TW572955B - Semiconductive resin composition and molded article - Google Patents

Semiconductive resin composition and molded article Download PDF

Info

Publication number
TW572955B
TW572955B TW90130313A TW90130313A TW572955B TW 572955 B TW572955 B TW 572955B TW 90130313 A TW90130313 A TW 90130313A TW 90130313 A TW90130313 A TW 90130313A TW 572955 B TW572955 B TW 572955B
Authority
TW
Taiwan
Prior art keywords
weight
parts
fiber
resin composition
fibrous
Prior art date
Application number
TW90130313A
Other languages
Chinese (zh)
Inventor
Takayuki Miyashita
Mineo Ohtake
Original Assignee
Polyplastics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co filed Critical Polyplastics Co
Application granted granted Critical
Publication of TW572955B publication Critical patent/TW572955B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/04Carbon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/014Additives containing two or more different additives of the same subgroup in C08K

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Elimination Of Static Electricity (AREA)
  • Conductive Materials (AREA)

Abstract

To provide a semiconductive liquid crystalline polymer composition which is advantageously used particularly for electronic parts where a stable antistatic property is given without a significantly lowering of mechanical property. That is, a semiconductive resin composition having a volume resistivity of from 1x10<4> to 1x10<11> Omega.cm in which 100 parts by weight of a liquid crystalline polymer (A) are compounded with 1-50 part(s) by weight of graphite (B) having not less than 95% by weight of fixed carbon, 1-50 part(s) by weight of a fibrous electrically conductive filler (C) and 1-50 part(s) by weight of a fibrous non-conductive filler (D) in such a manner that the total compounding amount of the components (B), (C) and (D) to 100 parts by weight of (A) is 25-100 parts by weight and that the ratio ranges of (B):(C) is from 1:3 to 4:1 and of [(B)+(C)]:(D) is from 1:2 to 2:1 are satisfied.

Description

572955 月 修正 曰 1 號 90130313 五、發明說明(1) 本發明乃關於一種半導電性樹脂組成物,其尤指一 將纖維狀導電性充填材料及纖維狀導電性充填材料配方之 液晶性聚合物組成物,更詳而言之,75關於-種半導電性 = ί物組成物’其_於要求防止帶電功能的電 ㈣Γ ί異:性溶融相的液晶性聚合物,即使在熱可塑性 k :俱’、尺寸精度、制振性、流動性佳、成形時的毛 和〆的叙點亦廣為人知。習知,活用這樣的特徵,採 以::強^晶性聚合物組成物作為電子零件者相 指動,產生了帶2,::零件中’因為組裝時的接觸與 樣的产宴私Ζ 電妨礙的問題,因此,為了防止這 碳黑二bott開昭62-1 3 1 067以報中,嘗試將導電性 ,由其手法結果’ac^ i配方於液晶性聚合物中改良導電性 101 Ω .cm以;,具右^性可以提高’其體積電阻率在1 X 本身具有導電性:、因而不止:電的效果,但是,因為成形品 止帶電的效!要控制在沒有導電性、且具有防 常困難。此率在1 χ丨。4〜1X㈣·⑽,非 281 885號公報中,’:平207083戒公報及特開2000-改良導電性,但' 旨口將黑錯作為導電性充填材料配方 表面電阻值相關二二f用黑錯作為導電性充填材料時, 止帶電性,若里:;的然相當優異’但是,A 了提昇防 °#的充填量過多’會使流動性及機械物 572955 曰 修正 _ 案號 90130313 五、發明說明(2) =變;開:〜就 ^e;.2619,^ V」;t;纖?配方以提昇其摺動性,但是,摺動性提昇 :二…且¥的控制就變得困難,使成形品的體積電加 變大,嶋無可以解決上述所有問題的材料, 右供ί,明ί有鑑於上述之問題點’在致力探索與檢討具 14 ::方止▼電特性的素材後,I現將黑鉛與纖維狀導電 性充填材料及纖維狀導電性充填材料’以特定的配方量混 合於液晶性聚合物中,可使機械性質加大、不會變差並具 有安定的防止帶電性,乃至完成本發明。 亦即,本發明在於提供一種半導電性樹脂組成物,體 積電阻率在1 X 104〜1 Χ 1〇11 Ω · cm,其在液晶性聚合物 (A ) 100重量部中,將固定碳95重量%以上之黑鉛(B )卜 5 0重$部、纖維狀導電性充填材料([)1〜5 〇重量部及纖 維狀非導電性充填材料(D ) 1〜5〇重量部,以 述之 範圍加以配方:(B) 、 (C) 、 (D)成分的總配方量, 相對於(A ) 100重量部為25〜1〇〇重量部,(B ) : (c ) &lt; 1 : 3 〜4 : 1、且[(B ) + ( C ) ] : ( d ) = 1 : 2 〜2 : 1 的比例 本發明中所使用的液晶性聚合物(A ),是指具有形 成異方性溶融相性質的溶融加工性聚合物。異方性溶融相 的性質’可以利用直交偏光子的慣用偏光檢查方法加以漆 認。更具體來說’異方性溶融相的確認,可以使用L e i t2572955 month of amendment No. 1 90130313 V. Description of the invention (1) The present invention relates to a semi-conductive resin composition, especially a liquid crystalline polymer formulated with a fibrous conductive filling material and a fibrous conductive filling material formula. The composition, more specifically, 75 is about-a kind of semi-conductive composition = Its composition is used for the electric charge of the function of preventing the charging function. The liquid crystal polymer of the sexually soluble phase, even in the thermoplasticity k: It is also widely known for its dimensional accuracy, vibration damping, good fluidity, and the description points of wool and cymbals during forming. It is customary to take advantage of such characteristics, adopting :: strong crystalline polymer composition as the electronic part of the finger, produced the belt 2 ::: in the parts' because of the contact during assembly and the same production banquet. In order to prevent the problem of electrical interference, in order to prevent this carbon black II bott Kaizhao 62-1 3 1 067 from being reported, an attempt was made to improve the conductivity of the liquid crystal polymer by formulating its 'ac ^ i' by the method. Ω.cm with the right, can increase the volume resistivity of 1 X itself has conductivity :, and therefore more than: the effect of electricity, but because the molded product only stops the effect of electrification! It is difficult to control without conductivity. This rate is at 1 χ 丨. 4 ~ 1X㈣ · ⑽, non-Gazette No. 281 885, ': Heisei 207083 or Gazette and JP 2000-Improving conductivity, but' the purpose is to use black error as a conductive filler material formula surface resistance value is related to the use of black When it is used as a conductive filling material, the electrification is stopped. If it is: ', it is quite excellent.' However, the filling amount of A is increased to prevent °° too much 'will cause fluidity and mechanical objects. 572955 Amendment _ Case No. 90130313 V. Invention Explanation (2) = change; open: ~ 就 ^ e; .2619, ^ V ″; t; fiber? The formula is to improve its flexibility, but the flexibility is improved: Second, the control of ¥ becomes difficult, making the volume of the molded product larger, and there is no material that can solve all the above problems. Right, In the light of the above-mentioned problem points, after committing to exploring and reviewing materials with electrical characteristics of 14: 方 止 ▼, I will now use black lead and fibrous conductive filling materials and fibrous conductive filling materials to specify The formula is mixed with the liquid crystal polymer, which can increase the mechanical properties, does not deteriorate, and has stable antistatic charging properties, and even complete the present invention. That is, the present invention is to provide a semi-conductive resin composition having a volume resistivity of 1 X 104 to 1 X 1011 Ω · cm, which will fix carbon 95 in 100 parts by weight of the liquid crystal polymer (A). 50% by weight or more of black lead (B), fibrous conductive filler ([) 1 to 50 weight part and fibrous non-conductive filler (D) 1 to 50 weight part, Formulated in the range stated above: (B), (C), (D) The total amount of ingredients is 25 to 100 parts by weight relative to (A) 100 parts by weight, and (B): (c) &lt; 1 : 3 to 4: 1 and [(B) + (C)]: (d) = 1: 2 to 2: 1 ratio The liquid crystalline polymer (A) used in the present invention means that it has different formation properties. Melt-processable polymer with a square melt phase. The nature of the anisotropic molten phase can be recognized by the conventional polarization inspection method of orthogonal polarized photons. More specifically, for confirmation of the anisotropic molten phase, L e i t2 can be used.

第7頁 572955Page 7 572955

Γ古0 率進行觀察。本發明所適用之液晶性聚合物, 子之間檢查·,即使在溶融靜止的狀態下,偏 光仍可牙透’顯示出光學性異方性。 # 2之液晶性聚合物(A),並沒有特別限定,但以 万香缺=醋(P〇lyester)或芳香族聚酯醯胺(afflide)為 佳,將方香族聚酯或芳香族聚酯醯胺(amide )部分包含 方、同刀子鎖中的聚酯亦含於該範圍内。這些在6 〇。〇以濃 度〇·1重溶解於五氟酚(Pentaf luorophenol )時,較 好使用至有約2· 〇di/g、最好是2· 〇〜;ι〇· 〇 dl/g的對數粘 度(I · V·)。 :以適用於本發明的液晶性聚合物(A )之芳香族聚 酯或芳香族聚酯醯胺,尤其適合從芳香族hydr〇xy carboxylic acid、芳香族hydroxy amine、芳香族 diamine群中選擇至少j種以上的化合物作為構成成分的芳 香族聚酯或芳香族聚酯醯胺。 更具體說明,有: (1) 主要由芳香族hydr〇Xy carb〇xylic acid及其誘 導體1種或2種以上所構成之聚酯; (2) 主要由(a)芳香族hydr〇Xy carb〇xylic acid 及,、誘V體1種或2種以上、及(b)芳香族dicarboxylic acid、脂環族dicarboxylic acid及其誘導體1種或2種以 上、及(c )芳香族diol、脂環族di〇i、脂肪族di〇1及其 誘導體1種或2種以上所構成之聚酯; (3) 主要由(3)芳香族hydroxy carboxylic acid 及其誘導體1種或2種以上、及(b)芳香族hydroxy amineΓ ancient 0 rate was observed. In the liquid crystal polymer to which the present invention is applied, even if it is molten, the polarized light can be penetrated through the interlayer inspection, and the optical anisotropy is displayed. The liquid crystalline polymer (A) of # 2 is not particularly limited, but it is preferable to use fragrant vinegar (Polyester) or aromatic polyester amine (afflide). Polyesteramide (amide) part of the same, including the same polyester in the knife lock is also included in this range. These are at 60. 〇 When redissolved in pentafluorophenol (Pentaf luorophenol) at a concentration of 0.1, it is preferably used to have a logarithmic viscosity of about 2.0 · di / g, preferably 2.0 · 〇 ~; ι〇 · 〇dl / g I · V ·). : Aromatic polyester or aromatic polyester amidamine suitable for the liquid crystalline polymer (A) of the present invention, especially suitable for selecting at least from the group of aromatic hydroxy carboxylic acid, aromatic hydroxy amine, and aromatic diamine Aromatic polyester or aromatic polyester amidamine having j or more compounds as constituents. More specifically, there are: (1) a polyester composed mainly of one or more aromatic hydrOxy carboxylic acid and its inducer; (2) a polyester mainly composed of (a) aromatic hydrOxy carb 〇xylic acid, and one or two or more kinds of attractants, and (b) aromatic dicarboxylic acid, cycloaliphatic dicarboxylic acid and its inducers, one or two or more kinds, and (c) aromatic diol, lipids Polyesters composed of one or more cyclic di0i, aliphatic di01, and its inducers; (3) one or two or more of the aromatic hydroxy carboxylic acids and their inducers And (b) aromatic hydroxy amine

572955 __案號90130313 年月日 修正 五、發明說明(4) 、芳香族diamine及其誘導體1種或2種以上、及(c )芳香 族 dicarboxylic acid、脂環族 dicarb0Xylic acid 及其誘 導體1種或2種以上所構成之聚酯醯胺; (4)主要由(a)芳香族hydroxy carboxylic acid 及其誘導體1種或2種以上、及(b )芳香族h y d r o x y a in i n e 、芳香族diamine及其誘導體i種或2種以上、及(c )芳香 族 dicarboxylic acid、脂環族 dicarboxylic acid 及其誘 導體1種或2種以上、及(d)芳香族diol、脂環族diol、 脂肪族diol及其誘導體1種或2種以上所構成之聚酯醯胺等 。再則,亦可因應上述構成成分,必要時併用分子量調整 劑。 構成可以適用於本發明的液晶性聚合物(A )的具體 化合物例,有:P - hydroxy安息香酸、6 - hydroxy - 2 - naphthoic acid 等芳香族hydroxy carboxylic acid 、 2,6 - dihydroxy naphthalene、1,4 - dihydroxy naphthalene、4,4’ - dihydroxy biphenyl、 hydroquinone 'resorcin、下述一般式(I )及下述一般 式(II)顯示的化合物等芳香族diol ;terephthalic acid 、iso phthalic acid 、 4, 4’ - diphenyl dicarboxylic acid 、 2, 6 - naphthalene dicarboxylic acid及下述一般式(Π I )顯示的化合物等芳香族 dicarboxylic acid ; p - aminophenol 、p - phelene diamine等芳香族amine類等。572955 __Case No. 90130313 Amended on the 5th, the description of the invention (4), one or more aromatic diamines and their inducers, and (c) aromatic dicarboxylic acid, cycloaliphatic dicarb0Xylic acid and its inducers Polyesteramide composed of 1 or more types; (4) Mainly (a) one or two types of aromatic hydroxy carboxylic acid and its inducer, and (b) aromatic hydroxya in ine, aromatic diamine and its inducer i or two or more, and (c) aromatic dicarboxylic acid, alicyclic dicarboxylic acid and its inducer, one or two or more, and (d) aromatic diol, alicyclic diol, Polyesteramide and the like composed of one or more aliphatic diols and their inducers. In addition, in accordance with the above-mentioned constituent components, a molecular weight modifier may be used in combination as necessary. Examples of specific compounds constituting the liquid crystalline polymer (A) that can be suitably used in the present invention include aromatic hydroxy carboxylic acids such as P-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid, 2,6-dihydroxy naphthalene, 1 Aromatic diols such as 4-dihydroxy naphthalene, 4,4'-dihydroxy biphenyl, hydroquinone 'resorcin, compounds shown by the following general formula (I) and the following general formula (II); terephthalic acid, iso phthalic acid, 4, Aromatic dicarboxylic acids such as 4'-diphenyl dicarboxylic acid, 2, 6-naphthalene dicarboxylic acid, and compounds shown by the following general formula (ΠI); aromatic amines such as p-aminophenol and p-phelene diamine.

第9頁 572955 ^£ 90130313 五、發明說明(5) 修正 „〇_0.χ^〇Η CI) 胍 OXCC〇〇X5~〇H (I&gt; ROOC-0-^'-0-COOH (Π) 、但5 疋從X .alkylene (C1〜C4) 、alkyiidene、- 〇 一、一 SO -、- S02 -、— s-、— c〇 - 選擇的基、Y: - (CH2)n - (ηΗ 〜4) 、—〇 (CH2)n〇 _ (η =卜 4)選擇的Page 9 572955 ^ £ 90130313 V. Description of the invention (5) Amendment „〇_0.χ ^ 〇Η CI) Guanidine OXCC〇〇X5 ~ 〇H (I &gt; ROOC-0-^ '-0-COOH (Π) , But 5 疋 selected from X.alkylene (C1 ~ C4), alkyiidene, -〇 一, 一 SO-,-S02-, — s-, — c〇-, the selected base, Y:-(CH2) n-(ηΗ ~ 4), -〇 (CH2) n〇_ (η = Bu 4) selected

基)。本發明特別適用的液晶性聚合物(Α ),是以ρ 一 hydroxy 女息香酸、6 _ hydroxy — 2 - naphthoic acid 為主構成單位成分的芳香族聚g旨。 本發明的目的在於加大機械性質、不會變差並賦予安 定的防止帶電性,所以必須要在液晶性聚合物(A ) 1 〇〇重 量部中’將固定碳95重量%以上之黑鉛(b ) 1〜50重量部、 纖維狀導電性充填材料(C) 1〜5〇重量部及纖維狀非導電 性充填材料(D ) 1〜5 0重量部,以滿足下述之範圍加以配 方· ( B ) 、( C ) 、 ( D )成分的總配方量,相對於(A ) 100重量部為25〜100重量部,(B) : (c)=l: 3〜4:1、base). The liquid crystalline polymer (A) particularly suitable for the present invention is an aromatic polyglyceride which is composed mainly of ρ-hydroxydibenzoic acid and 6_hydroxy-2-naphthoic acid. The purpose of the present invention is to increase the mechanical properties, not to deteriorate, and to provide stable antistatic charging properties. Therefore, it is necessary to fix black lead of 95% by weight or more in the liquid crystal polymer (A) 100 weight portion. (B) 1 to 50 parts by weight, fibrous conductive filler (C) 1 to 50 parts by weight and fibrous non-conductive filler (D) 1 to 50 parts by weight, formulated to meet the following range · (B), (C), (D) The total amount of ingredients is 25 to 100 parts by weight based on (A) 100 parts by weight, (B): (c) = 1: 3 to 4: 1,

且[(B) + (C) ] : (D)=l :2 〜2 :1 的比例。 在本發明中,(B )黑鉛,雖然也可以使用人造黑錯 、天然黑錯等鱗片狀黑錯、鱗狀黑錯、土狀黑錯等種類的 黑錯,但是,為了附加能夠達到防止帶電性的導電性,必 須採用固定碳95重量%以上、最好是98重量%的黑錯。其 中’從功能面來看,以固定碳率高的人造黑鉛、及成形品 内容易構成結構(structure )的鱗片狀黑鉛或鱗狀/錯And [(B) + (C)]: (D) = 1: 2 to 2: 1 ratio. In the present invention, although (B) black lead, scaly black errors such as artificial black errors and natural black errors, scaly black errors, earthy black errors, and other types of black errors can be used. The electrified conductivity must be 95% by weight or more, and preferably 98% by weight of black carbon. Among them, from a functional point of view, artificial black lead having a high fixed carbon ratio, and scaly black lead or scaly / wrong structures easily formed in the molded product.

572955 案號 90130313 年 修正 五、發明說明(6) 為佳。 ! · 其次,在本發明中,(C )纖維狀導電性充填材料, 可以使用碳纖維、金屬纖維等導電性纖維、及玻璃纖維、 單結晶體短纖維(wh i sker )、無機系纖維、礦石系纖維 等,塗鍍鎳、銅等金屬以附加導電性的材料。 碳纖維,可以採用以polyacry ioni tri le為原料的PAN 系、以木瀝青(p i t c h )為原料的木瀝青系纖維。 金屬纖維,可以採用軟鋼、不銹鋼、鋼及其合金、黃 銅、紹及其合金、斜等纖維。這些金屬纖維,若需要更^ 的導電性時’亦可以塗鑛其他金屬便於使用。 ° 塗鑛金屬使用的單結晶體短纖維(whisker ),可以 使用氮化理單結晶體短纖維、三氮化理單結晶體短纖維、 5 = 鎂單結晶體短纖維、碳化珪單結晶體短纖維、 纖維等’無機纖維方面,可以使用玻璃質纖 _si ! icaN ,, ^ . 、&quot;( rconia)、硅酸鋁(alumina ica)、鈦i鉀、鈦酸鋇、氧 二氧化硅、爐渣(sl )裳 a厌化ί土、虱化鋁、 可以使用石棉纖維(asbest )入=丄礦石系纖維方面, 以碳纖維為佳。 寻。其中,從功能面來看, 其次’在本發明中,(〉姐、 ,可以使用玻璃纖維、單纤曰触\維狀非導電性充填材料 機系纖維、礦石系纖维等,:辦短纖維(whisker )、無 其中,從功能面 此外 ::生充填材料,塗鑛金屬加與上述⑷纖維狀導 來看,以玻璃纖維為佳。使用一樣 的組成物成形572955 Case No. 90130313 Amendment 5. The invention description (6) is better. Secondly, in the present invention, (C) a fibrous conductive filler, conductive fibers such as carbon fibers, metal fibers, and glass fibers, single crystal short fibers (wh i sker), inorganic fibers, ores can be used. Fibers and other materials are coated with metals such as nickel and copper to add conductivity. As the carbon fiber, a PAN-based fiber using polyacry ion trile as a raw material and a wood pitch-based fiber using wood pitch (pi t c h) as a raw material can be used. Metal fibers can be soft steel, stainless steel, steel and its alloys, copper, Shao and its alloys, and oblique fibers. If these metal fibers require more electrical conductivity, they can also be coated with other metals for ease of use. ° Single crystal short fibers (whisker) used for ore-coated metal can use nitridated single crystal short fibers, trinitrided single crystal short fibers, 5 = magnesium single crystal short fibers, carbide single crystal short fibers, fibers, etc. 'Inorganic fiber, you can use glass fiber _si! IcaN ,, ^., &Quot; (rconia), aluminum silicate (alumina ica), titanium i potassium, barium titanate, oxygen silicon dioxide, slag (sl) As for the soil, aluminum, and asbestos fibers (asbest) can be used, carbon fibers are preferred. Searching. Among them, from a functional point of view, in the present invention, (> sister, can use glass fiber, single fiber, touch-dimensional non-conductive filling material machine-based fiber, ore-based fiber, etc .: Fiber (whisker), none of them, from the functional side In addition: raw filler material, coated with mineral metal and the above ⑷ fiber shape, glass fiber is preferred. Use the same composition to form

真材料(D 第1】頁 572955 曰 MM 9013031^ 五、發明說明(7) _ ::的重量平均纖維長 好在6 •長J超糊_上日夺,難燃性不:二^ 附有安ί:;防:ίϊΓ生、成形性、機械物理性良好,且 乃文疋的防止帶電性,所 g 「(町 九 J:; ^(c) ^ ^ ^ ^ ^ t ^^ #^ f} 亦^ 個Λ方Λ及旦總配須在特性的範圍内: 成形性會惡化,導致機械強度變差。另?日:,押出性及 過少時,無法有效達到導電性,使得防止;U配方量 :匕時,若想要增加纖維狀導電性充填材;;c電效= 來達到導電性的話,會使導電性參差()的配方直々 的防止帶電效果。因此,黑鉛(Β)的 …法達到女疋 物(Α)100重量部,需限定在卜 相對於液 是在10〜30重量部的範圍内。 里里4,取好 古θ ί夕士卜’纖維狀導電性充填材料(c)的配方量,在配 方1多時’雖然可以提昇機械 里在配 形性會惡化’甚至使導電性太好而引起導通。另甲=成 在配方量過少時’無法有效達到導電性 = 電性=話’會如前所述一般,押出性及成形性會亞化,導 致,強度變差。因此,纖維狀導電性充填材i7C)的 配方f ’相對於液晶性聚合物 1〇。 ,二)的 卜5。重量部’最好是在5〜25重量部的範圍内。…在 此外’黑热(B )與纖維狀 方比觸艮重要’必須(B) : (0=1 :3M :! 0 }(B) 572955Real materials (D Page 1) Page 572955 MM 9013031 ^ V. Description of the invention (7) _ :: The average fiber length of the weight is better than 6 • Long J super paste _ the previous day, the flame resistance is not: 2 ^ Attached An ld :; defense: ίϊΓ, good formability, mechanical and physical properties, and is the anti-charging properties of Wen Wen, so "(町 九 J :; ^ (c) ^ ^ ^ ^ ^ t ^^ # ^ f } Also ^ square Λ and denier must be within the range of characteristics: the formability will deteriorate, resulting in poor mechanical strength. In addition: when the extrusion and too little, the conductivity cannot be effectively achieved to prevent; U Formulation amount: If you want to increase the fibrous conductive filling material when the dagger is used; c electric efficiency = to achieve conductivity, the formula with poor conductivity () will prevent the charging effect. Therefore, black lead (B) The method is to reach 100 parts by weight of the nun (A), and it must be limited to the range of 10 to 30 parts by weight relative to the liquid. Lili 4, take the ancient θ 夕 Xi Shi Bu 'fibrous conductive filling material (C) The amount of the formula, when formula 1 is too much, 'although the shape can be improved in the machine, it will deteriorate', and even the conductivity is too good to cause conduction. On the other hand, when the amount of the formula is too small, 'the electrical conductivity cannot be effectively reached = electrical = the word' will be as described above, the extrusion and moldability will be reduced, resulting in poor strength. Therefore, the fibrous conductive filling Material i7C) formula f 'with respect to the liquid crystalline polymer 10., b) Bu 5. The weight part' is preferably in the range of 5 to 25 weight part .... In addition, 'black heat (B) and fiber State is more important than contact. 'Must (B): (0 = 1: 3M :! 0) (B) 572955

銮號 90130313 五、發明說明(8) 的成分較比例多時,會無法有效達到目的的導 例多時,則會使導電性太好而引起導通。 電丨生’較比 此外次,在本發明中,纖維狀非J電性充填材料 D)的配方效果尤其重要。亦即,將纖維狀 ( 於液晶性聚合物組成物中時,成形σ本品4 寸添加 ^ 战形扣表面會粗糙、摺動从 低洛,但是,相反地,會出現導雷祕玄垃史… ^ H 凡今4性保持女圪的效果。但 疋 ,將此以纖維狀導電性充填材料(c )增加配方量時,合 產生如前所述的導通問題’所以,必須要有特定量的曰 狀非導電性充填材料(D )的配方。亦即,纖維狀非導 性充填材料(D )的配方量,在配方量過多時,雖人導電 性可以安定化,但是押出性及成形性會惡化,另一方面, 在配方量過少時,導電性會無法安定,且機械強度也會變 差。因此,纖維狀非導電性充填材料(D )的配方量,相 對於液晶性聚合物(A ) 1 〇 〇重量部,需限定在卜5 〇重量 部,最好是在10〜40重量部,且限定於[(B) + (c)]: (D ) = 1 : 2〜2 : 1的比例之範圍内。 此外’ (B ) 、( C ) 、 ( D )的總配方量,在配方量 ,^時,押出性及成形性會惡化,另一方面,在配方量過 乂 k ’導電性會無法安定,且機械強度也會變差。因此, ,對於液晶性聚合物(A ) 100重量部,需限定在25〜1〇〇重 ®部’較好是在40〜80重量部,更好是50〜70重量部。No. 90130313 V. Description of the invention (8) When there are more components than proportions, there will be many examples of failure to effectively achieve the purpose, which will make the conductivity too good and cause conduction. Comparison of electricity generation. In addition, in the present invention, the formulation effect of the fibrous non-J electrical filling material D) is particularly important. That is, when adding fibrous (in the liquid crystalline polymer composition, the shape of the product is added by 4 inches. ^ The shape of the buckle will be rough, and the movement will be low, but, on the contrary, the mystery of the mine will appear. History ... ^ H Fanjin maintains the effect of son-in-law. However, when this formula is increased with a fibrous conductive filling material (c), the continuity problem mentioned above will occur. Therefore, there must be a specific The amount of the formula of the non-conductive filling material (D). That is, when the amount of the formula of the fibrous non-conductive filling material (D) is too large, although the human conductivity can be stabilized, On the other hand, when the amount of the formulation is too small, the conductivity becomes unstable and the mechanical strength is deteriorated. Therefore, the amount of the formulation of the fibrous non-conductive filler (D) is polymerized relative to the liquid crystal. The object (A) 100 weight part must be limited to 50 weight part, preferably 10 to 40 weight part, and is limited to [(B) + (c)]: (D) = 1: 2 ~ Within the ratio of 2: 1. In addition, the total formula of (B), (C), (D), When the amount is ^, the extrusion properties and moldability will be deteriorated. On the other hand, if the amount of the formula is too large, the conductivity will be unstable and the mechanical strength will be deteriorated. Therefore, for the liquid crystalline polymer (A) 100 The weight part must be limited to 25 to 100 weight parts, preferably 40 to 80 weight parts, and more preferably 50 to 70 weight parts.

第13頁 此外,本發明的半導電性樹脂組成物,在不損及本發 ,目的的防止帶電功能之範圍内,亦可以將板狀或粉粒狀 狀充填材料作為配方。非纖維狀充填材料,具體 572955 曰 修正 案號 90130313 五、發明說明(9) 來說乃由下述材料所構成:滑石(talc)、雲母(inica)、高 湏土(kaol in)黏土(ciay )、石墨(graph j te )、蛭石 (vermiculUe)、硅酸鉀、硅酸鋁、長石粉、酸性白土、 壤^ 黏土 ^ 絹雲母(sericite)、5圭線石 二知潤土、bent〇n】te)、玻璃片(gUss fiake)、板岩 粉、、娃烷(sUane)等娃酸鹽、碳酸鉀、胡粉、 ,酸鎖、:炭酸鎮、白雲母(d〇i⑽ite)等碳酸鹽、重晶石 ( 殿硫酸鎖(bianc fixe)、沉降性硫酸鉀 ①月、石爪酸鋇等硫酸鹽、水和氧化 化紹、氧化録、鎖、氧化欽、氧化鋅、二=二、 石央、白碳(white carbon )、理拜土等4 乂 鎖等硫化物、金屬粉粒體等材質。休土 4乳化物、二氧化 本發明中所使用的黑鉛、纖維 維狀=電性充填材料、非纖維狀充填材以使J i但也可以併用一般通用的表右處理劑、收=狀使用 再則,對液晶性聚合物組成物, 機燒成顏料等顏料、防止氧 核劑、、碳黑、無 、離型劑及難燃劑等添加劑,附= = =、可塑劑、滑劑 包含於本發明所說的液晶性 ^ 性之組成物’亦 本發明的液晶性聚合物組成 =圍内。 導電性充填材料及i種以上的^错由採用2種以上的 足各自的不足,可以得到不損二=充填材料’可以補 優異的材料’並均句分散成形體:::種3防止帶電性 的性能。 在的分散狀態下,發揮更高 572955In addition, the semi-conductive resin composition of the present invention can also use a plate-like or powder-like filling material as a formula, as long as the purpose of preventing the electrification function is not impaired by the present invention. Non-fibrous filling material, specifically 572955, Amendment No. 90130313 V. Description of the invention (9) is composed of the following materials: talc, mica, kaol in clay (ciay ), Graphite (graph j te), vermiculUe, potassium silicate, aluminum silicate, feldspar powder, acid white clay, loam ^ clay ^ sericite, 5 guilinite jizhirun soil, bent. n] te), glass flakes (gUss fiake), slate powder, sane, and other silicates, potassium carbonate, pulverized powder, acid locks, carbonic acid town, domitite, and other carbonates , Barite (dianc fixe), settling potassium sulfate ① moonstone, barium stone clawate and other sulfates, water and oxides, oxide records, locks, oxides, zinc oxide, two = two, stone Materials such as sulphur, yoke, etc., such as central carbon, white carbon, and ribeite, metal powder and granules, etc. Suotu 4 emulsified product, black lead used in the present invention, fiber shape = electricity Filling material, non-fibrous filling material to make J i, but it can also be used in combination with a general-purpose surface treatment agent. In addition, for liquid crystal polymer compositions, pigments such as organic firing pigments, additives such as anti-nuclear agents, carbon black, none, release agents, and flame retardants, including ===, plasticizers, and lubricants include The liquid crystalline composition of the present invention is also the liquid crystalline polymer composition of the present invention. Within the range. The conductive filler and i or more kinds of ^ are wrong due to the lack of two or more kinds. Get non-destructive two = filling material 'can supplement excellent materials' and uniformly disperse the molded body :: species 3 performance of preventing chargeability. In the dispersed state, play higher 572955

