TWD184735S - 光半導體元件 - Google Patents
光半導體元件Info
- Publication number
- TWD184735S TWD184735S TW105305624D02F TW105305624D02F TWD184735S TW D184735 S TWD184735 S TW D184735S TW 105305624D02 F TW105305624D02 F TW 105305624D02F TW 105305624D02 F TW105305624D02 F TW 105305624D02F TW D184735 S TWD184735 S TW D184735S
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- design
- sealing resin
- resin portion
- case
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 239000011347 resin Substances 0.000 abstract 9
- 229920005989 resin Polymers 0.000 abstract 9
- 238000007789 sealing Methods 0.000 abstract 9
- 238000005516 engineering process Methods 0.000 abstract 1
Abstract
【物品用途】;本設計係關於一種光半導體元件。本設計之一透明密封樹脂部分完全覆蓋一板部分之一表面,且具有一大暴露區域。除自該暴露區域透過一入射窗部分直接進入之光之外之光被遮擋於該透明密封樹脂部分內。該光在該透明密封樹脂部分內反射且接著經由該入射窗部分進入至一光接收元件部分中。因此,本設計具有一寬光接收範圍,其不僅接收來自該透明密封樹脂部分之一頂部之光,且亦接收來自其側面之光,從而使光能夠由該光接收元件部分有效偵測。另外,本設計之一遮光密封樹脂部分密封該光接收元件部分。該遮光密封樹脂部分阻斷除經由該入射窗部分進入之入射光之外之入射光,且可因此抑制雜訊。此外,本設計之該板具有自該遮光密封樹脂部分突出之一凸緣部分。當將本設計安裝於一安裝板上時,將該遮光密封樹脂部分裝載於配置於該安裝板上之一孔部分中。本設計可藉由將該凸緣部分安裝於該板上而容易地安裝於該安裝板上。;【設計說明】;圖式所揭露之虛線部分,為本案不主張設計之部分。圖式所揭露之由點劃線組成之線僅指示使本案所主張之設計與本案不主張之其他部分分開之線。圖式所揭露之由點劃線組成之線部分,為本案不主張設計之部分。 本設計之該透明密封樹脂部分係透明的。 本設計係關於一種新穎且具創意之設計,其不僅可達成所需功能,且亦可提供先前技術中所未見且令觀察者耳目一新之一獨特外觀。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2016-6369F JP1563908S (zh) | 2016-03-24 | 2016-03-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD184735S true TWD184735S (zh) | 2017-08-01 |
Family
ID=57322087
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105305624D02F TWD184735S (zh) | 2016-03-24 | 2016-09-23 | 光半導體元件 |
Country Status (3)
Country | Link |
---|---|
US (1) | USD832802S1 (zh) |
JP (1) | JP1563908S (zh) |
TW (1) | TWD184735S (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD831593S1 (en) * | 2016-03-24 | 2018-10-23 | Hamamatsu Photonics K.K | Optical semiconductor element |
USD826184S1 (en) * | 2016-03-24 | 2018-08-21 | Hamamatsu Photonics K.K. | Optical semiconductor element |
JP1682283S (zh) | 2020-07-31 | 2021-03-29 |
Family Cites Families (48)
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US750578A (en) | 1904-01-26 | Self-leveling furniture | ||
USD511328S1 (en) * | 2004-06-23 | 2005-11-08 | Harvatek Corporation | Light-emitting diode |
USD512029S1 (en) * | 2004-06-28 | 2005-11-29 | Samsung Electro-Mechanics Co., Ltd. | Light-emitting diode |
USD738832S1 (en) * | 2006-04-04 | 2015-09-15 | Cree, Inc. | Light emitting diode (LED) package |
USD576115S1 (en) * | 2006-11-14 | 2008-09-02 | Lg Innotek Co., Ltd. | Light-emitting diode |
USD568834S1 (en) * | 2007-06-28 | 2008-05-13 | Citizen Electronics Co., Ltd. | Light-emitting diode for illuminating an object |
USD585850S1 (en) * | 2007-07-20 | 2009-02-03 | Lg Innotek Co., Ltd | Light-emitting diode (LED) |
USD574994S1 (en) * | 2008-04-11 | 2008-08-12 | Lsi Industries, Inc. | Lighting fixture |
USD626097S1 (en) * | 2009-10-16 | 2010-10-26 | Kabushiki Kaisha Toshiba | Light-emitting diode |
USD627314S1 (en) * | 2010-02-01 | 2010-11-16 | Foxsemicon Integrated Technology, Inc. | Light-emitting diode |
USD626922S1 (en) * | 2010-02-23 | 2010-11-09 | Citizen Electronics Co., Ltd. | Light-emitting diode |
USD647864S1 (en) * | 2010-12-22 | 2011-11-01 | Lite-On Technology Corp. | Light emitting diode carrier |
USD654032S1 (en) * | 2011-01-07 | 2012-02-14 | Silitek Electronic (Guangzhou) Co., Ltd. | Package of a light emitting diode |
