TWI221325B - Molding apparatus with a pressure sensor for semiconductor package - Google Patents
Molding apparatus with a pressure sensor for semiconductor package Download PDFInfo
- Publication number
- TWI221325B TWI221325B TW092129690A TW92129690A TWI221325B TW I221325 B TWI221325 B TW I221325B TW 092129690 A TW092129690 A TW 092129690A TW 92129690 A TW92129690 A TW 92129690A TW I221325 B TWI221325 B TW I221325B
- Authority
- TW
- Taiwan
- Prior art keywords
- mold
- pressure sensor
- mold chase
- sealant
- cavity
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
- B29C45/4005—Ejector constructions; Ejector operating mechanisms
- B29C45/401—Ejector pin constructions or mountings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/7646—Measuring, controlling or regulating viscosity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/77—Measuring, controlling or regulating of velocity or pressure of moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76003—Measured parameter
- B29C2945/76006—Pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76177—Location of measurement
- B29C2945/7624—Ejection unit
- B29C2945/76244—Ejection unit ejectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76177—Location of measurement
- B29C2945/76254—Mould
- B29C2945/76257—Mould cavity
- B29C2945/7626—Mould cavity cavity walls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
1221325 五、發明說明（l) (一）、【發明所屬之技術領域】 h本發明係有關於一種半導體封裝用之鑄模裝置，特別 疋有關於種模穴中之脫模頂針處設置有一壓力感測哭 半導體封裝用鑄模裝置。 j时之 (二）、【先前技術】
Ik著微小化以及高運作速度需求的增加，半導體 5 t t電子裝置或元件之製造所扮演之角色也愈形重要: 己〃疋半導體兀件封膠後脫模前，需要求形 封膠體體能較容易從模具中脫離。 ^之 ^ ^ ,般而吕，目珂模具裝置之設計（如圖1所示）係包含一 、坐 jno」d chase holder)ll〇、一模具（m〇ld chase)12〇 及 lon ^ ltjdl:er」其中，模座lio係用以容置模具 ^3〇Ϊΐ120係具有複數個模穴l21(m〇ld cavity);加熱 模座110中，而模具120係藉由模座n〇上之 r ^ p" 0使其加熱之。由於模具上並無任何量測封膠體與 :巧；ΐ度(黏著力大小)之感測器，故只能利用高感度 儀σ。在封膠后即時量測封膠體之黏度（adhesion ’所以無法得知封膠材於模穴121中形成後， 封膠體與模具間之實際黏度，，亦即無法得 間之黏著力大小。也因此高感度儀器所偵 # I. 一，、立之黏度貪料往往與封膠固化形成後之實際 ，而無法得知實際之封膠材黏度。 有！皿於此，為得知封膠材於形成後脫模時之實際黏
第6頁 1221325
度，以得知其相關封膠之材 、 改善依據，來提升半導體元、 ，作為相關封膠材料之 課題。 、 之封衣效施，實為一重要的 (三）、【發明内容】 有鑑於上述課題，本發明 ^ 感測器之半導體封裝用鑄模裝目的係提供一種具有壓力 置於脫模頂針處，用以直接^ ，其具有—壓力感測器設 具中之膠材施加於脫模頂針：：封膠體脫模時’殘留於模 模時與模具間之黏度（黏著力i力，進而量測出封膠體脫 之特性，並作為相關封膠材料小），以得知相關封膠材料 相關封膠材之品質。 e善依據，以進一步確保 緣是，為了 力感測器之半導 模具、一加熱器 具有一模穴、_ 穴表面用以容置 貫孔將成型之封 以容置該模具， 具。值得注意的 用以直接量測封 脫模頂針之壓力 度（黏著力大小） 綜上所述， 達成上 體封裝 述目的 用麵模 ’本發明 裝置，主 、一脫板頂針及一^壓力 貫孔及一脫模頂針，且 脫模頂針於其中，以使 膠體頂出而脫離模具。 且該模座具有一加熱器 是，該壓力感測器係設 膠體脫模時，殘留於模 ，進而量測出封膠體脫 係提供 要包含 感測器 $ ^'孑 L 脫模頂 另外， ，用以 置於脫 具中之 模時與 一種具有壓 一模座、一 。該模具係 係貫穿該模 針能經由該 該模座係用 加熱該模 模頂針處， 膝材施加於 模具間之黏 由於壓力感測器係設置於脫模頂 1221325
能正確量測 膠體與模具 作為相關封 之品質。 出封膠材固 間之之黏度 膠材料之改 化後形成封 ，以得知相 善依據，以 膠體後於脫 關封膠材料 進一步確保 模時，該封 之特性，並· 相關封膠材 (四）、【實施方式】 右軍：I將苓照相關圖&，說明依本發明較佳實施例之具 有土力感測器之半導體封裝用之鑄模裝置。 圖2係顯示本發明較佳實施例之^ ^ ^ ^ ^ ^ ^ ^ 體封裝用鑄模裝置。本發明之丰霧舻封缺/ α測為之+ ¥ 一、衣直奉毛明之牛V體封裝用之鑄模裝置主 口口匕3旲上2 1 〇、一模具2 2 0、一加熱器2 3 0及一壓力感測 器240。模具220係具有複數個模穴221，且模呈22〇具有至 少一貫孔226且貫孔22 6係貫穿模穴表面222 (請、一併;考圖 2Α)。再者，一脫模頂針228係容置於貫孔226中，並能於貫 孔2 2 6中上下自由移動，以作為將固化後之封膠材頂出模具 2 2 0用。另外，模座2 1()係用以容置該模具22〇，且該模座/ 210設有一加熱器230，用以加熱該模具22〇 入置有半導體元件之模穴221中，進行半導體 驟。值得注意的是，壓力感測器24〇係設置於模且22〇之脫 模頂針228處，用以量測封膠體脫模時，殘留於模具中之膠 材施加於脫模頂針之壓力，以得知該封膠材固化後脫模時/ 之黏度。其中，該壓力感測器240係藉由殘留於模具中之膠 材直接施壓於該壓力感測器2 4 0之内含壓力桿件（未標示於 圖中）所產生之變形量，以量測出封膠體脫模時與模'"具間之
