1228291 五、發明說明（1) 【發明所屬之技術領域】 本發明是有關於一種晶片盤（chip tray)，且特別 是有關於一種具有相對之凹槽及平台的晶片盤。 【先前技術】 在半導體製程上，主要可分成積體電路設計 (integrated circuit design，IC design)、晶圓製程 (wafer fabrication)、晶圓測試（testing)、晶圓切 割及晶片封裝（chip packaging )等步驟。在以積體電路 設計為基準下，矽晶圓可以經由一連串的晶圓製程而形成 一具有電氣特性的晶圓。接著，將對晶圓上的每個晶片 (ch 1 p )進行電性測試。例如，在檢測頭裝上金線所製成 之細如毛髮的探針（probe)，並與晶片上的接點（pad) 接觸，以測試其電氣特性，不合格的晶片會被標上記號。 然後i晶圓將被切割成單顆獨立的晶片，並將好的晶片置 放於晶片盤（chip tray )中，以送給封裝廠進行晶片封 裝動作，即將切割出來的晶片包入封裝材質之中。 請同時參照第1A〜1C圖，第1A圖繪示乃傳統之晶片般 的俯視圖，第1B圖繪示乃第ία圖之晶片盤的仰視圖 二 圖繪不乃沿著第u圖之剖面線1C —κ，所視之 圖。在第1A〜ic圖中，曰κ般in谷幻口J面 圖中日日片盤10至少包括一本體部12及四 ' 本體部12具有相對之一本體部頂面12a及一本 ，部！ ：12b。本體部頂面12a具有數個整齊排列之置晶桿 ’母-置晶槽14用以置放一晶片16。例如，第u圖之‘ 1228291 五、發明說明（2) 左邊那一行之置晶槽1 4置放有數個晶片1 6。其中，置晶槽 1 4之開口大小必須大於晶片丨6之底面積，這樣晶片丨6方可 置放進去。另外’這四個平台18係配置於本體部底面12b 之四個角落上，用以作為晶片盤丨〇被一機台吸真空而抓持 時之吸住點。 曰曰 台18及 12之平 生不規 面的不 片盤10 出於晶 錯誤的 度一般 槽14中 晶片1 6 片盤10通 本體部頂 ^附近的 口 則的變形 平整。當 將會呈現 片盤1 0外 現象，晶 都會大於 時，晶片 非常容易 常以塑膠射出成型的方式來完成。由於平 面12a之間的結構厚度較厚，導致本體部 部分結構於晶片盤丨〇被射出成型後將會產 現象’造成本體部正面丨2a及平台18之表 機台吸真空以抓持不平整之平台丨8時，晶 傾斜而不平整之狀態，導致晶片1 6在被抓 或被置放於晶片盤10上之過程中產生對位 ^ 16很容易被刮傷。另外’置晶叫之深 曰曰片1 6之厚度，當灰塵或異物掉落在置晶 16的頂面將會高過置晶槽1 4之開口，導致 被刮傷。 【發明内容】 有鑑於此，本發明的目的就是在提供 凹槽相對於孚二夕士凡士+，-Γ 從日日片盤。其 u倌邗對於十σ之a又计，可以減少平台及本體 的結構厚度，而避免本體部 頁面之間 盤被射出成型後產生變形之王目务 、口構於曰曰片 人土1夂里王I小之現象，且防止 不平整的現象。 丁 口之表面產生 根據本發明的目的，提出-種晶片盤，至少包括一本 1228291 五'發明說明（3) 體部及一平台。本體部具有相對 部底面，本體部了頁面具有一置丄本體部頂面及-本體 置放-晶片…係配Ϊ於本以：：槽，置晶槽用以 相對。 个股邛底面上，平台係與凹槽 ^據本發明的再—目的，提出_種 一本體部及四平台。本體部具有柏斜 > =凰芏少匕祜 體部頂面具有一置晶槽及-凹槽，置晶槽 。本體部頂面之四角落係各具-凹槽，四 I 口係配置於本體部麻而之四备贫 菔丨底面之四角洛上，此四平台係與此四 凹槽相對。 根據本發明的另-目的，提出-種晶片盤，至少包括 :本體部及-平台。本體部具有相對之一本體部頂面及一 本體部底面，本體部頂面具有一置晶槽及一凹槽，置晶槽 用以置放一晶片。凹槽係位於本體部頂面之中心處，平台 係配置於本體部底面之中心處，平台係與凹槽相對。 ^為讓本發明之上述目的、特徵、和優點能更明顯易 懂，下文特舉一較佳實施例，並配合所附圖式，作詳細說 明如下： 【實施方式】 實施例一 請同時參照第2Α〜2C圖，第2Α圖繪示乃依照本發明之 貫施例一之晶片盤（chip tray )的俯視圖，第2Β圖繪示 乃第2A圖之晶片盤的仰視圖，第2C圖繪示乃沿著第2A圖之 第6頁 TW1246F 倚景)._ 1228291 五、發明說明（4) 曰曰片所視之晶片盤的剖面圖。在第2A〜2C圖中， 本#邱/對之一本體部頂面21 2a及一本體部底面21 2b。 置放1 了曰面212a具有數個置晶槽214，每一置晶槽214用以 曰曰片216，置晶槽214之開口大小係大於晶片216之 右盍二例如，第2 A圖之最左邊那一行之置晶槽2 1 4置放 21?h晶片。其中，四平台218係配置於本體部底面 '^四角落上，用以作為晶片盤2 1 0被一機台吸真空而 抓持時之吸住點。 本發明特別在本體部頂面212a之四角落各設計一凹槽 ，且每一凹槽22〇與每一平台218相對，可以減少平台 8及本體部頂面21 2a之間的結構厚度，而避免本體部212 之四個角落的結構於晶片盤2 1 〇被射出成型後產生變形之 現^，以維持本體部頂面212a之平整度。並且，更可防止 平台218之表面產生不平整的現象。如此一來，當機台吸 真空且抓持平台2 1 8時，晶片盤2 1 〇將會維持其平整度，避 免晶片216在被抓出於晶片盤210外或被置放ς晶片^21() 上之過程中產生對位誤差的情況，防止晶片2 1 6因對位不 準產生被刮傷損壞的現象。 如第3圖所示，本發明亦可在置晶槽214之槽底中設計 一底部凹槽222，底部凹槽222之開口大小係小於晶片 之底面積，使得晶片216置放於置晶槽214中時封閉底部凹 槽222之開口。本發明之底部凹槽2 22可以作為容納灰塵或 異物用的緩衝空間，避免灰塵或異物將晶片2丨6墊高，並1228291 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a chip tray, and more particularly to a wafer tray having opposite grooves and platforms. [Previous technology] In semiconductor manufacturing, it can be mainly divided into integrated circuit design (IC design), wafer fabrication, wafer testing, wafer cutting, and chip packaging. And so on. Based on the integrated circuit design, a silicon wafer can be formed into a wafer with electrical characteristics through a series of wafer processes. Next, each wafer (ch 1 p) on the wafer will be electrically tested. For example, a hair-like probe made of gold wire is attached to the detection head, and it is in contact with the pad on the wafer to test its electrical characteristics. Unqualified wafers will be marked with a mark . Then the i wafer will be