TWI230429B - Testing method and apparatus for circuit substrate - Google Patents
Testing method and apparatus for circuit substrate Download PDFInfo
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- TWI230429B TWI230429B TW92126917A TW92126917A TWI230429B TW I230429 B TWI230429 B TW I230429B TW 92126917 A TW92126917 A TW 92126917A TW 92126917 A TW92126917 A TW 92126917A TW I230429 B TWI230429 B TW I230429B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Description
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本發明係為一藉雷炊I 4 日 ga ^ Θ 種電路基板之篁測方法及裝置,特別是 關於一種可置測高密声雷 j疋 【發明所屬之技術領域】 pa佶&旦、目,丨t、+ 度電路基板之線路或導電貫孔之微小The present invention relates to a method and device for measuring circuit board ga ^ Θ circuit boards, especially to a high-density acoustic thunder which can be measured. [Technical field to which the invention belongs] pa 佶 & , 丨 t, + degree of circuit board circuit or tiny conductive vias
阻值的夏測方法及裝置。 k J 【先前技術】 ▲按,由於科技的進步使得電子產品能夠越來越小,而 功此部越來越多,而電子產品需使用電路基板來承載電子 ::及其連接線路,目前最高密度之電路基板莫過於使用 在中央處理器(CPU)之球閘陣列(Ball Grid Array,bga) 封裝技術之電路基板,該種BGA封裝技術的好處是在同樣 尺寸面積下之電路基板,可連接之引腳數高達300支接腳 以上的高密度封裝Ic。 又由於目前電子產品的工作電壓相當的低,如新式 CPU的工作電壓約在1.3V左右,在如此低電壓的高密度電 ,基板上,其線路或導電貫孔之微阻值大小就非常重要, 若線路阻值過大,或導電貫孔發生微破孔,都會影響電子 元件的正常動作,因此電路板裸板之微阻值量測是目前各 IC廠商在封裝製程前或電路基板廠商出貨前皆必須要量測 的。 電路基板有單面式、雙面式或多層式,且電路基板有 分為硬式基板或軟式基板兩種,而其製程又可分印刷式及 壓合式兩種,不論那一種電路基板其上皆會設有導電線路 以連接電子元件,而在雙面式或多層式電路基板上會設導Summer measurement method and device for resistance value. k J [Previous technology] ▲ Press, due to the advancement of technology, electronic products can become smaller and smaller, and more and more power can be obtained. Electronic products need to use circuit substrates to carry electronics :: and its connection lines, currently the highest There is no density circuit board than the circuit board used in the Ball Grid Array (bga) packaging technology of the central processing unit (CPU). The advantage of this BGA packaging technology is that the circuit board can be connected under the same size area. High-density package Ic with pin count up to 300 pins or more. And because the current operating voltage of electronic products is quite low, such as the new CPU's operating voltage is about 1.3V, at such a low voltage high-density electricity, the micro resistance value of the circuit or conductive via on the substrate is very important. If the resistance of the line is too large, or the micro-hole of the conductive through hole will affect the normal operation of the electronic component, the measurement of the micro-resistance of the bare board of the circuit board is currently shipped by the IC manufacturers before the packaging process or the circuit substrate manufacturers. It must be measured before. There are single-sided, double-sided, or multi-layer circuit boards, and there are two types of circuit boards: hard or soft. The process can be divided into two types: printed and laminated. No matter which circuit board is on it Conductive circuits will be provided to connect electronic components, and conductive circuits will be provided on double-sided or multilayer circuit boards.
第5頁 1230429Page 5 1230429
電貫孔以連接之每一層之導電線路,為降低阻值會在其 電線路或導電貫孔上鍍金、鍍銀或鍍銅,如銀膠貫孔,、 前針對電路基板導電線路或導電貫孔(以下簡稱待測物) 微小阻值量測有二種方式,第一種是二線式量測法, 種是四線式量測法。 首先凊先參閱第一圖所示,係為二線式量測之電路連 接示意圖,主要利用二支探針電氣接觸在待測物(dut)之 兩端,再施加電壓V以量測電流值A,即可量測該待測物之Electrical vias are used to connect the conductive circuits of each layer. To reduce the resistance, gold, silver, or copper plating is applied to the electrical circuits or conductive vias, such as silver glue vias. Hole (hereinafter referred to as the object to be measured) There are two ways to measure the small resistance value. The first is a two-line measurement method and the fourth is a four-line measurement method. First, please refer to the first figure, which is a schematic diagram of the circuit connection of the two-wire measurement. The two probes are mainly used to electrically contact the two ends of the object under test, and then the voltage V is applied to measure the current value. A, you can measure the
Pf值RDUJ = V/A,然而在該種二線式量測法中,若是探針或Pf value RDUJ = V / A, however, in this two-line measurement method, if the probe or
S測儀器導線之阻值(rl、r2)與該待測物阻值(rdut)越接 近時,其實際量測阻值(rMEAS)之誤差會越大,亦即 RMEAS = V/A = rl+r2 + RDUT,故而僅能量測歐姆級(Ω)的電路 基板,亦即無法量測鍍金、鍍銀或鍍銅,如銀膠貫孔的電 路基板。 再參閱第二圖所示,係為四線式量測之電路連接示意 圖,该四線式量測是為量測毫歐姆級Ω )的電路基板, 主^要^利用四支探針分別電氣接觸在待測物(DUT)之兩端 (每^各二支),該四支探針可將其定義為S+、M+、S-及M-各探針及導線之阻值為(1«1、r2、rml&rm2),此時分別在 M^f及M-兩端施加電壓v,而在s+及3-兩端量測電流值a,由 於V之内阻為高阻抗,故流經該電壓V之電流Im+及一与 〇曰’所以量測電壓(VMEAS)与待測物電壓(VDUT),所以實際 量測阻值(RMEAS) = V/A=待測物阻值(RDUT),而不會受到 rl+r2 及 rml+rm2 的影響。The closer the resistance value (rl, r2) of the wire of the S measuring instrument and the resistance value (rdut) of the object to be measured, the greater the error in the actual measured resistance value (rMEAS), that is, RMEAS = V / A = rl + r2 + RDUT, so only the ohmic (Ω) circuit board can be measured with energy, that is, the gold-plated, silver-plated, or copper-plated circuit board cannot be measured. Referring again to the second figure, it is a schematic diagram of the circuit connection of a four-wire measurement. The four-wire measurement is a circuit substrate for measuring milliohms. It is necessary to use four probes to electrically The four probes can be defined as S +, M +, S-, and M-. The resistance of each probe and wire is (1 « 1, r2, rml & rm2), at this time a voltage v is applied across M ^ f and M-, respectively, and the current value a is measured at s + and 3-. Because the internal resistance of V is high impedance, the current The current Im + and the voltage V through the voltage V so that the measurement voltage (VMEAS) and the voltage of the object to be measured (VDUT), so the actual measured resistance value (RMEAS) = V / A = resistance of the object to be measured (RDUT ) Without being affected by rl + r2 and rml + rm2.
第6頁 1230429 五、發明說明(3) 二支量測必需在每一待測物之兩端各接觸 二 小(如bga之導電貫孔約在’而 考=針約為〇.7m/m,根本無法採用四線式量測法,又 慮基板偏移及兩探針之間距,故測點邊緣尚需留 • m m至〇. 7m/m為宜,否則會因電路基板的偏移而伸入貫 之單價::Ϊ:即ίί折斷探針之虞’況且該種最細探針 用铲今$二叩貝右里測點多時根本不敷成本,更別提使 用鍍金或鍍銀的探針了。 <心 方十ΐ Ϊ Ζ ΐ是二線式或四線式量測,習知探針式的量測 i測軟式電路基板’且在使用探針量 該作量測以’並需規 器來量測,』:常:針精確位置,才能搭配測試儀 同的量測、、Λ 1 ^ ί f各種不同線路的電路基板製作不 的探# , 一篁測治具上皆佈滿數百甚至數千支 =針::因此廠商在量測電路基板 ; 探針,以及量測治具的製作。 1牡於 美板^古I案發明人即為冑決上述現有量測高冑度電路 =有:便與缺失,乃特潛心研究並配合學 Ϊ適不使用探針及量測治具之電路基板量測方法 法’里測兩面式或多層式電路基板之阻值的目的。置測 【發明内容】 1230429 五、發明說明(4) 本發明之目的是提一入 萬用的量測带置 /、 王新的電路基板量測方法及 量測的問胃,、亦Z解決高密度電路基板無法使用四線式 板,完全不需針二里〆則軟式、硬式等任何種類的電路基 針,故亦無二= = 製作治具,且因不使用探 成本。 、木十抽耗的問題,可大幅降低量測 為達成上述目的,木挤 一種電路基板量测 ^ 要技術特徵係在於提供 接供線路電性連接至少一導電貫孔,該方法首先 路基板之一面,使該導= 測板,覆貼於該電 板,=於Ξί:=:Γ:行橫導電條之第二量測 線觸於“導電=著 -該直導電條與橫導電條;最後量測任 任二該橫導電條Η夕ί ί導條間、任二該直導電條間或 為一種入薪Μ : 4電壓、電流、電阻等電性物理值,係 測試儀器之功效。 