TWI655439B - Method for measuring and evaluating a probe card using a detecting device - Google Patents

Abstract

A method for evaluating the functionality of a probe card includes: providing a probe card analyzer without a probe card interface; and removably coupling the probe card with probes to the support plate of the probe card analyzer ; Align the sensor head of the probe card analyzer with the probe card; and measure the probe assembly with the sensor head.

Description

Method for measuring and evaluating probe card with detection device [Cross-reference to related applications]

This application is a partial continuation of US Patent Application No. 14 / 282,565 with the invention titled "Inspection Device with Vertically Moveable Assembly" filed on May 20, 2014. US Patent Application No. 14 / 282,565 is 2011 The application for the invention titled "Inspection Device with Vertically Moveable Assembly" of the US Patent Application No. 13 / 093,456 (now US Patent No. 8,729,917) filed on April 25, 2015, and the US Patent Application No. 13 / 093,456 No. 61 claims the benefit of US Provisional Patent Application No. 61 / 327,220 with the invention titled “Inspection Device with Vertically Moveable Assembly” filed on April 23, 2010. All teachings of the above application are incorporated herein by reference.

The invention relates to a method for measuring and evaluating a probe card with an inspection device.

The probe card used to test the integrated circuit during the manufacture of the integrated circuit requires periodic evaluation and maintenance to avoid damage to the integrated circuit. As part of probe card evaluation and maintenance, optical inspection devices are often used to measure the X, Y, and Z positions of the probes in the probe card to determine whether the probes are flat and whether they are properly aligned with the probes. The set pattern of the bonding pad on the inspected semiconductor wafer. The device can also predict the position and length of the scrub marks formed on the bonding pad based on measurements made using fiducial plates (ie, check plates) instead of semiconductor wafers with bonding pads . Other evaluations of the probe card may also be desired.

The probe card analyzer can be used to evaluate the performance of the probe card. Many different tester platforms for probe card analyzers are available. The exact tester platform with the exact tester interface is typically about the exact probe card configuration, which in some cases must have multiple probe card analyzers. The probe card interface (PCI) is a very expensive part of the entire probe card analyzer.

Even if each probe is very small, the force required to achieve the appropriate amount of scrubbing is a few grams. In the case of hundreds or thousands of probes in a single probe card, the amount of force overtraveling the probe to achieve a suitable scratch can be very high. Normally, the overtravel of all probes occurs simultaneously. For example, the device may have a conductive check board that is used to measure the Z height of each separately wired probe and the Z height of the lowest of a set of bus bar wired probes (Some probes are wired together, making it impossible to electrically separate signals from each other). In this Z height measurement program, the check board is driven to contact all the probes, and when each probe (or a group of probes) is brought into electrical contact, the Z height of the check board is recorded.

To measure the XY position of the probe (also known as the alignment of the probe), the image of the probe can be captured. In some cases, the probe is positioned within the image of the stage on which the camera is mounted and the linear encoder to be used to help determine the XY position. In other cases, the position of the probe is relative to the fiducial mark formed on the window in the image. Due to the large force involved in overtraveling all probes into contact with the reference plate, bending in the detection system and probe card can occur. Therefore, it is desirable to minimize the applied force.

In addition to minimizing the amount of force applied to the probe card, it is also desirable to minimize the amount of wear experienced by the probe card and its probe. For example, in systems such as those described in US Patent Nos. 5,657,394 and 6,118,894, the probe must land every time an optical alignment measurement is made. Even if it is considered that multiple probes can be taken together, in the case where the probe card has hundreds or thousands of probes, each probe and probe card will be subjected to very unnecessary wear and tear, and this wear is inevitably Causes a shorter life of the probe card and its probe.

Therefore, the analysis of the less expensive system and method for carrying out the evaluation of the probe card and the analysis that minimizes the stress placed on the probe card and its probe and similarly minimizes the wear of the probe card and its probe There is a demand for a mechanism for probe cards.

Some aspects according to the principles of the present disclosure relate to a method of evaluating the functionality of a probe card. This method includes: providing a probe card analyzer without a probe card interface; removably coupling the probe card with probes to the support plate of the probe card analyzer; and sensing the probe card analyzer The probe head is aligned with the probe card; and the probe head is used to measure the components of the probe.

Other aspects according to the principles of the present disclosure relate to a method of evaluating probe cards. The method includes: providing a probe card analyzer including a support plate and a sensor head; coupling the adapter to the support plate; coupling the probe card with the probe to the adapter; and using the sensor head Addressing the probe card through the hole of the support plate; and performing mechanical measurement of the probe.

Other aspects in accordance with the principles of the present disclosure relate to a method of monitoring probe cards. This method includes: establishing a first service time interval for the probe card; establishing a second service time interval for the probe card; removably coupling the probe card to the probe card analyzer; and During a service interval, the probe card is evaluated without using the probe card interface.

90‧‧‧Housing

92‧‧‧vehicle; retracted position

92'‧‧‧Extended position; second position

93‧‧‧Image device

94‧‧‧Actuator

98‧‧‧stage

100‧‧‧ testing device; testing system

101‧‧‧ dotted line

102‧‧‧Check board

200‧‧‧Objective Focus Flexor

202‧‧‧ Top section

204‧‧‧Bottom section

206‧‧‧Middle section

208‧‧‧flexion point

210‧‧‧Optical axis

212‧‧‧shaft collar; flange

214‧‧‧Sag

216‧‧‧Convergence point

Around 218‧‧‧

220‧‧‧fixing screw opening

222‧‧‧Bottom

224‧‧‧Screw hole

226‧‧‧Gap

300‧‧‧Cam assembly

301‧‧‧actuation surface

302‧‧‧Actuator

304‧‧‧Slope

304a‧‧‧The first slope

304b‧‧‧Second slope

306‧‧‧Inner radius

308‧‧‧Outer radius

310‧‧‧First plane surface

312‧‧‧ Initial stepped surface

314‧‧‧inclined surface

316‧‧‧ Terminate the ascent platform

320‧‧‧vehicle

322‧‧‧Top surface

324‧‧‧Hollow Center

326‧‧‧Bottom surface

328‧‧‧Top ring

330‧‧‧oblique cone

332‧‧‧Bottom ring

334‧‧‧hard point

336‧‧‧leading edge

338‧‧‧Fate

340‧‧‧Outer edge

350‧‧‧bearing assembly; bearing

352‧‧‧shaft

354‧‧‧Bearing body

356‧‧‧Inner diameter wall

358‧‧‧Outer diameter wall

360‧‧‧Outer diameter

400‧‧‧Shell

402‧‧‧Objective

404‧‧‧window

406‧‧‧Optical axis

408‧‧‧Objective focusing mechanism

410‧‧‧Resilient member

420‧‧‧Elbow assembly

500‧‧‧probe card analyzer

501‧‧‧ Probe Card Analyzer

502‧‧‧Support plate

503‧‧‧ Hub

504‧‧‧Probe Card Interface (PCI)

506‧‧‧Probe card

510‧‧‧probe

520‧‧‧Sensor head

521‧‧‧Check board

528‧‧‧pillar

529‧‧‧ Load element type

530‧‧‧land

532‧‧‧Adapter

533‧‧‧ clamping mechanism

C‧‧‧Camera

d‧‧‧Depth

R‧‧‧Extended radius

r‧‧‧radius

FIG. 1 is a schematic side view of an embodiment of a detection device according to the present disclosure.

2A to 2G are embodiments of an objective focusing flexor according to the present disclosure.

3A to 3G are the objective focus flexors according to the present disclosure 的 实施 例。 Examples.

4A to 4D are embodiments of the cam assembly according to the present disclosure.

5A to 5C are embodiments of the housing, carrier, and actuator assembly according to the present disclosure.

Figure 6 is a schematic side view of a prior art probe card analyzer.

7A and 7B are schematic diagrams of embodiments of probes.

8 is a schematic side view of a probe card analyzer with a probe card according to an embodiment.

9 is a schematic side view of a probe card analyzer according to another embodiment.

FIG. 10 is a schematic perspective view of the probe card analyzer shown in FIG. 9.

11A is a schematic diagram of the detection device and the probe depicted in FIG. 1.

11B is a partial schematic diagram of an embodiment of a sensor head of a probe card analyzer according to the present disclosure.

Some aspects according to the present disclosure relate to detection devices used with check plates and probe cards. With this in mind, an embodiment of the detection device 100 is generally depicted in FIG. 1 and includes a flow path that is independent of vertically cycling the window / pin upward and downward. The verification mechanism 102 is installed again. This minimizes the complexity and flexion of the entire assembly due to the effects of others. The inspection board and reciprocating mechanism are coupled to the XY and Z stages.

FIG. 1 is a schematic diagram of an embodiment of a detection device 100. Although the inspection device 100 will be described as being used in the inspection of semiconductor probe card pins, it is to be remembered that the inspection device 100 may have applications other than those specifically used here. In general, the detection device 100 has an external body or casing 90, a carrier 92, and an actuator 94.

The carrier 92 is installed in the housing 90 and reciprocates vertically in the Z direction as indicated by the adjacent arrows. The carrier 92 moves between the first position (retracted position) indicated by the element symbol 92 and the second position (extended position) indicated by the element symbol 92 '. In one embodiment, the carrier 92 is shifted from its extended position 92 'to the retracted position 92 by gravity. At the second position 92 ', the upper surface of the carrier 92 may contact the object under inspection. In some embodiments, this may be a probe or stylus of a probe card. In other embodiments, the object under inspection (not shown in FIG. 1) may be some other object as required by the application. It should be noted that the upper surface of the carrier 92 can bend the object under inspection, but in all cases, move the upper surface of the carrier 92 into contact with the object under inspection, or move the carrier at least into proximity inspection The object in will help to locate the object under inspection in the Z direction. That is, in the case of contact with the upper surface of the carrier 92, the exact position of the object under test is known (even if the object has been bent or deformed by the contact). Similarly, if there is no contact between the upper surface of the carrier 92 and the object under test, one can know that the object is positioned as desired or acceptable Outside the range of the location. Since the carrier 92 is provided with a conductive coating, or the upper surface of the carrier 92 itself is conductive, the contact between the carrier 92 and the object under test can be determined by electrical contact. The contact can also be determined optically by viewing the object under test through the upper surface of the carrier 92. It should be noted that in the case where the upper surface of the carrier 92 is substantially a transparent window and the inspection system 100 provides the required optical path, the object under inspection is located on the optical axis of the central channel through which the light can pass through the carrier 92 And, a camera or other imaging device 93 can be used to view the object under inspection through the inspection system 100.

