TW562932B - Method for manufacturing probes on a substrate and a probe card with the probes - Google Patents

Abstract

A method for manufacturing probes on a substrate is provided. A mold is installed in front of a nozzle of injection device, the mold forms a plurality of holes. A semi-molten metal is filled inside the injection device. Then, the injection device injects the semi-molten metal to a plurality of contacts of a provided substrate, so the shape of predetermined probes is formed on the contacts by injection molding.

Description

562932 *

[Field of the Invention] The present invention relates to a method for forming a probe-a method for directly forming a probe in an injection molding method: the other is related to [prior art] a method for forming alder needles. After the semiconductor wafer manufacturing is completed, it needs to be energized. The test equipment for testing semiconductor devices usually includes: ^ 2 :: sexually resting electrodes of thousand-conductor Japanese yen (electrode), the material of the electrode is The surface of aluminum or copper will produce poor electrical contact when it is touched, and the connection will be :::, and the electricity of the semiconductor wafer to be tested will be improved in US Patent Application Publication No. 200 1 / 00549〇6 "Test Card "And its manufacturing method", a probe card is disclosed, which includes a wiring board (wiring board), a plurality of contact terminals (叩 仏), and a plurality of probes. The surface of the wiring board with the detection circuit is covered with a metal layer and a plurality of contacts j are formed. The contact ends are electrically connected to the detection circuit of the wiring board, and the positions of the contact ends correspond to the products on the semiconductor wafer. Circuit for testing 'and a plurality of probes are formed on the contact end by plating, and these probes are S-shaped, so each probe system has a bonding end, f = section and A probe end, the joint end Connected to the contact end, two curved line portions are bent in an opposing direction, so that the plurality of elastic probe, to provide

Page 4 562932. V. Description of the invention (2) Good ^ .L between the probe tip and the semiconductor wafer-Electrical "contact" However, non-vertical probes (such as s-plated s , And it is more difficult to control the process (its control power is more complex and cost.) Zeng Lijia manufacturing process required manpower and time [Objective and Summary of the Invention] The main purpose of this :: is to provide a method for forming a probe on a substrate It is a probe with a vertical shape in the United States by injection molding, so that the probe t1 ^ becomes vertical or non-traceable # PM ^ U The needle has a changeable shape, and the J branch provides good electrical contact . Fang Maiben Γ Γ § is to provide a probe with a vertical shape of the probe on the substrate, so that the probe 2 can form a vertical or not on the substrate: 1 The process of making a wooden needle has high mass productivity. Device ϊΓΓ = Method for forming a probe on a substrate 'It is-injection ^ θ Μ Ψ # = It is known that a mold is provided, and the mold is provided with a plurality of molds. ^ The internal system is filled with semi-melted metal. +: 'Multiple shots to a substrate [Detailed description of the invention] The second reference, the attached drawings, the present invention will enumerate the following embodiments: The first specific embodiment of the invention is to directly form a probe on the substrate. These probes are formed by metal injection molding (MIM), and the manufacturing method is described in detail below. 'Preparing a substrate 111' shown in Figure 1 The material system of the substrate 111

Page 5 562932 ^ V. Description of the invention (3) It is a ceramic substrate such as a ceramic substrate or a multilayer ceramic circuit board (mu) L layer ceramic (MLC). The substrate in is formed with a plurality of through holes 112 for injection. Forming method A probe 113 (prObes) is formed in the through hole 112, and an injection device 300 (injechon device) for injection molding mainly includes a thermal melting furnace 310, a feeding screw 320, and a discharging port. 330. A hopper 340, an injection actuat 35 and a heater 360, wherein a mold 370 is provided at the front end of the material outlet 33, and the material of the mold 370 is Metal or ceramic ... etc., It has a plurality of die holes 371. Preferably, the diameter of these die holes 371 is equal to the through hole 1 1 2 of the substrate 11 1 and the die holes 3 7 1 are provided at the end. Larger diameter to facilitate the introduction and injection of semi-molten metal. The semi-molten metal is filled from the hopper 34 to the inside of the hot-melt furnace 310 of the injection device 300, and is continuously heated by a heater 36. The temperature of the semi-molten metal within the furnace is kept at a melting temperature (such as the melting of aluminum The temperature is about 500 ° C and the melting temperature of copper is about 1 000 or more). The semi-molten metal is made by mixing metal powder with a binder (or polymer binder). The metal powder can be copper or gold. , Tungsten, silver, aluminum, etc., and the injection device 300 is used to push the feeding screw 32 with the booster 350 to force the semi-molten metal ~ to be injected from the die hole 371 of the die 370 at the front end of the outlet 330. The substrate 111 is positioned on the mold 370 so that the plurality of mold holes 371 of the mold 37 correspond to the through holes 112 of the substrate ni. The semi-molten metal is passed through the mold holes 371 of the mold 37 at the front end of the ejection opening 330 of the injection device 300. It flows through the through hole 112 ′ of the substrate and shoots out perpendicularly from the surface of the substrate lu, so it is semi-melted 562932. V. Description of the invention (4) The metal is cooled and solidified, so that the probe 1 1 3 is formed. Preferably, the substrate 1 1 1 series is placed in a temperature-controlled closed space. When the probe 丨 3 is injected and formed, the semi-refined metal can be rapidly cooled and solidified. In addition, the semi-molten metal is caused by the pressure inside the injection device 300 (ie The motivation wo pushes the feeding screw 32 () to form the pressure evenly, so that the probes 3 and 3 have good consistency in shape and height. 'The contact resistance can be reduced to improve the semiconductor wafer to be tested. Electrical contact.

The probes 113 made according to the above process are green compact. After that, the probes 113 are debinding to remove the previously mixed binders, and then the temperature is about 12 ° C. High-temperature firing (such as atmospheric sintering, atmospheric sintering or hot-pressing sintering ...), making the structure of these pins 1 1 3 more compact, and has a high density (more than 95%), high Mechanical property and high electroplatability. As shown in FIG. 2, the substrate 111 with the probe 11 3 formed thereon becomes a probe head. It can be used with a multilayer ceramic circuit board. 120 and a multilayer printed circuit board 110 constitute a test card. The ceramic circuit board is electrically connected to the multilayer printed circuit board 130. The size of the multilayer ceramic circuit board is The multilayer printed circuit board has a size of 30, and the probe head no is combined with the multilayer ceramic circuit board 120. One end of the probe 11 of the probe head 11 () is filled in the through hole Π2, and is formed vertically. The surface of the substrate 丨 丨 1 is used for testing semiconductor wafers, so by injection molding To probe Shushu 3, in the manufacturing process may be required to save manpower, time and cost and the like. The second specific embodiment of the present invention is shown in FIG. 3. The substrate 21 has a detection circuit (not shown) inside, and the surface is formed with

562932 'V. Description of the invention (5) A plurality of contact terminals 2 1 1 (such as solder pads or electrical contacts), the contact terminals 2 丨} are further formed with bumps 212 formed by plating or evaporation, and For forming the probe 213 by injection molding, as in the first embodiment of the present invention, the front end of the ejection opening 330 of the injection device 300 is also provided with a mold 370 having a plurality of mold holes 371. Smelting metal (semiiolten metal) to the inside of the hot furnace 31o of the injection device 300, but the substrate 210 is positioned in front of the mold 37 by a moving device 22 ′ so that the contact end 211 of the substrate 210 corresponds to the mold 37. The die hole is 37m, and the moving device 220 can control the horizontal and vertical rotation of the substrate 210. The injection device 300 is used to push the feeding screw 320 with a booster 350 to force the semi-molten metal to be ejected from the discharge port 330. The moving device 220 can match the shape of the required probe 213, rotate the substrate 21 horizontally and vertically, or move the 4 injection device 300 ′ to make the grasping needle 213 constitute the required before the semi-molten metal cools and solidifies. Shape, preferably, A cooling device (not shown) is provided in the moving device 220 so that the semi-molten metal can be rapidly cooled and solidified to the shape of the required probe. · Φ Through the above-mentioned metal injection molding method, and cooperate with the mobile device 220 to control the substrate 2 1 0 horizontal and vertical rotation, you can efficiently form a variety of curved probes, as shown in Figure 4, the substrate 4 1 0 A plurality of probes 4 1 2 are formed on the contact pad 4 1 1. The probes 4 1 2 are in the shape of helical compression springs. They are formed by the moving device when the probe 412 is formed. 220 The control substrate 210 is rotated horizontally and vertically to form 'Also as shown in Fig. 5, a plurality of probes 413 on the substrate 410 are in the shape of a tower compression spring (conical spring), and these probes 413 are

Page 8 562932 V. Description of the invention (6) It is formed by moving the device 220 to control the substrate 210 for horizontal and vertical rotation and the movement of the injection device 300. These spiral-shaped probes 4 丨 2, 41 3 The system has excellent elasticity and can provide better electrical contact during testing. And right, in the present invention, the probes can be non-vertical, so that they can be Aj, and then degreased and sintered to make the structure of the probes high density, high mechanical properties and high availability. For electroplating, some flexible probes can consistently pierce the electricity, but because of the lro mountain, the contact resistance is reduced, so that the process of good electrical contact probes has high mass production. Therefore, the shape can be efficiently controlled by shooting the W 4 curve shape, and the probe can be formed in the shape of the M 2 type on the system to have a more variable shape. : Requires manpower, time, cost, etc. Whichever prevails, any person who is familiar with what is done within the scope defined by the scope of this patent, does not depart from the spirit and scope of the present invention. Persons who are modified belong to the protection scope of the present invention 562932

[Explanation of drawings] FIG. 1: a cross-sectional view of a probe directly formed on an injection-molded square substrate according to a first embodiment of the present invention; and FIG. 2 is a diagram of a first embodiment according to the present invention; Sectional view of the probe card Figure 3: According to the second embodiment of the present invention, the shape of the probe is shot to form a non-vertical cross section of the probe directly on the substrate. Figure 2 according to the present invention A side view of a probe in which a screw compression spring shape is directly formed on a substrate by injection molding; and FIG. 5 · A side view of a probe in which a tower compression spring shape is directly formed on a substrate according to the injection molding method of the present invention. ° [Illustration of drawing number] 1 0 0 probe card 1 1 0 probe head 111 substrate 120 multilayer ceramic 1 3 0 multilayer printing 2 1 0 substrate 211 contact end 220 mobile device 300 injection device 31 0 hot melt furnace 3 4 0 feeding hopper 370 mold

11 2 Through hole Circuit board Circuit board 21 2 Bump 3 2 0 Feed screw 3 5 0 Actuator 11 3 Probe 21 3 Probe 330 Outlet 360 Heater 犓

562932 Brief description of the drawing 3 7 1 Die hole 4 1 0 Substrate 4 11 Contact end 41 2 Probe 41 3 Probe ΙΙΗΙΙ

Claims (1)

562932 6. Scope of patent application [Scope of patent application] 1. A method for forming a probe on a substrate, which is provided with a mold at the front end of a discharge port of an injection device, the mold has a plurality of die holes, and the injection device The internal system is filled with semi-molten metal, and the semi-molten metal is ejected from the discharge port of the injection device to a plurality of contact ends of a substrate to form a probe. t ί fth 2. The method for forming a probe on a substrate as described in item 1 of the scope of patent application, wherein the semi-molten metal in the injection device is made of metal powder and bonded Mixing agent. 3. The method for forming a probe on a substrate as described in item 2 of the scope of the patent application, wherein the metal powder is copper, gold, crane, silver or | Lu. 4. The method for forming a probe on a substrate as described in item 1 of the scope of patent application, wherein one end of the die hole of the mold has a larger diameter. 5. The method of forming a probe on a substrate as described in item 1 of the scope of the patent application, wherein the substrate is held in place by a mobile device, and the mobile device is protected by rotating the substrate horizontally and vertically to make the probe Non-vertical shape. 6. The method of forming a probe on a substrate as described in item 1 of the scope of the patent application, wherein when the probe is shot and formed, the injection device is moved so that the probe has a non-vertical shape. + 7. The method for forming a probe on a substrate as described in item 丨 of the scope of patent application, wherein the material of the substrate is ceramic. 8. The method of forming a probe on a substrate as described in item 1 of the scope of patent application ', wherein the plurality of contact ends of the substrate are through holes. Page 12 562932 9. The method of forming a substrate as described in item 丨 of the scope of the patent application, wherein a bump is formed at the contact end of the substrate.衣 之 方 10. A detection card comprising: a multilayer printed circuit board; a multilayer ceramic circuit board, the multilayer ceramic circuit board is electrically connected to the multilayer circuit board; and a detection head is combined with In the multilayer ceramic circuit board, the substrate of the probe head has a plurality of through holes and probes, and the _ ends of the probes are filled in the through holes and formed on the surface of the substrate. " 11 1. The probe card as described in item 10 of the scope of patent application, wherein the material of the substrate of the probe is ceramics. 1, 12 The detection card as described in item i 0 of the scope of patent application, wherein the size of the multilayer ceramic circuit board is smaller than that of the multilayer printed circuit board. 1 3. The probe card as described in item No. 丨 0 of the scope of patent application, wherein the probes are non-vertical and flexible. Clothing 14. The detection card as described in item No. 0 of the patent application scope, wherein the material of the probes is copper, gold, tungsten, silver or aluminum. -Clothing 15. A detection card comprising: a substrate 'on which a plurality of contact terminals are formed; and A plurality of probes are formed at the contact ends of the substrate, and the probes have a spiral shape. '1 6' The probe card as described in item 5 of the scope of patent application, wherein the probes are in the shape of a spiral compression spring (helical spring). 17. The detection card as described in item 5 of the patent application scope, wherein these detection cards Page 13 562932 VI. Scope of patent application The needle system is in the shape of a tower compression bomb (c ο n i c a 1 s p r i n g). 18. The detection card according to item 15 of the scope of patent application, wherein the contact end of the substrate is formed with a bump. 19. The probe card as described in item 15 of the scope of patent application, wherein the material of the probes is copper, gold, silver, silver or inscription. Page 14