TWD232106S - Sealing materials for chemical mechanical polishing equipment - Google Patents

Sealing materials for chemical mechanical polishing equipment Download PDF

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Publication number
TWD232106S
TWD232106S TW112304974F TW112304974F TWD232106S TW D232106 S TWD232106 S TW D232106S TW 112304974 F TW112304974 F TW 112304974F TW 112304974 F TW112304974 F TW 112304974F TW D232106 S TWD232106 S TW D232106S
Authority
TW
Taiwan
Prior art keywords
mechanical polishing
chemical mechanical
polishing equipment
sealing materials
equipment
Prior art date
Application number
TW112304974F
Other languages
Chinese (zh)
Inventor
田嶋一啲
柏木誠
古澤磨奈人
Original Assignee
日商荏原製作所股份有限公司 (日本)
日商荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商荏原製作所股份有限公司 (日本), 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司 (日本)
Publication of TWD232106S publication Critical patent/TWD232106S/en

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Abstract

【物品用途】;本設計的物品係化學性機械研磨裝置用密封材，是在化學性機械研磨(CMP)裝置中使用在供保持四邊形基板之頂環的密封材。;【設計說明】;(無)[Product Application]; This product is a seal material for chemical mechanical polishing equipment. It is a seal material used in chemical mechanical polishing (CMP) equipment to hold the top ring of a quadrilateral substrate. ;[Design Description]; (None)

Description

化學性機械研磨裝置用密封材Sealing materials for chemical mechanical polishing equipment

本設計的物品係化學性機械研磨裝置用密封材，是在化學性機械研磨(CMP)裝置中使用在供保持四邊形基板之頂環的密封材。The article of this design is a sealing material for a chemical mechanical polishing device, and is a sealing material used in a chemical mechanical polishing (CMP) device to hold a top ring of a quadrilateral substrate.

(無)(without)

TW112304974F 2023-03-30 2023-09-26 Sealing materials for chemical mechanical polishing equipment TWD232106S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-006489 2023-03-30
JP2023006489F JP1755378S (en) 2023-03-30 2023-03-30 Sealing material for chemical mechanical polishing equipment

Publications (1)

Publication Number Publication Date
TWD232106S true TWD232106S (en) 2024-07-01

Family

ID=88327915

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112304974F TWD232106S (en) 2023-03-30 2023-09-26 Sealing materials for chemical mechanical polishing equipment

Country Status (3)

Country Link
US (1) USD1119829S1 (en)
JP (1) JP1755378S (en)
TW (1) TWD232106S (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD977677S1 (en) 2020-08-11 2023-02-07 Michael Ross Hodges Extrusion for a draft seal

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Publication number Priority date Publication date Assignee Title
USD387070S (en) * 1996-11-08 1997-12-02 Black & Decker Inc. Planer
USD685335S1 (en) * 2008-11-18 2013-07-02 Applied Materials, Inc. Substrate support
USD621427S1 (en) * 2009-12-18 2010-08-10 3M Innovative Properties Company Adapter for a sanding tool
USD643820S1 (en) * 2010-04-09 2011-08-23 Panasonic Electric Works Co., Ltd. Electroluminescence module
USD642996S1 (en) * 2010-04-09 2011-08-09 Panasonic Electric Works Co., Ltd. Electroluminescence apparatus
JP1437719S (en) * 2010-04-09 2015-03-30
USD674364S1 (en) * 2011-07-08 2013-01-15 Nihon Dempa Kogyo Co., Ltd. Crystal unit
JP1463922S (en) * 2012-05-02 2016-02-29
USD784276S1 (en) * 2013-08-06 2017-04-18 Applied Materials, Inc. Susceptor assembly
USD723596S1 (en) * 2013-09-26 2015-03-03 Casio Keisanki Kabushiki Kaisha Sheet holder for stamp making machine
USD881822S1 (en) * 2017-10-06 2020-04-21 Laird Technologies, Inc. Material having an edge shape
USD879046S1 (en) * 2017-10-06 2020-03-24 Laird Technologies, Inc. Material having edging
USD909322S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
CA192473S (en) * 2020-01-14 2022-04-25 Structure Shims Inc Square storm sewer extension form
USD920399S1 (en) * 2020-02-24 2021-05-25 Hk Co., Ltd. Laser processing machine
WO2023058751A1 (en) * 2021-10-08 2023-04-13 株式会社荏原製作所 Substrate suction member, elastic seal assembly, top ring, and substrate processing device
USD1003328S1 (en) * 2021-11-26 2023-10-31 Shenzhen Atomstack Technologies Co., Ltd Laser engraving machine
USD1051186S1 (en) * 2023-09-11 2024-11-12 Sprintray, Inc. 3D printer screen module

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD977677S1 (en) 2020-08-11 2023-02-07 Michael Ross Hodges Extrusion for a draft seal

Also Published As

Publication number Publication date
JP1755378S (en) 2023-10-16
USD1119829S1 (en) 2026-03-24

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