狄、發明說明： 【發明所屬之技術領域】 本發明是有關於一用於印刷電路板之金屬箔粗糙化 方法’特別是一種以電鍍方式使金屬箔粗糙化以加強金屬 $與印刷電路板之一絕緣層之結合力的成型方法。 【先前技術】 參閱圖1，一般印刷電路板100包含一金屬箔u，及 一與該金屬箔11相連結之絕緣層12，該金屬箔n 一般是 導電性良好的銅箔，形成預定態樣而可電性傳導，該絕緣 層與該金屬箔11共同對應欲連結之一電子元件2〇〇的 複數電性接腳300，例如電阻、電容、IC等，形成多數孔 洞13，供該複數電性接腳3〇〇插置銲粘後，與該印刷電路 板1〇〇電性導通而可傳輸預定的電子信號。 上述印刷電路板之絕緣層與金屬箔，是以壓合方式連 結成一體，目前，為了增加絕緣層與金屬箔間的結合力， 業界常使用以下方式粗糙化金屬箔之一表面： 一、機械刷磨方式即以機械加工方式刷磨使表面粗 化，此方式僅適用於傳統之印刷電路板，無法應用於超薄 金屬泊的製程中，因為在製程中極容易因刷磨力道不均勻 而开y成板f (bending)或是板组（warpage)之現象，同時，此 方式使表面粗糙化的程度不一，而造成後序製程控制不 4 589412 易’此外’刷磨過程中會產生細小之金屬飛灰，造成工作 環境及空氣品質低落。 二、化學咬蝕方式即以化學溶液進行表面粗糙化處 理，此方式目前廣為業界所採用，但其缺點為所需控制製 5 程參數相當繁雜，主要是由於化學藥品及添加劑（additive) 濃度控制，為粗糙化表面處理良窳之關鍵，同時，設備上 的操作參數，例如噴流速度（impingement)、噴流孔位分 佈、槽液度之均勻性，都影響表面粗縫化的均一度。此 外，廢液處理問題，也造成環保及額外費用支出。 一傳統電錄方式使用不同添加劑，例如過渡元素 金屬離子’於高電流密度產生不同形狀之銅瘤，其優點為 控制參數較少且得到表面粗化效果良好。其缺點為銅瘤之 大小控制不《，尤於銅瘤（c〇pper n〇dule)之分佈亦隨電流 进度不同而有所不同，而且不同添加劑與銅一起沉積在銅 15 I表面，將造成銅層純度不夠，並且殘餘之金屬離子亦可 能影響其它槽液的工作狀態，此外在高頻線路傳輸中，為 了減V粗1表皮+的訊號損失與發生雜訊，需採用低棱線 (Low prome)金屬_製作，同時其厚度也要愈薄愈好，但 此法由於受到製程與設備的限制，所形成的銅瘤並無法得 20 魏棱線之稜線分佈（平均波峰波谷差值Ra <G.5"m，而 5 589412 最大波峰波奋差值Rz<4//m)而滿足低稜線之稜線分佈的 %求，因此使用傳統電鑛以進行瘤化處理之銅箔並無法適 用於高頻線路產品中。 所以，如何改進目前用於印刷電路板1〇〇以銅箔為主 5 ^金屬U構造’以在適合於例如高頻線路的使用前提 下，增進其與絕緣層間的結合力（亦即均勻地使其表面粗 糙化），是印刷電路板業界研究改善研究的方向之一。 【發明内容】 因此，本發明之目的，即在提供一種應用於印刷電路 1〇 板之金屬猪的粗糙均成型方法，它可以使金屬箱形成一均 勻且具有低稜線分佈的粗糙表面，增加與結緣層間的結合 力。 本發明之-種應用於印刷電路板之金屬羯的粗輪化成 型方法，是將用於-該印刷電路板上之一金屬簿粗糖化， 15 增加該金屬猪與該印刷電路板之一絕緣層之間的結合力。 該粗糙化成型方法是將該金屬箔置於—電鍍液中，並 以一週期性脈衝反脈衝電流進行電鍍，使電鍍液中之多數 金屬離子還原沉積於該金屬箔之一表面，生成多數分別自 該表面向外凸伸之凸體單元，使該金屬羯之表面與:等凸 20 料元共同構成—苔狀層，藉此增加該金屬落與該絕緣層D. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a method for roughening a metal foil for a printed circuit board, particularly a method for roughening the metal foil by electroplating to strengthen the metal and the printed circuit board. A method for forming the bonding force of an insulating layer. [Prior Art] Referring to FIG. 1, a general printed circuit board 100 includes a metal foil u and an insulating layer 12 connected to the metal foil 11. The metal foil n is generally a copper foil with good conductivity and forms a predetermined state. It can be electrically conducted. The insulating layer and the metal foil 11 correspond to a plurality of electrical pins 300 of an electronic component 2000 to be connected, such as resistors, capacitors, ICs, etc., and form a plurality of holes 13 for the plurality of electrical connections. After the soldering pin is inserted into the soldering pin 300, it is electrically connected with the printed circuit board 1000 to transmit a predetermined electronic signal. The insulation layer of the printed circuit board and the metal foil are connected together by compression. At present, in order to increase the binding force between the insulation layer and the metal foil, the industry often uses the following methods to roughen one surface of the metal foil: 1. Mechanical The method of brushing is to roughen the surface by mechanical processing. This method is only suitable for traditional printed circuit boards and cannot be used in the process of ultra-thin metal moire because it is very easy to cause uneven brushing during the process. The phenomenon of opening y into plate f (bending) or plate (warpage). At the same time, this method makes the surface roughened to different degrees, resulting in inadequate post-process control. 