In one embodiment, the housing 90, carrier 92, and actuator 94 of the detection system 100 are mounted on a stage 98 that is movable at least on the XY plane. In general, the object under test will remain stationary, although it will be known that in some applications, those skilled in the art can reverse this configuration and cause the object under test to be relative to the housing 90, the carrier 92 and the The actuator 94 moves at least on the XY plane. The stage 98 can also move in the Z direction, although in some embodiments and applications of the inspection system 100, the reciprocating movement of the carrier 92 may be sufficient for all movements in the Z direction. It should be noted that in the case where contact is desired between the object under inspection and the inspection board 102, it may be desirable to couple the inspection board 102 to the stage 98 (shown by the broken line 101) (Point out) so that the inspection board 102 and the stage 98 move together. Although shown in FIG. 1 as being close to each other (the inspection board 102 with holes passing through allows the carrier 92 to extend through and above the upper surface of the inspection board 102), the inspection board 102 and the housing 90 / load on the stage The tool 92 assembly can be spatially separated so that the inspection board 102 is undamaged Upper surface. In many embodiments, it may be desirable to avoid physically coupling the inspection board 102 to the housing 90 in order to avoid the object under inspection and the housing 90 / carrier 92 / actuator 94 assembly and The contact between any one or both of the inspection board 102 is deformed in the housing 90 / carrier 92 / actuator 94 and / or the inspection board 102.

Since the embodiment shown in FIG. 1 must be schematic in nature, one can easily understand that the detection system 100 shown can be implemented in different physical modes.

In consideration of the above, the detection device 100 includes an objective focus flexure 200 and a cam assembly 300, which are described in more detail below. Generally speaking, the objective lens focusing flexure 200 holding the objective lens for focusing is operated together with the reciprocating cam assembly 300 to ensure proper focusing. The focal plane of the detection device 100 will usually be fixed, but the position of the focal plane can also be modified. This flexor focusing device has many uses in addition to probe card detection. Applications that want focus adjustment may benefit from the present disclosure. Such applications include medical devices, cameras or video recording devices, and various other manufacturing, testing, and quality control devices.

2A-2G and 3A-3G, the objective lens focus flexor 200 is a hollow cylindrical member. The objective lens focus flexor 200 has a top section 202, an opposing bottom section 204, and a middle section 206 between the top section 202 and the bottom section 204. Resilient couplings like the flexion point 208 are positioned in the interface area between the middle section 206 and the top section 202 and between the middle section 206 and the bottom section 204. The flexion point 208 is resilient in the axial direction of the objective focusing flexor 200, and the diameter of the objective focusing flexor 200 It is substantially rigid in the direction. In one embodiment, the objective lens focus flexor 200 is made of a single piece of material.

In one embodiment, the top section 202 includes a collar or flange 212 that extends to the outside of the objective focusing flexor 200. The outer diameter of the collar / flange 212 is larger than the outer diameter of the body of the objective focusing flexor 200. In an embodiment, the inner diameter is constant throughout the top section 202 including the collar 212.

The middle section 206 includes a recess 214. In one embodiment, the depth “d” of the recess 214 tapers into the body of the objective focusing flexor 200. The recess 214 linearly follows along the x-axis, while the body of the objective focusing flexor 200 is circular. In an embodiment, the middle section 206 includes a convergence point 216 along the z-axis. In an embodiment, the middle section 206 is at least partially screwed onto the inner periphery 218. In one embodiment, the middle section 206 includes a fixing screw opening 220 to assist in fixing and aligning the objective focusing flexor 200 within the elbow assembly (not shown).

2G, the bottom section 204 has a bottom surface 222 that is generally ground plane. In an embodiment, a screw hole 224 in the bottom surface 222 is provided for attachment of the objective focusing flexor 200 to the toggle assembly.

As described above, the flexion point 208 is established at a position along the periphery of the objective focusing flexor 200 at the opposite end of the middle section 206. Multiple cross-sections through the area of the flexion point 208 are shown in FIGS. 3B to 3G. In an embodiment, each of the flexion points 208 is constructed to extend a radius "R" from the objective axis 210 of the objective focusing flexor 200 to a point toward the outside of the flexor. In one embodiment, the extension radius "R" is larger than the radius "r" of the outside of the objective focusing flexor 200 (for example, see FIG. 3B).

In one embodiment, the flexion points 208 are constructed on a plane level and are evenly spaced along the circumference of the objective focusing flexor 200. 3B to 3G show a plurality of plane levels according to an embodiment of the objective focus flexor 200. In one embodiment, there are at least two plane levels of flexion points 208, and each plane level includes a flexion point 208 offset from an adjacent plane level. In one embodiment, the flexion points 208 are evenly offset along the circumference. In one embodiment, where there are at least three adjacent planar levels, the alternating levels include flexion points 208 at the same position along the circumference, for example, the first and third levels include the same along the circumference Flexion points (eg, see FIGS. 3B and 3D). In one embodiment, the opposite side of the flexion point 208 corresponds to the outer periphery. The flexion point 208 connects the upper and lower surfaces to the adjacent level or top section 202 or bottom section 204. Along the surroundings, between the flexion points 208, voids 226 are formed without material. The gap 226 forms a clearance in the level / plane. In one embodiment, the void 226 covers a larger surrounding area than the flexion point 208. In a preferred embodiment, there are three adjacent plane levels that constrain five of the six degrees of freedom.

In one embodiment, in order to use the objective lens focus flexor 200 to adjust the focus on positioning, the middle section 206 is adjusted along the optical axis 210, and the top section 202 and the bottom section 204 remain fixed. Alternatively, the top section 202 and the bottom section 204 are adjusted along the optical axis 210, and the middle section 206 remains fixed.

Now referring to the cam assembly illustrated in FIGS. 4A to 4D The embodiment of 300, wherein the actuator 302 is a disc-shaped, hollow, cylindrical cylindrical rotating cam. The actuator 302 includes an interior that is open along the central axis. The cam assembly 300 has an actuation surface 301 that includes at least one ramp 304. At least one ramp 304 has an inner radius 306 and an outer radius 308 and extends from the first planar surface 310 of the actuator 302. In one embodiment, the at least one ramp 304 includes an initial stepped surface 312, an inclined surface 314, and a terminating ascending platform 316. In one embodiment, at least one ramp 304 is a series of ramps 304 configured in a circular pattern to form a ring shape. With particular reference to FIG. 4C, in one embodiment, the series of at least one ramp 304 is configured such that the initial stepped surface 312 of the first ramp 304a is followed by the initial stepped surface 312 of the second ramp 304b. In an embodiment, there is a gap between each of the at least one ramp 304, where the length of the planar surface 310 is exposed. In one embodiment, at least one ramp 304 is equidistantly separated from the other in the series.

In an embodiment, the inner radius 306 of the actuator 302 is constructed to fit along the peripheral radius of the carrier 320. In an embodiment, the outer radius of the at least one ramp 304 is smaller than the outer radius of the carrier 320, although they may be substantially equal. In one embodiment, the carrier 320 includes a multi-layered top surface 332 and a hollow central portion 324 extending from the top surface 322 to the opposite bottom surface 326. In one embodiment, the top surface 322 includes a top ring 328, an oblique cone 330, and a bottom ring 322 that are concentrically arranged from the hollow center portion 324, respectively. The carrier 320 has an outer periphery protruding with at least one hard point 334. In one embodiment, and with particular reference to FIG. 4B, at least one hard spot 334 includes a leading edge 336, a following edge 338, and an extension extending from the leading edge The outer edge 340 between the edge 336 and the following edge 338. In one embodiment, the at least one hard spot 334 includes a bottom surface 342 that is planar with the bottom surface 326 of the window carrier 320. The carrier 320 may be assembled or formed from a single piece of suitable material.

4A to 4D, at least one bearing assembly 350 has a shaft 352 extending from a central shaft opening in the bearing body 354. In one embodiment, the bearing body 354 is rotatable about the shaft 352. In one embodiment, the bearing body 354 contains bearing balls between the inner diameter wall 356 and the outer diameter wall 358. In one embodiment, the bearing body 354 includes an open surface and a closed surface. In one embodiment, at least one bearing assembly 350 is coupled to the carrier 320, wherein the distal end of the shaft 352 is inserted into a hole of the outer diameter of the carrier 320 adjacent to at least one hard point 334. In an embodiment, the open surface of at least one bearing body 354 is close to the proximal end of the shaft 352. In one embodiment, the open surface is adjacent (but not touching) the outer periphery of the carrier 320 and the leading edge 336 of the hard spot 334. In an embodiment, the bearing assembly 350 is positioned so that the outer diameter 360 is not aligned with the bottom surface 342 of the hard spot 334. In an embodiment, the outer edge 340 of the at least one hard spot 334 extends laterally beyond the outer radius 308 of the at least one ramp 304.

The actuator 302 is rotatable relative to the carrier 320. In an embodiment, when the actuator 302 rotates in a counterclockwise direction, the carrier 320 remains axially fixed. In this manner of rotation, the bearing assembly 350 leads each hard point 334. During rotation, the hard spot 334 travels across the exposed first planar surface 310, and then the bearing assembly 350 contacts the stepped surface 312 of the ramp 304 until the hard spot 334 contacts the stepped surface 312, whereby The tool 320 is lifted axially by a distance equal to the height of the stepped surface above the first planar surface 310. As the rotation continues, the bearing 350 intercepts the inclined surface 314 of the ramp 304 and the hard spot 334 rises freely. When the bearing 350 reaches the apex to the end rising platform 316, the leading edge 336 of the hard point 334 contacts the end rising platform 316. As the actuator 302 continues to rotate, the leading edge 336 of the hard spot 334 travels past the upper edge of the terminating rise platform 316 until the bearing 350 freely rises. When the actuator 302 rotates to its final position, the bottom surface 342 of the hard spot 334 slides along the terminal ascending platform 316, further raising the carrier 320 above the brake 302. In one embodiment, when the hard point 334 is in contact with the actuation surface 301, there is a gap between the outer diameter 360 of the bearing assembly 350 and the planar surface of at least one ramp 304 and the planar surface of the planar surface 310 (eg, 3 Mil).

When assembling, for example, in the semiconductor detection device implemented in FIG. 5B, the objective lens focusing flexor 200 as a focusing mechanism is assembled in the central channel of the housing 400. In an embodiment, the middle section 206 of the objective focusing flexor 200 is coupled to the housing 320, and the top section 202 and the bottom section 204 are freely movable relative to the housing 400. In another embodiment, the top section 202 and the bottom section 204 of the objective lens focus flexor 200 may be coupled to the housing 400, and the middle section 206 may move freely relative to the housing 400. The actuator 302 is positioned within the housing 400 at the top end 202 of the objective focusing flexor 200.

The actuator 302 is positioned within the housing 400 such that at least one actuation surface 301 of the actuator 302 can selectively bear against at least one bearing surface of the carrier 320, the actuator 302 in the first position and the second Actuatable between positions. In this first position, the bearing surface allows the carrier 320 to maintain or return to its retracted position, and in this second position, the force abuts against the carrier 320 by at least one actuating surface At least one bearing surface is applied to move the carrier 320 to its extended position. The objective lens 402 is inserted into the objective lens focusing flexor 200 and the housing 400. The objective lens 402 is assembled inside the objective lens focusing flexor 200, and is movably secured by screwing the objective lens 402 to the middle section screw 218 of the objective lens focusing flexor 200. In the case where the middle section 206 of the objective focusing flexor 200 is coupled to the carrier 92, the objective lens 402 is coupled to the middle section 206 such that the middle section 206 of the objective focusing flexor 200 is along the optical The axis 406 moves. Alternatively, when the top section 202 and the bottom section 204 are coupled to the carrier 320, the objective lens 402 is coupled between the top section 202 and the bottom section 206 of the objective focusing flexor 200, so that the objective lens is focused and flexed The top section 202 and the bottom section 206 of the device 200 move along the optical axis 406 of the objective lens 402 with each other and with the objective lens 402. The vehicle 320 with the window 404 secured to the top ring 328 is coupled to the toggle assembly 420. As shown in FIGS. 5A and 5C, the resilient member 410 is coupled between the carrier 320 and the housing 400, and the resilient member 410 is between the retracted position and the extended position of the carrier 320. The axial direction defined by the movement is resilient, and the relative rotation about the axial direction within the housing 400 relative to the carrier 320 is largely rigid. The window 404 is assembled above the protruding end of the objective lens 402 directed close to the top section 202 of the objective focusing flexor 200. The objective lens 402 assists in maintaining the top section 202 and the bottom section 204 in a plane parallel relationship with each other.

Referring to the above, the rotation of the actuator 302 causes the actuator 320 and the window 404 to adjust vertically when the hard point 334 and the bearing 350 move along the inclined slope 304. The objective lens focusing mechanism 408 is an adjustment mechanism that engages the objective lens focusing flexor 200 at the recess 214 in the toggle assembly 420, and is adjusted along the optical axis 406. In an embodiment, the objective lens focusing mechanism 408 is coupled between the housing 400 and at least one of the top section 202 and the bottom section 204 of the objective lens focusing flexor 200, and actuation of the objective lens focusing mechanism 408 results in The relative translation of the top section 202 and the bottom section 204 relative to the housing 400. In another embodiment, the objective focusing mechanism 408 is coupled between the housing 400 and the middle section 206 of the objective focusing flexor 200, and actuation of the objective focusing mechanism 408 causes the middle section 206 to be relative to the housing 400 Relative translation. Upon actuation, the flexion point 208 of the objective focusing flexor 200 deforms, and there is a substantially zero bend from a plane parallel position.

According to the principles of the present disclosure, the cam assembly 300 and the objective focusing flexor 200 can be assembled and used as part of the inspection system assembly. Other aspects of the inspection system assembly are described below.

FIG. 6 shows a probe card analyzer 500 with a support base 502 to which a probe card interface (PCI) 504 is secured in the prior art. PCI 504 provides a mechanical connection and more important electrical connection between probe card 506 and probe card analyzer 500. PCI 504 connects individuals or groups of probes 510 to a test circuit (not shown) for transmitting electrical signals through the probes and for receiving synthesized signals to determine whether they are operating properly.

The support plate 502 can be rotated around the hinge 503 to position the probe card 506 secured to the support plate 502 as shown in FIG. 7A Point downward or "live bug", or point upward or "dead bug" as shown in FIG. 7B. In the "pin-down" orientation, the probe 510 of the probe card 506 can be physically and electrically detected. Typically, this is made using a probe card analyzer 500 that determines the alignment of the probe 510 (XYZ in two states) and various physical and electrical characteristics. Such various physical and electrical characteristics include but are not limited to probes Needle resistance, capacitance, probe force, channel testing, leakage, and component testing. The probe card analyzer 500 can also perform cleaning of the probe card 510 and allow manual reprocessing or repair of the probe card 510. The support plate 502 can position the probe card 506 so that the microscope or camera C can acquire the image of the probe 510 and provide the operator with a close-up image of the probe to facilitate reprocessing or repair.

