TWD218919S - 用於半導體處理腔室中的蓋環 - Google Patents

用於半導體處理腔室中的蓋環 Download PDF

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Publication number
TWD218919S
TWD218919S TW110302307F TW110302307F TWD218919S TW D218919 S TWD218919 S TW D218919S TW 110302307 F TW110302307 F TW 110302307F TW 110302307 F TW110302307 F TW 110302307F TW D218919 S TWD218919 S TW D218919S
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TW
Taiwan
Prior art keywords
processing chamber
semiconductor processing
cover ring
design
cover
Prior art date
Application number
TW110302307F
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English (en)
Inventor
阿比錫 喬德亨瑞
哈里沙 薩蒂亞納拉亞納
愛德恩Ｃ 隋瑞茲
四清 路
納塔拉吉 巴斯卡爾饒
Original Assignee
美商應用材料股份有限公司
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Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TWD218919S publication Critical patent/TWD218919S/zh

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Abstract

【物品用途】;本設計所請求係用於半導體處理腔室中的蓋環。;【設計說明】;無。

Description

用於半導體處理腔室中的蓋環
本設計所請求係用於半導體處理腔室中的蓋環。
TW110302307F 2020-11-18 2021-05-05 用於半導體處理腔室中的蓋環 TWD218919S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/758,812 USD1038049S1 (en) 2020-11-18 2020-11-18 Cover ring for use in semiconductor processing chamber
US29/758,812 2020-11-18

Publications (1)

Publication Number Publication Date
TWD218919S true TWD218919S (zh) 2022-05-21

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ID=80326147

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TW110302307F TWD218919S (zh) 2020-11-18 2021-05-05 用於半導體處理腔室中的蓋環
TW110306065F TWD222669S (zh) 2020-11-18 2021-05-05 用於半導體處理腔室中的蓋環

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TW110306065F TWD222669S (zh) 2020-11-18 2021-05-05 用於半導體處理腔室中的蓋環

Country Status (3)

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US (1) USD1038049S1 (zh)
JP (2) JP1707743S (zh)
TW (2) TWD218919S (zh)

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Also Published As

Publication number Publication date
TWD222669S (zh) 2022-12-21
USD1038049S1 (en) 2024-08-06
JP1707743S (ja) 2022-02-17
JP1707822S (ja) 2022-02-17

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