案號 901303U ;、發明說明(10) 在製造此液晶性聚合物組成物方面,將兩者以前★ 成比例配方並加以混煉即可。一般是採用押出機混煉、f 出丸狀(pe 1 1 e t )、射出成形等,但並不限定於使: 機混煉。 、押出 以下就以實施例來詳細說明本發明,但本發明並…π 定於這些實施例。此外,實施例中物性的測定及測=限 下述方法進行。 ♦ &amp; I以 (1 )體積電阻率採用0100 X 3t平板測試片, ASTM D257為標準,進行體積電阻率之測定,以5片 依 的平均值作為體積電阻率。體積電阻率的平均是以對=片, 均求出。此外,亦進行5片測試片間測定參差的評價、。平 (2 )張力測試(tensile )採用ASTM 1號租鈐形、曰, = 為標準,進行張力強度及張:::: (3) 彎曲測試採用130 X 13 X 〇.8mm的彎 二定依謂D790為標準,進行彎曲強度及彎曲彈性= (4) 玻璃纖維(GF)的纖維長度測定方法 之丸狀試料,以電器爐約7〇〇 t埶、、、g 、踹鑣給士入撤咕 』吟,將Μ脂、黑鉛 -醇t Γ王:,’將殘留成灰份的玻璃纖維分散於聚乙 二 giyc〇i)的5%水溶液中,將適量移 行50。]_條纖維的重量平.均纖維長度。。像處里破置進 片二*用130χΐ3χ〇._的彎曲測試 --1J: 94為彳if,進行燃燒性的測定〇實施例卜5及比 572955 _案號90130313_年月日__ 五、發明說明(11) 較例1〜12,對液晶性聚酯(LCP; PolyP las tic(株)製, Beetra A94 0) 1 0 0重量部,將圖卜圖2所示的各種充填材 料以圖1〜圖2所示的比例乾混合之後,以二軸押出機(池 貝鐵工(株)製,P C Μ - 3 0型)溶融混煉,並加以丸狀化。 以射出成形機將此丸狀物製作成上述之測試片,進行評 價’結果如圖1〜圖2所示。Case No. 901303U; Description of the invention (10) In the production of the liquid crystalline polymer composition, the former and the former are proportionally formulated and kneaded. Generally, extruder kneading, f-peening (pe 1 1 e t), injection molding, etc. are used, but it is not limited to: machine kneading. Extrusion The following describes the present invention in detail with examples, but the present invention is not limited to these examples. The measurement and measurement of physical properties in the examples were performed by the following methods. ♦ &amp; I used (1) the volume resistivity to use a 0100 X 3t flat test piece, ASTM D257 as the standard, and measured the volume resistivity. The average value of 5 pieces was used as the volume resistivity. The average of the volume resistivity is calculated as pairs = sheets. In addition, the evaluation of the measurement variation between the five test pieces was also performed. Flat (2) Tensile test (tensile) adopts ASTM No. 1 、 shape, said, = as the standard, the tensile strength and tension :::: (3) Bending test uses a 130 X 13 X 0.8mm bend Erdingyi D790 is used as the standard, and the flexural strength and flexural elasticity are measured. (4) Pellets for measuring the fiber length of glass fiber (GF). The electrical furnace is used to enter and withdraw about 700 t 埶, 、, 踹 镳, and 踹 镳. Goo Yin, disperse M fat, black lead-alcohol t Γ Wang :, 'Disperse the ash-retained glass fibers in a 5% aqueous solution of polyethylene (giyco), and transfer an appropriate amount to 50. ] _ The weight of the fibers is flat. The average fiber length. . The image is inserted into the second piece. * Bending test with 130χΐ3χ〇 ._- 1J: 94 is 彳 if, and the flammability is measured. Example 5 and ratio 572955 _Case No. 90130313_ year month day __ five Description of the invention (11) Comparative examples 1 to 12 are based on liquid crystal polyester (LCP; PolyPlastic, Inc., Beetra A94 0) 1 0 0 by weight. After dry mixing in the proportions shown in Fig. 1 to Fig. 2, it is melt-kneaded with a two-axis extruder (manufactured by Ikegai Iron Works Co., Ltd., PC M-30 model) and pelletized. The pellets were formed into the above-mentioned test pieces by an injection molding machine, and the evaluation was performed. The results are shown in Figs. 1 to 2.

第16頁 572955 案號 90130313 A_η 曰 修正 圖式簡單說明 圖1為本發明所使用之實施例1〜5的組成及其測試結果表丨 圖2為本發明所使用之比較例1〜1 2的組成及其測試結果表 第17頁Page 16 572955 Case No. 90130313 A_η Revision diagram Brief description Figure 1 shows the composition and test results of Examples 1 to 5 used in the present invention. Figure 2 shows the comparative examples 1 to 12 used in the present invention. Composition and test results page 第 17 页

Claims (1)

572955,1. 4-1 W 个 i _ 案號 90130313_年月日__ 六、申請專利範圍 1 · 一種半導電性樹脂組成物,其為芳香族聚酯及/或芳 香族聚酯胺之液晶性聚合物(A ) 1 0 0重量部中,將固 定碳9 5重量%以上之黑鉛(B ) 卜5 0重量部,選擇於以 金屬覆蓋之碳化纖維、金屬纖維及玻璃纖維、鬚晶、 無機系纖維或礦石系纖維,並賦予導電性之一種或二 種以上的纖維狀導電性充填材料(C ) 1〜5 0重量部及 選擇於玻璃纖維、鬚晶、無機系纖維或礦石系纖維之 一種或二種以上的纖維狀非導電性充填材料(D) 1〜 5 0重量部,以滿足下述之範圍加以配方:(B )、( C )、572955,1. 4-1 W i _ Case No. 90130313_Year_Month__ VI. Patent application scope1. A semi-conductive resin composition which is an aromatic polyester and / or aromatic polyester amine In the liquid crystal polymer (A) 100 weight parts, black lead (B) with a fixed carbon content of 95% by weight or more and 50 weight parts are selected from carbonized fibers, metal fibers, and glass fibers covered with metal. One or two or more fibrous conductive fillers (C), which are made of crystal, inorganic fiber or ore fiber, and impart conductivity, 1 to 50 parts by weight and selected from glass fiber, whisker, inorganic fiber or ore One or two or more kinds of fibrous non-conductive filler materials (D) 1 to 50 parts by weight, formulated to meet the following ranges: (B), (C), (D )成分的總配方量,相對於(A) 1 0 0重量部為2 5〜 100 重量部,(B): (C)= 1: 3 〜4: 1且【(B)+ (C)】: (D )= 1 : 2〜2 : 1的比例、其體積電阻率在1 X 1 0 4〜 1 X 10 11 Ω · cm。 2 ·如申請專利範圍第1項所述之半導電性樹脂組成物, 其組成物中,纖維狀非導電性充填材料(D)的重量平 均纖維長度以6 0 0# m分散。 3 ·如申請專利範圍第1或第2項所述之半導電性樹脂組 成物,其纖維狀導電性充填材料(C)是PAN系碳纖維 〇(D) The total amount of ingredients is 25 to 100 parts by weight based on (A) 1 0 0 weight parts, (B): (C) = 1: 3 to 4: 1 and [(B) + (C )]: (D) = 1: 2 ~ 2: 1 ratio, and its volume resistivity is 1 X 1 0 4 ~ 1 X 10 11 Ω · cm. 2. The semi-conductive resin composition according to item 1 of the scope of the patent application, in which the weight-average fiber length of the fibrous non-conductive filler (D) is dispersed at 600 #m. 3. The semi-conductive resin composition according to item 1 or 2 of the scope of the patent application, wherein the fibrous conductive filler (C) is PAN-based carbon fiber. 4 ·如申請專利範圍第1或第2項之任一項所述之半導電 性樹脂組成物,其纖維狀非導電性充填材料(D)是玻 璃纖維。4. The semi-conductive resin composition according to any one of claims 1 or 2 in which the fibrous non-conductive filler (D) is glass fiber. 第18頁Page 18
TW90130313A 2000-12-25 2001-12-07 Semiconductive resin composition and molded article TW572955B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000392903A JP3859966B2 (en) 2000-12-25 2000-12-25 Semiconductive resin composition and molded article

Publications (1)

Publication Number Publication Date
TW572955B true TW572955B (en) 2004-01-21

Family

ID=18858816

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90130313A TW572955B (en) 2000-12-25 2001-12-07 Semiconductive resin composition and molded article

Country Status (4)

Country Link
JP (1) JP3859966B2 (en)
CN (1) CN1247703C (en)
TW (1) TW572955B (en)
WO (1) WO2002051940A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5136324B2 (en) * 2007-09-28 2013-02-06 東レ株式会社 Liquid crystalline resin composition and molded article comprising the same
JP6962546B2 (en) * 2016-07-07 2021-11-05 ユニチカ株式会社 Plate-shaped molded product and its manufacturing method
JP2019214694A (en) * 2018-06-12 2019-12-19 積水樹脂株式会社 Fiber-reinforced thermoplastic resin composition
KR20230061917A (en) * 2021-10-29 2023-05-09 롯데케미칼 주식회사 Liquid crystalline polymer composition and article produced therefrom

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0819262B2 (en) * 1988-07-22 1996-02-28 東海ゴム工業株式会社 Conductive resin composition
JP3693275B2 (en) * 1998-06-30 2005-09-07 ニチアス株式会社 Fuel cell separator
JP4724896B2 (en) * 1999-10-27 2011-07-13 東レ株式会社 Thermoplastic resin composition and molded article

Also Published As

Publication number Publication date
CN1483061A (en) 2004-03-17
WO2002051940A1 (en) 2002-07-04
JP2002194229A (en) 2002-07-10
CN1247703C (en) 2006-03-29
JP3859966B2 (en) 2006-12-20

Similar Documents

Publication Publication Date Title
JP4450902B2 (en) Liquid crystalline polymer composition
JP5941840B2 (en) High thermal conductivity thermoplastic resin
WO2001053416A1 (en) Liquid-crystalline polymer molding
KR20140009300A (en) Thermoplastic resin, resin composition, and molding of high thermal conductivity
JP2011084716A (en) Thermoplastic resin composition, and heat-radiation/heat-transferring resin material
JP4672552B2 (en) Conductive resin composition
JP5684999B2 (en) High thermal conductivity thermoplastic resin composition for blow molding
TW572955B (en) Semiconductive resin composition and molded article
JP5903732B2 (en) Liquid crystal polyester composition and molded body
JP5468975B2 (en) High heat conductivity thermoplastic resin heat sink
WO1997015631A1 (en) Synthetic resin composition and molded article thereof
JP5680873B2 (en) High thermal conductivity thermoplastic resin and thermoplastic resin molding
JPH06207083A (en) Liquid crystal polyester resin composition, carrier for electronic component and heat-resistant tray for ic
JPH0468345B2 (en)
JPS5883048A (en) Polyester resin composition
JPH0473461B2 (en)
JP2575039B2 (en) Glass fiber reinforced polyester resin composition
JP2002194194A (en) Semiconductive resin composition and molded product
JP4460672B2 (en) IC tray
JPH05230367A (en) Resin composition and electronic part consisting of the same composition
JPS6268854A (en) Electrically conductive resin composition
JPH0689232B2 (en) Polybutylene terephthalate composition
JPS63277262A (en) Plastic magnet composition
JPH0689226B2 (en) Polybutylene terephthalate resin composition
JPH01282245A (en) Electrically conductive resin composition

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees