TW569017B - Vertical probe card with feedback contact force sensor - Google Patents

Abstract

The invention uses MEMS process to make many vertical spring-like probes. The probe card fabrication includes multi-layers thick photo resist, electroplating, micro assembly and anodic bonding. It is not only easy to reproduce many accurate probe array, but also to reduces fabricating cost and to decrease dependence on high skill workers. Between probe array and PCB (print circuit board) is a space transformer using BGA (ball grid array) that is simple, easy and low cost. If we insert a membrane pressure sensor in between the probe array and the BGA, the probe card can use the feedback contact force to monitor probe contact status. By using the invented probe card to measure all the bumps or pads on the prepared standard chip, we can employ the recorded contact force as a reference for comparing with the chip under test. The difference between reference data and test data can tell that whether the probe is worn out or the bumps and pads have offset, and defects. If the test contact force is below the standard value, we can overdrive the probe card to have better contact status and avoid misjudge the failure of the test chip.

Description

569017

[Technical Field] Another example of m 1 is to make the present invention have a large flexibility, or to have a probe: touch the f-type spring probe 'make it use a multilayer thick photoresist plating probe, micro dream feedback' its characteristics In order to make it as a precision probe card, it can make high-priced precise combination, which can be easily customized and reduce the dependence on artificial assembly technology. Therefore, it can reduce its price. [Previous technology] For a long time, various electronic products have been quantified, and with the enhancement of product functions and more circuits, the number of large I / 0 pins has increased, and they have been implemented, " ,,, Smaller ICs have become more sophisticated. Wei Weiting makes testing after IC manufacturing processes more difficult. Mind 1 (: all f ^ ^ ^ DIP .SOP ^ SOJ. SQFP. BGA F to the current flip-chip, fliP — chip,,., PehlP) k, which I / O pins are already arranged by the array

'P, etc. or bumps, so the original 7 A, *, oblique probe used in DIP for F, as shown in the first figure, is not easy to use; example. Therefore, vertical (vertical = pe) needle cards have been developed accordingly, such as Japanese TCL and American Wentworth [Pi [π. Cooperation a probe card 'and American RNC's Vertical contact probe card Sheng λ .. and T 卞 Temple belong to it. No matter what type of probe card, it can be said that most of them use / _ — to manually arrange the position of the probe, so the technology ^, ', the second inspection layer-the person is very high, resulting in a high unit price of the probe card And, if there is a reason, I1 = early wear is also returned to the original factory for manual maintenance. In order to improve this situation, US patents US58 699 74 and US5828 22 6 use micro

569017 V. Description of the invention (2) Electromechanical process technology to overcome the following problems: 1 · The coplanarity of the probes on the traditional probe card is not easy to achieve. 2 · The coplanarity of the die (d i e) or IC on the wafer to be tested is not good. 3 · Traditional probes will deform and wear or deviate over time. f The test pad of the die usually has an oxidation phenomenon, and the traditional probe may get a strong pierce through the oxide layer, thereby damaging the test pad. 5 ... The complexity and inconvenience of a membrane probe card (US Pat. No. 5,108,977). The US patent US 58 69974 is mainly based on bulk micromachining in the micro-electro-mechanical process. Its main advantage is that Liff II achieves the function of an elastic film. The disadvantage is that (1) the probe used for testing = Not elastic 'because the general deformation amount of Shi Xiji film = the size is unknown, and (3) using ^ for the contact force of the test cup (4) ^% ^ ^ ^) has been used for a long time, there is still the problem of wear, 4 J ί The production of wooden dots is not easy to copy. US patent US5 82822 6, the main way to achieve the appropriate deflection. 1k point is the probe using the cantilever beam plating and polishing method, the material of the probe 'For „Shadow, Narration, Miscellaneous. (2) The probe deflection is small. (3) Two =. Disadvantages: (1) Complex process is not easy to know. One restraint. (4) The contact force of the probe is to improve the shortcomings of the prior art. First, the manufacturing process of the I probe uses a multi-layer Ben Maoming using three important techniques to make the probe's flexure more photoresist plating and micro-assembly. And the anode pressure sensor can be contacted by the pin == replicability. 2. Combining the space between the thin-film needle array and the printed circuit board; detecting the state of the second contact. 3. Explore the __θ converter, using the ball grid array 569017 V. Description of the invention (3) The pottery method is simple and low cost. [Objective of the Invention] One of the objectives of the present invention is to produce vertical springs with anode junctions. The layer thickness is thick & electric resistance *, the degree of micro-assembly, and it can be easily produced. Its price reduces the dependency that the high 2 precision probe card can be used for the purpose of the present invention.

The thin belly of the probe contact force sensor ^ The substrate of the j-meter needle is designed to contain a feed to monitor the probe contact: Then the probe contact force can be used to return the film to the main feature of the present invention. F Condition. By using the pre-prepared reference wafer or card for the standard crystal bumps or solder pads, you can measure all the standard wafers with respect to their forces, and the body ▲ ^ According to this force record, is there any deviation from the wafer to be tested? Bit, defect. At 0, whether the needle is faulty or worn, or the point to be measured is the second purpose of the present invention, the probe card can be pressed down: the force on some probes of the two right probe card is low, and the chip circuit test and projection are misjudged. The block or welding pad is not in contact, and the object of the present invention is

Quantitative test, from single-'probe card combination, can provide a variety of capacity test machines, that is: two multi-chip, to the wafer level, as long as there is a change of eight f, as for the wiring KI; ΪPuzzle " to achieve: Easy to complete. ^ " Degree and impurity, using micro-electromechanical technology, compared with the purpose of the present invention to make the precise ic circuit test under the contact force of the probe, can be-due to the stable electrical test results, avoid contact ;

569017 V. Description of the invention (4) Good interference The sixth object of the present invention is to utilize the space between the ball grid array (BGA) and the printed circuit board. The formula is simple, and the cost is low. [Technical content] Give examples of i-systems, and further understand the present invention. The following is a description of the composition and functions of the invention. It is known that the horizontal probe arrays and probes of the present invention used for horizontal tilting of DIP, QFP, etc. are as follows. The whole assembly situation. The printed circuit board of the present invention uses a ball grid array (BGa). H ^ type to achieve a small turn (Er. Ming). Ball grid array (BGA) package carried printed circuit board Ϊ: ;; two-crystal packaging method from the ball thumb array coffee board ㈣ vertical probe structure of the present invention. The type of the vertical probe of the invention. The comparison chart between the analytical value and the simulation value of the invention. Page 9 V. Description of the invention (5) Drawing force, Figure 10 The stress distribution chart of the probe. Figure 10-ί: Optimization of the probe's bend angle. The possible probe spacing and change of "2" Ming's micro-probes placed on the film :: Figure. = Ming Zhi's method of making vertical micro-probes. Ming's manufacturing probes Contact force sensing; = t procedure for making the upper and lower guide covers, and the invention of the probe card assembly process. Figure No. 1 Vertical probe card 2 Horizontal probe 3 Silver glue 4 Pressure sensor 10 Thin film substrate with piezoresistance built in 11 Probe array 12 Upper guide cover 13 Lower guide cover 1 4 Ball grid array (BGA) structure with LTCC or BT / glass substrate 15 Printed circuit board (PCB) 1 6 Space partition 1 7 Fixing screw 18 L-shaped metal clamp 1 9 Fixing clamp 第 10 页

569017 V. Description of the invention (6) 2 0 Silicon substrate 21 Pl (polyimide) 22 Seed layer (Cu, Cr) 23 Photoresist 2 4 Remove photoresist liquid 2 5 Remove PI photoresist liquid 26 Photomask 2 7 UV 2 8 Ion implantation booth or phosphorus 29 oxide layer 3 0 thin film wire metal layer 31 Si02 32 metal for probe contact 33 inductively coupled plasma (ICP) 34 deep-RIE etching machine (deep-RIE) As shown in FIG. 2, the present invention The main components of the probe card 1 include: (1) a piezoresistive thin-film substrate 1 with optional devices; (2) a probe array 11; (3) an upper guide cover 12; (4) Lower guide cover 13; (5) Ball grid array (BG A) structure with LTCC or BT / glass substrate 1 4; (6) Printed circuit board (PC B)

1 5; (7) Space partition 16 (s p a c e r); (8) Fixing screws 1 7; (9) L-shaped metal clamps 1 8; (1 0) fixed clamps 19. The main function of the piezoresistive thin-film substrate 10 ′ is to provide the force of the probe and convert the electrical signals of the probe and the pads on the wafer to a test instrument. %

Page 11 569017 V. Description of the invention (7) The needle picking array 11 is arranged on the bottom end of the j pin of the ball grid array (BGA) structure 14 and directly pressed on the pad of the ball grid array (BGA) structure 14; Ball grid array (fliP-chip BGA) packaging method, j wood = switch to ball grid array soldering probe 'middle end of the probe has the appropriate' needle line T end is in contact with the 1C㈣ 塾 or bump to be tested, can be A Make it big elastic. In addition, the f-pin array 11 can also be installed on the thin-film substrate. The piezoresistance on the base of the probe is based on the piezoresistive close contact. The general ball grid array ci is used! As with the conventional bare crystal, the probe connection on the thin film substrate 10 is switched to the bonding pad of the ball grid array by wire bonding. Tan, Bu 12: Shrink can be guided by another upper and lower guide cover. Upper and lower:, are located at the two ends of the space partition 16 (spacer), the space of the needle array is jealous, and the upper and lower T guide covers are respectively arranged to pass through two rows and one: guide the i of the array to make the probe The guide cover is exposed for about 50 ~ 2 0 0um, which is used as a channel for up and down deformation. The upper guide cover 12 is mainly used to slide the probe when it is deformed 2... The cover 13 is used to detect: :: = Grid array: (⑴ 一 h ... 封 褒 方;,

Column (BG A) 1 4. When the connection line is small and large on the ball grid array, the field can be placed in the printed circuit board (PCB) 15 (PCB) 1 5 BGA structure 丨 4 wiring conversion to printed circuit board such as = H% and large wiring can be directly connected to the test instrument, board ,: ϊ Printed circuit board (PCB) 15 is used to fix the film base (bgA) 1: Figure: Shown. And the contact of the thin film substrate is converted from a flip chip package (FUp_Chip) to a printed circuit car through a ball grid array (歹 1⑽).

Page 12 569017 V. Description of the Invention (8) Large wiring of the PCB (PCB) and the large wiring can directly connect the $ 丨 device, as shown in the fifth figure. After receiving the tester, the L-shaped clamp 18 with the fixing screws 7 combined the ball grid array 14 with the printed circuit board (PCB) 15 and the U15GA). The L-shaped clamp 18 has a positioning groove. It can be precisely positioned on the ball grid array (BGA) structure 14 or on the thin film substrate 10. Wooden needle solid

[Probe array design principle J The structure of the vertical probe of the present invention can be determined by pitch, beyond the shape of the braid II. · Return to weight, probe design (a ac " orce), in; = (, ⑽) The contact force determines the geometry and size of the probe to fall below the limit of elasticity. As shown in the seventh figure, the design of the middle curved j-type needle has a circular arc with various shapes or Combination, making it |: type, which can be different angles and curved probe distances, one of which is greater flexibility and smaller allowance: the structure of the probe, the relationship is as the second theorem of Karst (Cas theorem) The unit § ian〇, s second is used to analyze the vertical of the probe structure, and (Unit-load method), 5 ′ formula (1) is as follows. For the 7-mile problem, the amount of deformation beyond the probe is 569017

__ FL 23 cos 2 Θ El (h + L2 sin Θ + Lx)

Example 1: One probe length: 3mm, L1 = 2mm, L2 = 0.79,4mm, 0 = 49 〇8 h-〇.2mm, F = 4.7g, probe section a * a = 〇.〇4 * 0 04 2i〇GPa, I = a4 / 12 = u44 / 12 = 213 * 1G_7mm4 E = ement type · Beam 2D elastic (1: Know, the middle should be like a sharp product, the size should be maintained at the corners

However, the boundary condition restricts the point D to move only in the UY direction, and A 'is shown in the eighth figure, and the analytical value and simulation are worth comparing. After the comparison of the :: knot, τ is used to know whether the "" formula is applicable to: fruit detection, ..., structure design, for example, to do a simulation analysis and substituting numerical values into the formula ^ and finishing, as shown in the figure As shown in Figure 8, the error between the analytical value and the analog value in the figure is about 4 to 5%. At the 2-pin bend, the main purpose of the arc design is to avoid the stress when the probe is stressed. It will be distributed on the arc line, but the stress is concentrated at the sharp corner.

In the case of J force solid long 固 and Young's coefficient, only R 2 force 2 right R larger, the more stress concentration can be avoided, i deformation can be… 疋, as shown in the ninth figure. From ANSYS 5 · i points It can be clearly seen from the graph. Arm take big response knife 岣 occurred in probe _

Page 14 569017

V. Description of the Invention (ίο) Example 2: The total length of the probe = 7. 5mm, Ll = 5mm, L2: 6. 5mm, 0: 49 · 08. h = 0 · 85mm (at the guide plate) F = 0.005N, Cross-section area = 〇.〇4 * 0.04 um2 2 1 0 Gpa

The shape 2D definition I, · shape Dixiu's main information on the stress distribution near the corner ΐ —, the element type (Element type) selects Bp boundary conditions to limit the point D point — Tanΰ e a 丨

. 2 Only commit sliding in the UY direction, and point A is solid. After simulation ^ 1mm, we can get the knitting ^ The radius of the corner of the plate needle is from R = 〇 · 2mm ~ R as shown in the figure. The optimized convergence curve of the special angle Yuan Da stress is shown in the following table. Different probe sections, different probe holding materials, and (3 ^ 4 · 5, 6, 7.5mm), different probes are designed according to this. The 许 $ 下 'of each contact force and transcendence deformation can be pin size and material.

569017 V. Description of the invention (π) Probe length mm Probe ## Material probe face (um% m) Contact force (g) Transcendence (um) Tungsten 20 * 20 0324 131 40 * 40 2.37 623 50 * 50 4.8 49 60 * 60 S3 40.6 80 * 80 18.9 322 100 * 100 3? 25.7 Beryllium copper 20 * 20 0.41 91 40 * 40 3.04 43.4 50 * 50 5J7 34.5 60 * 60 9.75 28.4 S0 * S0 23.5 22.S 100 * 100 44.2 18 Nickel 20 * 20 1.77 36.4 40 * 40 13 17.1 50 * 50 24.8 14.4 60 * 60 41.S 122 80 * 80 101 9,2 100 * 100 189 7.6 (b

Page 16569017 V. Description of the invention (12) Probe length 4.5 mm Probe section of probe material (um% m) Contact force (g) Deformation (um) 20 * 20 L2 287 40 * 40 8 · 8 139 50 * 50 17,9 116 60 * 60 29.4 93.2 80 * S0 662 6S 100 * 100 131 56 Yangang 20 * 20 0.27 201 40 * 40 2.05 97 50 * 50 4.2 8.2 60 * 60 6.86 65-2 80 * 80 154 47.4 100 * 100 30.6 39.4 Money 20 * 20 0.22 81 40 * 40 1,65 39.5 50 * 50 3.36 33,2 60 * 60 5.35 26 80 * S0 13 20 100 * 100 25.9 17 Page 17569017 V. Description of the invention (13) Probe length 6mm Probe # material Probe cross section (um * um) Contact force (g) Deformation director (um) Mine Ϊ 20 * 20 0.S9 521 40 * 40 6.94 257 50 * 50 133 203 60 * 60 22,6 167 80 * 80 52,4 125 100 * 100 98.6 97.6 Ammonium steel 20 * 20 0,208 365 40 * 40 1.61 179 50 * 50 31 142 60 * 60 5.27 117 80 * 80 12.2 86.7 100 * 100 23 68.3! Table 20 * 20 0.16 142 40 * 40 1.27 71 50 * 50 2.47 57.3 60 * 60 4.25 48 80 * 80 9.5 34 100 * 100 193 29 Bandit__ Page 18569017 V. Description of the invention (14) Probe length 7 . 5mm good probe sealing material 揲 needle face (um% m) contact force ( g) Deformation (um) tungsten 20 * 20 0.71 810 40 * 40 5.42 390 50 * 50 10: 7 317 60 * 60 17.5 251 80 * 80 447 205 100 * 100 63 181 key steel 20 * 20 0.16 547 40 * 40 L26 272 50 * 50 2.5 222 60 * 60 43 185 80 * 80 10.4 143 100 * 100 147 127 Nickel 20 * 20 0.12 208 40 * 40 1.03 111 50 * 50 1.9 87.7 60 * 60 3.4 74.2 80 * 80 8.2 57.2 100 * 100 1L8 51.6

d or

Column C, Lhr Needle Probe, Type C Grain Array, Momentum Degree, Roundness, Dense Crystal Height —MJ. E— Operation is to be determined by the need for physical probe measurement if the surface area is different.

Page 19 569017 V. Explanation of the invention (15) Whether there will be a norm between each other, and how big is it during simulation Η The allowable vertical deformation on the graph (Probe pitch: the amount and the probe pitch P 2 α · Δ Vertical spring 1 OOum, width 20-llOum, can be included; protruding points, for measuring the amount of [contact force sensor on the implementation, to provide probe changes not equal to zero, many, each probe will not be limited (fatigue life),

The contact will cause a short circuit, so the specification must be established before manufacturing to understand the surface height difference of the crystal grain or I c itself. It can be assumed only by the middle probe contact. From the third curve, the relationship (2) can be obtained. . A formula representing the amount of the probe (Deformation) △ 6 and the distance between the probes p > ′ where a is a constant, which indicates the deformation ratio of the probe:,

Bismuth needles, basically their size, are about 20-100um in depth, 3000-7500um in length, and the probe pitch is 30-Γ protruding points. Contains bumps. The I 2 ft pin is placed on a thin-film substrate with built-in piezoresistance. The probe at 10 g has a piezoresistance average, and the deformation of the film is about the same under a force of 10g; full strength, and sufficient fatigue °, / 3 silicon drop strength (70MPa). Design 569017 V. Description of the invention (16) Calculate adjustable variables such as film thickness, use P-type piezoresistance and piezoresistance, post-processing circuit to make piezoresistance change uniform, etc. 2 n type. The arrangement of the microprobes on the film is shown in the figure. ^ The arrangement between the probe and the pressure sensor is basically the same. The two probes can be changed with one force. The thin film piezoresistance can be different from a piezoresistor under its base post and shares another thin film piezoresistance = T t 1 to become a bridge circuit to measure the pressure 卩 I = not a text It is not too small; or one probe cooperates with a complete set of four thin and force-changing forces. Each probe is individually set at four resistances under its post, and also becomes a bridge circuit. Between 1U and 4M piezoresistors, as for the configuration of the probe and the thin film, multiple thin films can be used; or one probe can be provided on one thin film. If the distance between the big wood and the common Han is l′ 〇 ^ m ', you can use one hole and one needle', as shown in Figure 12⑷Wujian; 丨 70-12 Oum, you can use one hole and two needles, As shown in the '* 2, 184 stitches; if the distance is below 70 levels, you can use 181 stitches or 9 points in one hole. As shown in Figure 12 (c). [Preferred embodiment]

5. The implementation process of the entire probe card will be explained with the production of the vertical probe as the main axis. The implementation process is as follows. Bei Ye = Cheng Yi uses multilayer thick photoresist plating to produce multiple sets of vertical probe arrays. Qing L Cheng II uses a micro-electro-mechanical process to make upper and lower guide covers.

Page 569017

The third process uses packaging technologies such as micro-assembly and anode bonding to integrate the upper and lower sets of vertical probe arrays into a probe module.盍 〃 Process 4: Fabricate ball grid array (BGA) structure 14 of LTCC or BT / glass substrate, or use 1C process to make piezoresistive thin film substrate 10. Process 5 combines the substrate's ball grid array (BGA) structure 14 substrate with the thin film substrate 10, and leads to the printed circuit board (PCB) 15 and fixed to the printed circuit board (PCB) ', and then with the probe module of process 2 Position and join together to complete the card combination. wood

The preferred embodiment shown below, in which the electroplated metal used is a nickel-based alloy such as nickel or nickel-manganese, but the plating seed layer can also be nickel, nickel alloy, tungsten, titanium alloy, copper , Copper alloy, etc. [Probe making example] The procedure for making a vertical microprobe according to the present invention is shown in FIG. Step 1: As shown in the thirteenth figure (a), firstly spin-coat a layer of about 3 // m PI (p〇lyimide) 21 on the substrate 20 as a sacrificial layer for the entire oblique release from the substrate in the future (Sacrificial layer). Step two

As shown in FIG. 12 (b), ′ is reduced from the first layer PKpoiyimide ^ 1; the thickness of the bond seed layer 22 (Seeding layers) (Cu 100A, Cr 2 0 0A). Step 3: As shown in the thirteenth figure (c), the spin coating thickness is about 4 5 #claw thickness photoresist 2 3 On the seed layer 22, the acceleration of the first rotation speed is 1 50 0 rpin, and the second rotation speed is 3 0 0 Or pm for 10 seconds and soft roast for 5 minutes,

Page 22 569017 V. Description of the invention (18) Step 4 Step 5 Step 6 Step 7 Expose the shape of the probe with a layered mask and develop it for 120 seconds. The shape of the probe 11 is revealed by development. After that, the electricity of nickel and nickel alloy (mckel alloy) is about 2um higher than the photoresist, and then polished to make the thickness reach to the thirteenth figure (d). The table after grinding: about 50 # m photoresist 23, Become the first layer of intermediary. T One step by step, grab the needle and repeat steps 2 to 5 to get the second layer probe structure shown in Figure 13 (e) in step eight. Figure 13 (f) shows the third layer probe structure. As shown in the third figure (g), considering the degree of potential, the probe assembly can be performed after the multi-layer probe / acquisition eight-pin array is complicated. The yoke is produced in layers, as shown in the thirteenth figure (h), with 耖 — and a suitable mask is made, and the y-engraving technique (rie) is selected. CC14 + 02 can etch photoresist and = § etching reaction gas. The tail is etched. U Γ ′ Repeat step 2 to step 5 for the head of the probe. Step 9 · Figure 12 (i) shows that the head and tail of the probe are suspended. With a little bit of light removal, the probe heads of each layer are removed, and the liquid barrier 2 4 is removed. The tail is bare. Step 10: As shown in Figure 13), select PI 21 25, and place the wafer in it. 1 The photoresist liquid substrate can be detached, and then the night can be obtained: the entire probe set can be from the probe of J Xiang Tianxi 1 1 〇569017 V. Description of the invention (19) [Exemplary embodiments of the production of a pressure sensing film] Production of the present invention The procedure of the pressure sensing film is shown in Fig. 14. The technical details of this part are known techniques, please refer to Chapter 4 of Fundamental of Microfabrication (2002) by Madou, figure 4.1 °, step one step two fourteenth figure (a), First, a photoresist 23 is spin-coated on a silicon substrate 20 and then a photomask 26 is used for exposure and development. As shown in Fig. 2), boron or phosphorus 28 is then ion-implanted as a piezoresistance to temper and deposit an oxide layer 29.

As shown in the fourth figure (c), the two layers are wide and the masonry emulsion layer is 2 y open-and layer 28, metallized and lithographically etched to define the pressure =, and then the upper-layer layer is used. The cover develops and etches the insulating layer si 〇 2 31 ^ ^ The through hole of the resistance line is exposed, 'makes Akane to connect the shoulder 32. The development and etch define a layer of metal 30 on the line of the probe, and the probe 11 is a line that is subsequently contacted with C. Produced. Set 5 points instead of this step. Three: Ten: Figure (d) shows the household weight. • From the back to the thickness of the thin plate is 15_4um, Q etch the silicon substrate. The probe 11 is the position of the assembly contact afterwards. The film making process is produced. Tong Ming is not

569017 V. Description of the invention (20) [Example of making the upper and lower guide caps] The production of the needle fixed guide f, 13 is applied by micro-electromechanical technology 'Developing #etching it with: the probe aperture, the manufacturing steps are as follows: 〃 The hafnium oxide is sent into the oxidation furnace tube on the silicon substrate 20, and the front and back surfaces of the silicon substrate are dry-spinned / painted. The silicon substrate is vaporized into Si 02 31, and then a photoresist 23 is coated on the side. Required aperture mask 26, less exposure ". Then use the inductive coupling plasma (1 groove. The step should be an etching machine (deep-RIE) 3 salute P) 33 or deep ion as shown in Figure 15 (a) The depth of the perforation is about 40 Um .: Wet etching on the back of the silicon substrate-a probe guide hole preset by the original is smooth: f and the photoresist is removed to make the production, such as the tenth, good way out, Complete the step 4 of the upper and lower guide cover as shown in Figure 4 (b). In order to find out the position of the upper and lower guide cover of the probe more accurately, the lower cover of the main cup is configured to complete the cutting step of the substrate during the etching. once

1 2, 1 3, as shown in the fifteenth figure / U to get accurate upper and lower cover map. Back to C) shows an example of the assembly procedure of the bismuth needle card on the upper and lower guide caps.] Figure 6 shows the assembly process of the probe card of this' X Ming, as shown in Figure 569017. 5. Description of the invention (21) Step-: Figure 16 The three-axis positioner shown in (a) is used by Shuangcheng Technology Co., Ltd. to pick up the probe set, and if oy * stick positioner is to be obtained, f, the needle is suspended and exposed to the lower guide plate with 4 Gechuan 2's probe moment J car 1 needle card structure, the upper and lower needles of the skirt group, and fun ten a. Assemble all the probes in step two: the sixteenth figure “广 所 _ 路 #” is assembled on the upper and lower guide plates. The structure of the LV * package in the guide plates is connected together in the upper and lower steps. Anodic bonding method drips a little fixing glue on all the joints of the probes of this structure. As shown in step (4), (+) fd and (d), using the selective wet etching method, / f, Photoresist 23 and seed layer 22 (Cu, Cr). Step 5: Figure 16 (e) 'The packaged probe will be completed

The force sensor 4 can be combined, and the pressure sensor can be ^ 1-hole, 2-hole or 1-hole multi-pin, and the ball grid array (BGA) 14 expands the tiny circuit to The printed circuit board (PCB) 15 is then passed through two L-shaped metal fixtures 18, and the entire probe module is fixed on the printed circuit board (PCB). [Example] Page 26 569017

The "spear" is made into a passive or active micro-probe card using the process provided by the present invention. The probe material can be τ τ, 八, 今, # # i 目 # ^, 1 issue nju 疋 steel, or nickel, or nickel Alloy, the technical specifications can be achieved as follows: 1. Density: Number of probes> 250; Probe pitches <40um 2 · Coplanarity <5 um 3 · Needle tip: i5-20um 4 · Probe array &gt; 1 5 X 1 5 5 · Number of measurable components &gt; 1 6 · Probe compliance pin compliance: &gt; 75um 7 · Suitable for probe cards with metal pads or bumps thus completed, with the following advantages 1 High cost-effectiveness 2. Easy to combine with printed circuit board (PCB) 3. Long life cycle 4. Suitable for the currently available probe station Example 1 Memory test bare die size: 7.81 mm X 4.2 mm 'Number of test wafers : 3 2 Number of pads per wafer: 50 Pad size: 80 um X 80 um Pitch: 100 um Pad arrangement: 2 on each side 4 6 Test machine: A dvantest T 5 3 3 5

Page 27 569017 V. Description of the invention (23) ^ :: required, area is about 35mm x 32fflm, two wires, piezoresistance ^ Nine sets of probe cards' need a total of at least 1 60 0 probing, according to 70. Example 4-Designed memory test implementation example: 32; description of each chip _ X 5. 59 _;-number of test chips 85⑽; soldering distance ($ number: 58; pad size: 85 um) x HI f};: Advantest T5371 〇 ^ LCD;, 贯 Using the conventional example pad ruler + 〇n aLLD test (Pitch): 40 um .: 30 um X 60 um pad distance can be detected by the probe Lifu ,, Prepare the standard wafer first, = = ΐ = When using a pin card, using a pre-invented probe card, you can have a good coplanarity every day, and according to the test, according to this force & amp _ 1 = All the bumps or pads of the sheet are used to learn whether the probe has &amp; damage and = the sheet is compared with the force and depression of the sheet. Whether the phase or the point to be measured is deviated, if the probe card is missing Some probes can avoid the failure of the probe card due to the probe and the bump or soldering ^. Touch it well, but mistakenly think that the chip circuit test pin 'makes it longer to make a vertical spring probe. The combination of mining and micro-assembly and anode can accommodate the use of multilayer thick photoresistive precision probe cards, which can reduce the price of the pot, and the dense probe cards make the dependence. The probe array and the printed circuit board; = The artificial space-changing technology of Shiba-Jiang, it is page 569017 &amp; Invention Description (24)-^ ~ It is achieved by the ball grid array (BGA) method, which is simple and low cost. The substrate of the needle is designed as a thin film containing a pressure sensor, and the contact force of the needle is used to feedback the following: the change in the contact of the monitoring probe can be achieved, as long as it does not depart from the present invention: Within the scope of patents, "spirit" should be included in the application

Page 29

Claims (1)

569017 Elephant 9VVi * ___1 丨 _ h ▲ · ~ '「_: 7' ' The scope of the patent application is based on the micro-electro-mechanical manufacturing technology for the production of vertical probe arrays. One or two of them can be awkward. One or two can spit you. 4 + Lu Jia and n to a, 丄. The order of the eight-probe array of the clothing is 1F. The probe array is produced in a large number of batches and the distance between the probe and the probe can be adjusted and controlled quite accurately. Its main steps include:-Spin-coating a layer of photoresist PR1 On a flat substrate, make sacrifices to the substrate; |; 4 (After the probe is peeled off ^ photoresist PR1 deposited on top-electromine seed I, and then spin-coat another type of photoresist PR2: the normal distance on the top layer to Grinding—a good layer is naked at the right place—one can I— ▲ XV J type i photomask is placed on the photoresist PR2, exposed to develop the groove of the bismuth needle, and then the probe metal plating is performed to The planned thickness of the probe; then the surface is ground and polished, and the surface is further spin-coated with a photoresist pR2 interposer between the second layer of probes, which can be matched with the first-layer probe to the distance between the probes. ; To achieve more sophisticated ^ ^ The above steps can be successively obtained a lot of train complexity considerations, you can The fabrication process is followed by probe assembly work; &quot; "Clothing needles are applied to the soil mask, and the photomask is matched with the dry etching technology (RIE) * 1. The etching reaction gas is used to detect and select the photoresist PR2 and crystals. The seed layer is different between the horizontal direction produced by Ben Erbei and Guangwei Φ Gu Shi A, and then the liquid is blocked first to remove the photoresistance pR2 between the straight direction of the drill and the tail is suspended, and the rest of the exploration is magical. The tail is used to etch the probe, and the removed photoresist step is used as a solid photoresist remover to remove the photoresist PR and the substrate. It does not affect the two-pin array used as a probe for fixing. 569017 6. The scope of patent application PR2 〇2: The method referred to in item 1 of the scope of patent application, in which the arc of curvature suppression or the combination thereof is such that the pot has different angles and different probe distances. . n. It has large flexibility and small capacity. The so-called probes 'tungsten and tungsten alloys, among which the so-called probes' are sequentially layered. Each is used to provide high density tf. According to the first scope of the patent application. According to the method, "the seed layer for the matched electric ore can be nickel, nickel-copper, copper alloy. &Gt;,, t According to the method mentioned in the first item of the scope of the patent application, the" liguang "with the vertical probe The arrangement of the array, the individual pitches of the needles, and even the individual probe shape products = vertical probe cards assembled by electromechanical production. High-density production, including temporary connection and connection during circuit testing. Its main components The system is composed of the guide covers 12, 13 under the two mountains, which are located on the space partition 16 (spacer) to form a space capable of accommodating the probe array, and the perforated arrays of the upper and lower guide covers. , Covering the probe array, exposing the probe to the guide cover for about 5 and θ250mm, as a channel for guiding the probe to deform up and down, the upper guide cover 12 mainly allows the probe to slide when deformed in the vertical direction, and The lower guide cover 丨 3 is used to fix the bottom end of the probe; 1. It is set on the ball grid array (BGA) structure 14 and the probe ^ ^ is directly pressed on the pad of the ball grid array (BGA) structure 14 and the line mountain is changed to the ball grid array pad. The middle end of the probe With proper bending, it can stand upright and can be larger due to the column effect when it comes into contact with the pad or bump to be measured 1 c One uses a similar flip-chip BGA (flip-chip BGA) packaging method, which treats the pin array as a flip-chip, and design small to large connection lines in the ball-grid array (BGA) structure 14 and is installed in printing The circuit board (PCB) 15 can be used to convert the ball grid array (BGA) structure 14 wiring to the large wiring of the printed circuit board (pcB) 15, and the large wiring can be directly connected to the test instrument,-- The L-shaped clamp 18 is combined with the fixing screw 17 to combine the assembly of the ball grid array (BGA) 14 structure with the printed circuit board (PCB) 15 and the probe assembly. The L-shaped clamp 18 has a positioning groove, which can The probe is fixed on the ball grid array (BGA) 14 structured thin film substrate 10 very accurately. 6. According to the vertical probe card mentioned in Item 5 of the scope of the patent application, the so-called ball grid array (BGA) 14 structure in the basin can use low temperature dome ceramic (LTCC) or BT / glass substrates. 1 fox /, k 7. According to the vertical probe card referred to in item 5 of the scope of the patent application, the main purpose of the medium-sized fixture 18 is to fix the probe 11 on the ball grid array. The L-shaped fixture 18 can be used with a printed circuit board. (PcB) type, + circular, concentric circle type. 8 ^ According to the patent claims _5 vertical probe card, among them. The perforation arrays set on the upper and lower guide covers of the month 1,2,3 define the perforation positions, inductively coupled plasma (lcp two fine ^ "deep-RIE" 34 to make deep holes, and 3 'Muzi reaction The etching process is used to complete it. 后 After the old age, micro-electro-mechanics such as thin films are etched. First, micro-electro-mechanical production and assembly can detect the force of the probe card, which is used to provide high-density integrated circuits. 2 pins Page 35 569〇i7 蝽 1 [10, -1 6. The scope of the patent application, the main components are: the upper 'lower' cover 12 '13, divided at the two ends of the space partition 16 (spacer) ' A space for accommodating the probe array is formed, and the upper and lower guide covers are provided with perforated arrays 'covering the probe array so that the probe is exposed from the guide cover for about 50 ~ 250um' as a guide for the probe to deform up and down. In the channel, the upper guide cover 12 mainly allows the probe to slide when deformed in the vertical direction, while the lower guide cover 丨 3 fixes the bottom end of the probe; ~~ a piezoresistive thin-film substrate 10 is installed in the The main function of the ball grid array (BGA) structure 14 is to provide the force of the probe;-a piezoresistive film substrate 10 is mounted on the ball grid array (BGA) 14 structure, and the bottom end Directly press the top of the thin-film substrate 10 with piezoresistance. The wiper wiring and piezoresistive wiring on the thin-film substrate 10 are converted to solder pads of ball grid array (BGA) ^ 4 by wire bonding, which has the function of a space converter. The middle end of the probe has a proper bend, so that when the tip is in contact with the pad or bump of the IC under test, Effect and greater flexibility;-using a general ball grid array packaging method, the thin film substrate 10 is treated as a general bare die, and the small to large connection lines are designed into the ball grid array (bga) 14 structure, And mounted on the printed circuit board (PCB) 15 'to convert the ball grid array (BGA) 14 structural wiring to the large wiring of the printed circuit board (pcB) i5, and the large wiring can be directly connected to the test instrument;- -=, The L-shaped clamp 18 cooperates with the fixing screw 17 to connect the ball grid array (bga) junction 2 and the printed circuit board (PCB) 15 to the assembly and the probe assembly: :: cage Λ clamp 18 has a positioning groove 'may The probe is fixed on the thin film substrate 10 very accurately. 569017 Scope of patent application ^ · According to the ball grid array (BGA) 14 structure of the 9th patent application scope, pottery tincture (LTCC) or BT / glass substrate. It is called a vertical probe card, in which the substrate used can be a low temperature co-firing semicircular, concentric circle type. 11. The vertical probe card according to item 9 of the scope of the patent application, in which the so-called L-shaped inflammation tool is mainly used for fixing the probe on the thin-film substrate 10 provided with piezoresistance. Printed circuit board (pcB) 15 is [type, Page 37