TW555723B - Porous structure ceramic heat dissipation plate - Google Patents

Abstract

This invention relates to a kind of porous structure ceramic heat dissipation plate, mainly comprising a heat dissipation layer and a heat conduction layer; the heat dissipation layer uses microscopic chemical liquid phase transformation principle to form ceramic powder with micro-cell structure through non-uniformly dispersing emulsion type slurry to be joined with sub-micro powder material and then sintered into porous structured dissipation layer with hollow crystalline body, whose contact surface to the heat source has a heat conduction layer to absorb energy from the heat source; the porous structure with hollow crystalline body of the heat dissipation layer uses air as heat dissipation medium and a force convection condition is further included to increase the heat dissipation capability of the heat dissipation plate.

Description

555723

[Technical field to which the invention belongs] The present invention relates to a surface where a heat sink contacts air. [Prior Art] Field A ceramic heat sink with a porous structure has an increased product to improve the heat dissipation capability of the heat sink. With the development of the semiconductor industry, semiconductor wafers are continuously developing toward high frequency. In recent years, the processing speed of electronic wear σ such as central processing units (CP u) has been increasing rapidly, however, high temperatures at high processing speeds have accompanied them. How to effectively discharge the high temperature generated by the heat source of electronic devices (such as the central processing X device) so that the electronic devices can operate at an appropriate operating temperature is the focus of competition for development. Taking a computer as an example, a conventional radiator is installed on the central processing unit to help exhaust the heat generated by the central processing unit chip. Most of them include a heat sink, which is arranged on the central processing unit and is connected to the central processing unit. The heat sink is fitted with a suitable shape of heat dissipation fins, and a fan is provided on the heat sink to generate convection air to remove the heat of the heat sink absorbing heat of the central processor from the heat sink (convection or Supply air, depending on the computer's internal space and design requirements) to reduce the temperature. Although the conventional heat sink has been made of copper and Shao alloy with good heat conduction and heat dissipation effect, but because the heat conduction and heat dissipation effect is not good, there is still room for improvement. The above is the biggest existing deficiency of conventional technology. Difficulties for industry to overcome. [Summary of the Invention] In view of the lack of the aforementioned conventional technology, the inventor of the present invention intends to 'use a direct die forming' of a ceramic material with a porous structure and improve the contact surface area of thermal convection by using an air medium (hole single crystal structure). Most easy

555723

The production process of manufacturing high-value-added products is based on design. After continuous research and improvement, the research and development of the present invention will be successful and made public.

The main purpose of the present invention is to provide a "hole-structure ceramic, ==", which is mainly composed of a heat dissipation layer and a heat conductive layer. The heat dissipation layer is based on the principle of chemical liquid phase change and uses latex slurry. The material is unevenly dispersed to form a microporous structure of 2 porcelain powders, which is combined with sub-micron powders, and then sintered into a pore structure with a medium = crystal structure. The heat dissipation layer has a thermal layer in contact with the heat source, and I! The heat of the heat source is based on the high surface area of the hollow structure of the Japanese and Japanese versions of the heat dissipation layer, using air as a heat dissipation medium, and a forced convection condition to improve the heat dissipation capacity of the heat sink. The ear first explained the theory applied to the present invention as follows: 1. Micro-chemical part: Liquid-liquid phase change (U (luid-llquld phase transformatlon)) It is stated that two organic solvents existing in organic slurry are used. Ben 1 = alcohol. After mixing the hydrophilic polymer binder, ethanol and water can accomplish this: Ren Ben Jia Ben and hydrophilic functional groups will repel each other. Use Ben Ben to search for the characteristics of ΓΓΛ based broad picture mutual compatibility 1 intend to prepare a latex-like slurry (the latex area shown in Figure 1), and then the ceramic powder

Linked in gift gel. As shown in Figure 2b, 'Large particle size powder in latex is because of the large size of the Wal-Like powder, and the small particle size is filled outside the large particle size powder while the polymer binder and the inorganic material form a stable covalent. The country is a simulation diagram of particle size dispersion. Among them, Figure 21 shows uniform dispersion 2; 2-2 is not the uneven dispersion produced after making latex]. That is, the sintering of the pottery can produce a natural and uniform hollow M, forming holes.

555723 j No. 911328 Lang JL. ___3. One amendment, the fifth, the description of the invention (3) 2. The physical part: the nature of the material is the same as that of the same material in the block, so that there are powders = description = fruit U powder and machinery And other properties. For the diameter, it is only necessary to use a grade such as 〇.13 "). If the particle has thermal characteristics, its thermal conductivity is greatly improved. In addition, the main and the main :: the force will be improved, while the mechanical strength will be better porosity and mechanical strength, the smaller the porosity after sintering, in general, the smaller the particle size of the powder. The mechanical strength of T material is relatively large 3. Heat transfer part of the object: The heat transfer of all objects can be divided into three types of energy that can be removed by radiation: ‘conduction, convection, and radiation. -This is the most important supplement when making a heat sink: so you don't need to consider it. Because of flow. The heat dissipation device J in the computer;. = System is conduction and 'transmission to the surface of the heat-dissipating object [refer to Section 3. The importance is that the heat 旎 is the effect of thermal convection factors. Because the temperature f is the heaviest f, the thermal energy generated by the CPU chip of the computer is passed through the fluid (a ^ r) by convection.

The factor is the heat dissipation area. Q (Convection) ... A (Surface area) X This ^ open-hole structure political film is mainly composed of a heat dissipation layer and a thermally conductive layer. 'The heat dissipation layer is based on the principle of microchemical liquid phase change and is polymerized in a latex-like manner. 4. Description of the invention (4) ^ I _correction__ The material is unevenly dispersed to form a ceramic bond, and then sintered to have a hollow junction = 髀 micro-encapsulated structure, and has a layer of heat conduction with the submicron powder, the source contact surface; 5 holes The heat dissipation layer of the structure is formed by absorbing the heat of the crystalline body through the heat dissipation layer, absorbing heat from the heat source through the heat conduction layer, and then introducing a forced convection 2. The structure uses air as a heat dissipation medium to dissipate heat. The aforementioned heat dissipation is second [such as a fan], to mention the type of heat sink, and silver Ag is used as a guide. 平板 It can be made into a flat plate or a unicorn. If a higher thermal conductivity is used, the second coefficient is K = 421 W. / mK. helpful. The improvement of heat dissipation capacity due to the improved thermal conductivity material [Embodiment] In order to achieve the foregoing purpose of the invention, and with the illustration of the drawings, as follows, expensive: t 'enumerate-implementation structure, characteristics and achieved effects: Obtained :: For the ingenious water of the present invention, take appropriate proportions of ceramic materials (mainly 成 80% _ atmosphere, barium oxide Ba〇, oxidation pin Sr0, r oxygen must be made into a knife, a emulsification

Zrd, Shu-Congshi π — ★ an emulsified dialuminum Al2O3, ytterbium oxide r0) and an organic solvent ethanol (Et〇H) spot ^ ^ ^ dispersant formulation (the viscosity is best controlled at 5:10, This () and powder, and then use grinding balls (such as zirconia grinding balls, gas P) 'to ensure uniform mixing into sub-micron powder particles; pore-shaped grinding balls... Grinding uniform: cement preparation: take an appropriate proportion of polyethylene Methanol (m) and water, search and mix = viscous, agent: Mix the aforementioned sub-micron powders and binders, stir ..., stir until a milky colloid is formed;

Page 7 555723 Amendment ^ No. 911328fi5 V. Description of the invention (5) Drying: drying the milky colloid material in the previous step. 'Mouth body, that is, made into holes. The present invention uses grinding balls to grind and stir the balls at a low speed. The method uses a variety of different ball diameters. The present invention uses the aforementioned hole-forming short polymer grinding. time. The steps of the radiating fin mainly include: · material to produce a hole-forming structure; granulation · · punching the aforementioned hole-forming hibiscus into a predetermined shape. The heat-dissipating layer is ground and ground into a special sintering: the predetermined shape of the space is formed into a hollow shape, and the layer is formed with a natural and uniform surface heat-conducting layer. Printing: Allowing the person to say ί2, the thermal layer uses a screen printing method to guide the surface: ;;: == μ According to the foregoing f of the present invention, it can be printed. See Figure 6 and the main;, :: f: hole structure heat sink 'Please refer to β® r 1,', to (ding, the thermal layer (丨) and the guide layer (2) hibiscus λ This heat dissipation The layer system is composed of micro-chemistry: '... 2), the material is unevenly dispersed, and the original Wangli of culture is combined with a latex-like slurry, and then sintered to have a' = and a sub-micron powder and its contact surface with a heat source and => The heat dissipation layer of the cavity structure has a heat-conducting layer (the source heat 'is then dissipated: conducting ... the layer absorbs the hot air to dissipate the medium cavity :: the pore structure of the medium structure, Since then, Qiu ^, a piece of forced-convection conditions [such as a fan], can be made into a flat type. The heat dissipation layer is based on the heat dissipation demand layer, which teaches conduction. In addition, this embodiment uses silver "as heat conduction Materials, right; i = w / mK. If the 7-leaf with higher thermal conductivity is used, it will be more helpful to improve the political and thermal capacity. Page 8555723 ___Case No. 91132865 (6) The following is a list of preferred and feasible embodiments of the present invention to further verify the present invention: Mixing slurry: take ceramic material ([6 ^ 11145) 1 3 7.872, ethanol (£ 1; 01〇2 5.0 6§, toluene (but 〇11 ^ 1 ^) 37.0 62 and dispersant (such as 8A1 (-111) 2.76gC ceramic material 2.0 % Amount) Viscosity is controlled at 5 ~ 10 cp to ensure uniform dispersion. Stir 12 Hrs at low speed with 0 = 3mm: 10mm: 30mm = 5: 3: 2 oxidized ball error. (Powder particle size = 0.09 ~ 0.30 // m) [The low-speed grinding method of the three different ball diameter oxidation hammer balls can save more than 1/2 of the grinding time compared with the conventional method. For the relationship between the grinding time and the particle size, refer to Figure 5]; 4g of alcohol (PVA) O · 4g was added to 9.6g of water and stirred well (PVA = 4 ° / 〇); 5g slurry of powder (particle size 〇e13 / zm) in the mixing step was added to 5g of 4% PVA. Stir until a milky colloid is formed, and then dry into a solid; Granulate: Grind the block solid in the previous step in a mortar, take 0 · 5g of fine powder and punch into a plate-like heat dissipation layer in a special jig; Sintering: sintering the heat-dissipating layer of the predetermined shape into a natural and uniform space in a three-stage temperature-holding manner to form a hole-structured heat-dissipating layer with a hollow crystal. See Figure 4;

Surface heat-conducting layer printing: Print the aforesaid hole-structured heat-dissipating layer with hollow crystals using a polymer silver paste, and then bake it at 50 ° C for 2 minutes. The heat sink of the present invention made by the above process is tested by the following method: 17 As shown in Figure 7, the device uses the heat conduction characteristics of the material to explore the absorption of heat energy, and then turns on the fan to observe the heat dissipation ability of the material. ...,

555723 Case No. 91132865 Amendment V. Description of Invention (7) Compare the following four materials: copper sheet, aluminum sheet, water-absorbing ceramic, one of hole-structured ceramics, and the heat absorption of the heat sink to the heat sink [see Figure 8 ] Second, the heat source increases the heat dissipation of the heat sink and the fan (5 V ο 11/0 · 4 W) [Please refer to Figure 9] 3. Heat dissipation capacity (heat absorption temperature minus heat dissipation temperature at the same time) 1 0 picture]

From the simple test and analysis above, the heat dissipation ability of the hole ceramic is the best. At the same time, it can be seen from the above figure that the heat dissipation ability will be better with the increase of time. The reason is that the hole structure has a very large air contact surface area, which is far higher than the dense structure by ten million times. The relevant calculations are as follows: The following calculation only compares the copper heat sink with the hole structure ceramics. The heat source provides 1573 joule / sec = 1573 W. The average particle size of the hole structure ceramics = 0.13um and the porosity = 18%. Copper plate A = 2. 56 X 10_4 m2 Δχ = 2. 0 x 10—3 m Study of the hole structure A = 6. 7 6 x 1 O'4 m2 Δ X = 1. 7 x 1 O'3 m Heat conduction formula · Q = KA ΔΤ / Δχ sphere volume formula: 4/3 χ 7Γ r3

Sphere surface area formula: 4 7Γ r2 'For calculations made from the above data, please refer to Figure 11 and Figure 11. Although the thermal conductivity of ceramics with pore structure is poor, the unit heat dissipation area is 5 0 8 8 6 times, so the heat energy that can be taken away per unit time is so high. It has both mechanical strength and impact resistance = 17 ~ 28 Kg / cm2.

