TW556447B - An organic light emitting diode - Google Patents

An organic light emitting diode Download PDF

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Publication number
TW556447B
TW556447B TW091120384A TW91120384A TW556447B TW 556447 B TW556447 B TW 556447B TW 091120384 A TW091120384 A TW 091120384A TW 91120384 A TW91120384 A TW 91120384A TW 556447 B TW556447 B TW 556447B
Authority
TW
Taiwan
Prior art keywords
substrate
light emitting
organic light
emitting diode
lower substrate
Prior art date
Application number
TW091120384A
Other languages
English (en)
Inventor
Hsiao-Ping Lai
Original Assignee
Au Optronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=31989697&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW556447(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Au Optronics Corp filed Critical Au Optronics Corp
Priority to TW091120384A priority Critical patent/TW556447B/zh
Priority to US10/065,664 priority patent/US6825612B2/en
Application granted granted Critical
Publication of TW556447B publication Critical patent/TW556447B/zh

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/841Self-supporting sealing arrangements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • H05B33/26Light sources with substantially two-dimensional radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10Substrates, e.g. flexible substrates
    • H10K77/111Flexible substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851Division of substrate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells

Description

556447 域’至少一第二區域相對應於該下基板之該切割區域; 一密封材料(sea 1 i ng mater i a 1)位於該上基板與該下基板間之 各該主動區域外之一點膠(印试giue)區域上,用來黏結該上基板與 該下基板; 複數個第一溝槽(di tch)分別位於該上基板之各該第一區域中; 以及 至少一第二溝槽位於該點膠區域與該主動區域間的該下基板 中’且該第二溝槽之深度係小於該下基板之厚度; 其中該等第一溝槽與該第二溝槽係用來避免該密封材料溢出該 下基板之該切割區域中與溢入該下基板之各該主動區域中,而影響各 該有機發光二極體之正常操作。 4. 一種有機發光元件’該有機發光元件係包含有至少二有機發光二極 體(organic light emitting diode, 0LED),該有機發光元件包含有: 一下基板’該下基板表面包含有至少二元件區域,至少一切割區 域位於兩相鄰該元件區域之間,且各該元件區域均包含有一下電極設 於該元件區域表面,一有機薄膜設於該元件區域之一主動區域上,以 及一上電極設於該有機薄膜表面; 一上基板,平行地設於該下基板之上,且該上基板相對於該下基 板的表面包含有至少二第一區域相對應於該下基板之該等元件區 3 556447 域’至少一第二區域相對應於該下基板之該切割區域; 一密封材料(sealing material)位於該上基板與該下基板間之 各該主動區域外之一點膠(spot glue)區域上,用來黏結該上基板與 該下基板; 複數個第一溝槽(di tch)分別位於該上基板之各該第一區域中; 以及 至少一第三溝槽位於該點膠區域與該主動區域間的該下電極 中’且該第三溝槽之深度係小於該下電極之厚度; 其中該等第一溝槽與該第三溝槽係用來避免該密封材料溢出該 下基板之該切割區域中與溢入該下基板之各該主動區域中,而影響各 該有機發光二極體之正常操作。
4
TW091120384A 2002-09-05 2002-09-05 An organic light emitting diode TW556447B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW091120384A TW556447B (en) 2002-09-05 2002-09-05 An organic light emitting diode
US10/065,664 US6825612B2 (en) 2002-09-05 2002-11-07 Organic light emitting diode including ditches in a substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW091120384A TW556447B (en) 2002-09-05 2002-09-05 An organic light emitting diode

Publications (1)

Publication Number Publication Date
TW556447B true TW556447B (en) 2003-10-01

Family

ID=31989697

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091120384A TW556447B (en) 2002-09-05 2002-09-05 An organic light emitting diode

Country Status (2)

Country Link
US (1) US6825612B2 (zh)
TW (1) TW556447B (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7138964B2 (en) 2003-12-30 2006-11-21 Au Optronics Corp. Mobile unit with dual panel display
TWI425688B (zh) * 2006-12-04 2014-02-01 Idemitsu Kosan Co Organic thin film transistor and organic thin film emitting transistor
TWI462634B (zh) * 2009-04-24 2014-11-21 Chi Mei El Corp 有機發光二極體之封蓋基板及顯示面板與製造方法

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JP4776769B2 (ja) * 1999-11-09 2011-09-21 株式会社半導体エネルギー研究所 発光装置の作製方法
JP2005071646A (ja) * 2003-08-28 2005-03-17 Chi Mei Electronics Corp 有機elディスプレイおよびその製造方法
KR100667358B1 (ko) * 2004-02-04 2007-01-12 엘지전자 주식회사 일렉트로-루미네센스 표시장치
JP4476073B2 (ja) * 2004-04-08 2010-06-09 東北パイオニア株式会社 有機el素子の製造方法及び製造装置
KR100603350B1 (ko) * 2004-06-17 2006-07-20 삼성에스디아이 주식회사 전계 발광 디스플레이 장치
KR100615228B1 (ko) * 2004-06-29 2006-08-25 삼성에스디아이 주식회사 흡습 능력이 개선된 유기 전계 발광 소자 및 그 제조방법
KR20060007161A (ko) * 2004-07-19 2006-01-24 엘지전자 주식회사 액정표시장치
JP4605499B2 (ja) * 2004-10-28 2011-01-05 富士電機ホールディングス株式会社 有機elディスプレイの封止構造
KR100637193B1 (ko) * 2004-11-25 2006-10-23 삼성에스디아이 주식회사 전계 발광 디스플레이 장치 및 이의 제조 방법
US20070170846A1 (en) * 2006-01-23 2007-07-26 Choi Dong-Soo Organic light emitting display and method of fabricating the same
KR101195611B1 (ko) * 2006-03-28 2012-10-29 삼성전자주식회사 멀티 디스플레이용 패널
TWI314025B (en) * 2006-04-13 2009-08-21 Au Optronics Corp Method for fabricating active illumination apparatus
US7667386B2 (en) * 2006-06-21 2010-02-23 Chunghwa Picture Tubes, Ltd. Fabricating method of display panel
FR2924275B1 (fr) 2007-11-27 2009-12-18 Commissariat Energie Atomique Procede de fabrication d'un dispositif d'affichage electronique recouvert d'une plaque de protection
TWI384591B (zh) * 2008-11-17 2013-02-01 Everlight Electronics Co Ltd 發光二極體電路板
KR101100955B1 (ko) * 2010-03-11 2011-12-29 삼성모바일디스플레이주식회사 유기전계발광표시장치 및 그의 제조방법
TWI432832B (zh) 2010-10-21 2014-04-01 Au Optronics Corp 顯示模組
CN104733504A (zh) * 2015-03-18 2015-06-24 京东方科技集团股份有限公司 Oled基板及制备方法、oled面板及显示装置
US11889713B2 (en) * 2018-10-02 2024-01-30 Sony Semiconductor Solutions Corporation Display device and electronic apparatus including seal part outside recess

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7138964B2 (en) 2003-12-30 2006-11-21 Au Optronics Corp. Mobile unit with dual panel display
TWI425688B (zh) * 2006-12-04 2014-02-01 Idemitsu Kosan Co Organic thin film transistor and organic thin film emitting transistor
TWI462634B (zh) * 2009-04-24 2014-11-21 Chi Mei El Corp 有機發光二極體之封蓋基板及顯示面板與製造方法

Also Published As

Publication number Publication date
US6825612B2 (en) 2004-11-30
US20040046494A1 (en) 2004-03-11

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