TW580715B - Bending piezoelectrically actuated liquid metal switch - Google Patents

Info

Publication number

TW580715B

TW580715B TW091113182A TW91113182A TW580715B TW 580715 B TW580715 B TW 580715B TW 091113182 A TW091113182 A TW 091113182A TW 91113182 A TW91113182 A TW 91113182A TW 580715 B TW580715 B TW 580715B

Authority

TW

Taiwan

Prior art keywords

piezoelectric

liquid

fluid

liquid metal

patent application

Prior art date

2002-02-14

Links

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• Global Dossier
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• 229910001338 liquidmetal Inorganic materials 0.000 title claims abstract description 49
• 238000005452 bending Methods 0.000 title abstract description 10
• 239000012530 fluid Substances 0.000 claims abstract description 49
• 239000012528 membrane Substances 0.000 claims abstract description 8
• 239000007788 liquid Substances 0.000 claims description 16
• 230000002079 cooperative effect Effects 0.000 claims 2
• PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
• 230000003044 adaptive effect Effects 0.000 claims 1
• 239000012771 household material Substances 0.000 claims 1
• 238000009434 installation Methods 0.000 claims 1
• 238000009736 wetting Methods 0.000 abstract 1
• 239000000463 material Substances 0.000 description 23
• 238000006073 displacement reaction Methods 0.000 description 12
• 239000010408 film Substances 0.000 description 11
• 230000000694 effects Effects 0.000 description 10
• 239000000758 substrate Substances 0.000 description 10
• 229910052751 metal Inorganic materials 0.000 description 9
• 239000002184 metal Substances 0.000 description 9
• 239000013078 crystal Substances 0.000 description 6
• 230000009471 action Effects 0.000 description 4
• 230000008859 change Effects 0.000 description 4
• 230000007246 mechanism Effects 0.000 description 4
• 238000005086 pumping Methods 0.000 description 4
• 239000000470 constituent Substances 0.000 description 3
• 229910010293 ceramic material Inorganic materials 0.000 description 2
• 230000008602 contraction Effects 0.000 description 2
• 238000000034 method Methods 0.000 description 2
• 230000010287 polarization Effects 0.000 description 2
• 229920000642 polymer Polymers 0.000 description 2
• 239000010453 quartz Substances 0.000 description 2
• 230000004044 response Effects 0.000 description 2
• VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
• GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
• 238000009825 accumulation Methods 0.000 description 1
• 230000002411 adverse Effects 0.000 description 1
• 229910045601 alloy Inorganic materials 0.000 description 1
• 239000000956 alloy Substances 0.000 description 1
• 230000004888 barrier function Effects 0.000 description 1
• 230000002902 bimodal effect Effects 0.000 description 1
• 239000003990 capacitor Substances 0.000 description 1
• 239000000919 ceramic Substances 0.000 description 1
• 238000004891 communication Methods 0.000 description 1
• 238000011038 discontinuous diafiltration by volume reduction Methods 0.000 description 1
• 230000009977 dual effect Effects 0.000 description 1
• 230000005684 electric field Effects 0.000 description 1
• 238000005516 engineering process Methods 0.000 description 1
• 229910052733 gallium Inorganic materials 0.000 description 1
• PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
• 239000010931 gold Substances 0.000 description 1
• 229910052737 gold Inorganic materials 0.000 description 1
• 238000010438 heat treatment Methods 0.000 description 1
• 229910052500 inorganic mineral Inorganic materials 0.000 description 1
• 230000003993 interaction Effects 0.000 description 1
• QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
• 229910052753 mercury Inorganic materials 0.000 description 1
• 150000002739 metals Chemical class 0.000 description 1
• 239000011707 mineral Substances 0.000 description 1
• 239000000203 mixture Substances 0.000 description 1
• 230000004048 modification Effects 0.000 description 1
• 238000012986 modification Methods 0.000 description 1
• 238000013021 overheating Methods 0.000 description 1
• 239000002861 polymer material Substances 0.000 description 1
• LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 1
• 230000009467 reduction Effects 0.000 description 1
• 235000011006 sodium potassium tartrate Nutrition 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1
• 239000007787 solid Substances 0.000 description 1
• 230000002269 spontaneous effect Effects 0.000 description 1
• TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
• 239000010409 thin film Substances 0.000 description 1
• 229910052613 tourmaline Inorganic materials 0.000 description 1
• 239000011032 tourmaline Substances 0.000 description 1
• 229940070527 tourmaline Drugs 0.000 description 1
• 239000002699 waste material Substances 0.000 description 1
• 238000003466 welding Methods 0.000 description 1