TW566796U - Standard printed circuit board core - Google Patents

Standard printed circuit board core

Info

Publication number
TW566796U
TW566796U TW092203766U TW92203766U TW566796U TW 566796 U TW566796 U TW 566796U TW 092203766 U TW092203766 U TW 092203766U TW 92203766 U TW92203766 U TW 92203766U TW 566796 U TW566796 U TW 566796U
Authority
TW
Taiwan
Prior art keywords
circuit board
printed circuit
board core
standard printed
standard
Prior art date
Application number
TW092203766U
Other languages
English (en)
Inventor
Tzyy-Jang Tseng
Original Assignee
Unimicron Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unimicron Technology Corp filed Critical Unimicron Technology Corp
Priority to TW092203766U priority Critical patent/TW566796U/zh
Priority to US10/655,845 priority patent/US20040178000A1/en
Priority to JP2003315904A priority patent/JP2004282003A/ja
Publication of TW566796U publication Critical patent/TW566796U/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW092203766U 2003-03-12 2003-03-12 Standard printed circuit board core TW566796U (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW092203766U TW566796U (en) 2003-03-12 2003-03-12 Standard printed circuit board core
US10/655,845 US20040178000A1 (en) 2003-03-12 2003-09-04 Standardized circuit board core
JP2003315904A JP2004282003A (ja) 2003-03-12 2003-09-08 回路基板用コア材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092203766U TW566796U (en) 2003-03-12 2003-03-12 Standard printed circuit board core

Publications (1)

Publication Number Publication Date
TW566796U true TW566796U (en) 2003-12-11

Family

ID=32504477

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092203766U TW566796U (en) 2003-03-12 2003-03-12 Standard printed circuit board core

Country Status (3)

Country Link
US (1) US20040178000A1 (zh)
JP (1) JP2004282003A (zh)
TW (1) TW566796U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8450623B2 (en) 2009-12-30 2013-05-28 Unimicron Technology Corp. Circuit board

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8168891B1 (en) * 2007-10-26 2012-05-01 Force10 Networks, Inc. Differential trace profile for printed circuit boards
US8008682B2 (en) * 2008-04-04 2011-08-30 Hong Kong Applied Science And Technology Research Institute Co. Ltd. Alumina substrate and method of making an alumina substrate
JP2011151185A (ja) * 2010-01-21 2011-08-04 Shinko Electric Ind Co Ltd 配線基板及び半導体装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3932932A (en) * 1974-09-16 1976-01-20 International Telephone And Telegraph Corporation Method of making multilayer printed circuit board
US4494172A (en) * 1982-01-28 1985-01-15 Mupac Corporation High-speed wire wrap board
US4617730A (en) * 1984-08-13 1986-10-21 International Business Machines Corporation Method of fabricating a chip interposer
US5450290A (en) * 1993-02-01 1995-09-12 International Business Machines Corporation Printed circuit board with aligned connections and method of making same
JP3355353B2 (ja) * 1993-08-20 2002-12-09 ケル株式会社 電気コネクタ
US5463191A (en) * 1994-03-14 1995-10-31 Dell Usa, L.P. Circuit board having an improved fine pitch ball grid array and method of assembly therefor
JP3311899B2 (ja) * 1995-01-20 2002-08-05 松下電器産業株式会社 回路基板及びその製造方法
US5784262A (en) * 1995-11-06 1998-07-21 Symbios, Inc. Arrangement of pads and through-holes for semiconductor packages
US6563210B2 (en) * 2000-12-19 2003-05-13 Intel Corporation Parallel plane substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8450623B2 (en) 2009-12-30 2013-05-28 Unimicron Technology Corp. Circuit board
US9510464B2 (en) 2009-12-30 2016-11-29 Unimicron Technology Corp. Manufacturing method of circuit board

Also Published As

Publication number Publication date
JP2004282003A (ja) 2004-10-07
US20040178000A1 (en) 2004-09-16

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees