TW581370U - Inspecting apparatus of printed state or the like in flexible printed circuit board - Google Patents

Inspecting apparatus of printed state or the like in flexible printed circuit board

Info

Publication number
TW581370U
TW581370U TW092211408U TW92211408U TW581370U TW 581370 U TW581370 U TW 581370U TW 092211408 U TW092211408 U TW 092211408U TW 92211408 U TW92211408 U TW 92211408U TW 581370 U TW581370 U TW 581370U
Authority
TW
Taiwan
Prior art keywords
circuit board
inspecting apparatus
printed circuit
state
flexible printed
Prior art date
Application number
TW092211408U
Other languages
English (en)
Inventor
Takehiko Murakami
Original Assignee
Minami Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minami Co Ltd filed Critical Minami Co Ltd
Publication of TW581370U publication Critical patent/TW581370U/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
TW092211408U 2001-09-17 2002-09-04 Inspecting apparatus of printed state or the like in flexible printed circuit board TW581370U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001281134A JP3876137B2 (ja) 2001-09-17 2001-09-17 フレキシブルプリント基板の印刷状態等の検査装置

Publications (1)

Publication Number Publication Date
TW581370U true TW581370U (en) 2004-03-21

Family

ID=19105017

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092211408U TW581370U (en) 2001-09-17 2002-09-04 Inspecting apparatus of printed state or the like in flexible printed circuit board

Country Status (4)

Country Link
US (1) US6940537B2 (zh)
JP (1) JP3876137B2 (zh)
KR (1) KR20030024603A (zh)
TW (1) TW581370U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104890372A (zh) * 2015-05-29 2015-09-09 歌尔声学股份有限公司 Pcb废板打标装置及其打标方法

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005064026A (ja) * 2003-08-12 2005-03-10 Juki Corp 部品装着装置
DE102005037498A1 (de) * 2005-08-09 2007-02-15 Man Roland Druckmaschinen Ag Qualitätskontrollsystem für eine Druckmaschine
KR101206756B1 (ko) 2010-11-22 2012-12-04 주식회사 한라정밀엔지니어링 Ｌｅｄ 비젼 검사 시스템
CN102095737B (zh) * 2010-12-23 2012-09-05 东莞市升力智能科技有限公司 一种单工作台挠性印制电路表面缺陷自动检测机
JP5858355B2 (ja) * 2011-05-25 2016-02-10 新光電気工業株式会社 ワークの搬送装置および搬送方法
DE202012003661U1 (de) 2012-04-12 2013-07-15 Mühlbauer Ag Vorrichtung zum Erkennen von Codes
CN104908456B (zh) * 2015-06-15 2017-04-19 苏州石丸英合精密机械有限公司 键盘激光自动打标机的伺服下料机构
CN108393273A (zh) * 2017-12-22 2018-08-14 苏州信立盛电子有限公司 一种pcb板的外观检测方法
WO2020004791A1 (ko) 2018-06-29 2020-01-02 주식회사 고영테크놀러지 플리퍼 장치 및 이를 이용한 대상물 검사방법
CN109625830B (zh) * 2018-10-24 2020-11-10 安徽达胜电子有限公司 一种集成电路板检测的上料装置及上料方法
CN109625829B (zh) * 2018-10-24 2020-11-10 安徽达胜电子有限公司 一种pcb板的自动上料及检测装置
CN109342451A (zh) * 2018-11-16 2019-02-15 罗博特科智能科技股份有限公司 一种正反aoi检测系统
DE102020202096B3 (de) * 2020-02-19 2021-05-27 Greenerity Gmbh Verfahren und Vorrichtung zur Markierung eines Defekts in einer funktionalen Schicht einer Brennstoffzelle, einer Elektrolysezelle oder einer elektrochemischen Sensoranwendung
CN113645829B (zh) * 2021-08-11 2022-06-07 东莞市沃德精密机械有限公司 电路板马达贴合生产线

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4858820A (en) * 1987-02-18 1989-08-22 Plato Products, Inc. Desoldering aid and method
US5657075A (en) * 1993-02-05 1997-08-12 Teradyne, Inc. Method and apparatus for locating and facilitating the repair of defects on a printed circuit board
US5574668A (en) * 1995-02-22 1996-11-12 Beaty; Elwin M. Apparatus and method for measuring ball grid arrays

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104890372A (zh) * 2015-05-29 2015-09-09 歌尔声学股份有限公司 Pcb废板打标装置及其打标方法
CN104890372B (zh) * 2015-05-29 2017-03-29 歌尔股份有限公司 Pcb废板打标装置及其打标方法

Also Published As

Publication number Publication date
JP3876137B2 (ja) 2007-01-31
KR20030024603A (ko) 2003-03-26
US20030052968A1 (en) 2003-03-20
US6940537B2 (en) 2005-09-06
JP2003083909A (ja) 2003-03-19

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees