JP2830694B2 - Semiconductor device mounting apparatus and mounting method - Google Patents

Abstract

PURPOSE:To provide a structure of a mounting device and its mounting method with which a fragile three-dimensional microscopically processed element chip can be mounted. CONSTITUTION:A suction hole 21, which is recessed almost in pyramid shape, is formed at the tip of a pick-up nozzle 21 which the tip (infrared ray detection element 4) of a semiconductor device is sucked, and a chip suction device, on which an air leaking groove 21c (leak area) is formed, is provided in the vicinity of the above-mentioned suction hole 21b. As a result, mounting operation can be conducted using the conventional mounting device without giving damage to a fragile three-dimensional microscopically processed element chip (infrared ray detection element 4).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device such as a sensor device, and more particularly to a device and a method for mounting a three-dimensional microfabricated device chip.

[0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for mounting a three-dimensional microfabricated element chip such as a sensor element. First, an example of the target sensor element will be described with reference to FIG. 3A and 3B show the structure of the infrared detecting element. FIG.
(B) is an AA sectional view. In the figure, a heat insulating film 2 is formed on the surface of a semiconductor substrate 1 having a substantially square plate shape, and a plurality of thermistors 3 for sensing infrared rays are further formed on the heat insulating film 2.
Has been implemented. In addition, a wiring portion for electrically connecting each thermistor 3 and an electrode pad for connecting to an external circuit are formed on the heat insulating film 2, but the description is omitted here. The semiconductor substrate portion below the thermistor 3 has been removed to form a substantially truncated pyramid-shaped void portion 1a.
With such a configuration, the heat of the thermistor 3 that has absorbed infrared rays is less likely to escape due to conduction, and the sensitivity of infrared ray detection can be increased. However, the heat insulating film 2
Is a fragile thin film that is vulnerable to external stress,
There was a problem that it was easily damaged. For this reason, in the die bonding step of mounting the chip of the infrared detecting element 4 on the substrate (stem), it is difficult to perform processing by an automatic mounting apparatus described later, and the individual chips are handled by using tweezers or the like.

FIG. 4 shows an example of a die bonder (die bonding apparatus) which is the above mounting apparatus. However, 3 of die bonder
Only one main part (chip suction device, centering device, chip mount device) is shown, and other portions are omitted.
In each of the main parts, detailed illustration and description thereof will be omitted.

[0004] First, the configuration and function of the chip suction device 5 will be described with reference to FIG. In the drawing, reference numeral 4 denotes an infrared detecting element to be mounted, 6 denotes a chip tray in which the infrared detecting elements 4 are arranged vertically and horizontally, 7 denotes a chip tray holder, 8 denotes a holder attached to a die bonder so as to be movable up and down , front and rear, and right and left. The pickup nozzle is attached to the tip of the holder 8 and sucks the infrared detection element 4.
FIG. 5 shows an example of the pickup nozzle 9. In the figures, (a) is a front view of the pickup nozzle 9, (b) is a bottom view showing the tip shape of the pickup nozzle 9, (c)
Is a BB sectional view, and (d) is an infrared detecting element 4 shown in FIG.
FIG. 4 is a cross-sectional view showing a state where the chip of FIG. As shown in the figure, the tip of the pickup nozzle 9 for sucking the chip is formed in a substantially truncated cone shape.
The rear end is formed in a substantially cylindrical shape. The pickup nozzle 9 has a through hole 9a formed from the front end to the rear end, and the opening at the rear end is connected to a device for generating suction vacuum pressure such as a vacuum pump via an air pipe. The chip suction device 5 utilizes the suction vacuum pressure to
This is a device for performing a chip pick-up step in which the infrared detecting elements 4 arranged on the chip tray 6 are sucked by the tip of the pick-up nozzle 9 and transported to the centering device 10 in the next step.

Next, the centering device 10 will be described. Reference numeral 11 denotes a rectangular parallelepiped mounting table, 12 denotes a substantially disk-shaped centering stage fixed on the mounting table 11, and 13 denotes a position by moving the infrared detecting element 4 conveyed on the centering stage 12. A 7-shaped centering pin, 14 is a holder, and 15 is a mount collet attached to the tip of the holder 14.

The centering stage 12 will be described with reference to FIG.
Will be described in detail. FIG. 6A is a perspective view showing a state in which the infrared detecting element 4 has been transported onto the centering stage 12. (B) is a CC sectional view. A through hole 11a is formed at the center of the mounting base 11 and extends from the upper surface of the mounting base 11 to the side surface.
An air pipe 16 is connected to the opening on the side of 1a as shown in FIG. The other opening of the air pipe 16 is connected to a device (not shown) such as a vacuum pump for generating a suction vacuum pressure. On the other hand, the other opening of the through hole 11 a is closed by a substantially disk-shaped centering stage 12 fixed to the mount 11. A plurality of small through-holes 12a connected to the through-holes 11a of the mounting base 11 are also formed at the center of the centering stage 12.
With this configuration, the suction vacuum pressure in the air pipe 16 is applied to the infrared detecting element 4 placed on the centering stage 12 through the through hole 11a and the through hole 12a. It can be adsorbed on the centering stage 12.

Next, the infrared detecting element 4 conveyed onto the centering stage 12 by the chip suction device 5
While being adsorbed on the centering stage 12 by the suction vacuum pressure acting from the back side of the centering stage 12,
The centering pin 13 is moved horizontally to a predetermined position to perform positioning (centering step). Thereafter, as shown in FIG. 4, the infrared detecting element 4 is transported to the chip mount device 17 by the holder 14 having the mount collet 15 attached to the tip.

The chip mounting device 17 is used in a chip mounting step of mounting a chip on a substrate (stem) via a die bond paste, and includes a transfer stage 18 and its peripheral structure, a portion for supplying the die bond paste, and the like. The configuration around the transfer stage will be described. On the conveying stage 18 is found stuck is elongated carrier film 19, on which the carrier film 19, the substrate 20 at predetermined intervals in the longitudinal direction
(Stem) is arranged. After the die bond paste is supplied on the substrate 20, the infrared detecting element 4 is arranged on the die bond paste by the holder 14.
Finally, the heat-treated infrared detecting element 4 on the substrate 20
Is completed.

[0009]

In a method in which chips of fragile three-dimensional microfabricated elements are individually handled by tweezers or the like and mounted, it has been difficult to quantify the work and to obtain stable quality. Also, a general IC as shown in FIG.
In the method of performing die bonding of a three-dimensional microfabricated element such as a sensor element using a die bonder used in manufacturing,
Since a chip to be mounted often has a fragile structure, when an excessive stress is applied to the chip, the chip is often damaged. In summary, there are the following two problems when the infrared detecting element shown in FIG. 3 is die-bonded using the above-described die bonder.

(1) The chip suction device 5 only has to convey the infrared detecting element 4 to a position near a predetermined position on the centering stage 12 of the centering device 10 so that the centering device 10 can perform positioning. Since it is not required, the tip of the pickup nozzle 9 is formed in a truncated cone shape as shown in FIG. When the diameter of the tip of the pickup nozzle 9 is too large, the tip of the pickup nozzle 9 contacts the thermal insulating film 2 on the gap 1a of the infrared detecting element 4 and damages the thermal insulating film 2. If the diameter of the tip of the pickup nozzle 9 is too small,
The vacuum suction force for adsorbing the infrared detecting element 4 is weakened, so that there is a problem that the suction cannot be performed. Although the mount collet 15 has the same problem as the pickup nozzle 9, the pickup nozzle 9 is taken as an example here because the pickup nozzle 9 generally has lower accuracy and easily damages the chip. (2) The centering device 10 performs positioning by moving the infrared detecting element 4 to a predetermined position with the centering pin 13 while adsorbing the infrared detecting element 4 through the small through hole 12 a formed in the centering stage 12. Was. If the suction vacuum pressure is too high, the thermal insulating film 2 formed on the infrared detecting element 4 will be damaged.
Moved easily, and accurate positioning could not be performed. Further, there is no means for adjusting and quantifying the vacuum suction pressure according to the strength of the infrared detecting element 4.

SUMMARY OF THE INVENTION The present invention has been made in consideration of the above problems, and has as its object to provide a structure of a mounting apparatus capable of mounting a fragile three-dimensional microfabricated element chip and a mounting method thereof. .

[0012]

According to a first aspect of the present invention, there is provided an apparatus for mounting a semiconductor device, comprising: a centering device for adsorbing a chip of a semiconductor device on an upper surface thereof under a vacuum pressure;
In the middle of the air piping that supplies the chip suction vacuum pressure to the stage
A leak line and a pressure gauge to leak air
And a centering device.

[0013] cell of the mounting device of the semiconductor device according to claim 1, wherein
Adjust the suction vacuum pressure to approximately 50-500mmHg with the intermediary device
Centering without damaging the thermal insulation film.
Can be done.

According to a second aspect of the present invention, there is provided a semiconductor device mounting apparatus comprising:
The tip of the pick-up nozzle that picks up semiconductor device chips
At the end, there is formed a suction port that is recessed in a substantially pyramid shape.
A leak area is formed near the suction port to leak air.
Characterized in that it is provided with a chip suction device.

Further, the apparatus for mounting a semiconductor device according to claim 2, in which is characterized by comprising a centering device of the mounting apparatus for a semiconductor device according to claim 1, wherein.

[0016]

The tip of the pickup nozzle of the chip suction device is recessed into a substantially pyramid shape, and a leak area is provided at the bottom corner of the pyramid, so that the pickup nozzle contacts a plurality of outer peripheries of the infrared detecting element, The suction vacuum pressure can be applied to the entire infrared detection element, and the suction vacuum pressure applied to the infrared detection element does not suddenly increase as soon as the infrared detection element is suctioned. The change in suction vacuum pressure before and after chip suction is smaller than when no leak area is provided, and it is easier to adjust the vacuum suction force applied to the chip. Can be prevented, and breakage of the fragile heat insulating film can be prevented.

[0017] A branch is provided in the middle of an air pipe connected to the side surface of the centering stage to supply the vacuum suction pressure onto the centering stage, and a valve (leak valve) for reducing and adjusting the suction vacuum pressure is provided. By installing a leak line and a pressure gauge for measuring the suction vacuum pressure and adjusting the vacuum suction pressure to approximately 50 to 500 mmHg, centering can be performed without damaging the thermal insulation film.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The mounting device (die bonder) according to the present invention is characterized by the shape of the pickup nozzle of the chip suction device and the air piping configuration of the centering device. The other configurations are the same as those of the die bonder shown in FIG. Because there is
A description will be given of parts different from the conventional example. FIG. 1 shows an embodiment of a pickup nozzle of a chip suction device according to the present invention. In the figure, (a) shows the pickup nozzle 21
, (B) is a bottom view showing the tip shape of the pickup nozzle 21, and (c) is the DD of the pickup nozzle 21.
FIG. 4D is a cross-sectional view taken along the line EE of FIG. 4A, showing a state in which the tip end of the pickup nozzle 21 has the infrared detecting element 4 attracted thereto.

The diameter of the substantially cylindrical tip of the pickup nozzle 21 for adsorbing the infrared detecting element 4 is set to be larger than the diagonal length of the infrared detecting element 4 for adsorbing the entire infrared detecting element 4. The substantially cylindrical rear end has the same shape as a conventional pickup nozzle. As shown in (c), the pickup nozzle 21 is provided with a through hole 21a for generating a suction vacuum pressure at the tip of the pickup nozzle 21, and an opening at the rear end of the through hole 21a is formed by an air pipe. Is connected to a vacuum pump or the like via a. The opening on the tip end side of the through hole 21a is a suction port 2 recessed in a substantially quadrangular pyramid shape at the tip end of the pickup nozzle 21.
1b. The shape of the opening surface of the suction port 21b is similar to the outer shape of the chip, and the size thereof is larger than the outer shape of the chip.
As shown in (c), the four corners (corners) of the suction port 21b recessed into a substantially quadrangular pyramid shape have a substantially triangular leak groove 21c that penetrates to the side surface of the tip of the cylindrical pickup nozzle. Are formed. In the example of the pickup nozzle 21 shown in FIG. 1, the leak groove 21c is a leak area formed in the pickup nozzle of the mounting device according to the present invention. The leak area is formed so as to leak air even when the chip is sucked.

The function of the pickup nozzle 21 configured as described above will be described. In FIG. 1 (d), since a suction vacuum pressure is generated in the suction port 21b at the tip of the pickup nozzle 21 through the through hole 21a of the pickup nozzle 21, the chip of the substantially square plate-shaped infrared detection element 4 has an outer periphery. Are sucked in a state of contacting the slopes of the suction opening 21b having a substantially quadrangular pyramid shape in the pickup nozzle 21 at the four sides. In this state, the suction vacuum pressure is also applied to the heat insulating film 2 of the infrared detection element 4, but the chip of the infrared detection element 4 is suctioned by the leak grooves 21 c (leak lines) formed at the four corners of the suction port 21 b. However, since the air leaks through the leak groove 21c, the change in the suction vacuum pressure applied to the infrared detecting element 4 at the tip of the pickup nozzle 21 before and after the suction is smaller than when the leak groove 21c which is the leak line is not provided. The suction vacuum pressure can be adjusted by changing the shapes of the suction ports 21b and the leak grooves 21c and the number of the leak grooves 21c so that the heat insulating film 2 is not damaged. The shape of the tip of the pickup nozzle 21 is not limited to the embodiment, but may be any shape as long as the entire chip can be sucked and a leak area such as a leak groove is secured even in a state where the chip is sucked. Also, even if the shape of the leak area is not a groove shape,
It may be a hole formed near the tip of the pickup nozzle, and the number is not limited.

Next, the centering device structure of the mounting device according to the present invention will be described with reference to FIG. As shown in FIG. 2, the centering device of the mounting device according to the present invention includes an air pipe 1 pulled out from a side surface of a mounting base 11.
A branch is provided in the middle of the pipe between the device 6 and a device (not shown) for generating a suction vacuum pressure such as a vacuum pump to leak air,
Leak line 22 for reducing the vacuum pressure applied to the chip
And a pressure gauge 23 for measuring a suction vacuum pressure applied to the chip. The leak line 22 shown in FIG. 2 includes a valve 24, and is configured so that the amount of air leakage can be finely adjusted by opening and closing the valve 24. If the quantity is required,
It is not necessary to provide an adjusting mechanism. By configuring the centering device as described above, the suction vacuum pressure generated on the centering stage 12 can be finely adjusted in accordance with the strength of the fragile chip, so that chip breakage can be prevented. In the case of a chip such as the infrared detecting element shown in FIG. 3, the degree of vacuum of suction is approximately 50 to 500 mmHg.
It is desirable that

As described above, by configuring the die suction device and the centering device of the die bonder, the die bonding of the fragile three-dimensional microfabricated element chip can be performed by diverting the die bonder used in general IC manufacturing. It is possible to achieve a great rationalization. Although an example of a die bonder has been described as an embodiment of the mounting apparatus, the present invention can be applied to a general mounting apparatus including a chip suction apparatus using suction vacuum pressure and a centering apparatus.

[0023]

As described above, according to the structure of the semiconductor device mounting apparatus and the mounting method of the present invention, the conventional mounting apparatus can be used without damaging the fragile three-dimensional microfabricated element chip. Implementation.

[Brief description of the drawings]

FIG. 1 is a structural view of a pickup nozzle of a mounting apparatus according to the present invention, wherein (a) is a front view, (b) is a bottom view, and (c).
Is a DD cross-sectional view, and (d) is an EE cross-sectional view showing a state where the infrared detecting element is adsorbed.

FIG. 2 is a configuration diagram showing an air pipe portion of a centering device of the mounting device according to the present invention.

3A and 3B are structural views showing an example of an infrared detecting element to which a mounting device according to the present invention is mounted; FIG.
(B) is an AA sectional view.

FIG. 4 is a perspective view showing an example of a mounting device according to the present invention.

5 (a) is a front view, FIG. 5 (b) is a bottom view, FIG. 5 (c) is a sectional view taken along the line BB, and FIG. 5 (d) is a state in which an infrared detecting element is adsorbed. FIG.

6A and 6B are structural views of a centering device of a conventional mounting device, in which FIG. 6A is a perspective view, FIG. 6B is a CC cross-sectional view, and FIG.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 semiconductor substrate 1 a void 2 thermal insulating film 3 thermistor 4 infrared detecting element 5 chip suction device 6 chip tray 7 chip tray holder 8 holder 9 pickup nozzle 10 centering device 11 mounting base 11 a through hole 12 centering stage 12 a through hole 13 centering pin 14 Holder 15 Mount Collet 16 Air Pipe 17 Chip Mount Device 18 Transfer Stage 19 Carrier Film 20 Substrate (Stem) 21 Pickup Nozzle 21a Through Hole 21b Suction Port 21c Leak Groove 22 Leak Line 23 Pressure Gauge 24 Valve

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 21/52 H01L 21/68 H01L 35/32

Claims (2)

(57) [Claims] 1. A semiconductor device chip having a vacuum pressure applied to an upper surface thereof.
The chip suction vacuum pressure is applied to the centering stage where
Leaker that leaks air in the middle of the supplied air piping
A mounting device for a semiconductor device having a centering device provided with a pressure gauge and a pressure gauge . 2. A pickup for adsorbing a chip of a semiconductor device.
At the tip of the top nozzle, a suction port is formed
Air leaks near the suction port.
In the middle of the air pipe that supplies the chip suction vacuum pressure to the chip suction device where the rear is formed and the centering stage that suctions the chip of the semiconductor device on the upper surface with vacuum pressure,
A semiconductor device mounting device including a centering device provided with a leak line for leaking air and a pressure gauge.