TW586988B - Retaining ring for chemical-mechanical polishing - Google Patents

Abstract

A retaining ring for chemical-mechanical polishing includes: an inner surface, an outer surface, and a wearing surface between the inner surface and the outer surface. The wearing surface is perpendicular to the inner surface and embeds a plurality of abrasive posts. During a long time CMP polishing, the abrasive posts protrude lightly from the wearing surface. So that the retaining ring is durable and is used for slurry flowing and conditioning a polishing pad.

Description

586988 V. Description of invention G) [Field of invention

The present invention relates to a restraint ring for chemical mechanical polishing, and more particularly to a durable restraint ring embedded with a wear-resistant column and suitable for chemical mechanical polishing. [Prior art]

With the miniaturization, high density, and complex multilayering of integrated circuits, a high degree of surface flatness is required in the f-conductor process. One of the more feasible planarization methods is chemical mechanical polishing [Chefflical Mechanical

Polishing, CMP], to remove the unevenness on the surface of the integrated electric bee by mechanical action and chemical action to obtain a suitable mirror surface. A conventional chemical mechanical polishing device is disclosed in U.S. Patent No. 6,068,548, "Stable ring for chemical mechanical polishing." As shown in Fig. 1, the chemical mechanical polishing device includes a polishing head.丨 〇〇 [carrier head], used to clamp a wafer 102, the grinding head 100

This system is a rigid metal plate 14 which is mounted on a rotatable rotating shaft 105. An elastic pad 112 is provided on the lower surface of the metal plate 114 to press the back of the wafer 102, and the periphery of the metal plate 114 is installed. A detachable restraint ring 11 7 is provided. The restraint ring 11 7 is a plastic material such as polyphenylene suifide (pps), and is used to clamp the wafer 102 to prevent the wafer from sliding laterally. A polishing head 100 clamps the wafer 102 above the polishing pad 106, and when the polishing slurry 108 is introduced, the rotating shaft 105 and the suspect turntable 10 carrying the polishing pad 106 rotate in opposite directions to each other to Grinding, however, the restraint ring 11 7 is rapidly worn at the same time when the wafer is polished, and it must be replaced frequently. At the same time, it does not have the effect of regulating the slurry 108.

Page 4 586988 V. Description of the invention (2) It is necessary to additionally install a finishing device [condi tiοner] with a rough surface on the polishing pad 丨 〇6 to remove the blockage of the pores in the polishing pad 106. Residues. In US Patent No. 6,004, 193, a "dual purpose restraint ring and a grindstone regulator", a retaining ring having a dual function is proposed. As shown in Fig. 2, the restraint ring 64 has an inner ring. The surface 6 4a and an outer surface 64b, and the opening formed by the inner surface 64a, can be placed with a wafer carrier 66 [wafer carrier] and a wafer 40. When the air pressure 70 is introduced from the back of the wafer carrier 66, the wafer carrier 66 can be moved up and down 68, and using the suction of vacuum pressure, the ventilation hole 76 of the wafer carrier 66 can adsorb a wafer 40, with a rough surface 54 'between the inner surface 6 4 a and the outer surface 6 4 b For example, protrusions with silicon carbide (si 1 ic〇I1 carbide) or diamond particles (diamond stud), when chemical mechanical polishing of a wafer 40, restraint% 64 series of fixed wafers 40 on a rotatable platform Above the polishing pad 42 of 7.4, an appropriate polishing slurry 34 is injected at the same time. Because the rough surface 54 of the restraint ring 64 can polish the wafer 40, the remaining debris blocking the pores of the polishing pad 42 can be removed, that is, the polishing slurry 34 is regulated. State, so that the restraint ring 64 has a fixed wafer Double effect regulation of the polishing slurry, but this is not a binding ring 64 of the sub-formula Z design, once rough surface 54 wear away, the need to replace nearly the entire grinding RESEARCH, having no durability, and is not easy removal replacement. [Objective and Summary of the Invention]

The main purpose of the present invention is to provide a restraint ring for chemical mechanical grinding. A plurality of wear-resistant columns are embedded in the wear surface of the restraint ring. The wear-resistant columns are slightly protruding from the wear surface during a long-term grinding process and can still be maintained. High and low side Y ΐϋΜΐιη Page 5 586988 Five 'invention description (3) Makes the removable assembly restraint ring highly durable, does not need to be replaced frequently, and has the effect of adjusting the condition of the polishing pad. The restraint ring of the chemical mechanical polishing of the present invention includes an inner surface for restraining a wafer; an outer surface; an abrasion surface between the inner surface and the outer surface and perpendicular to the inner surface. A plurality of holes; and a plurality of wear-resistant columns, which are embedded in the holes of the abrasion surface. [Detailed description of the invention] Please refer to the drawings. The present invention will enumerate the following embodiments: In the first embodiment of the present invention, a chemical mechanical polishing restraint ring 200 is listed. The third figure is the restraint ring 2 The exploded perspective view of 〇〇, Figure 4 is a top view of the restraint ring 200, Figure 5 is a cross-sectional view of the restraint ring 200 along the 5: 5 line of Figure 4, and Figure 6 is the restraint ring 2〇 〇 Partial cross-sectional view in use. The restraint ring 2 0 0 is a grinding head which can be removed and assembled in a chemical mechanical polishing device, and is a semiconductor process consumable, which has an inner surface 201, an outer surface 202, and an inner surface 201 and Between the outer surface 202 and the wear surface 2G3 facing the polishing pad 42, the inner surface _2 is used to bind a = 40 and perpendicular to the wear surface 203 [as shown in FIG. 6]. The V mountain restraint ring 200 is a two-piece type. As shown in Figures 3 and 5, the material of the restraint ring is stainless steel 304, titanium, aluminum alloy or fine willow. The material is softer. 'Plastic # 7 ring cut π [polyphenylene