4 589412 It is easy to occur in addition to the brushing process. Fine metal fly ash causes low working environment and air quality. 2. The chemical etchback method is to use a chemical solution to roughen the surface. This method is currently widely used in the industry, but its disadvantage is that the process parameters required to control the process are quite complicated, mainly due to the concentration of chemicals and additives. Control is the key to rough surface treatment. At the same time, the operating parameters on the equipment, such as the jet velocity (impingement), the distribution of the jet holes, and the uniformity of the tank fluid, all affect the uniformity of the rough surface. In addition, waste liquid treatment issues also cause environmental protection and additional costs. A traditional recording method uses different additives, such as transition element metal ions, to produce copper tumors of different shapes at high current densities. The advantages are less control parameters and a good surface roughening effect. The disadvantage is that the size of copper knobs is not controlled, especially the distribution of copper knobs (copper n0dule) also varies with the current progress, and different additives and copper deposited on the surface of copper 15 I will cause The copper layer is not pure enough, and the residual metal ions may also affect the working status of other tank fluids. In addition, in order to reduce the signal loss and noise of V rough 1 skin + in high frequency line transmission, low edge lines (Low Prome) metal _ production, while the thickness should be as thin as possible, but this method is limited by the process and equipment, the formation of copper knobs can not get the ridgeline distribution of the 20 Wei ridgeline (average peak and valley difference Ra < G.5 " m, and 5 589412 maximum peak crest difference Rz < 4 // m) to meet the% requirement of the low edge ridgeline distribution, so the use of traditional electric ore for nodulation treatment of copper foil is not applicable In high-frequency circuit products. Therefore, how to improve the copper foil-based 5 ^ metal U structure currently used for printed circuit boards 100 to increase the bonding force between the insulation layer and the insulation layer (ie, uniformly) Roughening its surface) is one of the research directions of the printed circuit board industry. [Summary of the Invention] Therefore, an object of the present invention is to provide a rough uniform forming method for a metal pig applied to a printed circuit board 10, which can form a metal box with a uniform and rough surface with a low edge distribution, and increase the The binding force between the binding layers. A rough round forming method of a metal grate applied to a printed circuit board according to the present invention is to coarsely saccharify a metal book used for the printed circuit board, and increase the insulation of the metal pig from one of the printed circuit boards. Cohesion between layers. The roughening forming method is to place the metal foil in a plating solution and perform electroplating with a periodic pulsed reverse pulse current, so that most metal ions in the plating solution are reduced and deposited on one surface of the metal foil to generate a majority of the difference. The convex body unit protruding outward from the surface makes the surface of the metal cymbal and the equal convex 20 material elements together to form a mossy layer, thereby increasing the metal drop and the insulating layer.
連結時之結合力。 B 、本發明之功效在於提供一種金屬箱的粗糙化成型方 法，使金屬箔構成苔狀層以增加連結時之結合力。 【實施方式】 6 589412 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之較佳實施例的詳細說明中，將可清楚 的明白。 本發明一種應用於印刷電路板之金屬箱的粗糙化成 5 型方法的一較佳實施例，是可用於製造如圖1所示之習知 印刷電路板10 0的金屬 '治11 ’例如銅羯、鋅箱、鎳羯，及 /含上述金屬元素之合金沾等等，使該金屬箔的一表面粗糙 化，以增加該金屬箔與該印刷電路板之一絕緣層12之間 的結合力。 10 首先，先將選定金屬種類材料之金屬箔，依序經過鹼 洗、水洗、水洗、酸洗之過程，清除表面或多或少的污染 物或是氧化物，以免造成鍍不均勻或是粗化附著力不佳情 況發生。在本例中，選用銅箔進行粗糙化成型以利說明。 且在此清潔過程中’驗洗時之驗洗槽液是包含氫氧化鈉 15 ( Sodium hydroxide ) 1 〜15g/L、葡萄酸鈉（sodium gluconate) 2〜25g/L、碳酸鈉（Sodium carbonate ) 1 〜7g/L、 矽酸鈉（Sodium silicate) 1 〜8g/L，及 Tergitol 0.1 〜lml/L， 並將該鹼洗槽液之清洗溫度控制於25〜40°C之間，清潔 5〜20秒之後，再進行水洗過程。而酸洗時之酸洗槽液是以 20 濃度2〜20g/L的硫酸（HjO4 )在酸洗槽液之清潔温度25〜40 °C之間，清洗5〜20秒之後，再進行後續製程。 再準備一包含有濃度5〜l〇〇g/L的銅離子、濃度 50〜300g/L的硫酸、濃度<10ppm的氣離子、濃度1〜5〇mi/L 的酸性平整劑（此處選用聚乙二醇polyether glycol)、及 7 0〜10ml/L的光澤劑（此處選用硫尿thi〇urea)之電鍍液， 將清潔後的銅箔置於該電鍍液中準備進行電鍍，同時準備 硫酸銅、氧化銅（cupric 〇xide)、焦磷酸銅、氰化銅等等溶 5 液做為二價銅離子的補充，控制二價銅離子之濃度介於5 5 公克/公升至100公克/公升之間，以免影響陰極極化程度； 開始進行電鍍時，是保持電鍍液之溫度介於2〇它至5〇。〇 之間，通以一週期性脈衝反脈衝電流進行，該週期性脈衝 反脈衝電流是一正向電流密度1〇至2〇〇ASF、逆向電流密 度10至500ASF、正向脈衝時間！至1〇〇ms，且逆向脈衝 日守間1至20ms的電流，使電鍍液中之多數二價銅離子還 原沉積於該銅箱之表面土—生成多數分別自該表面向外凸 伸之凸體單元（該複數凸體單元之平均波峰與波谷差值是 介於0·1至0.5微米之間），使該金屬箔之表面與該等凸 體單元共同構成一苔狀層，藉此可增加該金屬箔與該絕緣 15 層連結時之結合力。 由於銅離子濃度直接影響陰極極化程度，而極化程度 的不同將造成表面粗化程度不同，因此必須精確控制銅離 子濃度；再者，硫酸濃度直接影響為導電度及電鍍液黏 度，一般而言，若硫酸濃度過低，將造成槽液導電度較差， 20 而當硫酸濃度超過15〇g/L之後，其對導電度影響不大，在 此限制硫酸濃度介於50〜300g/L之間；而，氣離子濃度亦 是控制陰極極化狀況重要因素之一，一般而言，氯離子濃 度車父咼時’將造成粗化表面較為鬆散，因此在此粗糙化製 程中’需控制氯離子低於1 〇ppm ;此外，本發明採用 8 589412 polyether glycol，分子量 200〜10000，濃度 1〜5Oml/L 做為 酸性平整劑，而使粗化效果均勻；最後，選擇thiourea為 光澤劑，控制擴散的金屬離子濃度，使電鍍在高的表面濃 度下進行還原，並且提高成核速率，進而阻礙了晶粒成 5 長，因此使晶粒細化。 本發明採用之週期性脈衝反脈衝電流進行電鍍時，是 利用特定頻率（通常是ΙΚΗζ)下工作週期（10%)的調變，以 較直流電電鍍法更高的峰值電流以達到類似的沉積速 率，而使脈衝反脈衝交互變化間促成反應物在電鍵面附近 10 的再補充（replenishment)，而維持較高的反應物濃度。而 、其好處則為 - 1可長出更細的結晶 2可由工作週期的調整控制波形（wave-form)的產生 3藉由晶格方向（lattice orientation)控制可以增加電鍍 15 膜的電氣與耐磨特性 4可在角落處獲得較好的平整度 一般以週期性脈衝反脈衝電流進行電鍍與以直流電 進行電鍍最大的不同有兩點：一是藉由週期性的脈衝電流 (on—off)，可降瓞尖端與凹處的沉積速率的差異，因為 20 鐘液金屬離子補償了擴散層（diffusion layer)中擴散的金屬 離子濃度，使電鍍在非常高的表面濃度下進行，且有高的 成核速率，阻礙了晶粒成長，因此此方式的機制可使晶粒 細化。二是週期性反脈衝電流（periodical reverse)，可將 尖端的沉積物溶解，使先前沉積的鍍層溶解，一般溶解會 9 589412 發生在粗糙鍍層的尖端，因此可使鍍層變得光亮而平坦， 此外，週期中也會釋放沉積的氫氣，以避免氫氣在某些程 度上的阻礙，避免因氫脆造成的應力增加。 一般以週期性脈衝反脈衝電流進行電鍍使表面粗化 時’可控制的參數有電流開時間（ms)、電流關時間（ms)、 正向電流強度（A)、反向電流強度（A)，及電鍍時間等五項。 電流開啟時間及電流關閉時間可控制表面粗化顆粒的大 、 小’也就是當開啟時間越大時，所形成的顆粒越大，也就 直接影響到表面粗度（Ra)。而正向電流強度及反向電流強 · 度則疋影響表面粗化的程度’也就是當正向電流強度固定 時，反向電流越強，所形成顆粒越尖銳，因此得到—之附著 力與抗撕強度越好。 