Page 10 555723 jl32865

V. Description of the invention (8) The heat sink of the present invention is used to sink the Institute of Materials of Industrial Research Institute "(Patent No. 10 5890). Its foamed aluminum-gold flexure Γ / metal-clad heat dissipation / ⑶2, equivalent convective heat transfer coefficient-. .5 W belongs to: f heat capacity ... The heat dissipation capacity of the ceramic heat sink = 229.1 W / and the transmission coefficient of the present invention = 1 2 · 〇6 circles / cm2, which is obviously more than 誃 = effect pair / ;, L thermal hole structure to produce heat dissipation Film, can be fully resolved ^ ^, excellent two. The lack of the poor heat dissipation effect of the metal heat sink fins ^ = _ accumulated aluminum electronic devices are widely used for heat generation in various ways. This achieves the design purpose of the present invention and can be called a practical inventor. = As mentioned above, a type of "hole-structured ceramic heat sink" disclosed in the present invention is "there is nothing, and it has not been seen in domestic and foreign publications. It is already a patent element of =, novelty." Developed a patent that could eliminate the lack of customary technology, “Yada ’s cost of designing the invention, and also fully meets the invention patent: the creation of a high degree of technical thought with the laws of nature”. Application under the provisions of Article 19 :, then: the Examination Committee to review and grant the patent in this case, and I feel that the above mentioned, 蟮 & + & Law, reason; "# # ^ + 1—Declares that the alternative manufacturing method of the patent target should be included in the patent scope of the present invention.

Page 11 555723 Amendment No. 91132865 Brief description of the drawing [Brief description of the drawing] Fig. 1 is a liquid-liquid phase change diagram of the present invention. Fig. 2 is a simulation diagram of particle size dispersion of the present invention. Fig. 3 is an explanatory diagram of heat conduction of a medium. Fig. 4 is a temperature setting map of the present invention. Fig. 5 is a graph showing the relationship between the grinding time and the particle diameter of the present invention. Fig. 6 is a sectional view of a heat sink of a hole structure according to the present invention. FIG. 7 is a diagram of a heat sink test device of the present invention. Fig. 8 is a comparison diagram of the heat absorption of the heat sink by the heat source heating. Fig. 9 is a comparison diagram of the heat dissipation performance of the heat sink to the heat sink. Figure 10 is a comparison chart of heat dissipation capacity. Figure 11 is a comparison table between the copper heat sink and the heat dissipation capacity of the present invention. [Reference number in the figure] (1) Heat dissipation layer (2) Thermally conductive layer

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Claims (1)

555723 XV% 91132865 Rev. 4/32 Scope 1 1 1. A "hole-structure ceramic heat sink" is mainly composed of a heat dissipation layer and a thermally conductive layer. The heat dissipation layer uses the principle of microchemical liquid phase change to form a latex. The slurry is unevenly dispersed to form a micro-encapsulated structure of ceramic powder, which is combined with sub-micron powder, and then sintered into a pore structure with a hollow crystal structure. The heat dissipation layer has a porosity between 5%-40%. The particle size of the powder is between 0.09 and 0.30 // ni. The contact surface with the heat source has a heat conducting layer. The heat conducting layer absorbs the heat of the heat source, and then the high surface area of the hollow crystal structure of the heat dissipation layer is used to Air is a heat dissipation medium to improve the heat dissipation ability of the heat sink. 2. According to the "hole-structured ceramic heat sink" described in item 1 of the scope of the patent application, wherein the main component of the ceramic powder is titanium dioxide, oxide lock, oxide oxide, oxide oxide, and oxide oxide. 3. According to the "hole-structured ceramic heat sink" described in item 1 of the scope of the patent application, wherein the thermally conductive layer is silver. 4. According to the "hole-structured ceramic heat sink" described in item 1 of the scope of the patent application, wherein the heat sink has a fan on one side, and uses a forced convection method to separate the heat source-derived high-tropical heat. Page 13