As seen in FIG. 6, the probe card interface 504 supports the probe card 506 and provides a connection point between the probe 510 of the probe card 506 and the electrical test system (not shown) of the probe card analyzer 500. Since each probe card interface 504 is unique to each probe card 504, other aspects of electrical connection and testing are impossible. The user of the probe card 506 must have all types of probe cards 506 for use. At least one probe card interface 504 used. In the case where multiple probe cards of various types 506 are in use, the throughput issue may have to obtain multiple probe card interfaces 504, store them, and then use them when needed. For example, in the case where 20 probes are used for electrical testing of semiconductor devices, there cannot be more than one additional probe card 506 (if any) to replace the improperly functioning probe card 506. If two or more probe cards 506 do not work at the same time, it is necessary to make them Operate again as soon as possible. Performance maintenance of two or more probe cards 506 on each probe card analyzer 500 at the same time may be required to avoid costly downtime, and traditionally this has always been multiple probe cards Interface 504 is available. However, it has recently been determined that the probe card interface 504 is not necessary in all cases. In some cases, the inspection and maintenance of the probe card 506 may only require a limited number or type of more mechanically-oriented tests (eg, flatness, alignment, scratching). It can be implemented in the case of an expensive test card interface 504 mechanism.

According to several aspects of the invention, a probe card analyzer that does not include a probe card interface is shown in FIGS. 8 and 9. The probe card 506 is secured to the support plate 502 either directly (as shown in FIG. 8) or using an adapter 532 (as shown in FIG. 9). In these two embodiments, the probe card 506 can be addressed by the sensor head 520 of the probe card analyzer 501. The sensor head 520 may include one or a combination of different sensors or mechanisms that facilitate analysis of the performance of the probe card 506. In general, the sensor head 520 can move on the XY plane, which is intended to be substantially parallel to the plane defined by the end of the probe 510 of the probe card 506, which is nominally defined. In some embodiments, the sensor head 520 can be moved toward and away from the probe card 506 so that the tip of the probe 510 can contact a selected portion of the verification board 521 that can be part of the sensor head 520. In other embodiments, the sensor head 520 may be positioned adjacent to the probe 510 of the probe card 506, and the probe 510 is then sequentially contacted by the detection device 100, as described in conjunction with FIG. 1 and as shown Further depicted in 11A. In another embodiment, as shown in FIG. 11B, the probe 510 may be brought into contact with the sensor head A post 528 that is part of 520, which is adapted to measure the force applied between the post 528 and the probe or probes 510 in contact with the post 528. In this way, the force-based flatness is determined to be measured with the post 528 without electrical contact (ie, without PCI 504). The column 528 also provides measurements such as loop back probes. The sensor head 520 may include a check board 521, a detection device 100, and / or a post 528. It should be noted that the entire sensor head 520 or other parts thereof (such as the detection device 100 or the column 528) may include a load cell type element 529 to measure the application of one or more probes Of force. In this embodiment, a separate post 528 is unnecessary. In yet another embodiment, the verification board 521 of the sensor head 520 may contact multiple probes 510 at the same time.

Regarding the sensor head 520 and the verification board 521, and the detection device 100 and / or post 528 that can be formed as part of it, it is understood that each of these devices is or can be constructed and configured to conduct electricity or telecommunications number. Regarding the inspection board 521, the general appearance is made of a metal material such as carbide having both abrasion resistance and electrical conductivity. Other forms can be made of glass plates (reference plates) with sufficient thickness to maintain rigidity and with conductive coating. The post 528 may be provided with a conductive coating such as the detection device 100, or may be made of a conductive material electrically isolated from other parts of the sensor head 520 in which the post 528 is installed. Each of these structures can be electrically coupled to devices for recording and / or processing such signals, for example, computers, controllers, types of processors commonly used to control independent or networked semiconductor inspection, Meters and processing tools. In one case, a personal computer with suitable input / output communication equipment was used.

In operation, the sensor head 520 that is addressed to the probe card 506 (which is secured to the support plate 502) without using the probe card interface 504 can be implemented on the probe card 506 by the probe card interface 504 Many of the same tests or analyses that can be performed with the support plate 502 secured. For example, the sensor head 520 can determine the alignment of the probe 510 of the probe card 506, and capture the X, Y, and Z positions of the end of each probe at both the free hanging or overtravel positions. From this information, it can be determined whether there are physical displacements of individuals, groups, or arrays of probes that can affect their performance during use. The amount of force applied by one or more probes of the probe card can also be measured using the sensor head 520. Cleaning of dirty probes can also be carried out.

Since the probe card analyzer 501 does not include a probe card interface, automated electrical testing is somewhat limited. However, the support plate 502 provides simple physical access to the probe 510 and the circuits and components of the probe card 506, and thus the user can perform many manual and / or partially automated electrical analyses of the probe card 506 , Like contact resistance (CRES) measurement. 8 and 9 again, a portion of the probe card 506 may be connected to the ground 530. The initial probe plane can only be determined by a single connection to the ground plane of the probe card 506. Later, we can apply manual, conductive probes (not shown) to other parts of the probe card to measure certain electrical characteristics of the probe card, such as resistive, capacitive, and component functionality. This can be manual, or in some embodiments a semi-automatic procedure. Another measurement that can be performed is to determine the lowest suspended probe of probe card 506 connected to ground 530 by determining the position of sensor head 520 when the first ground probe contacts sensor head 520针 510.

With further reference to FIG. 8, the probe card 506 may be directly coupled to the support plate 502, wherein the support member has a structure conforming to the size and shape of the probe card 506. The support plate 502 has a hole (not shown) formed through it, this hole allows the probe 510 of the probe card 506 to be borrowed when the probe card 506 is directed downward with its pin downward (for example, also see FIG. 7A). The sensor head 520 is addressed. With additional reference to FIG. 10, the probe card 506 may be removably coupled to the probe card 502 using a clamping mechanism 533 such as a bolt, a clamping member, a braking member, and the like.

9, for example, in the case where the hole of the support plate 502 is too large for a given probe card 506 or has a wrong shape, the probe card 506 can be secured by attaching the adapter 532 to the support plate 502被 固 到 助 板板 502。 Be firm to the support plate 502. The probe card 506 can then be removably coupled to the adapter 532 for testing. In one embodiment, the adapter 532 is a simple metal bracket that is coupled to the support plate 502 and includes a coupling structure (not shown), such as a land, a flat, or Kinematic mount suitable for unique probe card 506 or range of probe cards 506 tested. Only the minimum hold-down force of the probe card 506 to the adapter 532 is required, however, in some cases, it is necessary to force the compliance of the probe card 502 to the adapter 532, for example, the probe The card is prestressed, etc. The adapter 532 positions the probe 510 above (or below) the support plate 502 with a suitable working distance. The adapter 532 can have an opening (not shown) that can be aligned with a hole formed in the support plate 502, and the hole in the support plate 502 allows the probe card 506 to point downward at its pins (for example, Ginseng In FIG. 7A), the probe 510 of the probe card 506 is addressed by the sensor head 520. In situations where the probe card interface 504 can cost as much as $ 100,000, we can know that using a relatively inexpensive adapter 532 can be economically beneficial. Additionally, the alignment measurements obtained using the adapter 532 are well correlated with the same measurements obtained using the probe card interface 504. In one embodiment, the alignment measurement obtained using the adapter 532 and the measurement obtained using the probe card interface 504 have a 95% correlation with each other.

In one embodiment, the usable life of the probe card 506 (ie, the estimated number of repetitions or uses) is defined by the user. During the useful life (functional life) of the probe card 506, a service time interval is established for the probe card 506 to establish the tests performed by the probe card analyzers 500, 501. In one embodiment, the probe card 506 will have a first service time interval that is established for use of the probe card analyzer 501 without PCI 504 to evaluate the functionality of the probe card 506, And with a second service time interval, this second service time interval is established for use of the probe card analyzer 501 with PCI 504 to evaluate the functionality of the probe card 506. These service intervals can be set on a priori basis without referring to the actual function of the probe card itself. However, in some other embodiments, it is desirable to modify the service time interval or procedure based on data or criteria derived from the operation of the probe card itself.

In another embodiment, the baseline functional performance of the probe card 506 performance is established or determined, and the service interval can be established from this baseline functionality. In other words, the first set of criteria related to the operation of the probe card 506 can be defined and based on the first set of criteria with or without the adapter 532 The probe card analyzer 501 is used for a limited analysis of the probe card 506. A second set of criteria related to the operation of the probe card 506 can also be defined, and a more complete analysis of the probe card 506 is performed using the probe card analyzer 500 including PCI 504 based on the second set of criteria.

With the use of adapter 532 or without adapter 532, probe card interface 504 can take many forms. In one embodiment, many similar probe cards 506 (ie, probers) used in electrical test systems are monitored over time. Criteria related to the performance of the probe card 506 can be measured and evaluated to determine whether the probe card 506 is operating properly. The criteria may include, but is not limited to: repeated failure of the device tested by the exact portion of the specific probe card 506 (representing a damaged probe or circuit in a specific area of the probe card); the capacity of the device under test The reduction, where the reduction is not confirmed by a similar probe card 506 (representing that the probe card generally does not reach the standard operation); the electrical test value deviating from the standard value (representing due to corrosion, debris, or probe card The deterioration of the probe card's functionality due to component degradation); the optical detection results of the probe marks (representing alignment problems); and the electrical and optical detection information directly obtained from the spot check by the prober itself. Other criteria and information can be obtained or exported as needed. In any case, in the event that the obtained data represents a failure requiring extensive electrical testing for diagnosis or repair, a standard probe card interface 504 can be used to test and repair the probe card 506. In other cases, the data obtained can be determined to describe a more modest problem, such as the probe card 506 has deformed the probe; in this case, a simple adapter can be used. It should be noted that it is often the case that multiple probe card analyzers are set up to perform analysis on similar probe cards in parallel. In these cases For example, it is even less expensive to use multiple probe card analyzers 501 equipped with adapters 532, and to use fewer or even no probe card analyzers 500 equipped with probe card interfaces 504, To maintain the probe card.

In other environments, the probe card analyzer 500 with the probe card interface 504 is used to analyze the probe card 506 exhibiting a malfunction, but the probe card analyzer 501 equipped with the adapter 532 is used for more ordinary Periodic and planned maintenance testing. For example, a given probe card 506 may have established one or more service time intervals, at which time, this type of basic entity and electrical detection may be implemented on the probe card analyzer 501 with adapter 532 get on. More significant problems with the probe card 506 that occur outside the established service time interval can be evaluated using the probe card analyzer 500 (if provided) provided with a complete probe card interface 504.

In still other environments, only the probe card manufacturer will maintain the complete probe card interface 504 for a given probe card design. This probe card interface can be used to fully qualify one or more probe cards 506 that are later transported to a remote location where the complete probe card interface 504 is not available. The probe card 501 equipped with the adapter 532 can be used for analysis and maintenance.

Although this disclosure has been described with reference to preferred embodiments, those skilled in the art will recognize that changes can be made formally and in detail without departing from the spirit and scope of the disclosure.

Claims (22)

A method for evaluating the functionality of a probe card includes: providing a probe card analyzer without a probe card interface; removably coupling the probe card with probes to the support of the probe card analyzer Board; align the sensor head of the probe card analyzer with the probe card; and use the sensor head to measure the characteristics of the assembly. The method for evaluating the functionality of a probe card according to item 1 of the scope of the patent application further includes: installing an adapter to the support plate, wherein the adapter is constructed to accommodate a variety of probe cards Installation; and the adapter card is used to removably couple the probe card to the support plate. The method for evaluating the functionality of a probe card according to item 1 of the patent application scope, wherein the probe card is removably directly coupled to the support plate. The method for evaluating the functionality of a probe card according to item 1 of the patent application scope further includes: rotating the support plate to position the probe card to face upward. The method for evaluating the functionality of a probe card according to item 1 of the patent application scope, wherein aligning the sensor head includes repositioning the sensor head along the XY plane. The method for evaluating the functionality of a probe card according to item 1 of the patent application scope, wherein the components of the probes are evaluated at the time of the first service. The method for evaluating the functionality of a probe card according to item 1 of the patent application scope, wherein the measurement assembly includes a check board that contacts the ends of the probes of the probe card against the sensor head. The method for evaluating the functionality of a probe card according to item 1 of the scope of the patent application, wherein the column of the sensor head is constructed to measure the force applied between the column and the probe. The method for evaluating the functionality of a probe card according to item 1 of the patent application scope, wherein the column of the sensor head is movable along the z-axis. The method for evaluating the functionality of a probe card according to item 1 of the patent application scope, wherein the sensor head includes a check board, and the sensor head is independent of the support plate and can be The plane virtually defined by the end of the needle moves on a substantially parallel XY plane. A method for evaluating a probe card includes: providing a probe card analyzer including a support plate and a sensor head; coupling an adapter to the support plate; coupling a probe card with probes to the adapter The connector; address the probe card with the hole of the sensor head through the support plate and through the hole of the adapter; and perform mechanical measurement of the probes. The method for evaluating a probe card according to item 11 of the patent application scope, wherein performing the mechanical measurement includes: acquiring the three-dimensional position of the end of at least one probe. The method for evaluating a probe card according to item 12 of the patent application scope, wherein capturing the position of the end includes capturing a free hanging position. The method for evaluating a probe card according to item 13 of the patent application scope, wherein capturing the position of the end includes capturing an overtravel position. The method for evaluating a probe card according to item 12 of the patent application scope includes determining the physical displacement of at least one probe. The method for evaluating a probe card according to item 11 of the patent application scope further includes manually manipulating a conductive probe relative to the probe card to measure at least one of the group of resistivity, capacitance, and component functionality . The method for evaluating a probe card according to item 11 of the scope of the patent application includes determining the lowest suspension of the probe card by determining the position of the sensor head when the first ground probe contacts the sensor head Probe. A method for monitoring a probe card, comprising: establishing a first service time interval for the probe card; establishing a second service time interval for the probe card; using a probe at a defined time point in the first service time interval A pin card interface to removably couple the probe card to the probe card analyzer, and at least partially use the probe card interface to evaluate the probe card; and the definition in the second service interval From time to time, the probe card is removably coupled to a probe card analyzer without a probe card interface, and the probe card is evaluated. The method for monitoring a probe card according to item 18 of the patent application scope further includes removably coupling the probe card to the probe card analyzer using an adapter. The method for monitoring a probe card according to item 18 of the patent application scope further includes establishing the first service time interval by using the probe card interface to determine the baseline performance of the probe card. The method for monitoring a probe card according to item 18 of the patent application scope, wherein the first service interval is established based on a first set of criteria related to the operation of the probe card, and the second service interval is based on A second set of criteria related to the operation of the probe card is established. The method for monitoring a probe card according to item 21 of the patent application scope, wherein the first set of criteria is at least partially related to the performance of the probe card, and the second set of criteria is at least partially related to the probe card usage of.