufacturing floors of this embodiment, the cross-sectional T-shaped small beam 17 and the floor panel 18 are alternately installed on the same plane in the space 16 surrounded by the large beam 15 in four directions. Therefore, utility penetration is performed by the floor panel 18, and fine vibration control can be borne by the beam 17, which is more cost-effective and space-saving than a conventional production floor. There is little waste.
[0016]
Further, by converting the beam 17 into a PC, the level of the set panel receiving material for the beam 17 is finished, the surface of the beam 17 is finished (self-leveling method, etc.), and the space between the beams 17 is provided as a permanent panel or temporary Covering with a scaffold board etc., the time to enter the next process can be shortened.
In addition, since the apparatus 32 for conveyance requires floor precision, the level adjustment mechanism can also be provided in the load support leg 35 similarly to the main manufacturing equipment 13 in the panel floor 33. In this case, the transfer device 32 requiring the floor accuracy can be installed with high accuracy by the load support leg portion 35 provided with the same level adjustment mechanism on the panel floor 33. And it becomes possible to adjust with the level adjustment mechanism 31a of the main manufacturing equipment 13, without raising the finishing surface level accuracy of the manufacturing floor 10 so much.
[0017]
FIG. 5 shows another production floor 10A.
This production floor 10A is different from the production floor 1 in that the small beam 17A has a trapezoidal shape at the top.
Also in this production floor 10A, the same effect as that of the production floor 10 can be obtained.
[0018]
FIG. 6 shows a support structure when there are a plurality of floor panels 18.
When there are a plurality of floor panels 18, a panel support member 19 such as a joist is installed, and the floor panel 18 is laid thereon.
This support structure can be applied to the production floor 10 and the production floor 10A.
[0019]
FIG. 7 shows still another production floor 10B.
In the manufacturing floor 10 </ b> B, the floor panel 18 is supported via the adjuster 20. The adjuster 20 is disposed on an adjuster receiver 20a disposed on the upper surface 17b of the T-shaped beam 17 (17A) and the joist 21 that is passed between the beam 17 (17A).
[0020]
In this case, fine utility piping can be passed through the space 22 formed under the floor panel 18. Cleaning under the floor panel 18 is performed by removing the floor panel 18.
This production floor 10B can achieve the same effects as the production floor 10 and the production floor 10A.
[0021]
In addition, although the case where the space 16 forming the manufacturing floor 10, 10 </ b> A, or 10 </ b> B is a space surrounded by the four beams 15 in the four directions has been described, any one of the large beams 15 or the opposed large beam 15 may be a small beam. good.
Moreover, although the small beam 17 or 17A demonstrated the example whose cross-sectional shape is T type | mold and the trapezoid with a wide upper part, it is not restricted to these, What combined these may be sufficient.
[0022]
8 and 9 show a semiconductor device 1A according to the second embodiment of the present invention (corresponding to claims 1, 2, and 3 ).
In the semiconductor factory 1 </ b> A according to the present embodiment, the manufacturing floor 10 </ b> C has a waffle slab shape, and the transfer device 32 is mounted on the RC floor 50 with the level adjuster 51. This is different from the semiconductor factory 1 according to the embodiment.
[0023]
As shown in FIGS. 8 and 9, the floor 10 </ b> C for manufacturing floor is manufactured by forming a large number of cavities 45.
In the semiconductor factory 1A according to the present embodiment, the same effects as those of the semiconductor factory 1 according to the first embodiment can be obtained.
Note that, instead of the RC floor 50 with the height adjuster 51, as in the semiconductor factory 1 according to the first embodiment, a structure that only supports the RC floor with load support legs may be used.
[0024]
Moreover, you may install the floor panel 18 shown in FIG.
FIG. 10 shows a semiconductor device 1C according to the third embodiment of the present invention (corresponding to claims 1, 2, and 3 ).
In this embodiment, the case where the power supply rail 61 of the apparatus 32 for conveyance is provided in the panel floor (manufacturing equipment floor) 60 is shown.
[0025]
In the semiconductor factory 1C according to the present embodiment, the same operational effects as those of the semiconductor factory 1 according to the first embodiment can be obtained.
The panel floor (manufacturing equipment floor) 60 may be provided with a level adjusting mechanism.
[0026]
【The invention's effect】
According to the present invention, the level of the finished surface level of the manufacturing floor is not high, and the level adjustment between the manufacturing device and the equipment for transportation such as AGV (automatic guided vehicle) that requires the floor accuracy is performed. As a result, the cost is greatly reduced.
[0027]
In addition, the floor on which the equipment for transport is mounted is manufactured as a panel supported by a level adjustment mechanism or a floor made of RC floor or steel plate manufactured in a separate process (because it is easy to remove in the future), so about 80% Can be manufactured with a simple finish (floor that does not require much floor accuracy), and significant cost reduction can be achieved.
Furthermore, utility penetration is performed by a panel, and fine vibration control is borne by a small beam, so there is little waste in terms of cost and space.
[0028]
In addition, by making the beam into a PC, it is the level of the set panel receiving material for the beam, finishing the surface of the beam (self-leveling method, etc.), and the space between the beams with a permanent panel or temporary scaffolding plate, etc. The time for entering the next process of covering can be shortened.
[Brief description of the drawings]
FIG. 1 is a schematic longitudinal sectional view showing a main part of a semiconductor factory according to a first embodiment of the present invention.
2 is a schematic plan view showing a main part of a manufacturing floor used in the semiconductor factory of FIG. 1. FIG.
3 is a schematic longitudinal sectional view showing a main part of the floor for production floor in FIG. 1. FIG.
4 is a schematic explanatory view showing the semiconductor factory of FIG. 1; FIG.
FIG. 5 is a schematic plan view showing a main part of a production floor used in the present invention.
FIG. 6 is a schematic longitudinal sectional view showing a support structure when a plurality of floor panels are provided.
FIG. 7 is a schematic plan view showing the main part of the floor for production floor used in the present invention.
FIG. 8 is a schematic longitudinal sectional view showing a main part of a semiconductor factory according to a second embodiment of the present invention.
9 is a schematic plan view showing a main part of the semiconductor factory of FIG. 8;
FIG. 10 is a schematic longitudinal sectional view showing a semiconductor device 1C according to a third embodiment of the present invention.
[Explanation of symbols]
1, 1A, 1B, 1C Semiconductor factory 10, 10A, 10B Production floor 11 Clean room (production floor)
12 Utility floor 13 Manufacturing equipment 13a Piping, electric cable and duct 14 Wire mesh 15 Large beam 16 Space 17, 17A Child beam 17a Step 17b Upper surface 18 Floor panel 14 is attached.
31, 35 Load support legs 31a Level adjustment mechanism 32 Transport device 33 Panel floor (manufacturing equipment floor)
34 Clean manufacturing area 36 FFU (fan filter unit)
50 RC floor with level adjuster 51 Panel floor (Manufacturing equipment floor)
61 Feed rail

Claims (3)

Production floor where main production equipment is installed,
Below this production floor, it is equipped with piping that supplies utilities (electricity, cooling water, gas, etc.) to the main production equipment, a floor that divides the utility floor where electric cables and ducts are installed,
The main part of the floor is made of concrete (RC or SRC) which is reinforced with reinforcing bars or steel frames or both, and is surrounded by four beams in a large space or in three directions by a large beam and in one direction by a small beam. In the space surrounded by or in parallel with the large beams and the space surrounded by the small beams that are orthogonal to and parallel to the large beams, the small beams that control vibration and one or more panels are installed alternately.
In the panel, a pipe that supplies utilities (electricity, cooling water, gas, etc.) to the main manufacturing equipment, a hole penetrating an electric cable or duct is formed,
The main manufacturing equipment is installed on the floor with a load support leg having a level adjustment mechanism or placed on a table having a level adjustment mechanism, and a utility is provided to the main manufacturing equipment through a hole in the panel. A semiconductor factory that is connected to pipes, electric cables and ducts for supplying electricity (cooling water, gas, etc.) . In the semiconductor factory according to claim 1,
A semiconductor factory characterized in that a manufacturing facility floor provided with a floor or rails for running a device for walking of human beings and for transporting products and materials is disposed on the floor surface. In the semiconductor factory according to claim 1,
A semiconductor factory characterized in that the beam is T-shaped or trapezoidal in cross section .

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