1222313 玖、發明說明： 【發明所屬之技術領域】 本發明係有關於一種進行積層電路圖型等之描繪的描 繪裝置、以及使用該描繪裝置之描繪方法。 【先前技術】 近年來，在積層電路圖型之製作方法中，爲利用光調 變元件，作爲具體之製作方法係爲，首先，如第17A圖 所示，在銅電鍍印刷基板之表面後，如第1 7 B圖所示來塗 覆被稱之爲光阻之感光性樹脂。 φ 此種光阻在接觸到光後便會產生硬化（亦有相反的情 況）’如第1 7C圖所示，在以光調變元件曝光光阻後便進 行顯像（參照第1 7D圖）、殘餘已曝光之部分的光阻、沖 洗其他部分。 並且如第1 7E圖所示，藉由蝕刻而使光阻已被沖洗之 部分的銅腐蝕後，便如第1 7F圖所示剝離光阻、將絕緣材 料塗覆至整面（參照第17G圖）。 其次，如第1 7H圖所示，在以雷射而將必須使上下導 φ 通之部分進行開孔後，便如第1 71圖所示進行銅電鍍、塗 覆光阻（參照第17J圖）。 並且，如第1 7K圖所示，在將光阻以光調變元件而曝 光後便進行顯像（參照第1 7L圖）。藉此，沖洗未被曝光 之部分的光阻，如第17M圖所示，進行蝕刻、使未曝光 · 的部分之銅受到腐蝕。 . 其次，如第1 7N圖所示，在使光阻剝離後，便如第1 70 圖所示的藉由網版印刷來塗覆絕緣體。在此，於網版印刷 方面係預先形成孔部’使焊料附著在該孔部內而經由焊料 導通電子構件等。 在此’將導電體或絕緣體塗覆於被描繪媒體、或是曝 光光阻之程序，爲藉由分別獨立設置裝置、在設於各裝置 內的台座上設置被描繪媒體以進行各個程序。因此，必須 於每個程序中將被描繪媒體設於座台上，而耗費作業時 此外，因在各程序中裝置係爲獨立，因此必須在各個 程序中進行被描繪媒體的定位，而在所積層之圖型形成的 情況下具有圖型位置偏移的情況。 另一方面，如第18A圖、第18B圖所示，使用以3種 種類之波長曝光（例如，R、G、B )來發出其他色彩的鹵 化銀感應材料，藉由具有4個曝光頭部（R、G、b、UV ) 之曝光裝置而將黑色以UV ( 405nm )曝光、將紅色以B (450nm)與G ( 5 3 2nm)曝光、將綠色以B ( 450nm)與 R ( 6 3 5nm )曝光、將藍色以 G ( 53 2nm )與 R ( 63 5 nm ) 曝光後，通過顯像液而進行顯像後，當感應材料爲金屬薄 條之情況下，同時將全數顏色發出色彩、形成各色的圖型， 不過，用以獲得高濃度之著色而必須將感應材料之厚度形 成爲數十微米（//m)，造成圖型形成之精度的不充分。 【發明內容】 本發明係考慮上述事實，其目的在於可藉由簡單的程 序來進行包含2維至3維的描繪，同時獲得可形成高精度 之圖型的描繪裝置及使用有該描繪裝置的描繪方法。 爲達成上述目的，依據本發明之第1態樣，爲在對於 ， 被描繪媒體而進行積層電路圖型等之描繪的描繪裝置中， 4 爲包含有··至少1個曝光頭部及/或至少1個吐出頭部、 以及用以使該頭部與被描繪體於指定方向上進行相對移動 的移動裝置；前述頭部爲沿著指定方向而配置呈略平行 爲達成上述目的’依據本發明之第2態樣，爲包含有 至少1個曝光頭部及/或至少1個吐出頭部，該頭部爲沿 · 著指定方向而配置呈略平行狀，其中，在使用描繪裝置之 描繪方法中’爲包含有：提供被描繪媒體之步驟、使前述 頭部及被描繪媒體相對於前述指定方向來移動之步驟、伴 隨於前述相對移動而由1個吐出頭部將其機能性材料吐出 至被描繪媒體的步驟、以及將其曝光之步驟。 【實施方式】 以下，針對有關於本發明之實施例的描繪裝置進行說 明。 鲁 如第1圖所示，在描繪裝置10方面係具備有略成直方 體狀的掃描座1 2，在掃描座1 2之上面係以藉由可定位作 爲被描繪媒體之印刷基板1 4之狀態下進行載置。此外， ， 在描繪裝置10方面，爲在沿著掃描座12之長邊方向的端 部上，係具備有略成直方體狀的頭部支撐體16。 - 在該頭部支撐體1 6方面係如第2圖所示，爲使導軌1 8 沿著頭部支撐體1 6之長邊方向來配設，而曝光頭部2 0以 及吐出頭部2 X有關於在第1圖所示之吐出頭部2 4方面， 因與吐出頭部2 2之構造略爲相同，因此省略圖式及說 明），爲經由連結部2 6、2 8以對於頭部支撐體！ 6之長邊 方向正交的狀態下分別單邊支撐，而形成爲可沿著導軌1 8 而分別移動於箭頭部A方向（以下，將該箭頭部a方向 稱爲「主要掃描方向」）。 曝光頭部2 0以及吐出頭部2 2之連結部2 6、2 8係爲， 形成線性馬達（圖式省略），藉由未圖示之驅動裝置來驅 動線性馬達，而使曝光頭部20以及吐出頭部22爲經由連 · 結部2 6、2 8沿著導軌1 8移動。 另一方面，如第1圖所示，此種描繪裝置1 0之控制部 係具備有CPU (中央處理器）30，當來自未圖示之輸入裝 置的作業命令輸入至CPU30後，對應於曝光頭部20之掃 描速度等作業條件而用以決定雷射功率之位準等控制內 容，由記錄有儲存在連接至CPU30之記憶體中所控制的 記錄條件與頭部傳送速度之間關係的表格3 2，讀取適合 於作業條件之雷射功率之位準等設定値。 · 依據由表格3 2所讀取之雷射功率之位準等設定値，將 用以控制曝光頭部20之控制信號傳送至記錄條件設定電 路34。此種記錄條件設定電路34係將包含有關於雷射功 , 率之設定値的控制信號傳送至記錄雷射驅動器3 6，經由 _ 記錄雷射驅動器36，藉由驅動雷射頭部20之光纖陣列光 - 源66 (參照第4圖（A)、第4圖（B))，而形成爲可發出 ， 雷射光。 1222313 此外，CPU30係依據由表格32所讀取之雷射功率之位 準等設定値，將用以控制曝光頭部2 0之控制信號傳送至 曝光頭部2 0用之主要掃描驅動器3 8。此種曝光頭部2 0 用之主要掃描驅動器3 8係傳送使曝光頭部20移動操作設 置於頭部支撐體1 6之驅動裝置的控制信號，使曝光頭部 20朝主要掃描方向移動。 此外，曝光頭部20用之主要掃描驅動器3 8係將控制 信號傳送至記錄同期信號產生電路40，對應於曝光頭部20 之移動速度而將曝光頭部2 0之曝光時間點進行同步化， β 經由記錄同步信號產生電路40而將同步信號傳送至調變 元件驅動器42。 在此種調變元件驅動器42之中，由記憶在CPU30之記 憶體的記錄資料44中讀取描繪圖型之記錄資訊，依據該 描繪圖型之記錄資訊，使印刷基板1 4曝光。 再者，CPU30係爲，依據由表格32所讀取之雷射功率 之位準等設定値，將用以控制吐出頭部22之控制信號傳 送至吐出頭部22用之主要掃描驅動器48。 · 此種吐出頭部22用之主要掃描驅動器48係爲，將控 制信號傳送至使吐出頭部2 2移動之驅動裝置，在使吐出 頭部22朝主要掃描方向移動的同時，藉由未圖示之同步 ， 信號產生電路而對應於吐出頭部22之移動速度，且使被 ι 封入至吐出頭部2 2之機能性材料的吐出時間點同步，將 - 同步信號傳送至吐出元件驅動器5 0，藉由以靜電方式所 。 達成之吐出裝置，依據已記錄之描繪圖型之記錄資訊，而 -9- 1222313 使機能性材料吐出至印刷基板1 4。 此外’ C P U 3 0係爲，依據由表格3 2所讀取之雷射功率 之位準等之設定値，將用以控制吐出頭部24之控制信號 經由吐出頭部24用之主要掃描驅動器52、而將控制信號 傳送至使吐出頭部24移動之驅動裝置，在使吐出頭部24 朝向主要掃描方向移動的同時，爲經由未圖示之同步信號 產生電路而將同步信號傳送至吐出元件驅動器54，藉由 以靜電方式等所達成之吐出裝置，依據已記錄之描繪圖型 之記錄資訊，使機能性材料吐出至印刷基板1 4。 另一方面，如第2圖所示，在被連結至可使曝光頭部2 0 以及吐出頭部22、24沿著導軌18來進行移動的連結部26、 2 8上，係分別設有螺鎖部（圖式省略），其係被設置成相 對於箭頭部A方向以及正交於箭頭部A方向之箭頭部B 方向，爲可調整對於導軌18之連結部26、28之位置。 藉此，係形成爲可調整對於曝光頭部20以及吐出頭部 22、24之箭頭部A方向以及箭頭部B方向的位置。具體 而言，爲藉由曝光頭部20以及吐出頭部22、24，而以指 定之圖型在印刷基板1 4上進行圖型化、測定目標圖型與 實際圖型之差，進而進行位置調整。 例如，將吐出頭部2 2之第3道之吐出線與曝光.頭部2 0 之曝光線一致的圖型設爲目標圖型，觀察曝光線爲與吐出 線之哪幾道一致，進行曝光頭部2 0之位置調整。相反的， 亦可將曝光線作爲基準而進行吐出頭部22之位置調整。 此外，在此，雖是形成爲可藉由設在連結部2 6、2 8之 -10- 1222313 螺鎖部來進行曝光頭部2 0以及吐出頭部2 2、2 4之位置調 整，不過，亦可將被使用在曝光頭部2 0之調變元件或是 使用在吐出頭部22、24之吐出元件之配列資料傳送至未 圖示之控制部，以自動地進行曝光頭部20以及吐出頭部 22、24之位置調整。 在此情況下，有關於箭頭部Α方向係爲，藉由同步信 號產生電路所造成之曝光或是藉由時間點的調整，係可達 到曝光線以及吐出線之箭頭部A方向之位置調整的目的。 不過，吐出頭部22、24係以噴墨方式所構成，因此在 吐出頭部22中，係藉由加熱而發現到導電性，爲將銅微 粒子樹脂膠囊分散液作爲導電體而封入，而在吐出頭部24 方面爲被封入有絕緣性樹脂分散液以作爲絕緣體。此外， 吐出頭部22、24係分別爲以靜電方式所構成，且使藉由 靜電力所封入之機能性材料吐出至外部。 另一方面，曝光頭部20係第3圖以及第4A圖、第4B 圖所示，.爲藉由多數之照射頭部5 6所構成，在各個照射 頭部56中係具有光纖陣列光源66，光源波長係爲3 5 0至 4 5 0nm (不過，在熱模式下，波長範圍則增廣成3 5 0至 9 5 0nm) 〇 由該種光纖陣列光源66所射出之雷射光係藉由構成透 鏡系列67之一對的組合透鏡7 1而被平行光化，且被射入 至一對組合透鏡73。此種組合透鏡73係爲，相對於雷射 射出端之配列方向，在靠近透鏡之光軸部分係增廣光束、 且聚縮遠離光軸之部分的光束，對於與配列方向正交之方 -11- 向爲具備有使光維持原狀透過之機能，而將雷射光補正成 使光量分布形成均勻狀。 藉由此種組合透鏡7 3，用以使光量分布形成爲均勻狀 而補正的雷射光係藉由聚光透鏡75所聚光，且經由反射 鏡69，將已射入之光束朝向對應於影像資料、作爲在各 個畫素中進行調變之空間光調變元件的數位微鏡裝置6 8 (以下，簡稱爲「DMD68」）射入。 已射入至DMD68之雷射光係藉由透鏡系統70、72而 成像於印刷基板1 4上。在此，D M D 6 8係如第5圖所示， 係在SRAM晶胞（記憶體晶胞）74上，微鏡76係被配置 成藉由支柱所支撐，且係爲一種將構成畫素（pixel )之 多數的（例如，600個X 800個）微鏡配列成格狀所構成 的鏡裝置。 在各個畫素中，係設有以支柱而支撐在最上部之微鏡 76，在微鏡76之表面上係蒸鍍有鋁等反射率較高之材料， 而微鏡7 6之反射率係達到9 0 %以上。 此外，在微鏡76之正下方係經由包含有樞鈕以及軛之 支柱而配置有以一般之半導體記憶體之製造生產線所製造 之矽柵（silicone gate)之CMOS的SARM晶胞74，整體 係以單石型（monolithic )( —體狀）所構成。 當數位信號寫入DMD6 8之SRAM晶胞74後，被支擦 在支柱上之微鏡76係將對角線作爲中心而對於配置有 D M D 6 8之基板側爲以± α度（例如± 1 0度）之範圍傾斜。 在此’弟6 Α圖所不係將微鏡7 6設爲開啓狀態而傾斜 -12- 成+ α度的狀態，第6B圖所示係將微鏡76設爲關閉狀態 而傾斜成- α度的狀態，因應於影像信號，藉由控制在 DMD68之各畫素中之微鏡76的傾斜，爲使已射入至 DMD 68之光爲朝向其各個微鏡76之傾斜方向反射。 此外，第5圖所示係擴大局部之DMD68、使微鏡76控 制成+ α度或是- α度之狀態下的一例，各個微鏡76之 開啓關閉之控制係藉由連接至DMD68之未圖示的控制器 來進行。此外，藉由關閉狀態之微鏡76而使光束反射之 方向上係配置有光吸收體（未圖示）。 此外，DMD68係如第7圖所示，係配列有多數個（例 如，800列X 600行）微鏡76，不過，在配置成千鳥格狀 的同時，爲對於主要掃描線方向（箭頭部Α方向）僅形 成指定角度（例如，0 · 1 °至5 ° )而傾斜，在使曝光頭部 2 0進行主要掃描的同時，鄰接的曝光部分係形成有局部 重疊狀。 藉此，即使DMD68之位置多少有所偏移，亦可吸收該 偏移而可實現高精度的曝光，同時，藉由將該重合部分之 微鏡7 6中之任一方形成爲關閉狀態而可迴避多重曝光。 其次，針對有關本發明之實施例的描繪裝置之作用進 行說明。 如第8 A圖所示，依據已記錄描繪圖型之記錄資訊，藉 由絕緣體吐出頭部2 4 (參照第1圖），而使絕緣性樹脂分 散液80吐出至定位在掃描座1 2 (參照第1圖）之上面的 印刷基板1 4上。 -13- 1222313 其次，藉由已封入有以加熱而發現導電性之導電體吐 出頭部2 2 (參照第1圖）而如第8 B圖所示，爲依據已記 錄描繪圖型之記錄資訊’而吐出作爲導電體之銅微粒子樹 脂膠囊分散液8 2 (另外，亦可在將銅微粒子樹脂膠囊分 散液8 2吐出至印刷基板1 4上之後，再吐出絕緣性樹脂分 散液）。 並且，藉由具有加熱機能之曝光頭部2〇(參照第1圖）， 係如第8 C圖所示，爲將印刷基板1 4進行全面曝光、而使 銅微粒子樹脂膠囊分散液82以及絕緣性樹脂分散液80硬 化。 在此，藉由絕緣性樹脂分散液之種類，控制構成曝光 頭部20之DMD68(參照第5圖）之微鏡76(參照第5圖）， 而亦可僅使已吐出銅微粒子樹脂膠囊分散液82之區域進 行曝光（此外，係可僅將必要之區域進行局部處的曝光， 而亦可將銅微粒子樹脂膠囊分散液82所吐出區域爲較少 的寬廣區域進行曝光）。 在此情況下，係可將印刷基板1 44局部的進行曝光， 且藉由熱退火依據不同的情況而僅使表面受到加熱，因 此，爲避免印刷基板14之熱伸縮，此外，係可降低印刷 基板1 4之耐熱溫度。此外，在與藉由熱退火所進行之情 況下進行比較，係可達到刪減時間的目的。 再者，於熱退火方面係不致使銅微粒子樹脂膠囊分散 液8 2中之樹脂完全的蒸散、此外在銅微粒子間係殘存有 間隙，因此爲具有無法將電阻値充分降低之問題（電阻値： -14- 1222313 5〜8x 1 (Τ5 Ω cm )，然而在藉由熱退火的情況下，因藉由一 般的電路而形成銅配線圖型同等的電阻値（3〜5 X 1 (Γ6 Ω c m )，故而可廣爲利用在一般的電路基板之用途。 其次，如第8 D圖所示，在硬化銅微粒子樹脂膠囊分散 液82及絕緣性樹脂分散液80所形成之絕緣性層84以及 銅微粒子層86之上，藉由絕緣體吐出頭部24而吐出絕緣 性樹脂分散液80後，便如第8E圖所示，藉由曝光頭部20 而將印刷基板1 4進行全面曝光，而使銅微粒子樹脂膠囊 分散液8 2及絕緣性樹脂分散液8 0硬化。 並且，如第8F圖所示，藉由絕緣體吐出頭部24，而使 絕緣性樹脂分散液80吐出在絕緣性層84以及銅微粒子層 86上，在吐出銅微粒子樹脂膠囊分散液82後，如第8G 圖所示，藉由曝光頭部20而將印刷基板1 4進行全面曝光， 而使銅微粒子樹脂膠囊分散液8 2及絕緣性樹脂分散液8 0 硬化。 其次如第8 Η圖所示，由附有焊料以外之電路基板而除 了取出電極之區域，爲藉由絕緣體吐出頭部24而使絕緣 性樹脂分散液80吐出在絕緣性層84以及銅微粒子層86 上，爲將印刷基板1 4之表面藉由絕緣性樹脂來被覆。 如此，將以加熱而發現導電性之材料藉由吐出頭部2 2 而吐出在印刷基板1 4上（亦可爲吐出至印刷基板1 4之整 面、亦即所謂的塗覆狀態）之後，爲藉由具有加熱機能之 曝光頭部而進行雷射退火（整面或是局部），藉此，可簡 單的進行導電性之圖型化，而可簡單的形成積層電路基 -15- 板。 在本型態中，係如第1圖所示，藉由將曝光頭部2 0以 及吐出頭部2 2、2 4配設在相同的掃描座1 2上，與在各頭 部上具有掃描座之情況下進行比較，爲可將程序簡略化的 同時係可縮短圖型化期間的時間，而可實現圖型形成之高 速化。 此外’在相同之掃描座1 2上藉由使電路圖型形成在印 刷基板1 4上，即使對於印刷基板1 4爲使曝光頭部20以 及突出頭部22、24之位置產生偏移，因此，爲可容易的 進行圖型的高密度化。 因此，在無法取得充裕的圖型化期間之時間之機械性 的情況下，例如，在吐出絕緣體或是導電體等機能性材料 後，即使在變形該種機能性材料之間爲必須使其硬化的情 況下，亦可實施圖型化的形成，同時，在機能性材料流動 之前亦可使該種機能性材料硬化，而形成高精度的圖型。 此外，藉由在各個掃描座1 2之間的搬送、或是伴隨於 圖型化期間之移動中所需要的經過時間，將不至有圖型之 尺寸變化之虞。再者，係無須最終性的去除如同光阻而造 成材料的浪費，因此可刪減成本，此外，因亦可刪減塗覆 光阻之程序，故而使得程序數目減低。 此外，藉由將曝光頭部2 0以及吐出頭部2 2、2 4配設 在相同的掃描座上，在與於各個頭部上具有掃描座之情況 下進行比較，係可縮小用以形成電路圖型而必要的裝置整 體之設置空間’此外’係可達到成本刪減以及省電力化的 -16- 目的。 此外，在本實施例中，雖是在掃描座1 2上設有使用DMD 以作爲光調變器之退火用的曝光頭部2 0、使銅微粒子樹 脂膠囊分散液8 2吐出之靜電方式的吐出頭部2 2以及使絕 緣性樹脂分散液8 0吐出之靜電方式的吐出頭部24等’不 過，本發明並非僅定在此種實施例之中。 例如，作爲曝光頭部之光調變器，係針對具備有DMD 之照射頭部來進行說明，不過，例如即使在使用 MEMS (Micro Electro Mechanical Systems)形式之空間調變元 件（SLM; Spacial Light Modulator)、或是藉由電氣光學 效果而調變透過光之光學元件（PLZT元件）或液晶光閘 (FLC )等、MEMS形式以外之空間調變元件的情況下， 藉由使用對於配列在基板上之全畫素部之一部份的畫素 部，而可加快每一畫素、每一主要掃描線之調變速度，而 可獲得相同的效果。 此外’所g胃的Μ E M S係爲，藉由將IC製造加工作爲基 礎之微精密機械技術而將微尺寸之感測器、致動器 (actuator )、以及控制電路積體化之細微系統的總稱，而 所謂的MEMS型之空間調變元件，則是意味著藉由利用 靜電力之電氣機械動作所驅動之空間調變元件。 此外’作爲感光性材料，係具有光阻、二氮、光聚合 物、微粒子分散材料（樹脂、介電體、導電材料、該等膠 囊構造之粒子）、熱結晶化材料、感熱材料、熱轉印材料、 分子擴散材料（換言之，爲昇華型熱轉印材料）等，而感 -17- 1222313 光性材料型態係具有薄膜、液狀、固體、微粒子、微粒子 分散液、微粒子成膜薄膜（基板）等，不過，倘若可藉由 曝光頭部以作爲二維描繪、換言之爲形成圖型（蝕刻罩、 ； 電鍍遮罩、疏水-親水、凹凸、熱退火、熱轉印、熱反應、 . 剝離）者、或是作爲三維描繪（多次重複進行二維描繪者） 而以光硬化、粉末燒結、熱溶融、熱硬化而形成立體造型 者亦可。 另一方面，在構成吐出頭部之噴頭之中，爲具有即需 即送噴嘴形式（壓力、靜電膜、熱等）、連續形式（場效 · 偏向、熱偏向等）、或是無即需即送噴嘴形式（超音波、 靜電吐出）’作爲吐出材料，爲具有光反應液、微粒子分 散液（樹脂、介電體、導電材料、熱結晶化材料、感熱材 料、熱熔融材料、分子擴散材料（換言之，爲昇華型熱轉 印材料）、觸媒、酵素、細菌、DNA、化學反應藥品等、 以及該等膠囊構造粒子）、熱熔融液（WAX等）、化學反 應液、觸媒溶液、表面改質液等。 藉由此種吐出頭部，爲形成圖型（蝕刻罩、電鍍遮罩、 φ 疏水-親水、凹凸）以作爲二維描繪，若是可形成爲藉由 熱熔融冷卻硬化' 光硬化、粉末燒結、熱硬化而形成立體 造型以作爲三維描繪時亦可。 < 具體而言，亦可使用導電性微粒子含有液吐出頭部以 及曝光頭部。如第9A圖所示，在玻璃基板90上藉由導 · 電性微粒子含有液吐出頭部，而使含有導電性微粒子之液 . 體92全面吐出。其次，如第9B圖所示，藉由曝光頭部， -18- 1222313 爲將已塗覆含有導電性微粒子之液體的絕緣材料以必要的 導電圖型狀而進行退火，藉此形成導電膜之圖型96、形 成電路基板9 8。 在此，作爲上述導電性微粒子，係可採用將銅、銀、 金等1 Onm至1 0 m之微粒子周圍以絕緣體所被覆之物。 此外，亦可採用絕緣膜吐出頭部以及電路切斷脈衝雷 射曝光頭部。如第1 〇 A圖所示，爲藉由絕緣膜吐出頭部 而使透明絕緣膜整面吐出至印刷基板1 0 0之最外層的導電 膜1 〇2。此種透明絕緣膜雖係爲透過狀，不過，以導電膜 吐出頭部或是電鍍所形成之導電膜係藉由具備有吸收波長 之曝光頭部來進行曝光，藉此，如第1 0B圖所示，形成有 切換導電膜102之電路圖型、形成爲空洞的電路基板1〇3。 在此種電路基板103方面，係形成爲可變更在表面未 出現之電路圖型，因電路圖型可在不致接觸到空氣之狀態 下進行加熱，因此係難以氧化切斷部周邊的導電膜材料。 再者，使用絕緣膜吐出頭部、標記製作印刷吐出頭部、 或是脈衝雷射標記製作曝光頭部，在貼上最外層之絕緣膜 之前，亦可藉由曝光頭部或是吐出頭部來進行編號、條碼、 定位圖型之標記製作。 爲了在貼上最外層之絕緣膜之前進行標記製作，圖型 並非爲直接露出於表面，進而可防止僞造或剝離。此外， 因爲可藉由在各層中以各個不同的內容來進行標記製作， 故而亦可防止電路在各層中於各個相異之情況下的檢查條 件之錯誤，亦可防止使電路基板安裝在最終製品中的情況 -19- 1222313 下之安裝錯誤。 此外，可使用隔件構造材料吐出頭部、以及硬化用雷 射曝光頭部。如第1 1 A圖所示，藉由隔件構造材料吐出頭 部，在使用以將LCD 104之玻璃間隔均勻化的隔件1〇6後， 藉由曝光頭部（若材料爲光硬化型時，則將3 5 0至45〇nm 之紫外雷射作爲光源，若材料爲熱硬化型的情況下，爲將 3 5 0至9 50nm之高功率雷射作爲光源），如第11B圖所示， 爲僅照射隔件1 〇 6之位置周邊、使隔件1 〇 6硬化，藉此而 形成基板105。 在此種基板105方面，爲提升隔件1〇6之高度的精度， 同時係可將隔件1 〇 6進彳了筒強度化。此外，藉此，亦可作 爲晶圓級覆晶（wafer level flip chip)用之隔件來應用。 再者，亦可使用光聚合物吐出頭部以及硬化用曝光頭 部。如第12A圖所示，在呈現可升降狀而設置之台座110 之上面，爲藉由光聚合物吐出頭部，而使光聚合物吐出一 層份量之圖型狀。其次，如第12B圖所示，藉由曝光頭部 照射3 5 0至450nm之光、使光聚合物硬化，如第12C圖 所示，使台座1 1 〇下降（約5 0 // m )，使光聚合物吐出頭 部以及硬化用曝光頭部相對性的上升一層份量。此時，將 曝光頭部以及光聚合物吐出頭部回到基準位置。 並且，如第1 2D圖所示，在藉由光聚合物吐出頭部而 使光聚合物吐出一層份量之圖型狀之後’藉由曝光頭部而 使光聚合物硬化，如第1 2 E圖所示，使台座1 1 〇下降，使 光聚合物吐出頭部以及硬化用曝光頭部相對性的上升一層 -20- 1222313 的份量。藉由多次重複如上所述之程序，如第1 2F圖所示， 爲形成電路基板1 1 2，相較於無法以光來固化之物，係可 進行高強度、高精度之立體造型。 此外，亦可使用導電吐出頭部以及修整用脈衝雷射曝 光頭部。如第1 3 A圖所示，藉由導電吐出頭部而在印刷 基板1 1 3上形成導電電路（導電體）後，如第1 3B圖所示， 藉由電阻計（resistance meter) 114爲一面測定電阻値、 一面藉由曝光頭部（以脈衝雷射爲佳）而削減（一般係稱 之爲修整）導電電路，而當形成爲目標電阻値時則停止照 射。 並且，如第1 3 C圖所示，爲藉由絕緣體而被覆印刷基 板1 1 3之上面，藉此而形成電路基板1 1 5。藉由此種程序， 除了可在電路基板上製作出高精度的電阻，同時，可將多 數之電阻以一次來進行調整。 再者，亦可使用具有相異之曝光機能的光阻用曝光頭 部、以及貫通孔用脈衝雷射曝光頭部。如第1 4 A圖所示， 在已經過銅電鍍之銅電鍍基板1 1 6上係如第1 4 B圖所示， 爲藉由脈衝雷射搭載之貫通孔用脈衝雷射曝光頭部而開啓 貫通孔1 1 8。 並且，如第14C圖所示，爲將銅電鍍基板116之雙面 以薄膜上之光阻來進行疊合，如第14D圖所示，在藉由 光阻用曝光頭部而使光阻硬化後係如第1 4E圖所示，爲藉 由顯像而去除未曝光部之光阻（此外，在此係依據曝光之 不同而對於顯像液爲形成不溶性，換言之，雖爲使用負片 -21- 1222313 型光阻，卻是藉由曝光而易溶解在顯像液中，換言之，亦 可使用正片型光阻，在使用正片型光阻之情況下，爲藉由 顯像而將曝光部之光阻去除），且藉由蝕刻而使已去除光 阻、進而露出之銅遭到腐蝕。 其次，如第14F圖所示，剝離光阻。接著如第14G圖 所示，將銅電鍍基板1 1 6之雙面以薄膜上之光阻來進行疊 合，如第14H圖所示，在藉由光阻用曝光頭部而使光阻 硬化後，係如第1 41圖所示，爲藉由顯像而去除未曝光部 之光阻。 β 並且，如第14J圖所示，在將形成在銅電鍍基板116 之貫通孔1 1 8之內緣部進行電鍍之後，如第1 4Κ圖所示， 係剝離光阻、形成電路基板1 2 0。如此，藉由在相同裝置 開啓貫通孔，而可提升孔部之定位精度。 此外，在以上之型態中，雖是針對於使印刷基板載置 於掃描座之狀態下而形成圖型的方法來進行說明，不過， 亦可固定各個頭部、使被描繪媒體移動以形成圖型。 如第1 5圖所示，爲使用長條狀之金屬薄條1 22以作爲 春 被描繪媒體。以送出裝置124所送出之金屬薄條122係形 成爲藉由捲取裝置126而被捲取，且在送出裝置124與捲 取裝置126之間係構成搬送路徑128。 ， 在此種搬送路徑128中，係將所搬送之金屬薄條122 隔有間隔，而於上下分別使吐出光阻之光阻吐出頭部1 3 0、 曝光頭部1 3 2、吐出顯像液之顯像液吐出頭部1 3 4、吐出 . 蝕刻液之蝕刻液吐出頭部1 3 8、以及吐出洗淨液之洗淨液 -22- 吐出頭部140配置在正交於各個搬送路徑128的方向上， 鄰接之各個頭部係被配置成相互平行狀。 藉此，在搬送金屬薄條1 2 2之過程中，在移動金屬薄 條1 2 2的同時係實施各個處理、形成圖型。此外，在此爲 使各個頭部配置在所搬送之金屬薄條1 2 2的上下，不過， 亦可僅配置在金屬薄條1 2 2之上方或是下方。此外，在此 雖是使用顯像液吐出頭部1 3 4、蝕刻液吐出頭部1 3 8、以 及洗淨液吐出頭部1 4 0，不過，並非必須得使用吐出頭部， 亦可使用分別儲存有顯像液、蝕刻液、洗淨液之槽。 β 此外，作爲頭部之型態的組合係如第1圖所示，爲針 對於曝光頭部2 0以及吐出頭部2 2、2 4爲線性頭部之情況 下來進行說明，不過，並非僅限定於此，例如，如第16 圖所示，曝光頭部1 4 2以及吐出頭部1 4 4、1 4 6亦可爲序 列噴頭（在此情況下，即使是對於與主要掃描方向（箭頭 Α方向）正交之方向亦可進行移動），此外，雖然圖中未 示，不過，亦可將當吐出頭部爲序列噴頭時曝光頭部則爲 線性頭部的情況、當吐出頭部爲線性頭部時曝光頭部則爲 · 序列噴頭的情況等進行各種組合。 〔產業上之可利用性〕 本發明係因構成如上，故而，藉由在相同的掃描座上 使電路圖型形成在被描繪媒體，係不致產生對於被描繪媒 體之各部的位置偏移，而可容易地進行圖型之高精度化。 此外，藉由將各個頭部配設在相同掃描座上，相較於 在各個頭部分別具有掃描座的情況下，係可將程序簡略化 -23- 1222313 的同時，爲可縮短圖型化期間的時間，而可實現圖型形成 之高速度化。因此，爲可行成高精度的圖型，此外，藉由 各個掃描座間之搬送、或是伴隨於圖型化期間之移動中所 需要的經過時間，將不至有圖型之尺寸變化之虞。 此外，係無須最終性的去除如同光阻而造成材料的浪 費，因此可刪減成本，此外，因亦可刪減塗覆光阻之程序， 故而使得程序數目減低。 再者，藉由將頭部配設在相同的掃描座上，在與於各 個頭部上具有掃描座之情況下進行比較，係可縮小用以形 成電路圖型而必要的裝置整體之設置空間，此外，係可達 到成本刪減以及省電力化的目的。 【圖式簡單說明】 第1圖所示係有關本發明之實施例之描繪裝置的立體 圖以及表示描繪裝置之動作的方塊圖。 第2圖所示係在有關於本發明實施例之描繪裝置中所 具備的曝光頭部以及吐出頭部之位置調整方法的說明圖。 第3圖所示係在有關於本發明實施例之描繪裝置中所 具備的曝光頭部之照射頭部之槪略構成的立體圖。 第4A圖所示係沿著於第_ 3圖所示之照射頭部之構造中 之光軸的副掃描方向的斷面圖，第4B圖所示係爲第 4A 圖之側面圖。 第5圖所示係構成在有關於本發明實施例之描繪裝置 中所具備的曝光頭部之DMD之構造的部分擴大圖。 第6A圖以及第6B圖所示係爲用以說明DMD之動作的 -24- 1222313 說明圖。 第7圖所示係有關於本發明之實施例之描繪裝置中所 具備的曝光頭部之雷射光之掃描線的平面圖。 第8A圖至第8H圖所示係藉由在有關於本發明之實施 例之描繪裝置中所具備的曝光頭部以及吐出頭部，而形成 電路基板之方法的斷面圖。 第9A圖以及第9B圖所示係藉由作爲本發明之變形例 之描繪裝置中所具備的曝光頭部以及吐出頭部，而形成電 路基板之方法的斷面圖。 第10A圖以及第10B圖所示係藉由作爲本發明之變形 例之描繪裝置中所具備的曝光頭部以及吐出頭部，而形成 電路基板之方法的斷面圖。 第11A圖以及第11B圖所示係藉由作爲本發明之變形 例之描繪裝置中所具備的曝光頭部以及吐出頭部，而形成 電路基板之方法的斷面圖。 第12A圖至第KF圖所示係藉由作爲本發明之變形例 之描繪裝置中所具備的曝光頭部以及吐出頭部，而形成電 路基板之方法的斷面圖。 第1 3 A圖至第1 3 C圖所示係藉由作爲本發明之變形例 之描繪裝置中所具備的曝光頭部以及吐出頭部，而形成電 路基板之方法的斷面圖。 第14A圖至第14K圖所示係藉由作爲本發明之變形例 之描繪裝置中所具備的曝光頭部以及吐出頭部，而形成電 路基板之方法的斷面圖。 -25- 1222313 第1 5圖所不係有關本發明之變形例之描繪裝置之變形 例的說明圖。 - 第1 6圖所示係說明有關本發明之其他變形例之立體圖 ： 以及描繪裝置之動作的方塊圖。 _ 第17A圖至第170圖所示係爲形成習知之電路基板之 方法的斷面圖。 第18A圖與第18B圖所示係以多數之曝光頭部形成圖 型之方法的斷面圖。 【主要部分之代表符號說明】 ® 1 〇 :描繪裝置 1 2 :掃描座 1 4 :印刷基板 1 ό :頭部支撐體 1 8 :導軌 20 :曝光頭部 22 :吐出頭部 24 :吐出頭部 _ 26 :連結部1222313 (1) Description of the invention: [Technical field to which the invention belongs] The present invention relates to a drawing device for drawing laminated circuit patterns and the like, and a drawing method using the drawing device. [Prior art] In recent years, in the manufacturing method of a laminated circuit pattern, in order to use a light modulating element, as a specific manufacturing method, first, as shown in FIG. 17A, after the surface of a copper electroplated printed substrate, such as As shown in Fig. 17B, a photosensitive resin called photoresist is applied. φ This kind of photoresist will harden after being exposed to light (there is also the opposite case) 'As shown in Figure 17C, after the photoresist is exposed with a light modulating element, development is performed (refer to Figure 17D ), The photoresist of the exposed part, and wash the other parts. And as shown in Fig. 17E, after the copper of the photoresist has been washed away is etched by etching, the photoresist is peeled off and the insulating material is applied to the entire surface as shown in Fig. 17F (refer to Fig. 17G). Figure). Secondly, as shown in FIG. 17H, after the portion where the upper and lower leads φ must be opened is opened by laser, copper plating and photoresist are performed as shown in FIG. 1 71 (refer to FIG. 17J) ). Furthermore, as shown in Fig. 17K, development is performed after the photoresist is exposed with a light modulating element (see Fig. 17L). As a result, the photoresist of the unexposed portion is washed out, and the unexposed portion of the copper is etched as shown in FIG. 17M. Secondly, as shown in FIG. 17N, after the photoresist is peeled off, the insulator is coated by screen printing as shown in FIG. 70. Here, in the screen printing, a hole portion 'is formed in advance so that the solder adheres to the hole portion to conduct the electronic component or the like through the solder. Here, the procedure of applying a conductor or an insulator to a drawing medium or exposing a photoresist is performed by separately setting a device and setting a drawing medium on a pedestal provided in each device. Therefore, the media to be drawn must be placed on the table in each program, which is time consuming. In addition, since the device is independent in each program, the media to be drawn must be positioned in each program, and When the stacked pattern is formed, the pattern position may be shifted. On the other hand, as shown in Figs. 18A and 18B, a silver halide sensing material emitting other colors using exposure at three types of wavelengths (for example, R, G, and B) is used, with four exposure heads. (R, G, b, UV) exposure device to expose black with UV (405nm), red with B (450nm) and G (5 3 2nm), and green with B (450nm) and R (6 3 5nm) exposure, after exposing blue with G (53 2nm) and R (63 5 nm), and developing with a developer, when the sensing material is a thin metal strip, all colors are emitted at the same time The pattern of each color is formed. However, in order to obtain a high-concentration color, the thickness of the induction material must be formed to tens of micrometers (// m), resulting in insufficient accuracy of pattern formation. [Summary of the Invention] The present invention is based on the above-mentioned facts, and its object is to allow a simple program to perform drawing including 2 to 3 dimensions, and simultaneously obtain a drawing device capable of forming a highly accurate pattern and a drawing device using the drawing device. Describing method. In order to achieve the above object, according to the first aspect of the present invention, in the drawing device for drawing a layered circuit pattern or the like for a medium to be drawn, 4 includes at least one exposure head and / or at least 1 ejection head, and a moving device for relative movement of the head and the object to be drawn in a specified direction; the head is arranged slightly parallel in the specified direction in order to achieve the above-mentioned object, according to the present invention The second aspect includes at least one exposure head and / or at least one ejection head, and the heads are arranged in a parallel direction along a specified direction. In the drawing method using the drawing device, 'Is included: a step of providing a pictured medium, a step of moving the head and the pictured medium with respect to the specified direction, and accommodating the functional material from one head to the subject with the relative movement The steps to describe the media and the steps to expose it. [Embodiment] Hereinafter, a drawing device according to an embodiment of the present invention will be described. As shown in FIG. 1, the drawing device 10 is provided with a scan box 12 having a slightly rectangular parallelepiped shape. On top of the scan table 12 is a printed board 14 that can be positioned as a medium to be drawn. Place in the state. In addition, in the drawing device 10, a head support 16 having a substantially rectangular parallelepiped shape is provided at an end portion along the longitudinal direction of the scanning base 12. -The head support 16 is shown in Figure 2 so that the guide rails 18 are arranged along the long side of the head support 16 and the head 20 and the head 2 are exposed. X is related to the ejection head 2 4 shown in Fig. 1. Since the structure is slightly the same as the ejection head 22, the drawings and description are omitted). Ministry support! The long sides of 6 are supported unilaterally in a state where they are orthogonal to each other, and are formed so as to be movable in the direction of the arrow portion A along the guide rail 18 (hereinafter, the direction of the arrow portion a is referred to as the "main scanning direction"). The connecting portions 2 6 and 28 of the exposure head 20 and the ejection head 22 are linear motors (not shown), and the linear motor is driven by a driving device (not shown) to make the exposure head 20 And the ejection head 22 is moved along the guide rail 18 via the connecting and knotting portions 2 6 and 2 8. On the other hand, as shown in FIG. 1, the control unit of such a drawing device 10 is provided with a CPU (Central Processing Unit) 30. When a job command from an input device (not shown) is input to the CPU 30, it corresponds to the exposure The control content used to determine the laser power level and other operating conditions such as the scanning speed of the head 20 is a table that records the relationship between the recording conditions controlled by the memory connected to the CPU 30 and the head transmission speed. 3 2. Read the laser power level and other settings suitable for the working conditions. · According to the setting of the laser power level read from Table 32, etc., the control signal for controlling the exposure head 20 is transmitted to the recording condition setting circuit 34. This recording condition setting circuit 34 transmits a control signal including the setting of the laser power and the rate to the recording laser driver 36, and the _ recording laser driver 36 drives the optical fiber of the laser head 20 The array light-source 66 (refer to FIG. 4 (A) and FIG. 4 (B)) is formed so as to be able to emit laser light. 1222313 In addition, the CPU 30 transmits the control signal for controlling the exposure head 20 to the main scanning driver 38 for the exposure head 20 according to the setting of the laser power level read from the table 32. The main scanning driver 38 for the exposure head 20 is a control signal for a driving device for moving the exposure head 20 to the head support 16 to move the exposure head 20 in the main scanning direction. In addition, the main scanning driver 38 for the exposure head 20 transmits a control signal to the recording synchronization signal generation circuit 40, and synchronizes the exposure time points of the exposure head 20 with the movement speed of the exposure head 20, β transmits the synchronization signal to the modulation element driver 42 via the recording synchronization signal generating circuit 40. In such a modulation element driver 42, the recording information of the drawing pattern is read from the recording data 44 stored in the memory of the CPU 30, and the printed substrate 14 is exposed based on the recording information of the drawing pattern. Furthermore, the CPU 30 transmits a control signal for controlling the ejection head 22 to the main scan driver 48 for ejecting the head 22 in accordance with the setting of the laser power level read from the table 32 and the like. · The main scanning driver 48 for the ejection head 22 is to transmit a control signal to a driving device for moving the ejection head 22 to move the ejection head 22 in the main scanning direction. As shown, the signal generation circuit corresponds to the movement speed of the ejection head 22 and synchronizes the ejection time point of the functional material enclosed by ι to the ejection head 22, and transmits a synchronization signal to the ejection element driver 50. By static electricity. The achieved discharge device is based on the recorded information of the recorded drawing pattern, and -9-1222313 causes the functional material to be discharged to the printed circuit board 14. In addition, 'CPU 3 0' is the main scanning driver 52 for controlling the ejection head 24 via the ejection head 24 according to the settings of the laser power level read from the table 32. The control signal is transmitted to the driving device for moving the ejection head 24, and the synchronous signal is transmitted to the ejection element driver through a synchronization signal generating circuit (not shown) while the ejection head 24 is moved in the main scanning direction. 54. With the discharge device achieved by an electrostatic method or the like, the functional material is discharged to the printed substrate 14 according to the recorded information of the recorded drawing pattern. On the other hand, as shown in FIG. 2, the connecting portions 26 and 28 connected to the exposure head 20 and the ejection heads 22 and 24 along the guide rail 18 are provided with screws, respectively. The lock portion (illustration omitted) is provided so as to adjust the position of the connecting portions 26 and 28 with respect to the guide rail 18 with respect to the direction of the arrow portion A and the direction of the arrow portion B orthogonal to the direction of the arrow portion A. This makes it possible to adjust the positions of the direction of the arrow portion A and the direction of the arrow portion B of the exposure head 20 and the discharge heads 22 and 24. Specifically, by exposing the head 20 and the ejection heads 22 and 24, patterning is performed on the printed circuit board 14 in a specified pattern, the difference between the target pattern and the actual pattern is measured, and then the position is performed. Adjustment. For example, set the pattern of the third line of the head 2 2 and the exposure. The pattern of the line of the head 2 0 that is the same as the target pattern. Observe which lines of the line of exposure are the same as the output line, and perform the exposure. Adjust the position of the head 20. Conversely, the position of the ejection head 22 may be adjusted using the exposure line as a reference. In addition, although it is formed here that the position of the exposure head 20 and the ejection head 2 2 and 24 can be adjusted by the -10- 1222313 screw lock portion provided on the connecting portions 26 and 28, but It is also possible to transmit the arrangement data of the modulation elements used in the exposure head 20 or the discharge elements used in the discharge heads 22 and 24 to the control unit (not shown) to automatically perform the exposure head 20 and Adjust the position of the ejection heads 22 and 24. In this case, the direction of the arrow portion A is that the exposure caused by the synchronization signal generating circuit or the adjustment of the time point can adjust the position of the arrow portion A direction of the exposure line and the ejection line. purpose. However, the ejection heads 22 and 24 are configured by inkjet method. Therefore, in the ejection head 22, electrical conductivity is found by heating. In order to seal the copper microparticle resin capsule dispersion as a conductor, The ejection head 24 has an insulating resin dispersion liquid sealed therein as an insulator. In addition, the ejection heads 22 and 24 are each constituted by an electrostatic method, and the functional material enclosed by the electrostatic force is ejected to the outside. On the other hand, the exposure head 20 is shown in FIG. 3, FIG. 4A, and FIG. 4B, and is composed of a plurality of irradiation heads 56. Each of the irradiation heads 56 includes a fiber array light source 66. The wavelength of the light source is from 350 to 450 nm (however, in the thermal mode, the wavelength range is widened to 350 to 950 nm). The laser light emitted by this fiber array light source 66 is composed of The combination lens 71 of one pair of the lens series 67 is parallel-actinized, and is incident on the pair of combination lenses 73. Such a combination lens 73 is a beam which expands the beam near the optical axis portion of the lens and condenses the portion away from the optical axis with respect to the alignment direction of the laser emitting end. For a square orthogonal to the alignment direction- 11- Direction is to have the function of keeping the light in the original state, and the laser light is corrected to make the light amount distribution uniform. With such a combination lens 73, the laser light for correcting the light quantity distribution is uniformly focused by the condenser lens 75, and the reflected light beam is directed to correspond to the image through the reflector 69 Data, a digital micromirror device 6 8 (hereinafter, simply referred to as "DMD68"), which is a spatial light modulation element that performs modulation in each pixel, is injected. The laser light that has entered the DMD 68 is imaged on the printed substrate 14 through the lens systems 70, 72. Here, as shown in FIG. 5, the DMD 6 8 series is mounted on the SRAM cell (memory cell) 74, and the micromirror 76 is configured to be supported by the pillar, and is a kind of pixel ( pixel) (for example, 600 X 800) micromirrors are arranged in a grid-like mirror device. In each pixel, a micromirror 76 supported by a pillar at the uppermost part is provided. On the surface of the micromirror 76, a material with high reflectivity such as aluminum is vapor-deposited, and the reflectivity of the micromirror 76 is More than 90%. In addition, directly below the micromirror 76 is a SARM cell 74 configured with a silicon gate manufactured by a general semiconductor memory manufacturing line via a pillar including a hinge and a yoke, and the whole is Monolithic (-body). After the digital signal is written into the SRAM cell 74 of DMD6 8, the micromirror 76 that was rubbed on