TW595291B - Reduced micro-solder balling, low solids, low residue, no-clean soldering flux - Google Patents

Abstract

A soldering flux includes a solvent, an activator in the solvent, and cationic and nonionic surfactants. The soldering flux can be applied to a substrate, such as a printed circuit board before solder is applied.

Description

595291 A7 __ B7 V. Description of the invention (1) Scope of the invention (please read the precautions on the back before filling out this page) The present invention relates to a flux composition for soldering used in electronic assembly (such as printed circuit boards). BACKGROUND OF THE INVENTION The manufacture of printed circuit boards (PCBs) (also known as printed wiring boards (pwBs)) is generally divided into two processing categories, namely, manufacturing and assembly. Near the end of the PCB process, that is, after plating and etching, most of the PCB is covered with green paint. Green paint is used to protect the shielded area of the PCB from solder adhesion. So ‘the PCB areas (such as pads and vias) to be soldered later are not covered by the resist. In the first step of the assembly process, the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed through-holes and surface-mounted components (such as integrated circuits, connectors, double-row packages, capacitors, and resistors) on the PCB Positioning. For example, parts with pins can be glued to the PCB by passing their pins through through holes in the board. Surface mount parts can be attached to the bottom side of the board with an adhesive (ie, the surface to be welded). The parts are then ready to be soldered to the PCB to ensure a reliable electrical connection between the part and the PCB electrical circuit. Part pins and loads or pads can be soldered by wave soldering. The wave welding method includes the steps of fluxing, preheating and welding. In the fluxing step, the flux is used to modulate the surface to be soldered. Such modulation is usually necessary because PCBs and parts may be contaminated by storage in a non-clean room environment before soldering. In addition, oxides may form on the pins, loads, and / or pads. Except for reacting with pollutants and oxides or removing it, the paper size applies Chinese National Standard (CNS) A4 specification (2) 0 × 297 mm) -4- 595291 A7 ___B7_ V. Flux description (2) It also has other functions, such as protecting the surface from re-oxidation and reducing the interfacial surface tension between the solder and the plate to improve tin adhesion. (Please read the precautions on the back before filling this page) Spray method, foam method or wave method are often used to apply flux to the surface of PCBs and parts to be soldered. The preheating step is performed after the fluxing process to evaporate the solvent carrier (such as alcohol or water) in the flux and begin to heat the surfaces to be joined. The wave soldering process is performed after the preheating step, and the PCB in which the parts are adhered is passed through a wave of molten solder. The solder wave is pumped through the nozzle; the wave then contacts the surface to be joined and deposits the solder thereon. The deposited solder then combines the pins and loads of the part with the contacts on the PCB and makes an electrical connection. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Many existing low-solid, no-clean fluxes can cause excessive solder balls on the surface of the PCB. These fluxes also cause tin bridges because their surface tension is too high. In addition, because of its weak activity, the flux cannot completely remove contamination and oxides from the surfaces to be joined. Solder balls are unwanted solder balls generated randomly or non-randomly on the green paint of the circuit board and / or between the parts pins; the solder balls may bridge between two wires and cause a short circuit. Tin The unwanted solder joints of the bridge system may cause a short circuit between two wires or pins that are not intended to be bonded. Solder bridges and / or balls may cause electrical failure of the board. When there are too many solder balls and bridges, touch-up operations to remove them also require considerable costs. Even tiny solder balls (commonly known as micro solder balls, because they can only be seen under a magnifying glass (for example, a 10x magnification)) may cause short circuits in closely-spaced lines and pads, as well as parts pins and loads. Another problem with the existing flux is that it may leave visible residues on the surface of the PCB. Except for the indecent appearance, the Chinese National Standard (CNS) A4 specification (210X29? Mm) is applicable. -5- 595291 A7 ________B7_ 5. Explanation of the invention (3) In addition, when the electrical test of the assembly board is carried out, its misalignment may cause misjudgment. (Please read the precautions on the back before filling this page) Therefore, it can effectively modulate the surfaces to be joined and can reduce the PCB surface, part pins / loads and molten tin without increasing the amount of residue that can be seen visually. There is a need for a flux composition that reduces the number of solder balls and solder bridges between surface tensions. Introduction The one disclosed in this article is a flux that reduces micro-ball formation, low residue, low solids, and no-clean ability. Fluxes include solvents, activators in solvents, cationic surfactants, and non-ionic surfactants. These fluxes are particularly suitable for PCB coating before solder application. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. In one embodiment, the solvent is an alcohol, such as isopropanol. The cationic surfactant may be a fluoroalkyl quaternary ammonium surfactant. The non-ionic surfactant may be a nonylphenoxy polyethoxyethanol surfactant. The activator may be a combination of a dicarboxylic acid and a non-ionic brominated compound. The printed circuit board coated with the flux described herein includes a plate having conductive paths and conductive contacts (usually made of metal) printed on and electrically coupled. Flux is applied to the conductive contacts; solder is then applied to the flux and the board. The solder provides electrical coupling between the contacts and the parts fixed to the PCB. The flux described in this article offers a number of advantages. Flux can effectively remove the metal oxide on the surface of the PCB to be soldered to promote solderability. Flux can also substantially reduce the interfacial surface tension between the PCB surface and the molten tin alloy, so it can promote excessive solder leakage from the board surface and reduce the generation of solder balls and tin bridges. In addition, the flux can also reduce the size of this paper during the wave soldering process. The Chinese national standard (CNS) A4 specification (210 X 297 mm) is applicable. -6-595291 A7 ______B7 5. The description of the invention (4) can be visually generated. And the amount of flux residue. (Please read the precautions on the back before filling this page) Detailed description of the flux composition is one or more cationic surfactants, one or more non-ionic surfactants and activators dissolved in volatile solvents, such as Isopropyl alcohol, ethanol, deionized water, or a mixture thereof. For these components in the flux composition, the appropriate concentration range (weight percentage) is as follows: 50-98% solvent, 0.2-10% activator, 0.01-1.0% cationic surfactant, and 0.05- 10% non-ionic surfactant. In a specific embodiment, the concentration range (weight percentage) of each of the above components is as follows: 75_98% solvent, 0.2-5.0% activator, 0.05-0.5% cationic interfacial activity agent, and 0.1 0-2.0% non-ionic Surfactant. One or more high boiling point additives may also be incorporated into the flux composition, for example at a concentration of 0.2 to 25% by weight. Cationic fluoroalkyl quaternary ammonium surfactants, such as FLUORAD FC-135 surfactant (manufactured by St. Paul, 3M Co., Minnesota), and SURFLON S-121 surfactant ( Seim i Chemical Co., manufactured by Japan) or Neos FTERGENT 300 surfactant (manufactured by Neos, Japan) is used to significantly reduce the flux residue and the surface tension of the board and the molten tin alloy. Therefore, the volume of tin balls generated on the board surface in a random and non-random manner is also reduced. It has been found that fluoroalkylammonium or amine surfactants including aromatic macrofunctional groups (such as Neos FTERGENT 300 surfactant, which is a cationic fluoroalkyl quaternary ammonium compound having an aromatic macrofunctional group) are particularly effective. The addition of non-ionic surfactants is used to further reduce the paper size of the composition. The Chinese National Standard (CNS) A4 specification (2) 0X: 297 mm is applied. -7- 595291 A7 B7 V. Description of the invention (5) (Please read the notes on the back before filling this page) Surface tension and improve the high temperature survivability of the flux to further reduce the formation of solder balls and bridges. Non-ionic surfactants can resist the decomposition of soldering furnaces at temperatures around 500 ° F (260 ° C). Suitable non-ionic surfactants include, but are not limited to, nonylphenoxy polyethoxyethanol, octylphenoxy polyethoxyethanol, alcohol ethoxide, ethoxylated / propoxylated (EO-PO) copolymer , Acetodiol, acetodiol ethoxylate, polyfluoroalkylene oxide, polyfluoroalkylamine oxide, and polyfluoroalkyl carboxylic acid esters (for example, 3_141, 3-145 manufactured by Seimi Chemical Co., Japan , 3-111 & 3-113). Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Although the cationic or nonionic surfactant itself can reduce the surface tension of the molten tin and the metal surface to be joined, the combination of the cationic and nonionic surfactant can significantly reduce it. The surface tension of the molten tin and the surface energy of the metal surface to be joined, the green paint on the PWB and the unshielded laminated board avoid the generation of solder balls and bridges. The use of non-ionic surfactants Although they can provide the desired high-temperature survivability, even if used at higher concentrations, non-ionic surfactants may still leave a significant amount of solder balls on the board surface. In contrast, the combined concentration of nonionic surfactants and cationic surfactants can produce a finish surface that is substantially free of tin balls and tin bridges-with the same concentration of nonionic surfactant or cationic surfactant alone. In comparison, the effect is particularly significant. The combination of cationic surfactants and nonionic surfactants establishes a synergistic effect by reducing the surface tension of the molten tin and the surface energy of the metal surfaces to be joined, the green paint on the PWB, and the surface energy of the unshielded laminate. As a result, the amount of micro solder balls, bridges, and flux residues can be reduced to extremely low levels. The flux composition can also contain a variety of high boiling point additives, such as alcoholic paper is also suitable for use. National National Standard (CNS) A4 specification (210X 297 mm) -8-595291 A7 B7 V. Description of the invention (6) (please Read the precautions on the back before filling out this page), glycol ethers, and esters, so that the flux can withstand the heat of the soldering process in special high-temperature soldering applications. There can be many types of alcohols; for example, both aromatic and / or long-chain aliphatic alcohols and rosin alcohols can be used. Specific examples include benzyl alcohol, tetradecanol, and / or h y d 1 · 〇 a b e i t y 1 a 1 c 0 h ο 1. In addition, rosin esters, such as methyl or glycerol esters of rosin, or esters of pentaerythritol, esters of modified rosins or resins, such as methyl esters of hydrogenated rosin, and / or other types of esters, such as methyl esters of carboxylic acids Can also be included in flux. Various glycol ether solvents, such as dipropylene glycol monomethyl ether or ethylene glycol / propylene glycol phenyl ether, can also be included in the flux. Rosin, resins and tinctures that can be incorporated into the flux include gum rosin, tall oil rosin, wood rosin, chemically modified resins and rosin (such as hydrogenated rosin), polymerized rosin, and rosin's fumaric / maleic acid Adducts, phenolic resins and other natural and synthetic resins, rosin and osmium. These rosin, resin and osmium can be used alone or in combination to improve the electrical reliability of the soldered PWB. The flux composition printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs also includes an active agent system, which may contain one or more organic carboxylic acids, such as succinic acid, adipic acid, itaconic acid, malonic acid, oxalic acid, or glutaric acid. Diacid. Alternatively, in addition to the foregoing, the flux may include non-ionic, covalently bonded organic halide activators, especially bromide activators, such as trans-2,3-dibromo-2-butene-1 , 4-diol (DBD), styrenated dibromo or dibromosuccinic acid. The bromide activator can be a mono-, di-, or tri- bromocarboxylic acid. The activator can chemically remove the oxide on the surface to be welded. Flux 尙 may contain a variety of boosting properties components that are present in small amounts that do not substantially affect the basic flux properties of the flux. These ingredients include, but are not limited to, corrosion inhibitors, dyes, foaming agents, and / or defoaming. The paper size is applicable to Chinese National Standard (CNS) A4 specifications (210X29? Mm) -9- 595291 ΑΊ _ _Β7__ V. Description of the invention (7) agent, bactericide and stabilizer. Those skilled in the art of flux formulation are well aware of the use of these enhanced properties. (Please read the precautions on the back before filling this page) After the pin or load of the part is placed on the PCB and positioned (such as passing the pin of the part through the plated or unplated through hole of the PCB), the flux can be Apply to pins and contacts by spraying, foaming, waving or other conventional methods. If necessary, an air knife can be used to remove excess flux. After the flux is applied, the substrate is heated to volatilize the solvent; the substrate is usually wave soldered by a molten solder wave. The wave soldering process deposits solder on the pins and contacts and the solder is used to bond and electrically connect the parts to the substrate. The flux composition of the present invention can substantially ensure that the surface tension of the substrate and the molten tin is reduced during wave soldering so that the solder does not generate unwanted solder balls and / or bridges on the green paint of the substrate and between the pins of the parts. In addition, the cleaning of the residual flux on the PCB can be omitted, so the PCB can be used in electronic applications and only a small amount of flux residue remains on the PCB. Printed with additional flux components and characteristics by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs and additional methods related to the fluxes and methods described in this article are provided in L. Turbini, "Fluxes and Cleaning", Printed Circuits Handbook, 4th Ed., Chapter 31 (1996) 0 Examples of fluxes are further illustrated in the following example composition. However, it should be understood here that although these descriptions are specific descriptions of specific embodiments of the present invention, the main purpose of the examples is to illustrate, and in a broader aspect, the present invention is not The paper size of the example is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) '— ~ -10- 595291

