JP2004537066A - パッケージ化されたオプティカルマイクロメカニカルデバイス - Google Patents
パッケージ化されたオプティカルマイクロメカニカルデバイス Download PDFInfo
- Publication number
- JP2004537066A JP2004537066A JP2003515889A JP2003515889A JP2004537066A JP 2004537066 A JP2004537066 A JP 2004537066A JP 2003515889 A JP2003515889 A JP 2003515889A JP 2003515889 A JP2003515889 A JP 2003515889A JP 2004537066 A JP2004537066 A JP 2004537066A
- Authority
- JP
- Japan
- Prior art keywords
- package
- optical
- die
- reference plane
- package frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 148
- 239000013307 optical fiber Substances 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 239000008393 encapsulating agent Substances 0.000 claims description 5
- 238000004891 communication Methods 0.000 claims description 4
- 230000007246 mechanism Effects 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 19
- 239000000463 material Substances 0.000 description 12
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 238000004806 packaging method and process Methods 0.000 description 8
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 8
- 229920005591 polysilicon Polymers 0.000 description 7
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- 229910000679 solder Inorganic materials 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000835 fiber Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
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- 239000004020 conductor Substances 0.000 description 3
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- 230000010287 polarization Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
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- 238000001746 injection moulding Methods 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 238000005459 micromachining Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 208000005647 Mumps Diseases 0.000 description 1
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- 229910045601 alloy Inorganic materials 0.000 description 1
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- 238000010292 electrical insulation Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
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- 150000002739 metals Chemical class 0.000 description 1
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- 238000004382 potting Methods 0.000 description 1
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- 239000005368 silicate glass Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/007—Interconnections between the MEMS and external electrical signals
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
- G02B6/4231—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment with intermediate elements, e.g. rods and balls, between the elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/911,950 US6798954B2 (en) | 2001-07-24 | 2001-07-24 | Packaged optical micro-mechanical device |
| PCT/US2002/019066 WO2003010574A2 (en) | 2001-07-24 | 2002-06-11 | Packaged optical micro-mechanical device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004537066A true JP2004537066A (ja) | 2004-12-09 |
| JP2004537066A5 JP2004537066A5 (enExample) | 2006-01-05 |
Family
ID=25431150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003515889A Withdrawn JP2004537066A (ja) | 2001-07-24 | 2002-06-11 | パッケージ化されたオプティカルマイクロメカニカルデバイス |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6798954B2 (enExample) |
| EP (1) | EP1410084A2 (enExample) |
| JP (1) | JP2004537066A (enExample) |
| AU (1) | AU2002344738A1 (enExample) |
| TW (1) | TWI222956B (enExample) |
| WO (1) | WO2003010574A2 (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6834154B2 (en) | 2001-07-24 | 2004-12-21 | 3M Innovative Properties Co. | Tooling fixture for packaged optical micro-mechanical devices |
| GB0203343D0 (en) * | 2002-02-13 | 2002-03-27 | Alcatel Optronics Uk Ltd | Micro opto electro mechanical device |
| DE10346360B3 (de) * | 2003-09-30 | 2005-06-23 | Siemens Ag | Elektrooptisches Bauelement für die Montage auf einem Trägerbauteil |
| KR100586941B1 (ko) * | 2003-11-27 | 2006-06-07 | 삼성전기주식회사 | 다채널 광 도파로 및 그 제조방법 |
| US8187246B2 (en) | 2006-11-03 | 2012-05-29 | The Procter & Gamble Company | Structurally optimized component |
| US8450842B2 (en) * | 2007-03-20 | 2013-05-28 | Kyocera Corporation | Structure and electronics device using the structure |
| US20120085170A1 (en) * | 2010-10-07 | 2012-04-12 | Letterneau James C | Shock Resistant Mounting for High G Shock Accelerometer |
| EP2866673B1 (en) | 2012-07-02 | 2020-03-18 | Koninklijke Philips N.V. | Minimally invasive medical instrument |
| WO2016064402A1 (en) * | 2014-10-23 | 2016-04-28 | Hewlett Packard Enterprise Development Lp | Optical fiber interface for optical device package |
| WO2016064426A1 (en) | 2014-10-24 | 2016-04-28 | Hewlett Packard Enterprise Development Lp | Optical interconnect device |
| US10261256B2 (en) | 2015-01-28 | 2019-04-16 | Hewlett Packard Enterprise Development Lp | Laser-written optical routing systems and method |
| US11630274B2 (en) | 2020-04-01 | 2023-04-18 | Mellanox Technologies, Ltd. | High-density optical communications using multi-core fiber |
| US11561352B2 (en) * | 2020-04-01 | 2023-01-24 | Mellanox Technologies, Ltd. | High density optical I/O inside a data center switch using multi-core fibers |
| US11378765B2 (en) | 2020-05-25 | 2022-07-05 | Mellanox Technologies, Ltd. | Intra data center and inter data center links using dual-wavelength multimode/singlemode multi-core fiber |
| US11303379B1 (en) | 2020-11-05 | 2022-04-12 | Mellanox Technologies, Ltd. | Communication between data centers using a multi-core fiber |
| US20250035867A1 (en) * | 2023-07-26 | 2025-01-30 | Aip Inc. | Sealing structure for optoelectronic transceiver device |
Family Cites Families (58)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4119363A (en) | 1976-03-18 | 1978-10-10 | Bell Telephone Laboratories Incorporated | Package for optical devices including optical fiber-to-metal hermetic seal |
| US4186995A (en) | 1978-03-30 | 1980-02-05 | Amp Incorporated | Light device, lens, and fiber optic package |
| US4347655A (en) | 1978-09-28 | 1982-09-07 | Optical Information Systems, Inc. | Mounting arrangement for semiconductor optoelectronic devices |
| EP0010352A1 (en) | 1978-10-16 | 1980-04-30 | Motorola, Inc. | Opto-electrical semiconductor device |
| US4346294A (en) | 1979-07-05 | 1982-08-24 | Burr-Brown Research Corp. | Low profile optical coupling to planar-mounted optoelectronic device |
| US4413881A (en) | 1979-07-26 | 1983-11-08 | Northern Telecom Limited | Optical fiber hermetic seal |
| US4399541A (en) | 1981-02-17 | 1983-08-16 | Northern Telecom Limited | Light emitting device package having combined heater/cooler |
| US4399453A (en) | 1981-03-23 | 1983-08-16 | Motorola, Inc. | Low thermal impedance plastic package |
| US4438338A (en) | 1981-11-05 | 1984-03-20 | Burr-Brown Research Corporation | Low profile optical coupling for an optoelectronic module |
| JPS58145169A (ja) | 1982-02-23 | 1983-08-29 | Nec Corp | 光半導体装置 |
| US4932745A (en) * | 1989-07-25 | 1990-06-12 | At&T Bell Laboratories | Radiation switching arrangement with moving deflecting element |
| US4936646A (en) | 1989-08-23 | 1990-06-26 | Tektronix, Inc. | Temperature-compliant tube for fiber optic components |
| US5113404A (en) | 1990-07-05 | 1992-05-12 | At&T Bell Laboratories | Silicon-based optical subassembly |
| US5050953A (en) | 1990-09-14 | 1991-09-24 | Northern Telecom Limited | Multi-path optical fiber and electro-optic transducer connector |
| EP0548440A1 (en) | 1991-12-23 | 1993-06-30 | International Business Machines Corporation | Bilithic composite for optoelectronic integration |
| US5208880A (en) * | 1992-04-30 | 1993-05-04 | General Electric Company | Microdynamical fiber-optic switch and method of switching using same |
| US5333225A (en) | 1993-08-03 | 1994-07-26 | International Business Machines Corporation | Substrate-embedded pluggable receptacles for connecting clustered optical cables to a module |
| US5555330A (en) | 1994-12-21 | 1996-09-10 | E-Tek Dynamics, Inc. | Wavelength division multiplexed coupler with low crosstalk between channels and integrated coupler/isolator device |
| JPH10511476A (ja) | 1994-12-21 | 1998-11-04 | イー−テック・ダイナミックス・インコーポレイテッド | 集積可能な光ファイバカプラならびにそれによってできる装置およびシステム |
| FR2738432B1 (fr) | 1995-09-01 | 1997-09-26 | Hamel Andre | Composant optique adapte a la surveillance d'une liaison multilongueur d'onde et multiplexeur a insertion-extraction utilisant ce composant, application aux reseaux optiques |
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| US5774604A (en) | 1996-10-23 | 1998-06-30 | Texas Instruments Incorporated | Using an asymmetric element to create a 1XN optical switch |
| EP0852337A1 (en) | 1996-12-24 | 1998-07-08 | STMicroelectronics S.r.l. | A hermetically sealed semiconductor inertial sensor |
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| US6430322B1 (en) * | 1999-11-23 | 2002-08-06 | L3 Optics, Inc. | Optical phase shifter having an integrated planar optical waveguide and phase shifter element |
| ATE340761T1 (de) | 1999-12-15 | 2006-10-15 | Asulab Sa | Hermetische in-situ-gehäusungsmethode von mikrosystemen |
| JP2001296486A (ja) | 2000-04-13 | 2001-10-26 | Sumitomo Osaka Cement Co Ltd | マトリクス光スイッチ |
| IL155675A0 (en) | 2000-10-31 | 2003-11-23 | 3M Innovative Properties Co | Mems-based wavelength equalizer |
| US20020113281A1 (en) | 2000-12-19 | 2002-08-22 | Cunningham Shawn Jay | MEMS device having an actuator with curved electrodes |
| US6470111B2 (en) * | 2001-01-24 | 2002-10-22 | Adc Telecommunications, Inc. | Fiber optic switch package and a method of assembling a fiber optic switch package |
| US6483957B1 (en) | 2001-01-29 | 2002-11-19 | 3M Innovative Properties Company | MEMS-based polarization mode dispersion compensator |
| US6701038B2 (en) | 2001-03-05 | 2004-03-02 | The Microoptical Corporation | Micro-electromechanical optical switch assembly for optical data networks |
| US6549693B2 (en) | 2001-03-14 | 2003-04-15 | Adc Telecommunications, Inc. | Fiber optic switch package and method of assembling a fiber optic switch package for redirecting fiber path |
| US6771859B2 (en) | 2001-07-24 | 2004-08-03 | 3M Innovative Properties Company | Self-aligning optical micro-mechanical device package |
| US6834154B2 (en) | 2001-07-24 | 2004-12-21 | 3M Innovative Properties Co. | Tooling fixture for packaged optical micro-mechanical devices |
-
2001
- 2001-07-24 US US09/911,950 patent/US6798954B2/en not_active Expired - Fee Related
-
2002
- 2002-06-11 JP JP2003515889A patent/JP2004537066A/ja not_active Withdrawn
- 2002-06-11 WO PCT/US2002/019066 patent/WO2003010574A2/en not_active Ceased
- 2002-06-11 EP EP02744371A patent/EP1410084A2/en not_active Withdrawn
- 2002-06-11 AU AU2002344738A patent/AU2002344738A1/en not_active Abandoned
- 2002-07-02 TW TW091114629A patent/TWI222956B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2003010574A2 (en) | 2003-02-06 |
| WO2003010574A3 (en) | 2003-04-10 |
| TWI222956B (en) | 2004-11-01 |
| US6798954B2 (en) | 2004-09-28 |
| EP1410084A2 (en) | 2004-04-21 |
| AU2002344738A1 (en) | 2003-02-17 |
| US20030021551A1 (en) | 2003-01-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050525 |
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| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20050525 |
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| A761 | Written withdrawal of application |
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