586988 V. Description of the invention (4) sulf ide (PPS), polyether ether [PE] [polyoletherketone, PEEK], polyethylene terephthalate (PET) or polybutylene terephthalate Plastics such as vinegar [p〇lybutylene terephthalate, PBT], have a plurality of holes in the wear surface 203 formed by the lower ring body 23 (), and are embedded with a wear-resistant column 21. The above-mentioned hole, the material of the wear-resistant column 210 It is selected from quartz, alumina, tungsten carbide or ceramics, or even abrasion-resistant materials with diamond particles. In this embodiment, the wear-resistant columns 21 0 are cylindrical and arranged in a double-ring staggered arrangement [such as the fourth And Figure 5], preferably, between the upper ring body 220 and the lower ring body 230, a positioning plate 24o with positioning holes such as stainless steel 410 material, and a wear-resistant wear column 2 1 0 can be included to improve Positioning effect of wear-resistant column 2 10. Since the restraint ring 200 is embedded with a hard abrasion resistance = 210 under the soft ring body 230, as shown in FIG. 6, in order to flatten the surface of the wafer 40, the restraint ring 200 is installed on a polishing head. In order to bundle the wafer 40, during the long or repeated repeated chemical mechanical polishing of the wafer 40, the restraint ring 200 also wears along the wear surface 2 0 3, but the consistency of resistance The grinding column 2 can continue, holding the shape slightly protruding from the wearing surface 203 of the lower ring 230, while maintaining the level of the surface, increasing the use time of the binding ring 200. In contrast, if the surface is only rough It does not have long-term durability, which makes the removable assembled restraint ring 2000 highly durable and does not need to be replaced frequently. At the same time, the uneven surface formed by the wear-resistant column 210 on the wear surface 203 has For the function of polishing slurry flow and adjusting the condition of the polishing pad, the restraint ring 200 has multiple functions such as durability and usability.

In the second embodiment of the present invention, a low-cost constraint is exemplified.

Page 7 586988

V. Description of the invention (5) Bundle ring 300, Figure 7 is a top view of the restraint ring 300, and Figure 8 is a single cross-sectional view of the $ 300 ring 300. The restraint ring 300 is a single piece. _, 丨, polyphenylene sulfide (PPS), polyetheretherketone (PEEK), polyethylene terephthalate (PET) or polybutylene terephthalate-vinegar [Polybutylene terephthalate, PBT] and other plastics form a ring body, which has an inner surface 301, a surface 302, and an abrasion surface 301 between the inner surface 301 and the outer surface 302. Among them, the abrasion surface 303 is perpendicular to the inner surface 301, and the abrasion surface 303 has a plurality of numbers; ^ The holes are embedded with a plurality of grinding columns 3 1 0, and the grinding columns 3 1 0 are arranged in a ring, so the ring 300 is restrained. In addition to having the above-mentioned durability and practicality of the same clothing as the first embodiment, it also has a low manufacturing cost. Therefore, the scope of protection of the present invention shall be defined by the scope of the appended patent application ^ shall prevail. Any changes and modifications made by those skilled in the art without departing from the spirit and scope of the present invention shall be protected by the present invention. Fan 586988 Schematic description [Schematic diagram 1: Picture 2: Picture 3: Picture 4: Picture 5: Picture 6: Brother Garden · Picture 8: [Picture No. 34 Grinding 54 Coarse Seam 64 Restraint 66 Wafer 74 Platform 100 Grinding is being ground in research and solution according to the figure, along the state, and according to the surface of the slurry surface ring carrier U.S. Patent No. 6, 068, 548 No. 1 stable binding restraint ring " Sectional view of Zhongbei; U.S. Patent No. 6,004, 1 No. 93, "Grinding pad regulator", which is a diagram of the first embodiment of the present invention; _ Suitable for the dual purpose of CMP The restraint ring and the wearing view of the ring; 'a three-dimensional view of a restraint ring is a first specific embodiment of the present invention, a cross-sectional view of the top view of the restraint ring is shown in FIG. 5-5 line 4; the first specific embodiment of the present invention A partial cross-sectional view; a second embodiment of the present invention The second embodiment of FIG particular embodiment of the present invention. Top view of the restraint ring in a grinding shape; the restraint ring is cut on one side of the ring 40, the circular shape 64a, the inner surface 68, the upper and lower 76 ventilation holes 1 〇2 wafer surface movement 42 polishing pad 64b outer surface pressure 1 0 4 rotary table 586988 Brief description of the diagram 105 Rotary shaft 106 Grinding 塾 108 Grinding slurry 112 Elastic pad 114 Metal plate 117 Restrained 200 Restrained ring 201 Inner surface 202 Outer surface 203 Abrasion surface 210 Wealth column 220 Upper ring body 230 Lower ring body 240 Positioning plate 300 constraint Ring 301 inner surface 302 outer surface 303 wear surface 310 wear-resistant column

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Claims (1)

586988 j number 90116795, patent application range ring ′, where these pairs of grinding weights are arranged in a Q… 191 ^ arrangement. 8. The A ring as described in item 1 of the scope of patent application, wherein the wear-resistant columns are in the form of a double-circle intersection = constraint of grinding 9. The chemical 'mechanical grinding' as described in item 1 of the scope of patent application The restraint ring, wherein the material of the wear-resistant columns is selected from the group consisting of quartz, alumina, carbonized crane, and pottery. 10. The restraint ring of chemical mechanical grinding as described in item 1 of the scope of patent application, wherein the wear-resistant columns contain diamond particles. Page 12