7 B Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy V. Invention Description (8) Restrictions. Example 1: Ingredients by weight% Functional isopropyl alcohol 93.00 Solvent succinic acid 1.40 Activator Adipic acid 0.20 Activator TRITON N-101 0.20 Non-ionic interface nonylphenoxy polyethoxyethanol activator ABITOL E Hydroabeityl alcohol 0.30 High temperature survivor FLUORAD FC-135 fluoro-based interfacial activity 0.40 cationic interfacial agent active agent dipropylene glycol monomethyl ether 4.50 solvent (please read the precautions on the back before filling this page) This paper size applies to China National Standard (CMS) A4 specification (210X 297 (Mm) -11-595291 B7 V. Description of the invention (9) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economics Example 2: Ingredients by weight% Functional isopropyl alcohol 93.00 Solvent adipic acid > Acid 0.20 Activator Succinic acid 1.40 Activator ABITOL E Hydroabeity 1 0.30 high temperature survivor alcohol TERGITOL NP-15 0.20 non-ionic interfacial active nonylphenoxy polyethoxyethanol based FLUORAD FC-135 fluoro based interfacial activity 0.40 cationic surfactant active agent dipropylene glycol monomethyl ether 4.50 Solvents (please read the precautions on the back before filling this page) This paper size applies National Standards (CNS) A4 size (210X 297 mm) -12-595291

