TWD184735S - 光半導體元件 - Google Patents

光半導體元件

Info

Publication number
TWD184735S
TWD184735S TW105305624D02F TW105305624D02F TWD184735S TW D184735 S TWD184735 S TW D184735S TW 105305624D02 F TW105305624D02 F TW 105305624D02F TW 105305624D02 F TW105305624D02 F TW 105305624D02F TW D184735 S TWD184735 S TW D184735S
Authority
TW
Taiwan
Prior art keywords
light
design
sealing resin
resin portion
case
Prior art date
Application number
TW105305624D02F
Other languages
English (en)
Chinese (zh)
Inventor
Fumitaka Nishio
Makio Kume
Original Assignee
Hamamatsu Photonics Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics Kk filed Critical Hamamatsu Photonics Kk
Publication of TWD184735S publication Critical patent/TWD184735S/zh

Links

TW105305624D02F 2016-03-24 2016-09-23 光半導體元件 TWD184735S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2016-6369F JP1563908S (cg-RX-API-DMAC7.html) 2016-03-24 2016-03-24

Publications (1)

Publication Number Publication Date
TWD184735S true TWD184735S (zh) 2017-08-01

Family

ID=57322087

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105305624D02F TWD184735S (zh) 2016-03-24 2016-09-23 光半導體元件

Country Status (3)

Country Link
US (1) USD832802S1 (cg-RX-API-DMAC7.html)
JP (1) JP1563908S (cg-RX-API-DMAC7.html)
TW (1) TWD184735S (cg-RX-API-DMAC7.html)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD831593S1 (en) * 2016-03-24 2018-10-23 Hamamatsu Photonics K.K Optical semiconductor element
USD826184S1 (en) * 2016-03-24 2018-08-21 Hamamatsu Photonics K.K. Optical semiconductor element
JP1682283S (cg-RX-API-DMAC7.html) 2020-07-31 2021-03-29
JP1701505S (cg-RX-API-DMAC7.html) 2021-01-20 2021-12-06
JP1701619S (cg-RX-API-DMAC7.html) * 2021-01-20 2021-12-06
USD1083850S1 (en) 2021-01-20 2025-07-15 Hamamatsu Photonics K.K. Light-emitting element module
JP1712335S (ja) 2021-01-20 2022-04-12 発光素子モジュール
USD1089808S1 (en) 2021-01-20 2025-08-19 Hamamatsu Photonics K.K. Light-emitting element module
USD1104971S1 (en) 2022-01-18 2025-12-09 Creeled, Inc. Light-emitting device package
JP1742543S (ja) * 2022-09-29 2023-04-21 レーザーダイオード
USD1102396S1 (en) * 2023-08-08 2025-11-18 Creeled, Inc. Light-emitting device package

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USD738832S1 (en) * 2006-04-04 2015-09-15 Cree, Inc. Light emitting diode (LED) package
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TWD155112S (zh) * 2012-11-20 2013-08-01 隆達電子股份有限公司 發光二極體載具
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TWD161267S (zh) * 2013-07-31 2014-06-21 隆達電子股份有限公司 發光二極體封裝
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TWD166329S (zh) * 2014-06-06 2015-03-01 新世紀光電股份有限公司 發光二極體晶片之部分
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USD737784S1 (en) * 2014-07-30 2015-09-01 Kingbright Electronics Co., Ltd. LED component
USD757664S1 (en) * 2014-09-30 2016-05-31 Lite-On Opto Technology (Changzhou) Co., Ltd. Light emitting diode
USD750578S1 (en) 2014-09-30 2016-03-01 Lite-On Opto Technology (Changzhou) Co., Ltd. Light emitting diode
USD763206S1 (en) * 2015-01-29 2016-08-09 Advanced Optoelectronic Technology, Inc. Light emitting diode package
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USD773724S1 (en) * 2015-11-18 2016-12-06 Pilot, Inc. Cordless LED lamp
USD795492S1 (en) * 2015-12-24 2017-08-22 Semicon Light Co., Ltd. Mold for packaging semiconductor light emitting device
USD805070S1 (en) * 2016-03-11 2017-12-12 Roe Visual Co., Ltd. LED display
JP1563811S (cg-RX-API-DMAC7.html) 2016-03-24 2016-11-21
JP1563910S (cg-RX-API-DMAC7.html) 2016-03-24 2016-11-21
JP1566954S (cg-RX-API-DMAC7.html) * 2016-04-28 2017-01-16
JP1566953S (cg-RX-API-DMAC7.html) * 2016-04-28 2017-01-16
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Also Published As

Publication number Publication date
JP1563908S (cg-RX-API-DMAC7.html) 2016-11-21
USD832802S1 (en) 2018-11-06

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