cut into a single independent wafer, and the good wafer will be placed in a chip tray to be sent to the packaging factory for chip packaging operations. The cut wafer will be packaged into the packaging material. in. Please refer to Figures 1A to 1C at the same time. Figure 1A shows the top view of a conventional wafer, and Figure 1B shows the bottom view of a wafer tray shown in Figure ία. Figure 2 does not follow the section line of Figure u. 1C —κ, as viewed. In FIGS. 1A to ic, the Japanese-Japanese film reel 10 in the κ-like in Valley Magic Valley J plane view includes at least a main body portion 12 and four 'main body portion 12 having an opposite main body top surface 12a and a book portion. !! : 12b. The top surface 12a of the main body portion has a plurality of aligned crystal rods' mother-crystal-grooves 14 for placing a wafer 16 thereon. For example, ‘1228291 of the u-th figure V. Description of the invention (2) The wafer slot 14 on the left row has several wafers 16 placed. Among them, the size of the opening of the crystal groove 14 must be larger than the bottom area of the wafer 6 so that the wafer 6 can be placed in it. In addition, the four platforms 18 are arranged on the four corners of the bottom surface 12b of the main body portion, and are used as suction points when the wafer tray is vacuumed and held by a machine. The platen 10 with irregular surfaces of the platforms 18 and 12 is generally crystalline due to crystal errors. The wafer 16 in the groove 14 is passed through the opening near the top of the main body and flattened. When there will be a phenomenon outside the disc 10, and the crystal will be larger than, the wafer is very easy to complete by plastic injection molding. Due to the thick structure between the planes 12a, part of the structure of the main body will be produced after the wafer tray is injected and molded. 'This will cause the front of the main body' 2a and the table of the platform 18 to be vacuumed to hold unevenness. When the platform is 8, the crystal is tilted and uneven, which causes the wafer 16 to be misaligned during the process of being scratched or placed on the wafer tray 10, which is easily scratched. In addition, the thickness of the chip is 16. When dust or foreign matter falls on the top surface of the chip 16, it will be higher than the opening of the chip 14 and cause scratches. [Summary of the Invention] In view of this, the object of the present invention is to provide a groove with respect to the Fuji Xerox Vase +, -Γ from the Japanese-Japanese disc. Its u 倌 邗 calculates a of ten σ, which can reduce the structural thickness of the platform and the body, and avoid the deformation of the king's head, which is deformed after the disk between the pages of the body is shot and molded. Li Wang I is small and prevents unevenness. According to the purpose of the present invention, a wafer tray is proposed, which includes at least one 1228291 five 'invention description (3) a body and a platform. The main body part has a bottom surface of the opposite part, and the main body part has a top surface of the main body part and-the main body placement-the wafer ... is arranged in the original :: slot, and the crystal trough is used for facing. According to the object of the present invention, a platform and grooves are provided on the bottom surface of each femoral palate. The body part has a cylindrical oblique > = huang 芏 少 刀 祜 The top part of the body part has a crystal trough and a -groove, a crystal trough. The four corners of the top surface of the main body are provided with grooves, and the four I ports are arranged on the four corners of the bottom of the main body, and the four platforms are opposite to the four grooves. According to another object of the present invention, a wafer tray is provided, including at least: a main body portion and a platform. The main body portion has an opposite top surface of the main body portion and a bottom surface of the main body portion. The top surface of the main body portion has a crystal trough and a groove, and the crystal trough is used for placing a wafer. The groove is located at the center of the top surface of the body portion, and the platform is arranged at the center of the bottom surface of the body portion. The platform is opposite to the groove. ^ In order to make the above-mentioned objects, features, and advantages of the present invention more comprehensible, a preferred embodiment is described below in detail with the accompanying drawings as follows: [Embodiment] Please refer to the first embodiment at the same time 2A to 2C, FIG. 2A shows a top view of a chip tray according to Embodiment 1 of the present invention, FIG. 2B shows a bottom view of the wafer tray of FIG. 2A, and FIG. 2C shows Shown is along the 6th page of Figure 2A, page TW1246F.) _ 1228291 V. Description of the invention (4) A cross-sectional view of a wafer disc as viewed from a film. In FIGS. 2A to 2C, the top surface of the main body portion 21 2a and the bottom surface 21 2b of the main body portion. The first surface 212a has a plurality of crystal grooves 214, and each crystal groove 214 is a wafer 216. The opening size of the crystal groove 214 is larger than the right side of the wafer 216. For example, as shown in FIG. 2A The leftmost row of the crystal grooves 2 1 4 places 21? H wafers. Among them, the four platforms 218 are arranged on the four corners of the bottom surface of the main body portion, and are used as suction points when the wafer tray 2 10 is vacuumed and held by a machine. In the present invention, a groove is designed in each of the four corners of the top surface 212a of the body portion, and each groove 22o is opposite to each platform 218, which can reduce the structural thickness between the platform 8 and the top surface 21 2a of the body portion, and The structure of the four corners of the main body portion 212 is prevented from being deformed after the wafer tray 2 10 is injection-molded to maintain the flatness of the top surface 212a of the main body portion. In addition, unevenness on the surface of the platform 218 can be prevented. In this way, when the machine is vacuumed and the platform 2 1 8 is held, the wafer tray 2 10 will maintain its flatness, so as to prevent the wafer 216 from being caught outside the wafer tray 210 or placed on the wafer 21 () An alignment error occurs during the above process to prevent the wafer 2 1 6 from being damaged due to inaccurate alignment. As shown in FIG. 3, the present invention can also design a bottom groove 222 in the bottom of the crystal groove 214. The opening size of the bottom groove 222 is smaller than the bottom area of the wafer, so that the wafer 216 is placed in the crystal groove. At 214, the opening of the bottom groove 222 is closed. The bottom groove 2 22 of the present invention can be used as a buffer space for accommodating dust or foreign objects, so as to avoid dust or foreign objects from raising the wafers 2 and 6 and
1228291 五 發明說明（5) 降低晶片2 1 6被刮傷的機會 實施匈二 奋^請同時參照第4A〜4D圖，第4A圖繪示乃依照本發明之 實施例二之晶片盤的俯視圖，第4B圖繪示乃第4A圖之晶片 盤的仰視圖，第4C圖及第4D圖分別繪示乃沿著第4A圖之剖 面線4C-4C，及4D-4D，所視之晶片盤的剖面圖。在第4A〜4D 圖中，曰曰片盤410至少包括一本體部412及一平台418，本 體部41 2具有相對之一本體部頂面412a及一本體部底面 412b。本體部頂面412a具有數個置晶槽414，每一置晶槽 414用以置放一晶片416，i晶槽414之開口大小係大於晶 片416之底面積。例如，第4A圖之最左邊那一行之置晶槽 414置放有數個晶片416。其中，平台418係配置於本體部 底面41 2b之中心處，用以作為晶片盤41〇被一機台吸直空 而抓持時之吸住點。 ” 本發明特別在本體部頂面412a之中心處設計一凹槽 422，且凹槽422與平台418相對，可以減少平台418及本體 部頂面412a之間的結構厚度，而避免本體部412之中心處 的結構於晶片盤410被射出成型後產生變形之現象，且防 止平台41 8之表面產生不平整的現象。此外，本發明亦可 f置曰曰槽414之槽底中設計_底部凹槽，以避免灰塵或異 物將晶片416墊高，並降低晶片416被刮傷的機會。 本發明上述實施例所揭露之晶片冑’其凹槽相對於平 口之认af，可以減少平台及本體部頂面之間的結構厚度， 第8頁 TW1246F 倚景).ptd 1228291 發明說明（6) 五 =免本體部：：台附近的部分結構於晶片盤被射出成型 ^產生變形之匕且防止平台之表面產生不平整的現 ΐ住：外::平台雖可為機台吸真空而抓持時之 叹1王點，但並不1%疋於中访能 量，而機台吸真空抵持之吸住點ς亦可能為結構或製程考 平台，其亦可能僅使:;：：：：：；必須使用所有的 π上所述，雖然本發明已 j 然其並非用以职6丄拉D ?乂佳員知例揭露如上， 本發明之精神和^ 2者任何热習此技藝者，在不脫離 本發明之保護: 5 :虽可作各種之更動與潤飾，因此 準。 f耗圍當視後附之申請專利範圍所界定者為1228291 Fifth invention description (5) Reduce the chance of the wafer 2 1 6 being scratched and implement Hungarian Second Fen ^ Please refer to Figures 4A ~ 4D at the same time. Figure 4A shows a top view of a wafer disc according to the second embodiment of the present invention. FIG. 4B shows the bottom view of the wafer disc of FIG. 4A, and FIGS. 4C and 4D show the wafer discs viewed along the section lines 4C-4C and 4D-4D of FIG. 4A, respectively. Sectional view. In FIGS. 4A to 4D, the reel 410 includes at least a main body portion 412 and a platform 418. The main body portion 412 has a top surface 412a and a bottom surface 412b opposite to the main body portion. The top surface 412a of the body portion has a plurality of crystal grooves 414, each of which is used to place a wafer 416, and the opening size of the i-crystal groove 414 is larger than the bottom area of the wafer 416. For example, in the leftmost row of FIG. 4A, a plurality of wafers 416 are placed in the wafer slots 414. Among them, the platform 418 is arranged at the center of the bottom surface 41 2b of the main body portion, and is used as a suction point when the wafer tray 41 is sucked and held by a machine. The present invention specifically designs a groove 422 at the center of the top surface 412a of the main body portion, and the groove 422 is opposite to the platform 418, which can reduce the structural thickness between the platform 418 and the top surface 412a of the main body portion, and avoid the The structure at the center is deformed after the wafer disc 410 is injection-molded, and prevents the surface of the platform 418 from being uneven. In addition, the present invention can also be designed in the bottom of the groove 414. Grooves to prevent dust or foreign objects from elevating the wafer 416 and reducing the chance of the wafer 416 being scratched. The wafers disclosed in the above embodiments of the present invention have grooves that are relatively flat af, which can reduce the platform and the body portion. The thickness of the structure between the top surfaces, page 8 TW1246F.) Ptd 1228291 Description of the invention (6) Five = no body part :: part of the structure near the stage is shot and molded on the wafer disc ^ daggers that cause deformation and prevent the platform The surface is uneven because of the uneven surface: Outer :: Although the platform can hold 1 sigh when holding the machine for vacuum, but not 1% of the energy of the visit, and the machine sucks vacuum to resist the suction Places may also be structural or institutional The test platform may also only use:; :::::; must use all of π described above, although the present invention has been used, but it is not intended to be used as an example. The spirit of the invention and anyone who is accustomed to this skill will not depart from the protection of the present invention: 5: Although various modifications and retouching can be made, it is accurate. for
TW1246F 倚景)·_TW1246F Yijing) · _
第9頁 1228291 圖式簡單說明 【圖式簡單說明] 第1 A圖繪示乃傳統之晶片盤的俯視圖。 第1 B圖繪示乃第丨A圖之晶片盤的仰視圖。 第ic圖緣示乃沿著第丨A圖之剖面線1C-1C，所視之晶片 盤的剖面圖。 第2 A圖緣示乃依照本發明之實施例一之晶片盤的俯視 圖。 第2B圖繪示乃第2A圖之晶片盤的仰視圖。 第2C圖繪示乃沿著第2人圖之剖面線2C-2C，所視之晶片 盤的剖面圖。 第3圖繪示乃第2C圖之置晶槽之槽底更具有一底部凹 槽時之狀態的剖面圖。 第4A圖繪示乃依照本發明之實施例二之晶片盤的俯視 圖。 第4 β圖繪示乃第4 A圖之晶片盤的仰視圖。 第4C圖繪示乃沿著第4A圖之剖面線4C-4C’所視之晶片 盤的剖面圖。 第4D圖繪示乃沿著第4A圖之剖面線4D-4D’所視之晶片 盤的剖面圖。 圖式標號說明 1 0、21 0、4 1 0 :晶片盤 12、212、412 :本體部 12a、212a、412a :本體部頂面Page 9 1228291 Schematic description [Schematic description] Figure 1A shows the top view of a conventional wafer disc. Fig. 1B shows a bottom view of the wafer tray shown in Fig. 丨 A. Figure ic is a cross-sectional view of the wafer disk viewed along section line 1C-1C of Figure 丨 A. Figure 2A is a top view of a wafer disk according to the first embodiment of the present invention. FIG. 2B shows a bottom view of the wafer tray of FIG. 2A. Fig. 2C shows a cross-sectional view of the wafer disk viewed along the section line 2C-2C of the second figure. Fig. 3 is a cross-sectional view showing a state where the bottom of the crystal trough in Fig. 2C has a bottom recess. Figure 4A is a top view of a wafer disk according to a second embodiment of the present invention. Figure 4 β is a bottom view of the wafer tray of Figure 4 A. Fig. 4C shows a cross-sectional view of the wafer disc as viewed along section line 4C-4C 'of Fig. 4A. Fig. 4D is a cross-sectional view of the wafer disk viewed along section line 4D-4D 'of Fig. 4A. Description of drawing symbols 10, 21 0, 4 1 0: wafer trays 12, 212, 412: main body portion 12a, 212a, 412a: top surface of main body portion
TW1246F 倚景).ptd 第10頁 1228291 圖式簡單說明 12b、212b、412b :本體部底面 1 4、2 1 4、4 1 4 :置晶槽 1 6 、2 1 6 、41 6 :晶片 18、 218、 418:平台 220、422 ··凹槽 2 2 2 :底部凹槽TW1246F) .ptd Page 10 1228291 Brief description of the drawings 12b, 212b, 412b: the bottom surface of the main body 1 4, 2 1 4, 4 1 4: the crystal tanks 1 6, 2 1 6, 41 6: the wafer 18, 218, 418: Platforms 220, 422 ·· Groove 2 2 2: Bottom groove
TW1246F 倚景).ptd 第11頁TW1246F Reliance) .ptd Page 11