7 7 AB V. Description of the invention (10) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Example 3: Ingredient weight% Function isopropyl alcohol 93.00 Solvent adipic acid 0.20 Activator Succinic acid 1.40 Activator ABITOL E Hydroabeityl 0.30 High temperature survivor alcohol TERGITOL NP-15 0.10 Nonionic interfacial active nonylphenoxy polyethoxyethanol based agent TRITON N-101 0.10 Nonionic interfacial active nonylphenoxy polyethoxyethanol based agent FLUORAD FC-135 fluorine based interface 0.40 cation Surfactant dipropylene glycol monomethyl ether 4.50 solvent (please read the precautions on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) -13- 595291

7 7 AB V. Description of the invention (11) Example printed by the staff of the Intellectual Property Bureau of the Ministry of Economic Affairs, Co-operative Society 4: Ingredient weight% Function isopropyl alcohol 90.72 Solvent succinic acid 0.60 Activator Malonic acid 0.40 Activator Glutaric acid 0.20 Activator Dibromobutenediol 0.50 Activator propylene glycol phenyl ether 5.00 Solvent benzyl alcohol 2.00 Solvent TRITON N-101 0.30 Non-ionic interface Nonylphenoxy polyethoxyethanol activator benzotriazole 0.08 Corrosion inhibitor FTERGENT 300 Fluoro interface Active 0.20 Cationic Surfactant Active Agent (Please read the precautions on the back before filling this page) This paper size applies to Chinese National Standard (CNS) A4 specifications (2) 0 parent 297 mm) -14- 595291 V. Description of the invention ( 12)

AB Example 5: Ingredients by weight% Functional isopropyl alcohol 93.00 Solvent succinic acid 1.40 Activator adipic acid 0.20 Activator TRITON N-101 0.20 Non-ionic interface nonylphenoxy polyethoxyethanol activator ABALYN Rosin methyl ester 0.30 High temperature Survivor FLUORAD FC-135 Fluoro Interfacial Activity 0.40 Cationic Interfacial Active Agent Dipropylene Glycol Monomethyl Ether 4.50 Solvent Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs (Please read the precautions on the back before filling this page)

This paper size applies to China National Standard (CNS) A4 specification (210X297 mm) -15- 595291

A

7 B V. Description of the invention (13) Example printed by the Consumer Cooperative of the Intellectual Property Office of the Ministry of Economic Affairs 6: Ingredient weight% Functional isopropyl alcohol 93.00 Solvent succinic acid 1.40 Activator adipic acid 0.20 Activator TRITON N-101 0.10 Non-ionic Interfacial nonylphenoxypolyethoxyethanol activator TERGITOL NP-15 0.10 Nonionic surfactant HERCOLYN D Hydrogenated Rosin A 0.30 High temperature survivor ester FLUORAD FC-135 Fluoro interface activity 0.40 Cationic interface agent active agent dipropylene glycol Monomethyl ether 4.50 solvent (please read the precautions on the back before filling this page). Clothes and paper size are applicable to China National Standard (CNS) A4 specification (210X297 mm) -16- 595291

7 7 AB Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (14) Example 7: Ingredients by weight% Functional isopropyl alcohol 93.00 Solvent succinic acid 1.40 Activator adipic acid 0.20 Activator TRITON N-101 0.10 Non-ionic Interfacial nonylphenoxy polyethoxyethanol activator TERGITOL NP-15 0.10 Nonionic interfacial nonylphenoxy polyethoxyethanol activator ABALYN Rosin methyl ester 0.30 High temperature survivor FLUORAD FC-135 Fluoro interfacial activity 0.40 Cation Surfactant Active Agent Tetrahydrofurfuryl Alcohol 4.50 Solvent (Please read the notes on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 (210X 297 mm) -17- 595291

7 7 AB Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (15) Example 8: Ingredient weight% Function isopropyl alcohol 92.50 Solvent succinic acid 1.40 Activator adipic acid 0.20 Activator TRITON N-101 0.10 Non-ionic Interfacial nonylphenoxy polyethoxyethanol activator TERGITOL NP-15 0.10 Nonionic interfacial nonylphenoxy polyethoxyethanol activator ABALYN Rosin methyl ester 0.30 High temperature survivor tetradecanol 0.50 High boiling point solvent SURFLON S- 121 fluorine-based interfacial activity 0.40 cationic interfacial active agent dipropylene glycol monomethyl ether 4.50 solvent (please read the precautions on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) -18 -595291

7 B V. Description of the invention (16) Example printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 9: Ingredients by weight% Functional isopropyl alcohol 90.825 Solvent succinic acid 0.600 Activator malonate 0.400 Activator glutarate 0.200 Activator dibromo Butenediol 0.500 Activator propylene glycol phenyl ether 5.000 Solvent TRITON N-101 0.300 Non-ionic interface nonylphenoxy polyethoxyethanol activator tetradecanol 2.000 High boiling point solvent benzotriazole 0.075 Corrosion inhibitor FTERGENT 300 fluorine Interfacial activity 0.100 Cationic surfactant (Please read the precautions on the back before filling out this page) This paper size applies to China National Standard (CNS) A4 specification (210 × 297 mm) -19- 595291 Β7 Employees of Intellectual Property Bureau, Ministry of Economic Affairs Printed by a consumer cooperative V. Description of the invention (17) Example 10: Ingredients by weight% Functional isopropanol 97.65 Solvent succinic acid 1.40 Activator DBD 0.40 Activator TRITON N-101 0.20 Non-ionic interface nonylphenoxy polyethoxyethanol activity ABITOL E Hydroabeityl alcohol 0.30 high temperature survivor FTERGENT 300 fluorine-based interfacial activity 0. 05 Cationic Interface Agent Active Agent Example 11: Ingredient Weight% Functional Ethanol 97.55 Solvent Succinic Acid 1.80 Activator Trans-2,3-Dibromo-2-butene-1,4-Di0.40 Activator Alcohol (DBD) TERGITOL NP -15 0.20 Non-ionic interface nonylphenoxy polyethoxyethanol active agent FTERGENT 300 fluorine-based interfacial activity 0.05 cationic interfacial agent active agent (please read the precautions on the back before filling this page) This paper size applies to Chinese national standards ( CNS) A4 specification (2) 0 × 29 < 7 mm) -20- 595291

A B7 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (18) Example 1 2: Compositional lightning content% Functional deionized water 97.55 Solvent succinic acid 1.80 Activator DBD 0.40 Activator TRITON N-101 0.20 Non-ionic interface Nonylphenoxy polyethoxyethanol activator FTERGENT 300 Fluoro interfacial activity 0.05 Cationic interfacial agent activator example 13: Ingredient weight% function isopropanol 50.00 solvent ethanol 47.50 solvent succinic acid 1.80 activator dibromosuccinic acid 0.40 activation Agent TRITON N-101 0.20 non-ionic interface nonylphenoxy polyethoxyethanol active agent FTERGENT 300 fluorine-based interface activity 0.05 cationic interface agent active agent hydroxybenzotriazole 0.05 uranium decay inhibitor (please read the precautions on the back first) (Fill in this page again) This paper size applies Chinese National Standard (CMS) A4 specification (21GX297 mm). Order -21-595291

Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (19) Example 14: Ingredient weight% Function isopropyl alcohol 38.77 Solvent ethanol 38.78 Solvent deionized water 20.00 Solvent succinic acid 1.80 Activator DBD. 0.40 Activator TRITON N-101 0.20 Non-ionic interface nonylphenoxy polyethoxyethanol active agent FTERGENT 300 fluorine-based interfacial activity 0.05 cationic interface agent active agent Example 15: composition lightning percentage function isopropanol 97.55 solvent succinic acid 1.40 activator Diacid 0.40 Activator DBD 0.40 Activator TRITON X-100 Octylphenol Ethoxylation 0.20 Non-ionic Surfactant FTERGENT 300 Fluoro Interfacial Activity 0.05 Cationic Surfactant (Please read the notes on the back before filling this page) This paper size applies to Chinese National Standard (CNS) A4 (210X297 mm) -22- 595291

AB V. Description of the invention (20) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Example 16: Ingredient weight% Functional deionized water 97.35 Solvent succinic acid 1.80 Activator DBD 0.40 Activator TRITON N-101 0.20 Nonionic interface nonyl Phenoxy polyethoxy ethanol active agent SURFLON S-121 polyfluoroalkyl tri 0.20 cationic interfacial methylammonium salt active agent FTERGENT 300 fluorine based interfacial activity 0.05 cationic interfacial agent active agent Example 17: ingredient weight% function deionized water 97.35 Solvent succinic acid 1.40 activator adipic acid 0.40 activator DBD 0.40 activator TRITON N-101 0.20 non-ionic interface nonylphenoxy polyethoxyethanol activator SURFLON S-141 polyfluoroalkyloxy 0.20 non-ionic fluorination Amine Surfactant FTERGENT 300 Fluoro Interfacial Activity 0.05 Cationic Surfactant This paper size is applicable to Chinese National Standard (CNS) A4 specification (2) 0X297 mm (Please read the precautions on the back before filling this page) -23 -595291 A7 B7 V. Description of Invention (21) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Example 18 8% by weight of ingredients isopropyl alcohol 97.25 solvent succinic acid 1.40 glutaric acid 0.20 activator adipic acid 0.20 activator DBD 0.40 activator ABITOL E Hydroabeityl alcohol 0.30 high temperature survivor TRITON N-101 nonylphenoxy Polyethoxylated alcohol 0.10 Nonionic ethoxylated surfactant TERGITOL NP-15 Nonylphenoxy polyethoxylated ethanol 0.10 Nonionic ethoxylated surfactant FTERGENT 300 Fluorosurfactant 0.05 Cationic fluorosurfactant (please Please read the notes on the back before filling in this page) This paper size is applicable to Chinese National Standard (CNS) A4 (210 乂 29 < 7mm) -24- 595291

AB V. Description of the invention (22) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Example 19: Ingredient weight% Function isopropanol 97.25 Solvent succinic acid 1.80 Activator DBD 0.40 Activator HERCOLYN D Hydrogenated rosin Formazan purpose 0.30 High temperature Survivor TRITON N-101 0.20 Non-ionic interface nonylphenoxy polyethoxyethanol active agent FTERGENT 300 fluorosurfactant 0.05 cationic surfactant Example 20: ingredient weight% function isopropanol 97.25 solvent succinic acid 1.80 activator Dibromobutene diol 0.40 Activator ABALYN Rosin ester 0.30 High temperature survivor TRITON N-101 0.20 Non-ionic interface nonylphenoxy polyethoxyethanol active agent FTERGENT 300 fluorine-based interface activity 0.05 cationic interface agent active agent ( Please read the notes on the back before filling out this page) This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) -25- 595291

7 7 AB V. Description of the invention (23) Example 21: _ Ingredient weight% Function isopropanol 97.05 Solvent succinic acid 1.80 Activator Dibromobutenediol 0.40 Activator POLYPALE resin (hydrogenated gum rosin :) 0.50 Film forming agent, Reliability improving agent TRITON N-101 0.20 Non-ionic interfacial active nonylphenoxy polyethoxyethanol based agent FTERGENT 300 Fluoro-based interfacial agent 0.05 Cationic interfacial agent (please read the precautions on the back before filling this page) Economy Printed by the Ministry of Intellectual Property Bureau's Consumer Cooperatives The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X29? Mm) -26- 595291 A7 B7 V. Description of the invention (24) Printed by the Intellectual Property Bureau's Employees' Cooperatives Example 22:% by weight of ingredients isopropyl alcohol 96.55 solvent succinic acid 1.80 activator DBD 0.40 activator gum rosin 1.00 film-forming agent, reliability improver TRITON N-101 or NP-15 0.20 nonionic ethoxylated nonylphenoxy Polyethoxyethanol Surfactant FTERGENT 300 Fluoro Interfacial Activity 0.05 Cationic Surfactant (Please read first Note on the back, please fill out this page again) This paper size is applicable to Chinese National Standard (CNS) A4 specification (210X297 mm) -27- 595291 A7 B7 V. Description of invention (25) Example printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 23: Lightning content% Function isopropanol 97.05 Solvent succinic acid 1.80 Activator DBD 0.40 Activator DYMEREX Dimerization rosin 0.50 Film-forming agent, Reliability improver TRITON N-101 Nonylphenoxy polyethoxyethanol 0- 20 Non-ionic ethoxylated surfactant FTERGENT 300 fluorine-based surfactant 0.05 cationic surfactant (please read the precautions on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 (210X297 mm) • 28- 595291 A7 B7 V. Explanation of the invention (26) Example printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Example 24: Ingredient weight% Function isopropanol 97.05 Solvent succinic acid 1.80 Activator DBD 0.40 Activator UNI-REZ 8200 Maleic acid modified 0.50 film-forming agent, rosin reliability improver TRITON N-101 0.20 nonionic ethoxylated nonylbenzene Polyethoxylated ethanol surfactant FTERGENT 300 Fluorine-based interfacial activity 0.05 Cationic surfactant (please read the notes on the back before filling this page) This paper size is applicable to Chinese National Standard (CNS) A4 (210X 297) (Ii) -29- 595291 ΑΊ Β7 V. Description of the invention (27) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs: ng # ^ Expansion light sffiE_fr ^ wJJ— 3 Contraction i Manufacturer Union Carbide Corp. (Danbury, Connecticut, USA) Union Carbide Corp. (Danbury, Connecticut, USA) 3M Co. (St. Paul, Minnesota, USA) Neos Co., Ltd. (Kobe, Hyogo, Japan) Seimi Chemical Co. (Chigasaki, Kanagawa, Japan) ) Seimi Chemical Co. (Chigasaki, Kanagawa, Japan) Hercules, Inc. (Wilmington, Delaware, USA) Hercules, Inc. (Wilmington, Delaware, USA) Hercules, Inc. (Wilmington, Delaware, USA) Hercules, Inc. ( Wilmington, Delaware, USA) Hercules, Inc. (Wilmington, Delaware, USA) Arizona Chemical (Jacksonville, Florida, USA) Composition of nonylphenol ethoxylate, 100% active octylphenol ethoxide, 100% active Fluoroalkyl quaternary ammonium cationic surfactants Fluoroalkyl quaternary ammonium cationic surfactants Polyfluoroalkyltrimethylammonium salt, 30% active polyfluoroalkylamine oxide, 30% active Hydrobebeityl alcohol Rosin methyl ester Hydrogenated rosin Methyl Hydrogenated Gum Rosin Rosin Derived Dimer Acid Rosin Trademark Modified by Fumaric Acid TRITON N-101 & TERGITOL NP-15 TRITON X-100 m cn r—t 1 〇 pH Q < 〇P FTERGENT 300 SURFLON S-121 SURFLON S-141 ABITOL E ABALYN HERCOLYN D POLYPALE Shuyuezhi DYMEREX UNI-REZ 8200 (Please read the precautions on the back before filling out this page) Clothing. The size of the paper used in this edition applies to the Chinese National Standard (CNS) A4 specifications (21〇 × 29 < 7 mm) -30- 595291 A7 B7 V. Description of the invention (28) Although the present invention has been given specific examples and illustrations with reference to its embodiments, those skilled in the art should understand without departing from the present invention Under the premise of the scope, the needle line can still be changed. More details and style pairs (please read the precautions on the back before filling this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper size applies to China National Standard (CNS) A4 (210X 297mm) -31-

Claims (1)

595291 A8 Βδ C8 D8 Patent application scope 1 1. A flux, comprising: a solvent; an activator in a solvent; a cationic surfactant in a solvent; and a nonionic surfactant in a solvent. Among them, the flux 尙 long-bond aliphatic alcohol, rosin (please read the precautions on the back before filling out this page) 2. If the flux of the patent application item 1 contains a solvent selected from the group consisting of glycol ether solvent, aromatic Local boiling point additives for the methyl esters, rosin esters, and modified rosin and resin esters of melanoic acid. 3. If the flux of the first scope of the patent application, the solvent includes alcohols. 4 · If the flux of the first scope of the patent application, the solvent includes water. 5. If the flux of the first scope of patent applications, A flux, wherein the activator includes a carboxylic acid. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 6. If the flux of the scope of patent application is No. 5, the carboxylic acid activator includes at least one selected from the group consisting of succinic acid, adipic acid, glutaric acid, itaconic acid, Activator of oxalic acid and malonic acid. 7. The flux according to the scope of patent application, wherein the activator comprises a non-ionic 'covalently bonded bromide. 8. The soldering flux according to item 7 of the patent application scope, wherein the non-ionic, covalently bonded bromide includes at least one selected from the group consisting of trans-2,3-dibromo-butene-1,4-di Alcohols; dibromostyrene; and compounds of mono-, di-, and tri-brominated carboxylic acids. The size of this paper applies to the Chinese National Standard (CNS) A4 (210X297 mm) -32- 595291 A8 B8 C8 D8. 6. Scope of patent application 2 ( (Please read the “Notes on the back side before filling this page”) 9. For the flux of item 1 of the patent application scope, the cationic surfactant includes one or more selected from the group consisting of a fluoroalkyl quaternary ammonium compound and a cationic fluorine Surfactant for alkylamine compounds. 10. The flux according to item 1 of the patent application, wherein the non-ionic surfactant includes one or more selected from the group consisting of an ethoxylated surfactant, an ethoxylated / propoxylated copolymer surfactant, and a fluorine-based interface. Surfactant. 11. The flux according to item 1 of the patent application scope, wherein the flux 尙 contains one or more selected from the group consisting of natural rosin, resin and wax; chemically modified rosin, resin and wax; synthetic resin and 鱲; And its mixture of rosin, resin or wax. 12. A flux, characterized in that the flux comprises a solvent; an activator in the solvent; and a cationic surfactant in the solvent, selected from the group consisting of a cationic fluoroalkyl quaternary ammonium compound and a cationic fluoroalkyl amine compound. Surfactant. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 13. For example, in the application for the flux in item 12 of the patent scope, in which the cationic boundary. Surfactants include aromatic milling functional groups. 14. A method for modulating the surface of a sheet to apply solder, characterized in that the method includes the steps of applying a flux to the surface of the sheet, the flux including a solvent, an activator, a cationic surfactant, and a non-ionic surfactant. 15. The method according to item 14 of the application, wherein the flux ， includes one or more methyl esters selected from the group consisting of glycol ether solvents, aromatic alcohols, long-chain aliphatic alcohols, rosin alcohols, carboxylic acids, Rosin esters, and modified rosin and resins The i-scale standard is applicable to Chinese National Standard (CNS) A4 specifications (210X297 mm) ~ '-33- 595291 A8 B8 C8 D8 High boiling point additive. 16. For example, the method of item 14 in the patent scope, wherein the method 尙 includes the step of applying the plate to welding by wave welding after the flux is applied to the plate. 17. The method of item 4 in the scope of patent application Among them, the cationic surfactant is selected from the group consisting of a cationic fluoroalkyl quaternary ammonium compound and a cationic fluorinated amine compound. 18. The method of claim 17 in which the cationic surfactant comprises an aromatic master functional group. 19. The method of claim 14 in which the non-ionic surfactant includes one or more interfaces selected from the group consisting of an ethoxylated surfactant, an ethoxylated / propoxylated surfactant, and a fluorine-based surfactant Active agent. 20. A printed circuit board, characterized in that the circuit board comprises an electrically insulating plate; one or more conductive paths on the plate; one or more conductive contacts electrically coupled to the conductive path; and coated A flux covering the conductive contacts. The flux includes a cationic surfactant and a non-ionic surfactant. (Please read the notes on the back before filling out this page)-Order Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper size applies to Chinese National Standard (CNS) A4 (210 X 297 mm) -34- April 12, 1990 90108812 Patent Application No. 90108812 Revised Chinese Specification (including the scope of patent application). 丨 Men's Mou December 12 _Amendment A4 C4 595291 (The above palms are filled by this Bureau) || Patents Manual Invention New Name Chinese Reduced Micro-Solder Balling, Low Solids, Low Residue, No Clean Power Flux Reduced micro-solder balling, low solids, low residue, no-clean soldering flux Arora Arora, Sanyogita Mo Bin Mo, Bin Inventor, residence, residence (1) 167 Jauncey Avenue, North Arlington, NJ 07031, IKS · A.0 New Jersey, USA 11 Southerland Drive, East Brunswick, NJ 08816, U ^ S * A Binding Name (Name) Nationality (1) Fry's Metals , Inc · d / b / a Alpha Metals, Inc · Line applicant's residence, residence (office) Name of representative (1) United States 四 No. 440, Road 60, Jersey City, New Jersey, USA 6 00 Route 440, Jersey City, NJ 07304, U.S.A. ⑴ 凯斯 · 纳尔 Nal, Keith F · The paper size is applicable to China National Standards (CNS) M specifications (210X297 mm)