!221325 五、發明說明（4) 黏度（黏著力大小）之黏度。 承上所述，如此可藉由準確量測封膠 其與先前藉由高感度量測儀器量測得知夕=之黏度啤低 異值。爯者，爭可拉卜卜俨a 4 a 5之封膠材黏度之差 兵值再者，更可稭此侍知相關封膠材料 相關封膠材料之改善依據，*而確保半導：特二 作為 品質。 作你千^體兀件之封膠材 於本實施例 了易於說明本發 制於該實施例， 專利範圍之情；兄 之詳細說明中所提出之具體的實施例僅為 明之技術内容，而並非將本發明狹義地限 因此，在不超出本發明之精神及以下申請 ’可作種種變化實施。
1221325 圖式簡單說明 (五) 、【圖 式 簡單說 明】 圖1為· -示意圖 ， 顯示習知半導體封裝用之鑄模裝置 圖2為- -示意圖， 顯示本發明較佳實施例之具有壓力 測器 之半導 體 封裝用 鑄模裝置。 圖2A為 一 不意圖 ，顯示壓力感測器設置於脫模頂針 處。 元件 符號說 明 110 ^ 210 模 座 120 > 220 模 具 121 ^ 221 模 穴 222 模 穴表面 226 貫 孔 228 脫 模頂針 130 >230 加 熱器 240 壓 力感測 器
第10頁
Claims (1)
1221325 六、申請專利範圍 1 · 一種具有壓力感測器之半導體封裝用鑄模裝置，包含： 一模具，其係具有至少一模穴，該模具係具有至少一貫穿 該模穴表面之貫孔； 一模座，其係用以容置該模具； 一脫模頂針，其設置於該貫孔中；以及 ’ 至少一壓力感測器，其係設置於該脫模頂針上。 2 ·如申請專利範圍第1項所述具有壓力感測器之半導體封裝 用鑄模裝置，更包含一加熱器設置於該模座上用以加熱該 模具。
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW092129690A TWI221325B (en) | 2003-10-24 | 2003-10-24 | Molding apparatus with a pressure sensor for semiconductor package |
| US10/876,609 US20050089593A1 (en) | 2003-10-24 | 2004-06-28 | Molding apparatus with a pressure sensor for packaging semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW092129690A TWI221325B (en) | 2003-10-24 | 2003-10-24 | Molding apparatus with a pressure sensor for semiconductor package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI221325B true TWI221325B (en) | 2004-09-21 |
| TW200515547A TW200515547A (en) | 2005-05-01 |
Family
ID=34389161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092129690A TWI221325B (en) | 2003-10-24 | 2003-10-24 | Molding apparatus with a pressure sensor for semiconductor package |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20050089593A1 (zh) |
| TW (1) | TWI221325B (zh) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006093588A (ja) * | 2004-09-27 | 2006-04-06 | Nec Electronics Corp | 表面に突起部を有する半導体装置および半導体パッケージの識別方法。 |
| HUE024564T2 (en) * | 2007-09-20 | 2016-02-29 | Priamus System Tech Ag | A method and apparatus for controlling, documenting and / or controlling an injection molding machine |
| KR101336156B1 (ko) | 2012-05-31 | 2013-12-03 | 서울과학기술대학교 산학협력단 | 사출기 부착형 금형 모듈을 이용한 점도 측정 장치 및 이를 이용한 점도 측정 방법 |
| CN107672123B (zh) * | 2017-11-14 | 2023-11-10 | 东莞德威铸造制品有限公司 | 模内成型模具及其顶出机构 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5835460B2 (ja) * | 1979-09-28 | 1983-08-02 | 株式会社日立製作所 | トランスフア成形機 |
| JP3937525B2 (ja) * | 1997-09-10 | 2007-06-27 | 双葉電子工業株式会社 | 圧力センサ付エジェクタピン |
-
2003
- 2003-10-24 TW TW092129690A patent/TWI221325B/zh not_active IP Right Cessation
-
2004
- 2004-06-28 US US10/876,609 patent/US20050089593A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US20050089593A1 (en) | 2005-04-28 |
| TW200515547A (en) | 2005-05-01 |
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| Date | Code | Title | Description |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |