TWI222956B - Packaged optical micro-mechanical device - Google Patents
Packaged optical micro-mechanical device Download PDFInfo
- Publication number
- TWI222956B TWI222956B TW091114629A TW91114629A TWI222956B TW I222956 B TWI222956 B TW I222956B TW 091114629 A TW091114629 A TW 091114629A TW 91114629 A TW91114629 A TW 91114629A TW I222956 B TWI222956 B TW I222956B
- Authority
- TW
- Taiwan
- Prior art keywords
- optical
- reference plane
- wafer
- scope
- patent application
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 142
- 239000013307 optical fiber Substances 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 238000004806 packaging method and process Methods 0.000 claims description 64
- 238000012545 processing Methods 0.000 claims description 30
- 230000007246 mechanism Effects 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 239000003566 sealing material Substances 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 7
- 238000013461 design Methods 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 claims description 2
- 229910052702 rhenium Inorganic materials 0.000 claims description 2
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 claims description 2
- 229910052707 ruthenium Inorganic materials 0.000 claims 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 92
- 238000000034 method Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000000835 fiber Substances 0.000 description 8
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 8
- 229920005591 polysilicon Polymers 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000004100 electronic packaging Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 150000002118 epoxides Chemical class 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 230000026676 system process Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 231100001010 corrosive Toxicity 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000003517 fume Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/007—Interconnections between the MEMS and external electrical signals
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
- G02B6/4231—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment with intermediate elements, e.g. rods and balls, between the elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/911,950 US6798954B2 (en) | 2001-07-24 | 2001-07-24 | Packaged optical micro-mechanical device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWI222956B true TWI222956B (en) | 2004-11-01 |
Family
ID=25431150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091114629A TWI222956B (en) | 2001-07-24 | 2002-07-02 | Packaged optical micro-mechanical device |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6798954B2 (enExample) |
| EP (1) | EP1410084A2 (enExample) |
| JP (1) | JP2004537066A (enExample) |
| AU (1) | AU2002344738A1 (enExample) |
| TW (1) | TWI222956B (enExample) |
| WO (1) | WO2003010574A2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI892759B (zh) * | 2023-07-26 | 2025-08-01 | 星系科技股份有限公司 | 用於光電收發裝置的密封結構 |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6834154B2 (en) | 2001-07-24 | 2004-12-21 | 3M Innovative Properties Co. | Tooling fixture for packaged optical micro-mechanical devices |
| GB0203343D0 (en) * | 2002-02-13 | 2002-03-27 | Alcatel Optronics Uk Ltd | Micro opto electro mechanical device |
| DE10346360B3 (de) * | 2003-09-30 | 2005-06-23 | Siemens Ag | Elektrooptisches Bauelement für die Montage auf einem Trägerbauteil |
| KR100586941B1 (ko) * | 2003-11-27 | 2006-06-07 | 삼성전기주식회사 | 다채널 광 도파로 및 그 제조방법 |
| US8187246B2 (en) | 2006-11-03 | 2012-05-29 | The Procter & Gamble Company | Structurally optimized component |
| US8450842B2 (en) * | 2007-03-20 | 2013-05-28 | Kyocera Corporation | Structure and electronics device using the structure |
| US20120085170A1 (en) * | 2010-10-07 | 2012-04-12 | Letterneau James C | Shock Resistant Mounting for High G Shock Accelerometer |
| EP2866673B1 (en) | 2012-07-02 | 2020-03-18 | Koninklijke Philips N.V. | Minimally invasive medical instrument |
| WO2016064402A1 (en) * | 2014-10-23 | 2016-04-28 | Hewlett Packard Enterprise Development Lp | Optical fiber interface for optical device package |
| WO2016064426A1 (en) | 2014-10-24 | 2016-04-28 | Hewlett Packard Enterprise Development Lp | Optical interconnect device |
| US10261256B2 (en) | 2015-01-28 | 2019-04-16 | Hewlett Packard Enterprise Development Lp | Laser-written optical routing systems and method |
| US11630274B2 (en) | 2020-04-01 | 2023-04-18 | Mellanox Technologies, Ltd. | High-density optical communications using multi-core fiber |
| US11561352B2 (en) * | 2020-04-01 | 2023-01-24 | Mellanox Technologies, Ltd. | High density optical I/O inside a data center switch using multi-core fibers |
| US11378765B2 (en) | 2020-05-25 | 2022-07-05 | Mellanox Technologies, Ltd. | Intra data center and inter data center links using dual-wavelength multimode/singlemode multi-core fiber |
| US11303379B1 (en) | 2020-11-05 | 2022-04-12 | Mellanox Technologies, Ltd. | Communication between data centers using a multi-core fiber |
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| US4119363A (en) | 1976-03-18 | 1978-10-10 | Bell Telephone Laboratories Incorporated | Package for optical devices including optical fiber-to-metal hermetic seal |
| US4186995A (en) | 1978-03-30 | 1980-02-05 | Amp Incorporated | Light device, lens, and fiber optic package |
| US4347655A (en) | 1978-09-28 | 1982-09-07 | Optical Information Systems, Inc. | Mounting arrangement for semiconductor optoelectronic devices |
| EP0010352A1 (en) | 1978-10-16 | 1980-04-30 | Motorola, Inc. | Opto-electrical semiconductor device |
| US4346294A (en) | 1979-07-05 | 1982-08-24 | Burr-Brown Research Corp. | Low profile optical coupling to planar-mounted optoelectronic device |
| US4413881A (en) | 1979-07-26 | 1983-11-08 | Northern Telecom Limited | Optical fiber hermetic seal |
| US4399541A (en) | 1981-02-17 | 1983-08-16 | Northern Telecom Limited | Light emitting device package having combined heater/cooler |
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| US4932745A (en) * | 1989-07-25 | 1990-06-12 | At&T Bell Laboratories | Radiation switching arrangement with moving deflecting element |
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| FR2738432B1 (fr) | 1995-09-01 | 1997-09-26 | Hamel Andre | Composant optique adapte a la surveillance d'une liaison multilongueur d'onde et multiplexeur a insertion-extraction utilisant ce composant, application aux reseaux optiques |
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| US6771859B2 (en) | 2001-07-24 | 2004-08-03 | 3M Innovative Properties Company | Self-aligning optical micro-mechanical device package |
| US6834154B2 (en) | 2001-07-24 | 2004-12-21 | 3M Innovative Properties Co. | Tooling fixture for packaged optical micro-mechanical devices |
-
2001
- 2001-07-24 US US09/911,950 patent/US6798954B2/en not_active Expired - Fee Related
-
2002
- 2002-06-11 JP JP2003515889A patent/JP2004537066A/ja not_active Withdrawn
- 2002-06-11 WO PCT/US2002/019066 patent/WO2003010574A2/en not_active Ceased
- 2002-06-11 EP EP02744371A patent/EP1410084A2/en not_active Withdrawn
- 2002-06-11 AU AU2002344738A patent/AU2002344738A1/en not_active Abandoned
- 2002-07-02 TW TW091114629A patent/TWI222956B/zh active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI892759B (zh) * | 2023-07-26 | 2025-08-01 | 星系科技股份有限公司 | 用於光電收發裝置的密封結構 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2003010574A2 (en) | 2003-02-06 |
| JP2004537066A (ja) | 2004-12-09 |
| WO2003010574A3 (en) | 2003-04-10 |
| US6798954B2 (en) | 2004-09-28 |
| EP1410084A2 (en) | 2004-04-21 |
| AU2002344738A1 (en) | 2003-02-17 |
| US20030021551A1 (en) | 2003-01-30 |
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