、j運成相谷於目刖所有 板次7技術特徵係在於提供-種二線式電路基 每導=1方法,該電路基板上佈設有複數導電線路, 母一導電線路電性遠垃 + _ -密佈複數平行直導;:導=,;方法首先提供 ^ ^ I 导%條之第一 1測板,覆貼於該電路基 一 ’使該導電貫孔或該導電、線路電性接觸該直導電 1230429 五、發明說明(5) 條,再提供一密佈複數平行橫導 於該電路基板 接觸該橫導電 條、任二直導 於該直導電條 導電條間;最 值,即得待測 統探針及測試 本發明之 板微阻值量測 每一導電線路 一密佈複數平 板之一面,使 條,再提供一 於該電路基板 觸該檢導電條 任一該橫導電 間所電性連接 該或直導電條 貫孔或該導電 路基板皆可作 本發明之 裝置’該電路 電性連接至少 之另一面 條;然後選 電條或任二 與該橫導電 後量測流經 該導電貫孔 治具,達成 另一技術特 方法,該電 電性連接至 行直導電條 該導電貫孔 密佈複數平 之另一面, ;接著提供 條間、任二 之該導電貫 或该橫導電 線路之微阻 四線式量測 又一技術特 基板上佈設 —導電貫孔 使該導 擇任一 橫導電 條間、 該直導 或導電 降低成 徵係在 路基板 少一導 之第一 或該導 行橫導 使該導 一量測 該直導 子或該 條之電 值,以 之功效 徵係在 有複數 ,該量 電條之 電貫孔 直導電條與任_ 條;接著提供一 第二量測 或該導電 二該直導電條間 該橫導電 小阻值, 電條或 線路之 本之功 於提供 上佈設 電貫孔 量測板 電線路 電條之 電貫孔 電壓於 電條間 導電線 流值, 達成使 效。 一種四線 有複數導 ’該方法 ’覆貼於 電性接觸 第二量測 或導電線 任一該直 或任二該 路;最後 即得待測 用在任何 板,覆貼 線路電性 橫導電 量測電壓 或二該橫 條之電流 以取代傳 式電路基 電線路, 首先提供 該電路基 該直導電 板,覆貼 路電性接 導電條與 橫導電條 量測流經 之該導電 高密度電 於提供一種電路基板量測 導電線路,每一導電線路 測裝置包括:一第一量測Page 6 1230429 V. Description of the invention (3) Two measurements must be in contact with two small ends at each end of each object to be measured (for example, the conductive through hole of bga is about 'and the test = the needle is about 0.7m / m It is impossible to use a four-wire measurement method, and the offset of the substrate and the distance between the two probes are taken into consideration, so the edge of the measurement point needs to be left • mm to 0.7m / m is appropriate, otherwise it will be The unit price of penetrating into :: Ϊ: the risk of broken probes. Moreover, the finest probe with this shovel costs two dollars. The measuring point at the right can't cover the cost at all, let alone the use of gold-plated or silver-plated probes. The heart is square. 心; Ζ is a two-wire or four-wire measurement. The conventional probe-type measurement is used to measure a soft circuit board. Requires a gauge to measure, ": often: the precise position of the needle can be used in conjunction with the tester to measure, Λ 1 ^ ί f # of circuit boards made of various different circuits # 皆, all on the test fixture Hundreds or even thousands of pins = pins: So manufacturers are measuring circuit substrates; probes, and measuring jigs are manufactured. 1 U in the US board ^ ancient I case the inventor is In order to determine the above-mentioned current measurement of high-degree circuits = Yes: there are and is missing, we are dedicated to research and cooperate with the school to measure the method of measuring circuit boards without using probes and measuring jigs. The purpose of the resistance value of the circuit board. Measurement [Inventive Content] 1230429 V. Description of the Invention (4) The purpose of the present invention is to provide a universal measurement tape placement method, Wang Xin's circuit board measurement method and quantity The test asks the stomach, and also solves the problem that high-density circuit substrates cannot use four-wire boards. Needless to say, two types of pins are required: soft, hard, and other types of circuit base pins. Because the cost of exploration is not used, the problem of the consumption of wood can greatly reduce the measurement. To achieve the above purpose, a circuit board measurement of wood extrusion is required. The technical feature is to provide at least one conductive through hole for the electrical connection of the power supply line. In this method, the first surface of the substrate is routed, so that the conductor = a measuring board is attached to the electric board, and the second measuring line of the horizontal conductive strip touches "conducting = facing-the straight conducting". Strips and horizontal conductive strips; finally measure any two of the horizontal conductive stripsΗ Xiί ί The guide bar, any two of the direct conductive bars, or a type of electrical physical value: 4 voltage, current, resistance and other electrical physical values, which are the effectiveness of the test instrument. The technical feature of sub-7 is to provide-a two-wire circuit base per lead = 1 method. The circuit substrate is provided with a plurality of conductive lines, and the mother-conductor line is far from electrical + +-dense parallel parallel direct conduct; The method firstly provides the first 1 test board with ^ ^ I conductive% strips, which is affixed to the circuit base to make the conductive through hole or the conductive line electrically contact the straight conductive 1230429 V. Description of the invention (5) And a dense plurality of parallel lateral guides are provided on the circuit substrate to contact the horizontal conductive strips, and any two are directly guided between the conductive strips of the straight conductive strips; the best value is to obtain the probe of the system under test and test the microchip of the present invention. The resistance value is measured on one side of a dense plurality of flat plates of each conductive line to make a strip, and then a circuit board is provided to electrically contact the conductive strip through hole or the conductive strip when the circuit substrate touches any of the lateral conductive spaces of the conductive strip. The circuit substrate can be used as the device of the present invention. Electrically connect at least another noodle; then select an electric strip or any two and measure the current through the conductive through-hole fixture after the horizontal conduction to achieve another technical special method, which is electrically connected to the straight conductive strip and the conductive The through holes are densely arranged on the other side of a plurality of flat, and then a micro-resistance four-wire measurement of the conductive through or horizontal conductive lines between strips is provided. Another technology is arranged on the special substrate-conductive through holes make the guide optional. Between a horizontal conductive strip, the direct conduction or reduced conductivity is the first one with less one in the road substrate, or the horizontal cross guide makes the guide measure the electrical value of the direct conductor or the strip to the effect Symptoms are that there are plural, electrical through holes of the electrical bar and any conductive bars; then a second measurement or the small resistance value of the lateral conduction between the conductive bars and the straight conductive bars is provided. The purpose of this book is to provide the through-hole measurement board with the electrical through-hole voltage of the electrical line of the electrical line and the conductive line current value between the electrical bars to achieve the effect. A four-wire method with a complex guide "the method" is applied to the electrical contact of the second measurement or the conductive line either directly or in any of the two ways; finally, the board to be tested can be used on any board and the line is electrically conductive Measure the voltage or the current of the horizontal bar to replace the circuit-based electrical line. First, provide the circuit-based straight conductive plate and cover the circuit. Electrically connect the conductive bar and the horizontal conductive bar to measure the conductive high density flowing through. The electric circuit provides a circuit substrate for measuring conductive lines, and each conductive line measuring device includes: a first measurement
五、發明說明(6) 路基板之::有:J :平行之直導電條,可覆貼於該電 一該直導電條;一=-旦貫孔或該導電線路電性接觸至少 之橫導電條,可覆貼:f板,其上密佈有複數相互平行 孔或該導電線政兩4 ;〜電路基板之另一面,使該導電貫V. Description of the invention (6) Circuit board :: Yes: J: Parallel straight conductive strips, which can be pasted on the electrical one-straight conductive strips; one = -through holes or the conductive lines electrically contact at least the horizontal Conductive strips can be overlaid: f-plates, which are densely covered with a plurality of parallel holes or the conductive lines 2 to 4; ~ the other side of the circuit substrate to make the conductive
開關電連接至所:接觸至少一該橫導電條;至少一選擇 電連接至直導電條及該橫導電條;—量測K 導電條與任一嗜彳1 ^雷f由該選擇開關選擇量測任一該直 橫導電條間之電‘:::間、任二該直導電條間或任二該 電路基板之導電線路或導電使用探針即能量測 【實施方式】 定目的所:取委更進一步瞭解本發明為達成預 明之詳細說明盥附固 2及功效,請參閱以下有關本發 當可由此得:深::且:信本發明之目的、特徵與特點, 考與說明用,並非用;S瞭解’然而所附圖式僅提供參 請參閱第來對本發明加以限制者。 硬體架構示意圖,第:圖發明電路基板量測裝置之 圖,第五圖係本發明量發明之使用⑯態剖面示意 係為一種完全 d電路基板之流程示意圖。本發明 :所量測電路基板量測裝置i 了為早面、雙面或多層電路A式或軟式之電路基板,亦 -板面及—第二板面22,上該電路基板2具有一第 其上佈设有複數導電線路23, 1230429 -----—— 五、發明說明(7) 每一導電線路23皆電性遠士 一電性焊點25,該導雷Ϊ接有至少一導電貫孔24或者至少 電性連接該第—板面21、J2一4:【穿:電 路23,如銀膠貫孔,而#罘一扳面22或内層板面之導電線 電子元件之一接腳。μ電性焊點25則係可電性焊接至一 本發明之量測裝置1 〇 測板12、至少一選擇 ^由一第一 I測板11、一第二量 該第一量測板11上密5一量測翠元14所組成。其中 可覆貼於該電路基板? 數相互平行之直導電條ill, 該導電線路23或4電性熄f9:板面21,使該導電貫孔24、 電條⑴(20。)以:·:2可電性接觸於至少-該直導 互平行之橫導電停121第·上亦同樣密佈有複數相 面以,使該導ΓΪ二Λ二該電路基板2之第二板 電性接觸;^ i /1、 β π I導電線路23或該電性焊點25可 兔f觸於”-該橫導電條1 21 ( 202)。 不導ί f所里,板11與該第二量測板1 2係可以為-可撓性 板2上,而其上= 可完全覆貼於該電路基 121的寬度可以為二:佈”直導電條111或該橫導電條 見厌』以马0· Olm/H 7m/m 二直導電條間或兩相鄰該橫導電條間之任規格兩相鄰 ΐίί 電線路、導電貫孔或電性焊的密度而定。 所有關13係電連接至所有該直導電條⑴或 可以選擇任—直導電條ιη(2〇4)及 任一k導琶條1 21 (206)作為量測的端點,或者任二直導電 第11頁 1230429 -*------ 五、發明說明(8) 條1 U或任一橫導電條作 J:::以-測試儀器,藉由 測電 以=_於心:==丄= 表量測任-直導電條與任條:1 ’ :該量測電 板“ 3板1貼覆於該電路基 241之導電貫孔或可=觸广標號 m電性接觸於如桿於242 :::;路’亦可使該橫導電條 糊之導電貫=4之;:!貫孔或232之導電線路, 之導電線路皆相互電連性^ U路、242之導電貫孔及232 係,而量測導電+ $ $ i Ϊ接者,故可藉其電性連接之關 =利導電貝孔或導電線路上之微阻值。 。第六圖所示即為本發明二線式量測 ίΙ^:::ηΓΤ 134所組成,哕笛一.s第二選擇開關133及一第四選擇開關 選擇電連接至任一吉^道擇開關131或該第三選擇開關133可 第四選ΪΪί:: 電條111 ’而該第二選擇開關⑶或 二關則坻擇電連接至任一橫導電條121 , 形成二線式量測之二個量測端點。 門量測單元U提供一電壓源141至第一或第三選擇 ^ 、133所選擇到之任一該直導電條111,以及第二 第12頁 1230429The switch is electrically connected to: contact at least one of the horizontal conductive strips; at least one selection is electrically connected to the straight conductive strip and the horizontal conductive strip;-measure the K conductive strip and any of the 彳 1 ^ thunder f selected by the selection switch Measure the electricity between any of the straight and horizontal conductive strips' :::, between any two of the straight conductive strips, or between any two of the conductive substrates of the circuit board or conduct electricity using a probe, which is the energy measurement [Implementation] The commissioner will further understand the detailed description of the present invention to achieve the detailed description of the toilet 2 and its effects, please refer to the following about the present invention can be derived from: deep :: and: believe the purpose, features and characteristics of the present invention, for examination and explanation It is not used; S understand 'however, the drawings are provided only for reference, please refer to the following to limit the present invention. Schematic diagram of the hardware architecture, the first figure is the circuit board measuring device of the invention, and the fifth figure is the schematic diagram