以下是以上述相同之電鍍液，控制不同週期性脈衝反 脈衝電流時所得到的數個實際製程範例： 粗糙化條件 Granulation condition 撕裂強度I Peel Strength (與FR4結合） 撕裂強度Π Peel Strength (與BT結合） 苔狀層 1 Copper Depth 1 200/1000 20:2 (1 m/min) > 2.0 1.2 >4 // m (如圖2、3所示） 2 200/450 20:2 (1.5 m/min) 1·8 〜1·9 1.0 2.5〜3 # m (如圖4、5所示） 3 200/350〜400 20:2 (2 m/min) 1.6 〜1·8 0.8 2〜2.5 // m (如圖6、7所示） 4 200/300 20:2 (2 m/min) 1 ·5〜1.6 0.6 <1 β m (如圖8、9所示） 10 589412 從上述說明可知，本發明一種應用於印刷電路板之金 屬箱的粗糙化成型方法，是應用週期性脈衝反脈衝電流， 並配口電鍍液的組成進行週期性脈衝反脈衝電錢，應用可 簡單產生附加性金屬薄膜結構的電鑛技術，配合週期性脈 衝反脈衝電流在特定頻率下工作週期的調變，長出更細 緻、平整性更佳、電氣與财磨性更佳的苔狀層結晶，不但 · 使沉積出的複數凸體單元平均波峰與波谷差值僅介於（U ·· 至0.5微米之$，而具有較平整度之低棱線的棱線分{布， 適用於各項回頻線路產品中，同時，由實際sem相片中可鲁 之每-凸體單元的外觀更形尖銳，因此而可得到與印刷電 路板之絕緣層連結時更大的附著—力與抗撕強度，確實達到一 本發明之目的。 ί隹以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍，即大凡依本發明申請專利 範圍及發明說明書内容所作之簡單的等效變化與修飾，皆 應仍屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 鲁 圖1是一側視圖，說明習知之印刷電路板之構造，並 说明一電子元件電性連結於該印刷電路板上； 囷2疋 相片’說明本發明一種應用於印刷電 · 路板之金屬箔的粗糙化成型方法於一第一製程參數時所 生成苔狀層之態樣； 圖3是一 SEM相片，說明圖2之苔狀層的多數凸體 單元的實際量測結果； 11 589412 圖4是一 SEM相片，$日日I ☆ 门°兄月本發明一種應用於印刷電 路板之金屬ί#的粗糖化成别古 化成组方去於一第二製程參數時所 生成苔狀層之態樣； 圖5是一 SEM相片，％ ^ 5兄明圖4之苔狀層的多數凸體 5 單元的實際量測結果； 圖6疋SEM相片，說明本發明一種應用於印刷電 路板之金屬fl的粗糙化成型方法於一第三製程參數時所· 生成苔狀層之態樣； . 10 圖7疋一 SEM相片，說明圖6之苔狀層的多數凸體籲 單元的實際量測結果； 圖-8是一 SEM相片，說明—本發明，種應用於印刷電一 路板之金屬箔的粗糙化成型方法於一第四製程參數時所 生成苔狀層之態樣；及 15 圖9是一 SEM相片，說明圖8之苔狀層的多數凸體 單元的實際量測結果。The binding force when connected. B. The effect of the present invention is to provide a method for roughening and forming a metal box, so that the metal foil constitutes a mossy layer to increase the binding force during connection. [Embodiment] 6 589412 The foregoing and other technical contents, features, and effects of the present invention will be clearly understood in the following detailed description of the preferred embodiment with reference to the drawings. A preferred embodiment of a method for roughening a metal box of a printed circuit board into a type 5 according to the present invention is a metal 'rule 11' which can be used to manufacture a conventional printed circuit board 100 as shown in FIG. , Zinc box, nickel tin, and / or alloys containing the above metal elements, etc., to roughen a surface of the metal foil to increase the bonding force between the metal foil and an insulating layer 12 of the printed circuit board. 10 First, the metal foil of the selected metal type is firstly subjected to alkaline washing, water washing, water washing, and acid washing in order to remove more or less pollutants or oxides on the surface, so as not to cause uneven or rough plating. Poor adhesion occurs. In this example, copper foil is selected for roughening and forming to facilitate explanation. And in this cleaning process, the inspection bath liquid during the inspection includes sodium hydroxide 15 (Sodium hydroxide) 1 ~ 15g / L, sodium gluconate 2 ~ 25g / L, sodium carbonate (Sodium carbonate) 1 ～ 7g / L, Sodium silicate 1 ～ 8g / L, and Tergitol 0.1 ～ 1ml / L, and control the cleaning temperature of the alkaline bath liquid between 25 ～ 40 ° C, clean 5 ～ After 20 seconds, the water was washed again. The acid pickling bath during pickling is sulfuric acid (HjO4) with a concentration of 2 to 20 g / L at a cleaning temperature of 25 to 40 ° C, and the cleaning process is performed for 5 to 20 seconds before the subsequent process. . An acid leveling agent (herein) containing copper ions at a concentration of 5 to 100 g / L, sulfuric acid at a concentration of 50 to 300 g / L, gas ions at a concentration of <10 ppm, and a concentration of 1 to 50 mi / L (here Polyethylene glycol (polyethylene glycol) and 70 ~ 10ml / L glossing agent (here, thiourea thiourea) plating solution is used, and the cleaned copper foil is placed in the plating solution to prepare for electroplating. Prepare 5 solutions of copper sulfate, cupric oxide, copper pyrophosphate, copper cyanide, etc. as supplements for divalent copper ions, and control the concentration of divalent copper ions between 5 5 g / l and 100 g / Liter, so as not to affect the degree of cathodic polarization; when starting the plating, keep the temperature of the plating solution between 20 and 50. 〇, through a periodic pulse reverse pulse current, the periodic pulse reverse pulse current is a forward current density of 10 to 2000 ASF, reverse current density of 10 to 500 ASF, forward pulse time! To 100ms, and a reverse current of 1 to 20ms between the daytime, the majority of the divalent copper ions in the plating solution are reduced and deposited on the surface of the copper box-most of the protrusions protruding outward from the surface Body unit (the difference between the average peak and trough of the complex convex unit is between 0.1 and 0.5 microns), so that the surface of the metal foil and the convex units form a mossy layer together, thereby Increase the binding force when the metal foil is connected to the insulating 15 layer. As the concentration of copper ions directly affects the degree of cathodic polarization, and the degree of polarization will cause different degrees of surface roughening, it is necessary to accurately control the concentration of copper ions; furthermore, the concentration of sulfuric acid directly affects the conductivity and the viscosity of the plating solution. In other words, if the sulfuric acid concentration is too low, the conductivity of the bath will be poor. 20 When the sulfuric acid concentration exceeds 15 g / L, it has little effect on the conductivity. Here, the sulfuric acid concentration is limited to 50 ~ 300 g / L. In addition, the gas ion concentration is also one of the important factors to control the state of cathodic polarization. Generally speaking, the concentration of chloride ion will cause the roughened surface to be loose when the driver ’s temperature is low. Therefore, it is necessary to control the chlorine in this roughening process. Ions are less than 10 ppm; In addition, the present invention uses 8 589412 polyether glycol, molecular weight 200 ~ 10000, and concentration 1 ~ 50ml / L as the acid leveling agent, so that the roughening effect is uniform; finally, thiourea is selected as a glossing agent to control The diffused metal ion concentration enables the electroplating to be reduced at a high surface concentration, and increases the nucleation rate, thereby preventing the growth of the crystal grains, so the crystal grains are refined.When the periodic pulsed reverse pulse current used in the present invention is used for electroplating, the modulation of the duty cycle (10%) at a specific frequency (usually IKΗζ) is used to achieve a similar deposition rate with a higher peak current than the DC electroplating method. However, the pulse-to-pulse interaction changes facilitate the replenishment of the reactant near the bond surface 10 while maintaining a high reactant concentration. However, its benefits are:-1 can grow finer crystals; 2 can be adjusted by the duty cycle to control the generation of wave-form; 3, by controlling the lattice orientation, the electrical and resistance of the plating can be increased. Grinding characteristics 4 can obtain better flatness at the corners. Generally, there are two major differences between periodic plating with reverse pulse current and direct current plating: two are the periodic pulse current (on-off), The difference in the deposition rate between the tip and the recess can be reduced, because 20 minutes of liquid metal ions compensate the concentration of metal ions diffused in the diffusion layer, allowing the electroplating to be carried out at a very high surface concentration with a high yield. The nucleation rate hinders grain growth, so the mechanism of this method can make the grains finer. The second is the periodic reverse current, which can dissolve the tip deposits and dissolve the previously deposited coating. Generally, the dissolution will occur at the tip of the rough coating, so the coating can be bright and flat. In addition, During the cycle, the deposited hydrogen will also be released to avoid the hydrogen being hindered to some extent and the increase in stress caused by hydrogen embrittlement. Generally, when the surface is roughened with periodic pulsed reverse pulse current, the controllable parameters are current on time (ms), current off time (ms), forward current intensity (A), reverse current intensity (A) , And five items such as plating time. The current on time and current off time can control the size of the roughened particles on the surface. That is, when the on time is longer, the larger the particles formed, it directly affects the surface roughness (Ra). The forward current intensity and reverse current intensity and degree do not affect the degree of surface roughening, that is, when the forward current intensity is fixed, the stronger the reverse current, the sharper the particles formed, so we get the adhesion and The better the tear resistance. The following are examples of practical processes obtained when the same electroplating solution is used to control different periodic pulsed reverse pulse currents: Roughening condition Granulation condition Tear strength I Peel Strength (combined with FR4) Tear strength Π Peel Strength ( Combined with BT) Moss layer 1 Copper Depth 1 200/1000 20: 2 (1 m / min) > 2.0 1.2 > 4 // m (as shown in Figures 2 and 3) 2 200/450 20: 2 ( 1.5 m / min) 1 · 8 ~ 1 · 9 1.0 2.5 ~ 3 # m (as shown in Figures 4 and 5) 3 200/350 ~ 400 20: 2 (2 m / min) 1.6 ~ 1 · 8 0.8 2 ~ 2.5 // m (as shown in Figures 6 and 7) 4 200/300 20: 2 (2 m / min) 1 · 5 to 1.6 0.6 < 1 β m (as shown in Figures 8 and 9) 10 589412 From the above It can be seen from the description that the method for roughening a metal box applied to a printed circuit board according to the present invention uses a periodic pulsed reverse pulse current and is matched with a composition of a plating solution for periodic