TW583403B - Automatic detection system of conductive particle bonding and its automatic detection method - Google Patents

Abstract

The present invention provided an automatic detection system of conductive particle bonding for LCD panel and its automatic detection method, wherein the LCD panel has plural liners and electrically connects to plural pins of plural chips via the liners. The system comprises: an image capturing module, a position orient module, an image processing module and a display module. The image capturing image can obtain the digital image of liners on LCD panel electrically connected to the pins. The position oriental module can move the LCD panel to the desired position. The Image processing module can identify whether the liners are electrically connected to the pins, and output a testing result for being displayed by the display module.

Description

583403

The present invention relates to an automatic detection system, and more particularly to an automatic detection system for conductive particle compression in a liquid crystal display panel.凊 Refer to FIG. 1. FIG. 1 shows an anisotropic conductive adhesive 10 (8 1 ^ 3〇1: 1 ′ (^ (: 〇11〇111 (31: Bu 6-1111, Yao).卩) Schematic diagram. Human 〇 〇 10 is a very important material in surface adhesion technology, usually used in printed circuit boards (PCB), liquid crystal display panel (LCD) chip pins for electrical connection manufacturing As shown in Figure 1, the ACF10 has conductive particles u and a viscous substance 12, wherein the conductive particles n are conductors for conducting, and the viscous substance 12 can be used for bonding pins of a fixed chip.

Please refer to FIG. 2. FIG. 2 is a schematic view showing a conventional technique for laminating a wafer on a liquid crystal display panel. Among them, the liquid crystal display panel 20 has a very large number of pads 21, which are electrically connected to the respective display units in the liquid crystal display panel 20, and the pins of the driving chip 3Q are connected to the liquid crystal display panel 2 by a compressive bonding method. Each of the pads 21 is electrically connected, so that the display state of the liquid crystal display panel 20 can be controlled.

Please refer to FIG. 3A and FIG. 3B. FIG. 3A is a schematic diagram showing the ACF bonding chip pins in the conventional technology. FIG. 3β is a schematic diagram showing the conventional ACF after pressing the pin 31 of the wafer. In the current ACF10 press-fitting method, 'Du' directly puts an ACF10 between the wafer pin 31 and the pad 2 丨 on the liquid crystal display panel 20, and applies a press-fitting force F in an automated mechanical manner. The pin 31 is pressed on the gasket 21, and the two are electrically connected by using the conductive particles 11 in the ACF10. At the same time, the chip pin 31 is adhered and fixed on the liquid crystal display panel 20 by the adhesive substance 12 in the ACF10. On the pad 21. Please refer to Figure 4A and Figure 4B. Figure 4A shows the conventional technology

583403

V. Description of the invention (2) = Enlarged schematic diagram of normal pin pressing. FIG. 4B is an enlarged schematic view showing that the pin pins of the conventional technology are not properly pressed. 4〇 is the enlarged area f ′ in FIG. 2. As shown in FIG. 4A, the relative position offset between the wafer pin 31 and the pad 2 丨 on the f-crystal display panel 2 〇 is very large under normal pressure. It is small, so the chip pin W and the pad 21 can be electrically connected, so that the signal can be transmitted. 2Sometimes it is different from the products produced by the automatic pressing equipment, and also because the equipment maintenance cycle time is different or It is the difference in instant temperature and humidity during lamination that causes wafer pin 3 as shown in Fig. 4B to be improperly pressed. "When wafer chat 31 is pressed with pad 21 of liquid crystal display panel 20 during lamination There is a relative X-axis error (ΛX), a relative γ-axis error (Λγ), or an unevenness in the z-axis level. Therefore, the chip pins 3 1 and the pads 21 cannot be electrically connected, and signals cannot be transmitted. At present, the conductive particle compression detection in the liquid crystal display panel 20 relies on manual point-by-point detection through an optical microscope, but a liquid crystal display panel 20 module has thousands of connection points between the chip pins 31 and the pad 21. Completely manual work, on the one hand, depends on a lot of manpower, on the other hand, because this work is extremely eye-consuming, the operator is easily fatigued, which may lead to missed inspections or different judgment standards, which will cause product quality problems. Unstable. In view of this, the purpose of the present invention is to use a charge-coupled camera (CCD) to obtain digital images, and automatically determine whether the pad 21 of the panel of the liquid crystal display panel 20 is electrically connected to the pins through the image processing module. The purpose of production automation. In order to achieve the above-mentioned object, the present invention provides an automatic clam detection system, which is suitable for the conductive particle lamination detection of a liquid crystal display panel, wherein the liquid crystal display surface