of the use of the invention's quantum cross section. It is a schematic diagram of a complete circuit board. The present invention: The measured circuit board measuring device i is an early-side, double-sided, or multilayer circuit A or soft circuit board, and also-a board surface and-a second board surface 22, on which the circuit board 2 has a first It is provided with a plurality of conductive lines 23, 1230429 --------- V. Description of the invention (7) Each conductive line 23 is electrically conductive and an electrical solder joint 25, and the lightning conductor is connected with at least one The conductive through hole 24 or at least electrically connects the first plate surface 21, J2 to 4: [through: circuit 23, such as a silver glue through hole, and # 罘 一 开关 面 22 or one of the conductive electronic components on the inner plate surface Pin. The μ electrical solder joint 25 can be electrically welded to a measuring device 10 of the present invention. 10 The measuring plate 12, at least one option. A first measuring plate 11 and a second measuring plate 11 Shangmi 5 was measured by Cuiyuan 14. Which can be attached to the circuit board? Numbers of parallel conductive strips ill parallel to each other, the conductive line 23 or 4 are electrically extinguished f9: board surface 21, so that the conductive through hole 24, the electrical strip ⑴ (20.) can be electrically contacted with at least -2: The direct conductive parallel parallel conductive stops 121 are also densely packed with multiple phases so that the conductive leads ΓΪ 二 Λ2 and the second board of the circuit substrate 2 are in electrical contact; ^ i / 1, β π I conductive The circuit 23 or the electrical solder joint 25 can be touched by the rabbit "-the horizontal conductive strip 1 21 (202). In this case, the board 11 and the second measurement board 12 may be-flexible The width of the board 2 can be completely covered on the circuit board 121. The width can be two: cloth "straight conductive strip 111 or the horizontal conductive strip is disgusting" Ima 0 · Olm / H 7m / m two straight Any size between conductive strips or between two adjacent conductive strips is determined by the density of two adjacent adjacent electrical lines, conductive vias, or electrical welding. All Guan 13 series are electrically connected to all the straight conductive strips. Or you can choose any-straight conductive strip ιη (204) and any k guide strip 1 21 (206) as the measurement endpoint, or any two straight strips. Conductive Page 11 1230429-* ------ V. Description of the invention (8) Article 1 U or any horizontal conductive bar as J :::-to-testing instrument, by measuring electricity to = _ 于 心: = = 丄 = Measure Measure-Straight Conductive Strip and Measure: 1 ': The measuring electric plate "3 plate 1 is attached to the conductive through hole of the circuit base 241 or can be touched wide with m electrically contacting such as The rod at 242 :::; road 'can also make the conductive conductivity of the horizontal conductive strip paste = 4;:! Through holes or 232 conductive lines, the conductive lines are all electrically connected ^ U road, 242 conductive The hole and 232 series, and the measurement of conductive + $ $ i connection, so you can take advantage of its electrical connection = the value of the micro-resistance on conductive conductive holes or conductive lines. The sixth figure shows the invention Two-line measurement ίΙ ^ ::: ηΓΤ 134, which is a second selection switch 133 and a fourth selection switch 133 which are electrically connected to any one of the selection switch 131 or the third selection switch 133 Can choose the fourth option: :: Article 111 'And the The second selection switch ⑶ or the second switch is electrically connected to any one of the horizontal conductive strips 121 to form two measurement endpoints of the two-wire measurement. The door measurement unit U provides a voltage source 141 to the first or the second measurement terminal. Three options ^, any one of the straight conductive bars 111 selected by 133, and the second page 1230429
或第四選擇開關132、134所選擇到之該橫導電條121上, 以供應該直導電條11丨與該橫導電121條間一量測電壓v, 使能量測流經該直導電條丨丨i與該橫導電條丨2 1間之電流值 A ’即可得知該直導電條丨丨!與該橫導電條丨2 1所電性連接 之電線路2 3、導電貫孔2 4或電性焊點之阻值r。 _請參閱第七圖所示,係為本發明二線式量測單面基板 之等效不意圖。由圖所示該實施例可藉由該第一或第三選 擇開關131、133以及第二或第四選擇開關132、134來選擇 該第一量測板1 1上任二條之該直導電條丨丨丨或任二條之該 ,導電條121,而所選擇之任二直導電條ηι或任二條之該 板導電條1 2 1皆電性接觸同一電性連接之導電貫孔24或導 電線路23,如此即形成二線式量測之二個量測端點/ ^而如第八圖所示,即為本發明四線式量測雙面基板之 等效示意圖,該四線式量測係經由該第一選擇開關丨31及 該第三選擇開關1 32所選擇到之任一該直導電條丨丨i,以及 由該第二選擇開關1 33及第四選擇開關丨34所選擇到之任一 °亥铋導電條1 2 1,由该量測單元1 4提供一電壓源1 41,供應 該第二選擇開關1 32與該第三選擇開關丨33間一量測電壓 V,使能量測流經該第一選擇開關丨31與該第四選擇開關 134間之電流值A,即可得知所擇之該直導電條U1與該橫 導電條121所電性連接之導電線路23、導電貫孔24或電性 烊點之阻值R。 々又如第九圖所不,係為本發明四線式量測單面基板之 等效示意圖。由圖所示該實施例可藉由該第一及第三選擇 1230429 五、發明說明(10) 開關1 3 1、1 3 3來選擇任一條該直導電條丨11或任一條該 121,以及第二及第四選擇開關132、134來選擇另一條該 直導電條1 11或另一條之該橫導電條丨2 1,而所選擇之二直 =電條111或橫導電條121皆電性接觸同一電性連接之導電 =孔24或導電線路23 ,如此即形成四線式量測之四個量測 職是 新的電路 裝置,但 型的電路 之使用價 合發明專 惟, 而已,凡 之改良, 定之專利 ,本發明 基板量測 又能相容 基板,週 值,又其 利之要件 上述所揭 精于此項 而這些改 範圍中。 確能藉上 方式,完 於現有的 然不同於 申請前未 ’菱依法 露之圖式 技藝者當 變仍屬於 述所揭 全取代 測試儀 習知者 見於刊 提出發 、說明 可依據 本發明 探針及測試治具的量測 器上,且可測試任何類 的設計,堪能提高整體 物或公開使用,誠已符 明專利申請。 ,僅為本發明之實施例 上述之說明作其他種種 之發明精神及以下所界 1230429 I圖式簡單說明^ ^—---— /【圖式簡單說明】 / (1)圖式說明: 丨量測之電路連接示意圖; 第―一圖係為四線式量測之電路連接示意圖; 弟二圖係為本發明之硬體架構示意圖·, 第四圖係為本發明之使用狀態剖面示耷圖; 第五圖係為本發明量測電路基板之流i示意圖; 第六圖係為本發明二線式量測雙面 圖; 工吁攻不葸 第七圖係為本發明 圖; 第八圖係為本發明 圖;及 第九圖係為本發明 圖0 二線式量測單面電 四線式量測雙面電 四線式量測單面電 路基板之等欵示意 路基板之等效示意 路基板之等效示意 (2 )主要部分之代表符號: 量測裝置 1 11 111 12 121 13Or the fourth conductive switch 132, 134 selects the horizontal conductive strip 121 to supply a measurement voltage v between the straight conductive strip 11 and the horizontal conductive strip 121, so that energy measurement flows through the straight conductive strip.丨 丨 The current value A ′ between i and the horizontal conductive strip 丨 2 1 can know the straight conductive strip 丨 丨! Electrical resistance 2 electrically connected to the horizontal conductive strip 丨 2 1, conductive through hole 24 or resistance r of the electrical solder joint. _ Please refer to the seventh figure, which is the equivalent intention of the two-line measurement single-sided substrate of the present invention. As shown in the figure, the first or third selection switch 131, 133 and the second or fourth selection switch 132, 134 can be used to select the two straight conductive bars on the first measurement board 11丨 丨 or any two, conductive strip 121, and any two straight conductive strips ηι or any two of the plate conductive strips 1 2 1 are in electrical contact with the conductive through hole 24 or conductive line 23 of the same electrical connection In this way, the two measurement endpoints of the two-line measurement are formed. As shown in FIG. 8, it is an equivalent schematic diagram of the four-line measurement of the double-sided substrate of the present invention. The four-line measurement system Any one of the straight conductive strips 丨 i selected by the first selection switch 31 and the third selection switch 1 32 and those selected by the second selection switch 1 33 and the fourth selection switch 丨 34 Any bismuth conductive strip 1 2 1 is provided with a voltage source 1 41 by the measuring unit 14 to supply a measurement voltage V between the second selection switch 1 32 and the third selection switch 丨 33 to enable By measuring the current value A flowing between the first selection switch 31 and the fourth selection switch 134, the selected direct conduction can be known U1 the horizontal conductive strip 121 is electrically connected to the conductive traces 23, 24, or points of electrical vias molten resistance R. 々 As shown in the ninth figure, it is the equivalent schematic diagram of the four-wire measurement single-sided substrate of the present invention. As shown in the figure, the first and third options 1230429 can be used in this embodiment. 5. Description of the invention (10) The switch 1 3 1, 1 3 3 can select any one of the straight conductive bars 11 or any of the 121, and The second and fourth selection switches 132 and 134 select another one of the straight conductive strips 1 11 or the other of the horizontal conductive strips 丨 2 1, and the selected two straight = electric strip 111 or horizontal conductive strip 121 are electrically Contact the same electrical connection of conductive = hole 24 or conductive line 23, so that the four measurement positions that form a four-wire measurement are new circuit devices, but the use of the type of circuit is unique to the invention, only, where The improvement, the fixed patent, and the substrate measurement of the present invention are compatible with the substrate, the week value, and the advantages of the advantages. It is indeed possible to borrow the method, which is different from the existing pattern artist before the application, which is still different from the application before the application. The current practice is still described in the full replacement tester. Needle and test fixture on the measuring device, and can test any kind of design, can improve the overall or open use, since the patent application has been identified. It is only an embodiment of the present invention. The above description makes other various inventive spirits and the following boundaries. 1230429 I Simple explanation of the diagram ^ ^ ---- / [Simplified explanation of the diagram] / (1) Illustration of the diagram: 丨Schematic diagram of circuit connection for measurement; The first diagram is the schematic diagram of circuit connection for four-wire measurement; the second diagram is the schematic diagram of the hardware architecture of the present invention, and the fourth diagram is a cross-sectional view of the use state of the invention. The fifth diagram is a schematic diagram of the flow i of the measurement circuit substrate of the present invention; the sixth diagram is a double-sided measurement of the two-line measurement of the present invention; the seventh diagram is a diagram of the present invention; the eighth The figure is a diagram of the present invention; and the ninth diagram is a diagram of the present invention. Fig. 0 Two-line measuring single-sided electric four-wire measuring double-sided electric four-wire measuring single-sided circuit board (2) Representative symbols of main parts: Measurement device 1 11 111 12 121 13
第一量測板 直導電條 第二量測板 橫導電條. 選擇開關 第一遂擇開關 1 3 ^First measurement board Straight conductive bar Second measurement board Horizontal conductive bar. Selection switch First selection switch 1 3 ^
第15頁 1230429Page 15 1230429
第16頁Page 16
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