the pillar is centered on the diagonal and the angle is ± α degrees (for example, ± 1) 0 degrees). Here, the image of the younger brother 6A is not the state where the micromirror 76 is set to the on state and tilted -12- to + α degree, and the figure 6B is the micromirror 76 is set to the off state and tilted to-α In accordance with the image signal, the tilt of the micromirror 76 in each pixel of the DMD 68 is controlled according to the image signal, so that the light that has entered the DMD 68 is reflected toward the tilt direction of each of the micromirrors 76. In addition, FIG. 5 is an example of a state where the local DMD 68 is enlarged and the micromirror 76 is controlled to + α degree or-α degree. The opening and closing control of each micro mirror 76 is connected to the DMD 68. The controller shown in the figure performs this. Further, a light absorber (not shown) is arranged in a direction in which the light beam is reflected by the closed micromirror 76. In addition, as shown in FIG. 7, the DMD68 system is provided with a plurality of (for example, 800 columns × 600 rows) micromirrors 76. However, the DMD68 is arranged in a houndstooth pattern and is oriented toward the main scanning line direction (arrow part A). Orientation) is tilted only at a specified angle (for example, 0.1 ° to 5 °). While the main scanning of the exposure head 20 is performed, the adjacent exposure portions are partially overlapped. Thereby, even if the position of the DMD68 is slightly shifted, the shift can be absorbed to achieve high-precision exposure. At the same time, any one of the squares of the micromirrors 76 in the overlapping portion can be turned off. Avoid multiple exposures. Next, the function of the drawing device according to the embodiment of the present invention will be described. As shown in FIG. 8A, according to the recorded information of the recorded drawing pattern, the insulator 2 is ejected from the head 2 4 (refer to FIG. 1), and the insulating resin dispersion liquid 80 is ejected to be positioned on the scanner base 1 2 ( (See FIG. 1) on the printed circuit board 14 above. -13- 1222313 Secondly, by enclosing the conductor 2 2 (refer to Fig. 1) which has been found to be electrically conductive by heating, as shown in Fig. 8 B, the recorded information is drawn based on the recorded pattern. Then, the copper fine particle resin capsule dispersion liquid 8 2 as a conductor is discharged (in addition, the copper fine particle resin capsule dispersion liquid 8 2 may be discharged onto the printed circuit board 14 and then the insulating resin dispersion liquid may be discharged). In addition, as shown in FIG. 8C, the exposure head 20 (see FIG. 1) having a heating function is used to fully expose the printed substrate 14 to expose the copper microparticle resin capsule dispersion liquid 82 and the insulation. The resin dispersion 80 is hardened. Here, the micromirror 76 (refer to FIG. 5) constituting the DMD 68 (refer to FIG. 5) constituting the exposure head 20 is controlled by the type of the insulating resin dispersion liquid, and it is also possible to disperse only the microcapsule resin capsules which have been discharged. The area of the liquid 82 is exposed (in addition, only necessary areas may be exposed locally, and the area ejected by the copper fine particle resin capsule dispersion liquid 82 may be exposed in a relatively small area). In this case, the printed substrate 1 44 can be partially exposed, and only the surface is heated by thermal annealing according to different situations. Therefore, in order to avoid thermal expansion and contraction of the printed substrate 14, the printing can be reduced. The heat-resistant temperature of the substrate 14. In addition, compared with the case performed by thermal annealing, the purpose of time reduction can be achieved. Furthermore, since the resin in the copper fine particle resin capsule dispersion liquid 8 2 is not completely evacuated in terms of thermal annealing, and a gap remains between the copper fine particles, it has a problem that the resistance 値 cannot be sufficiently reduced (resistance 値: -14- 1222313 5 ~ 8x 1 (Τ5 Ω cm), but in the case of thermal annealing, the equivalent resistance of the copper wiring pattern is formed by the general circuit 値 (3 ~ 5 X 1 (Γ6 Ω cm ), It can be widely used in general circuit board applications. Second, as shown in FIG. 8D, the insulating layer 84 and copper formed by the hardened copper microparticle resin capsule dispersion liquid 82 and the insulating resin dispersion liquid 80 After the insulating resin dispersion liquid 80 is ejected from the fine particle layer 86 through the insulator ejection head 24, as shown in FIG. 8E, the printed substrate 14 is fully exposed by the exposure head 20 to make copper The microparticle resin capsule dispersion liquid 82 and the insulating resin dispersion liquid 80 are hardened. As shown in FIG. 8F, the insulator 24 is ejected from the head 24, and the insulating resin dispersion liquid 80 is ejected from the insulating layer 84 and copper. Micro particle layer 86 After the copper microparticle resin capsule dispersion liquid 82 is ejected, as shown in FIG. 8G, the printed substrate 14 is fully exposed by exposing the head 20, and the copper microparticle resin capsule dispersion liquid 82 and the insulating resin dispersion liquid are exposed. 8 0 is hardened. Next, as shown in FIG. 8 (a), the circuit board other than the solder is used to remove the electrode, and the insulating resin dispersion 80 is ejected on the insulating layer 84 by ejecting the head 24 through the insulator. And on the copper fine particle layer 86, the surface of the printed substrate 14 is covered with an insulating resin. In this way, a material that is found to be conductive by heating is discharged onto the printed substrate 14 by discharging the head 2 2 ( It can also be discharged to the entire surface of the printed circuit board 14 (the so-called coated state), and then laser-annealed (whole or partial) by an exposure head with a heating function. It is easy to pattern the conductivity, and it is easy to form a multilayer circuit board -15-. In this type, as shown in Figure 1, by exposing the head 20 and ejecting the head 2 2, 2 4 arranged in the same scanning base 1 Compared with the case where there is a scanning base on each head, the procedure can be simplified while the time during patterning can be shortened, and the speed of pattern formation can be increased. The scanning base 12 is formed on the printed circuit board 14 by the circuit pattern. Even for the printed circuit board 14, the positions of the exposure head 20 and the protruding heads 22 and 24 are shifted, so it is easy. High pattern density. Therefore, when it is not possible to obtain sufficient mechanical properties during the patterning period, for example, after ejecting a functional material such as an insulator or a conductor, the functional properties may be deformed. In the case where materials must be hardened, patterning can also be performed. At the same time, before the functional material flows, the functional material can also be hardened to form a highly accurate pattern. In addition, there is no risk that the size of the pattern will change due to the elapsed time required for the transport between the respective scanning bases 12 or the movement during the patterning period. In addition, there is no need to remove the photoresist and material waste, so the cost can be reduced. In addition, the number of procedures can be reduced because the photoresist coating process can be eliminated. In addition, by arranging the exposure head 20 and the ejection head 2 2 and 24 on the same scanning base, it is possible to reduce the size of the formation by comparing with the case where there are scanning heads on each head. The layout space of the necessary equipment as a whole in the form of a circuit pattern, in addition, can achieve the purpose of cost reduction and power saving. In addition, in this embodiment, although the scanning head 12 is provided with an exposure head 20 using DMD as an annealing device for the light modulator, and an electrostatic method for discharging the copper microparticle resin capsule dispersion liquid 8 2 The discharge head 22 and the electrostatic discharge head 24 for discharging the insulating resin dispersion liquid 80, etc. are not limited to this embodiment. For example, the light modulator used as the exposure head is described with respect to the irradiation head equipped with DMD. However, for example, even if a MEMS (Micro Electro Mechanical Systems) type space modulation element (SLM; Spacial Light Modulator) is used ), Or an optical element (PLZT element) or liquid crystal shutter (FLC) that modifies transmitted light by an electro-optical effect, or a space modulation element other than a MEMS type, it is arranged on the substrate by using The pixel unit, which is a part of the full pixel unit, can speed up the modulation speed of each pixel and each main scanning line, and obtain the same effect. In addition, the EMS of the stomach is a micro system that integrates micro-sized sensors, actuators, and control circuits by micro-precision mechanical technology based on IC manufacturing and processing. In general, the so-called MEMS type space modulation element means a space modulation element driven by an electromechanical action using an electrostatic force. In addition, as a photosensitive material, it includes photoresist, dinitrogen, photopolymer, fine particle dispersing material (resin, dielectric, conductive material, particles of such capsule structure), thermal crystallization material, thermal material, thermal transfer Printing materials, molecular diffusion materials (in other words, sublimation-type thermal transfer materials), etc., and Sen-17-1222313 light material types have thin films, liquids, solids, microparticles, microparticle dispersions, and microparticle film-forming films ( Substrate) etc. However, if the head can be exposed as a two-dimensional drawing, in other words, a pattern can be formed (etching mask,; plating mask, hydrophobic-hydrophilic, uneven, thermal annealing, thermal transfer, thermal reaction,. (Peeling), or as a three-dimensional drawing (those who repeat the two-dimensional drawing multiple times), and can be formed into a three-dimensional shape by light curing, powder sintering, thermal melting, or thermal curing. On the other hand, among the nozzles constituting the ejection head, there are a form of on-demand delivery nozzle (pressure, electrostatic film, heat, etc.), a continuous form (field effect, bias, thermal bias, etc.), or no-demand That is, the nozzle type (ultrasonic, electrostatic discharge) is used as a discharge material, which has a photoreaction liquid, a fine particle dispersion (resin, dielectric, conductive material, thermal crystallization material, thermal material, hot melt material, molecular diffusion material). (In other words, sublimation-type thermal transfer materials), catalysts, enzymes, bacteria, DNA, chemical reaction chemicals, etc., and the capsule structure particles), hot melts (WAX, etc.), chemical reaction solutions, catalyst solutions, Surface modification fluid. With this ejection head, a pattern (etching mask, plating mask, φ hydrophobic-hydrophilic, unevenness) is formed as a two-dimensional drawing, and if it can be formed, it can be hardened by hot melt cooling, photo hardening, powder sintering, It may be a case where a three-dimensional shape is formed by thermally curing for three-dimensional drawing. < Specifically, conductive microparticle-containing liquid discharge heads and exposed heads can also be used. As shown in FIG. 9A, the glass substrate 90 discharges the head with the conductive fine particle-containing liquid, and the liquid 92 containing the conductive fine particles is completely discharged. Next, as shown in FIG. 9B, by exposing the head, -18-1222313 is annealed to the insulating material that has been coated with a liquid containing conductive fine particles in a necessary conductive pattern shape, thereby forming a conductive film. Pattern 96, forming a circuit board 98. Here, as the above-mentioned conductive fine particles, an insulator may be used in which the surroundings of fine particles of 1 Onm to 10 m, such as copper, silver, and gold, are covered with an insulator. In addition, it is also possible to use an insulating film ejection head and a circuit cut pulse laser to expose the head. As shown in FIG. 10A, the transparent insulating film is ejected to the outermost conductive film 100 of the printed board 100 on the entire surface by the insulating film ejecting head. Although such a transparent insulating film is transmissive, a conductive film formed by a conductive film ejection head or electroplating is exposed through an exposure head having an absorption wavelength, as shown in FIG. 10B As shown in the figure, a circuit substrate 10 is formed in which the circuit pattern of the conductive film 102 is switched and formed as a cavity. The circuit board 103 is formed so that a circuit pattern that does not appear on the surface can be changed. Since the circuit pattern can be heated without being exposed to air, it is difficult to oxidize the conductive film material around the cut portion. In addition, using an insulating film ejection head, a mark to make a printed ejection head, or a pulse laser mark to make an exposure head, you can also expose the head or ejection head before attaching the outermost insulating film. To mark the numbers, barcodes, and positioning patterns. In order to make the mark before the outermost insulating film is applied, the pattern is not directly exposed on the surface, thereby preventing forgery or peeling. In addition, because the marking can be made with different contents in each layer, it is also possible to prevent the error of the inspection conditions of the circuit in each layer when they are different, and prevent the circuit board from being mounted on the final product. In case -19- 1222313, the installation is incorrect. In addition, the head can be ejected using a spacer construction material, and the head can be exposed with a hardening laser. As shown in Fig. 1A, the head is ejected by the spacer construction material. After using the spacer 10 for uniformizing the glass interval of the LCD 104, the head is exposed (if the material is a light-hardening type). In this case, a UV laser of 350-450 nm is used as the light source. If the material is a thermosetting type, a high-power laser of 350-950 nm is used as the light source), as shown in Figure 11B. It is shown that the substrate 105 is formed by irradiating only the periphery of the position of the spacer 106 and hardening the spacer 106. With respect to such a substrate 105, in order to improve the accuracy of the height of the spacer 106, the spacer 106 can be strengthened at the same time. In addition, it can also be used as a spacer for wafer level flip chips. In addition, a photopolymer ejection head and a curing exposure head may be used. As shown in FIG. 12A, the photopolymer is ejected from the head on top of the pedestal 110 which is arranged to be raised and lowered, and the photopolymer is ejected in a layer form. Next, as shown in FIG. 12B, the exposure head is irradiated with light of 350 to 450 nm to harden the photopolymer. As shown in FIG. 12C, the pedestal 1 10 is lowered (approximately 5 0 // m). , The photopolymer ejection head and the exposure head for curing are relatively increased by one layer. At this time, return the exposure head and the photopolymer ejection head to the reference position. And, as shown in FIG. 12D, after the photopolymer is ejected from the head, the photopolymer is ejected in one layer, and the photopolymer is hardened by exposing the head, as shown in FIG. 12E. As shown in the figure, the pedestal 110 is lowered, and the photopolymer ejection head and the exposure head for curing are relatively increased by a layer of -20-1222313. By repeating the above-mentioned procedure many times, as shown in FIG. 12F, in order to form the circuit substrate 1 12, it is possible to perform high-intensity and high-precision three-dimensional modeling compared with objects that cannot be cured by light. In addition, conductive discharge heads and pulsed laser exposure heads for trimming can also be used. As shown in FIG. 13A, after a conductive circuit (conductor) is formed on the printed substrate 1 13 by the conductive ejection head, as shown in FIG. 1B, the resistance meter 114 is While measuring the resistance 値, the conductive circuit is reduced (generally referred to as trimming) by exposing the head (preferably a pulsed laser), and when the target resistance 値 is formed, the irradiation is stopped. Further, as shown in FIG. 1C, the printed circuit board 1 1 3 is covered with an insulator, thereby forming a circuit board 1 1 5. With this procedure, in addition to making high-precision resistors on the circuit board, at the same time, most resistors can be adjusted at one time. Furthermore, a photoresist exposure head having a different exposure function, and a pulse laser exposure head for a through hole may be used. As shown in FIG. 14A, the copper plated substrate 1 1 6 which has been subjected to copper plating is as shown in FIG. 14B. In order to expose the head with a pulse laser through a through hole mounted on the pulse laser, Open the through hole 1 1 8. In addition, as shown in FIG. 14C, both sides of the copper-plated substrate 116 are laminated with a photoresist on a thin film. As shown in FIG. 14D, the photoresist is hardened by exposing the head to the photoresist. The latter is shown in Fig. 1E, in order to remove the photoresist of the unexposed part by developing (in addition, it is insoluble to the developing solution depending on the exposure, in other words, although the negative -21 is used -1222313 type photoresist is easily dissolved in the developing solution by exposure. In other words, a positive type photoresist can also be used. In the case of using a positive type photoresist, the exposure part is exposed by imaging. Photoresist removal), and the exposed copper is etched by etching. Next, as shown in FIG. 14F, the photoresist is peeled off. Next, as shown in FIG. 14G, both sides of the copper electroplated substrate 1 1 6 are laminated with a photoresist on the film. As shown in FIG. 14H, the photoresist is hardened by exposing the head with the photoresist. Then, as shown in Fig. 1 41, the photoresist of the unexposed portion is removed by developing. β As shown in FIG. 14J, after plating the inner edge portion of the through hole 1 1 8 formed on the copper plating substrate 116, as shown in FIG. 14K, the photoresist is peeled off to form the circuit substrate 1 2 0. In this way, by opening the through hole in the same device, the positioning accuracy of the hole portion can be improved. In addition, in the above type, the method for forming a pattern with the printed substrate placed on the scanning base is described, but each head may be fixed and the medium to be drawn may be moved to form a pattern. Pattern. As shown in FIG. 15, a long thin metal strip 1 22 is used as a medium for drawing the spring. The thin metal strip 122 sent out by the sending device 124 is wound by the winding device 126, and a transfer path 128 is formed between the sending device 124 and the winding device 126. In such a conveying path 128, the conveyed metal thin strips 122 are separated by an interval, and the photoresist of the photoresist is ejected out of the head 1 3 0, the exposure head 1 32, and the image is ejected. The imaging liquid ejection head 1 3 4 is ejected. The etching solution ejection head 1 3 8 of the etching solution, and the cleaning liquid ejects the cleaning solution. 22- The ejection head 140 is disposed orthogonally to each conveying path. In the direction of 128, adjacent heads are arranged parallel to each other. Thereby, in the process of transferring the thin metal strips 1 2 2, various processes are performed while the thin metal strips 1 2 2 are moved to form a pattern. In addition, although each head is arrange | positioned above and below the thin metal strip 1 2 2 conveyed here, you may arrange only above or below the thin metal strip 1 2 2. In addition, although the developer ejection head 134, the etching solution ejection head 138, and the cleaning solution ejection head 144 are used here, it is not necessary to use the ejection head, and it may be used. Storage tanks for developing solution, etching solution and cleaning solution. β In addition, as shown in FIG. 1, the combination of head types is described in the case where the exposed head 20 and the ejected head 2 2 and 24 are linear heads, but it is not limited to Limited to this, for example, as shown in FIG. 16, the exposure heads 1 2 2 and the ejection heads 1 4 4 and 1 4 6 can also be serial heads (in this case, even for the main scanning direction (arrow Direction A) Orthogonal direction can also be moved). In addition, although it is not shown in the figure, the exposure head is a linear head when the ejection head is a serial nozzle, and when the ejection head is For linear heads, various combinations can be used, such as the case of sequential heads. [Industrial Applicability] The present invention is structured as described above. Therefore, by forming a circuit pattern on the medium to be drawn on the same scanning base, the position of the various parts of the medium to be drawn cannot be shifted. It is easy to increase the accuracy of the pattern. In addition, by arranging each head on the same scanning base, compared with the case where each head has a scanning base, the procedure can be simplified -23-1222313, and the pattern can be shortened During the period of time, the speed of pattern formation can be increased. Therefore, it is possible to achieve a high-precision pattern, and in addition, the size of the pattern may not be changed by the elapsed time required for the transport between the scanning seats or the movement during the patterning period. In addition, there is no need for final removal of material waste caused by photoresist, so the cost can be reduced. In addition, the number of procedures can be reduced because the process of applying photoresist can be eliminated. Furthermore, by arranging the heads on the same scanning base, and comparing with the case where scanning heads are provided on the respective heads, it is possible to reduce the installation space of the entire device necessary to form a circuit pattern. In addition, it can achieve the purpose of cost reduction and power saving. [Brief Description of Drawings] Fig. 1 is a perspective view of a drawing device according to an embodiment of the present invention and a block diagram showing the operation of the drawing device. Fig. 2 is a diagram for explaining a method for adjusting the position of the exposure head and the ejection head provided in the drawing device according to the embodiment of the present invention. Fig. 3 is a perspective view showing a schematic configuration of an irradiation head of an exposure head provided in a drawing device according to an embodiment of the present invention. Figure 4A is a cross-sectional view in the sub-scanning direction along the optical axis in the structure of the irradiation head shown in Figure _3, and Figure 4B is a side view of Figure 4A. Fig. 5 is a partially enlarged view showing the structure of the DMD of the exposure head provided in the drawing device according to the embodiment of the present invention. Figures 6A and 6B are -24-1222313 explanatory diagrams for explaining the operation of the DMD. Fig. 7 is a plan view showing a scanning line of laser light for exposing the head provided in the drawing device according to the embodiment of the present invention. Figures 8A to 8H are cross-sectional views of a method for forming a circuit board by using an exposure head and a discharge head provided in a drawing device according to an embodiment of the present invention. 9A and 9B are cross-sectional views of a method for forming a circuit board by using an exposure head and a discharge head provided in a drawing device as a modification of the present invention. 10A and 10B are cross-sectional views of a method for forming a circuit board by using an exposure head and a discharge head provided in a drawing device as a modification of the present invention. 11A and 11B are cross-sectional views of a method for forming a circuit board by using an exposure head and an ejection head provided in a drawing device as a modification of the present invention. Figures 12A to KF are cross-sectional views of a method of forming a circuit board by using an exposure head and a discharge head provided in a drawing device as a modification of the present invention. Figures 13A to 13C are cross-sectional views of a method for forming a circuit board by using an exposure head and a discharge head provided in a drawing device as a modification of the present invention. 14A to 14K are cross-sectional views of a method for forming a circuit board by using an exposure head and a discharge head provided in a drawing device as a modification of the present invention. -25- 1222313 FIG. 15 is not a diagram illustrating a modification of the drawing device according to a modification of the present invention. -Figure 16 shows a perspective view illustrating another modification of the present invention: and a block diagram depicting the operation of the device. _ Figures 17A to 170 are sectional views showing a method for forming a conventional circuit board. Figures 18A and 18B are sectional views showing a method of forming a pattern with a large number of exposed heads. [Description of Representative Symbols of Main Section] ® 1 〇: Drawing device 1 2: Scanning base 1 4: Printed substrate 1 ό: Head support 1 8: Guide rail 20: Exposed head 22: Eject head 24: Eject head _ 26: Link
2 8 :連結部 30 ： CPU 3 2 :表格 3 4 :記錄條件設定電路 - 3 6 :記錄雷射驅動器 胃 3 8 :主要掃描驅動器 -26- 1222313 40 :記錄同步信號產生電路 42 :調變元件驅動器 < 44 :記錄資料 丨 48 :主要掃描驅動器 _ 5 0 :吐出元件驅動器 5 6 :照射頭部 66 :光纖陣列光源 67 :透鏡系統 68 :數位微鏡裝置 · 69 :反射鏡 7 0 :透鏡系統 7 1 :組合透鏡 7 2 :透鏡系統 7 3 :組合透鏡 74 : SRAM 晶胞 7 5 :聚光透鏡 7 6 :微鏡 β 80 :絕緣性樹脂分散液 8 2 :銅微粒子樹脂膠囊分散液 8 4 :絕緣性層 8 6 :銅微粒子層 、 9 0 :玻璃基板 ‘ 9 2 :液體 · 96 :圖型 -27- 1222313 100 :印刷基板 1 0 2 :導電膜 I 〇 3 :電路基板2 8: Connection unit 30: CPU 3 2: Table 3 4: Recording condition setting circuit-3 6: Recording laser driver stomach 3 8: Main scanning driver -26-1222313 40: Recording synchronization signal generating circuit 42: Modulating element Driver < 44: Recording data 丨 48: Main scanning driver_ 5 0: Ejection device driver 5 6: Irradiation head 66: Fiber array light source 67: Lens system 68: Digital micromirror device 69: Mirror 7 0: Lens System 7 1: Combination lens 7 2: Lens system 7 3: Combination lens 74: SRAM cell 7 5: Condensing lens 7 6: Micromirror β 80: Insulating resin dispersion 8 2: Copper microparticle resin capsule dispersion 8 4: Insulating layer 8 6: Copper fine particle layer, 90: Glass substrate 9 2: Liquid 96: Pattern 27-1222313 100: Printed substrate 1 02: Conductive film I 03: Circuit board
104 ： LCD 105 :基板 106 :隔件 II 0 :台座 11 2 :電路基板 11 3 :印刷基板 ® 11 4 :電阻計 11 6 :銅電鍍基板 Η 8 :貫通孔 1 2 0 :電路基板 122 :金屬薄條 124 :送出裝置 126 :捲繞裝置 1 2 8 :搬送路徑 _ 1 3 4 :顯像液吐出頭部 1 3 8 :蝕刻液吐出頭部 140 :洗淨液吐出頭部 t -28-104: LCD 105: substrate 106: spacer II 0: stand 11 2: circuit board 11 3: printed circuit board 11 4: resistance meter 11 6: copper plated substrate Η 8: through hole 1 2 0: circuit board 122: metal Thin strip 124: Feeding device 126: Winding device 1 2 8: Conveying path_ 1 3 4: Development liquid discharge head 1 3 8: Etching liquid discharge head 140: Washing liquid discharge head t -28-