WO2012116470A1 (en) * | 2011-03-02 | 2012-09-07 | Cree Huizhou Solid State Lighting Company Limited | Miniature surface mount device |
USD671674S1 (en) * | 2012-02-23 | 2012-11-27 | Wooree Lighting Co., Ltd. | LED lamp |
USD693317S1 (en) * | 2012-05-29 | 2013-11-12 | Kabushiki Kaisha Toshiba | Light-emitting diode |
USD725613S1 (en) * | 2012-06-15 | 2015-03-31 | Cree, Inc. | LED package |
USD693781S1 (en) * | 2012-08-22 | 2013-11-19 | Kabushiki Kaisha Toshiba | Light-emitting diode |
USD753612S1 (en) * | 2012-09-07 | 2016-04-12 | Cree, Inc. | Light emitter device |
KR102033928B1 (ko) * | 2012-09-13 | 2019-10-18 | 엘지이노텍 주식회사 | 발광 소자 및 조명 시스템 |
TWD155112S (zh) * | 2012-11-20 | 2013-08-01 | 隆達電子股份有限公司 | 發光二極體載具 |
USD742554S1 (en) * | 2013-01-27 | 2015-11-03 | Citizen Electronics Co., Ltd. | Lighting unit |
USD776334S1 (en) * | 2013-02-13 | 2017-01-10 | Svv Technology Innovations, Inc. | Edge-lit light guide |
TWD163532S (zh) | 2013-04-30 | 2014-10-11 | 億光電子工業股份有限公司 | 發光二極體之部分 |
USD735683S1 (en) * | 2013-05-03 | 2015-08-04 | Cree, Inc. | LED package |
TWD161267S (zh) * | 2013-07-31 | 2014-06-21 | 隆達電子股份有限公司 | 發光二極體封裝 |
USD758976S1 (en) * | 2013-08-08 | 2016-06-14 | Cree, Inc. | LED package |
TWD160510S (zh) * | 2013-08-30 | 2014-05-11 | 東貝光電科技股份有限公司 | 發光二極體支架 |
USD741821S1 (en) * | 2014-04-10 | 2015-10-27 | Kingbright Electronics Co., Ltd. | LED component |
TWD166329S (zh) * | 2014-06-06 | 2015-03-01 | 新世紀光電股份有限公司 | 發光二極體晶片之部分 |
USD730303S1 (en) * | 2014-06-10 | 2015-05-26 | High Power Opto, Inc. | LED chip |
USD737784S1 (en) * | 2014-07-30 | 2015-09-01 | Kingbright Electronics Co., Ltd. | LED component |
USD757664S1 (en) * | 2014-09-30 | 2016-05-31 | Lite-On Opto Technology (Changzhou) Co., Ltd. | Light emitting diode |
USD750578S1 (en) | 2014-09-30 | 2016-03-01 | Lite-On Opto Technology (Changzhou) Co., Ltd. | Light emitting diode |
USD763206S1 (en) * | 2015-01-29 | 2016-08-09 | Advanced Optoelectronic Technology, Inc. | Light emitting diode package |
USD761214S1 (en) * | 2015-04-02 | 2016-07-12 | Genesis Photonics Inc. | Light emitting diode package |
USD761215S1 (en) * | 2015-05-06 | 2016-07-12 | Xiamen Sanan Optoelectronics Technology Co., Ltd. | Package for light-emitting diode |
USD783547S1 (en) * | 2015-06-04 | 2017-04-11 | Cree, Inc. | LED package |
JP1553788S (zh) * | 2015-11-05 | 2016-07-11 | ||
USD773724S1 (en) * | 2015-11-18 | 2016-12-06 | Pilot, Inc. | Cordless LED lamp |
USD795492S1 (en) * | 2015-12-24 | 2017-08-22 | Semicon Light Co., Ltd. | Mold for packaging semiconductor light emitting device |
USD805070S1 (en) * | 2016-03-11 | 2017-12-12 | Roe Visual Co., Ltd. | LED display |
JP1563910S (zh) | 2016-03-24 | 2016-11-21 | ||
JP1563811S (zh) | 2016-03-24 | 2016-11-21 | ||
JP1566953S (zh) * | 2016-04-28 | 2017-01-16 | ||
JP1566954S (zh) * | 2016-04-28 | 2017-01-16 | ||
USD805399S1 (en) * | 2016-07-19 | 2017-12-19 | Under Armour, Inc. | Package |
USD794582S1 (en) * | 2016-07-29 | 2017-08-15 | Enraytek Optoelectronics Co., Ltd. | LED chip |
-
2016
- 2016-03-24 JP JPD2016-6369F patent/JP1563908S/ja active Active
- 2016-09-21 US US35/355,026 patent/USD832802S1/en active Active
- 2016-09-23 TW TW105305624D02F patent/TWD184735S/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP1563908S (zh) | 2016-11-21 |
USD832802S1 (en) | 2018-11-06 |
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