pulsed reverse pulsed electricity. The application can easily generate additional The electrical mining technology with a thin metal film structure, combined with the modulation of the duty cycle of the periodic pulse reverse pulse current at a specific frequency, produces more detailed, better flatness, and electrical The moss-like layer with better financial properties not only makes the difference between the average peak value and the trough value of the deposited complex convex unit only between (U ·· to 0.5 micron $, but has a lower edge than flatness. The ridge line is distributed {applicable to various frequency-return circuit products. At the same time, the appearance of the per-convex unit in the actual SEM photos is sharper, so that when it is connected to the insulation layer of the printed circuit board Greater adhesion-tear and tear strength do indeed achieve the purpose of the present invention. The above-mentioned ones are merely preferred embodiments of the present invention. When the scope of the present invention cannot be limited by this, that is, where The simple equivalent changes and modifications made in accordance with the scope of the patent application and the contents of the invention specification should still fall within the scope of the invention patent. [Simplified illustration of the drawing] Lutu 1 is a side view illustrating the conventional printing The structure of the circuit board, and an electronic component is electrically connected to the printed circuit board; 囷 2 疋 Photo 'illustrates that the present invention is a method for roughening and forming a metal foil applied to a printed circuit board. Figure 3 shows the appearance of the mossy layer; Figure 3 is a SEM photo illustrating the actual measurement results of most convex units of the mossy layer in Figure 2; 11 589412 Figure 4 is a SEM photo, $ 日 日 I ☆ Door ° Brother month The present invention is applied to a printed circuit board of a metal ## rough saccharification into a different ancient grouping formula to a second process parameters generated when the appearance of the mossy layer; Figure 5 is a SEM photograph,% ^ Figure 5 shows the actual measurement results of most convex 5 units of the mossy layer in Figure 4. Figure 6 疋 SEM photo illustrates the roughening method of the metal fl applied to the printed circuit board of the present invention in a third process parameter The appearance of the mossy layer is shown in Fig. 7. Fig. 7 is a SEM photograph illustrating the actual measurement results of most convex units of the moss-like layer in Fig. 6; Invention, the appearance of a mossy layer produced by a roughening method of a metal foil applied to a printed circuit board at a fourth process parameter; and FIG. 9 is a SEM photograph illustrating the mossy layer of FIG. 8 Actual measurement results of most convex elements.
12 589412 【圖式之主要元件代表符號說明】 100 印刷電路板 300 電性接腳 11 金屬箔 2金屬箔 12 絕緣層 3 苔狀層 13 孑L洞 4 凸體單元 200 電子元件 1312 589412 [Description of the main components of the diagram] 100 Printed circuit board 300 Electrical pins 11 Metal foil 2 Metal foil 12 Insulating layer 3 Moss layer 13 孑 L hole 4 Convex unit 200 Electronic component 13