•-I 92. il. 2¾ *

Then, A is electrically coupled to a plurality of pins of the m: t film, which includes an image capture module, a position ^ board having a plurality of pads, and a pad and a display module through the pads. The video capture module can be used to connect the digital image of the pin to the image of the pin: ί; lining the display panel to the required positioning. Shadow: Disposal ,: Module removable liquid crystal element # 3 Prepared cool core group by X-axis, Y-axis, Z-axis Jian: ΓΓ and pin are electrically conductive, and output-test results by the display module show. This Maoyue also provides an automatic detection method for the conductive particle compression of liquid crystal display panels, which is suitable for a system with a search for post-construction structure Λ = Dan two ~ image capture kernel group, in which the LCD 2 panel has a plurality of women, Through the pads and the plurality of pins of the chip #Electric surface connection 'includes the following steps: Move the liquid crystal display panel so that it is placed at the position where the image capture module can capture these images to obtain the liquid crystal display panel The plurality of images on which the pad and the pin are electrically coupled, and whether the pad and the pin are electrically conductive are identified by the X-axis, Υ-axis, and Z-axis offsets, and a detection result is output. In order to clearly distinguish the difference between the embodiment of the present invention and the conventional technology, the automatic detection system of conductive particle lamination in Fig. 5 is compared with the traditional manual detection method. Please refer to FIG. 5. FIG. 5 is a block diagram showing an automatic detection system for conductive particle compression according to an embodiment of the present invention. The automatic detection system in the embodiment of the present invention is suitable for the press-fit detection between the liquid crystal display panel and the driving chip 30 (see FIG. 2). The liquid crystal display panel has a plurality of pads 2 1 that can pass through these. Power consumption of the plurality of pins 31 of the pad 21 and the driving chip 30

〇632-7〇23TWF (n); IP010127, IP010140; Jimmy.ptd page 7 583403 5. Description of the invention (4). ^^ ί 5 /; 'λ 5 λ? / " ^ ^ ^ ^ 71, Z axis position adjustment device 72, Zj; Hitch includes X axis position adjustment device controller 74. Position positioning module 70 adjustment devices 73 and a servo-controlled liquid crystal display panel two, with 75 fixed-one or several devices 71, Υ effect position π effective transparent controller 74 controls the X-axis position adjustment⑽ "Axis height adjustment device", movable liquid day ", the staff does not panel 2 〇, take charge 9 1 to stop / ^ r, ^ 〇A " M5 ° m ^ ^ and eight Tλ axis position adjustment device 71, can adjust the X-axis position of the display panel 20, γ-axis position adjustment device 72; display Lm, 2-axis height adjustment device 73 'can adjust the Z-axis south of the LCD display panel 20. Image capture Module 50 has electric charge and optical microscope 52, # 龙 控制 ㈣ When the LCD panel is moved to a predetermined position to be detected, a signal will be sent to notify the image capture module 50 to start capturing images. At this time, the optical microscope 52 can automatically align the image to make the image clear. The CCD camera 51 obtains the digital image of the pad 21 and the wafer “pin 31” after lamination (as shown in FIG. 4A or “Figure”). The message is sent to the image processing module 6 for processing. 、 An image is included in the image processing module 60 Algorithm, when the digital image is transmitted to the image processing module 60, the image processing module 60 can perform the algorithm to identify the relative X-axis offset () and relative Y-axis between the wafer pin 31 and the pad 21 Offset (ΔΥ), or even the level of the Z-axis. Use these data to determine whether the wafer pin 31 is pressed successfully, that is, whether ^ chip $ ^ 31 and pad 21 can be electrically connected. At this time, If image processing = group 60

ΙΗΙIIH 〇632-7〇23TW (n); lp〇i〇i27 JP010140; Jimmy, ptd 583403. Article Zheng · i R a 1) 2. U. 2 · Supplement > V. Description of the invention The relative x-axis, γ-axis, and z-axis offsets of the foot 31 and the pad 21 are greater than one = recognition value, and the electrical conduction is performed. The image processing module 6 will send a position signal ^ ^ a display module 80, display The position where the lamination fails on the liquid crystal display panel 20 is shown. Please refer to FIG. 16. FIG. 16 is a schematic perspective view showing a conductive particle pressure detection system according to an embodiment of the present invention. In the embodiment of the present invention, among the feeding controller 74, the image processing module and the display module shown in the figure, a central control computer 54 is controlled by the central control computer 54 for unified control. For example, the X-axis position adjustment device 71 ′ YM setting device 72 or the 2-axis height adjustment device 73 controls the feeding motor t = display = panel 20 to reach the position to be detected. The central control computer: further controls the focus of the lens of the optical microscope 52, discriminates the flatness of the application H of the wafer, and also displays the position of the lamination failure on the liquid crystal display panel 20. γ uranium: Λ6 Ϊ: ’The χ-axis position adjusting device 71, west of the embodiment of the present invention The person a adjustment device 72 and the 2-axis angle adjustment device 73 are composed of a linear lead screw port and a 5 servo motor. At the machine end, the boundary line = thorn is controlled by the feeding controller 74 in the computer 54. The camera is moved. Continued from Seiji aj Seita: Line 5 3 is connected to the central control computer 5 4, and the received digital image can be transmitted to the image processing module 60 for image identification. In the embodiment of the present invention, an automatic detection method is further provided.

In 53403, W. 22 Supplement V. Description of the invention (6) Figure 7, Figure 7 shows the outline of the automatic detection method of conductive particle compression in the embodiment of the present invention; First, the liquid crystal display panel 20 is arranged on the carrier 75 (step S61). The servo control module in the position positioning module 70 controls the X-axis, Y-axis, and Z-axis height adjustment devices 73, and the liquid crystal display panel 2 〇The focal length of the mirror 52 allows the image to be clearly received by the CCD camera 5i (step S63) 'After the CCD camera 51 obtains the digital image, it transmits the image to the image processing module 60 (step S64), At this time, the image processing module 60 uses the image axis, Y axis, and Z axis offsets to forge a profile through an image algorithm (21 ^ 1, I: 31). Whether it is electrically conductive (step S65), The result of the determination is that the number of pads 31, 80%, etc. is output, and the non-electrically conductive pin 31 is displayed (step S68). Then it is judged that: there is one position to be tested (step S66), if there is the next position to be tested = then ^ 亍 (step S62), the loop continues until the last position to be detected does not end the entire process (step S67) ). The mobilization method ‘LCD display panel manufacturer-can reduce costs on the one hand, and on the one hand, unified standardization of machine automation interpretation’ can also reduce the chance of defective products being missed. Limitation: ΞΠ has been disclosed as above in a preferred embodiment, but it is not intended to be used by those skilled in the art, without departing from the spirit of the present invention. Wai =: a few changes and retouching, so the scope of protection S of the present invention is attached as follows. The scope of the patent application shall prevail.

583403; ltl. Complementing the left diagram briefly explains that the above and other objects, features, and advantages of the present invention can be further improved. Γ also presents a preferred embodiment in conjunction with the accompanying drawings for details The explanation is as follows: The diagram is briefly explained. Fig. 1 is a schematic diagram showing anisotropic conductive adhesive (ACF) in the conventional technology. The first figure is a schematic view showing a conventional technique of laminating a wafer on a liquid crystal display panel (LCD). FIG. 3A is a schematic diagram showing the prior art ACF crimped wafer pin in the conventional technology FIG. 3B is a schematic diagram after the ACF crimped wafer pin in the conventional technology FIG. 4A is a wafer pin in the conventional technology Enlarged display of normal compression-a vertical f 4B picture, which shows an enlarged view of abnormal compression of the chip pins in the conventional technology. Example Automatic Detection System for Conductive Particle Lamination Example 5 Automatic Block Detection System for Conductive Particle Lamination Figure 5 is a block diagram showing the system of the present invention. Fig. 6 is a schematic perspective view showing a system of the present invention. Fig. 7 is a schematic flowchart showing an automatic detection method for conductive particle compression according to an embodiment of the present invention. Explanation of symbols: 10 ~ anisotropic conductive adhesive, 11 ~ light guide ▼ Electric repair I 1 lead particles, 1 2 ~ viscous material

583403 mj Schematic description, 20 to liquid crystal display panel, 21 to pad, 30 to driver chip, 31 to chip pin, 40 to enlarged area, 50 to image capture module, 51 ~ Charge-coupled camera (CCD), 52 ~ Optical microscope, 54 ~ Central control computer, 60 ~ Image processing module, 70 ~ Position positioning module '7 1 ~ X-axis position adjustment device, 72 ~ Y axis Position adjustment device, 73 to Z axis height adjustment device, 74 to servo controller, 75 to carrier, 53, 76 to cable, 80 to display module, F to pressing force, X, Y to X, Y direction, ΛX, ΛΥ ~ X, Y directions are offset.

0632-7023TWF (n); IP010127, IP010140; J immy .ptd page 12

Claims (1)

Please enquire about A '---------- L An automatic detection system for conductive particle compression, suitable for conductive particle compression detection of a liquid crystal display panel, wherein the liquid crystal display panel has a plurality of pads, and The pads are electrically coupled to a plurality of pins of a plurality of chips, including ·· *, an image capture module, which can obtain the pads and the pins to be electrically coupled on the liquid crystal display panel. A plurality of images; a position positioning module, which fixes the liquid crystal display panel through a carrier, and can move the liquid crystal display panel, so that the liners are placed on the image capture module capable of capturing the images Position; and an image processing module coupled to the image capture module, which can perform an ancillary processing on the images. 2. The conductive particle compression automatic detection system according to item 1 of the scope of the patent application, wherein the image capture module includes: a charge coupled camera (CCD) for acquiring the images; and an optical A microscope to sharpen the images. The conductive particle compression automatic detection system according to item 1 of the scope of patent application, wherein the position positioning module includes: an X-axis position adjustment module for adjusting the X-axis position of the liquid crystal display panel; a Y-axis A position adjustment device for adjusting the Y-axis position of the liquid crystal display panel; a Z-axis height adjustment device for adjusting the z-axis height of the liquid crystal display panel; and M3403 9¾ 11. 22 [> Patent application scope 4 · 10 11 A servo controller is used to control the χ-axis position adjustment device, the Υ-axis position adjustment device, and the Z-axis height adjustment device. The conductive particle lamination automatic detection system as described in item 1 of the scope of patent application, wherein the images are digital images. "As described in the patent application scope of the conductive particle compression automatic detection system 'wherein the number of pads and the pins are the same.', * As described in the scope of the patent application of the conductive particle Compression self-indication, and death 'Among them, the auxiliary processing is to determine the relative X-axis offset from one of these pins through the images. 'Automatic detection system' Among them, the auxiliary processing is to determine the Y-axis offset between the operator and one of the pins via the images. The automatic detection of the conductive particle compression as described in the first item of the patent application scope The system 'wherein, the auxiliary processing is to determine the 2-axis offset between the outline and one of the pins through the images. Person' The automatic detection system of conductive particle compression as described in the first scope of the patent application 'Among them, the image processing module can identify whether the schematic and the pins are electrically conductive by the relative x-axis offset / amount, the relative Y-axis offset, and the relative z-axis offset, and Output a test result. The conductive particle lamination automatic detection system described in Item 9 of the scope of interest further includes: a display module that can display the detection result. An automatic detection method for conductive particle lamination is suitable for the detection of the module by using the image finger sheet A liquid crystal display panel, wherein the liquid crystal display panel has 〇632.7023TW (n); IP01〇l27, IP〇i〇14〇; jiimiy.ptd page 14 There are a plurality of pads, and the pads are electrically coupled to the pins of the plurality of chips through the pads, including the following steps: The position positioning module moves the liquid crystal display panel, so that the outlines are in the image capture mode. The position where the group can capture the images; the remote image capture module obtains a plurality of images where the pads on the liquid crystal display panel and the pins are electrically coupled; and an image processing module Wait for the image to be attached. 12. The automatic detection method of conductive particle compression as described in item 11 of the scope of the patent application, wherein the image capture module includes: a charge-coupled camera (CCD) to obtain the images; and an optical A microscope to sharpen the images. 13. The automatic detection method of conductive particle compression as described in item 11 of the scope of the patent application, wherein the position positioning module includes: an X-axis position adjustment device for adjusting the X-axis position of the liquid crystal display panel; a Y An axis position adjusting device for adjusting the Y-axis position of the liquid crystal display panel; a z-axis height adjusting device for adjusting the Z-axis height of the liquid crystal display panel; and a servo controller for controlling the X-axis position adjustment Device, Y-axis position adjustment device and Z-axis height adjustment device. 14. The conductive particle compression automatic detection method as described in item 11 of the scope of patent application, wherein the position positioning module further includes a carrier, which can be fixed 0632-7023TW (n); IP010127, IP010140; Jimmy.ptd page 15 583403 a 丨 1 Mengzheng I 丨 added! 6. Scope of patent application This LCD panel is determined. The automatic detection method of conductive particle compression according to item 11 of the patent application scope, wherein the images are digital images. According to the automatic detection method of conductive particle compression described in item 丨 丨 of the patent application scope, wherein the number of these outlines is the same as that of the pins. The automatic inspection of the conductive particle compression as described in item 11 of the patent claim: the method, wherein the auxiliary processing is to determine the relative X-axis offset of the approximate pads and one of the pins through the images the amount. According to the automatic method of conductive particle compression according to item 11 of the scope of the patent application, wherein the auxiliary processing is to judge the relative gamma-axis offset of the pad and one of the pins through the images. Human view The method for automatic detection of conductive particle compression as described in item i i of the scope of patent application, wherein the auxiliary processing is to judge the relative Z-axis offset of the measuring pads and one of the pins through the images. According to the method for bonding self-conducting particles described in item 丨 丨 of the patent application scope, the method further includes the following steps: The image processing module is offset by the relative X-axis offset, the relative Y-axis offset, and the relative z-axis offset. The shifting amount identifies whether the pads and the connections are electrically conductive, and outputs a test result. The conductive particle compression method described in item 20 of the patent application scope further includes the following steps: The display module displays the test result. 15. 16 17. 18 · 19.% 20 21 Method