TWI482245B - Heat sink and method of fabricating the same - Google Patents

Description

Heat dissipating component and preparation method thereof

The invention relates to a heat dissipating component and a preparation method thereof, in particular to a heat dissipating component suitable for heat dissipation of a semiconductor wafer and a preparation method thereof.

With the rapid development of science and technology, the information semiconductor industry is constantly moving toward high-speed/high-frequency. In recent years, the processing speed of electronic devices such as central processing units (CPUs) is even more rapid, but the high-speed processing is accompanied by High temperature is produced. How to effectively discharge the high temperature generated by the heat source of the electronic device and enable the electronic device to operate at an appropriate working temperature is a key point for various manufacturers to compete for development.

For example, in a typical personal computer, a heat sink is mounted on the central processing unit to assist in discharging heat generated by the central processing unit chip. Most of the heat sink is attached to the central processor and is attached to the central processor, and the heat sink has a suitable heat sink blade shape. A heat sink is provided on the heat sink for generating convective air to remove the heat convection current of the heat sink absorbing the heat of the central processor from the heat sink (for example, air or air supply, depending on the internal space of the computer and design requirements) to reduce the temperature.

The heat dissipation method of setting multiple sets of fans and heat sinks not only increases the overall weight, but also increases the flow field impedance, so that the flow of the wind provided by the cooling fan through the heat sink is reduced, and the heat dissipation of the heat sink is reduced. Efficiency, therefore, the cooling fan speed must be increased at the same time to overcome the problem of flow reduction, but increasing the fan speed will cause an increase in noise.

In addition, although the heat sink used in the prior art has been made of copper or aluminum alloy with good heat conduction and heat dissipation effect, the use of an aluminum heat sink as a heat dissipation layer and a thermal conductive paste or a heat conductive sheet as a heat conductive layer is known. In the case where the application conditions of the product are to comply with the insulating properties, the aluminum heat sink can be insulated by the common anodizing treatment, but it has been experimentally confirmed that the insulating effect of this method is not good, and if it is not careful during the assembly process When the anodized surface is destroyed, the insulating properties are easily destroyed.

Further, in the prior art, there is a technique of manufacturing a heat sink using a ceramic material, but most of them are only used as a coating layer in the form of ceramic particles (for example, a nano ceramic heat sink plate disclosed in Taiwan Patent No. M384406). Or, the heat sink is made by stamping, but the heat sink produced by the heat sink is not good (the surface resistance of the commercially available product is only about 1.2×10 ³ Ω), and in addition to the poor porosity, the preparation method of the stamp is limited to the shape of the finished product. Many (for example, only a sheet-like heat sink can be produced), and the forming size is limited to a length/width of 60 mm or less and a thickness of 5 mm or less, so that the size and shape cannot be changed, and the application range is narrow. Moreover, it is limited by the sintering technology of the traditional ceramic heat sink. If a ceramic heat sink having a size of more than 25 mm is to be produced, the thickness must be 2.5 mm or more. At this time, there is a problem of easy deformation at the same time. Therefore, the ceramic heat sinks currently on the market do not have products with a length/width greater than 50 mm but a thickness of less than 2 mm.

Therefore, there is a need in the art for a new heat sink material that can have a high surface resistance, a high porosity, and is not limited by shape, thereby achieving excellent heat dissipation and heat conduction.

The invention provides a heat dissipating component comprising: 85-98 parts by weight of ceramic material, comprising 100-300 mesh ceramic particles and 300-600 mesh ceramic particles; and 5-10 parts by weight The sintering agent has a plurality of holes, the holes have an average diameter of 20 μm-100 μm, the porosity of the holes is 16%-30%, and the surface resistance of the heat dissipating component is 1×10. ⁶ Ω to 1x10 ⁸ Ω.

The invention adopts two or more kinds of ceramic particles mixed with different meshes to form a heat dissipating component with excellent insulating effect, and the heat dissipating component produced by the invention is formed by injection molding, so that various three-dimensional shapes can be formed, Limited to two-dimensional sheet of traditional ceramic heat sink. For example, the heat dissipating member of the present invention may be in the form of a sheet, and at least one surface thereof has a patterned groove such as a straight strip shape, a ring shape, a concentric shape, a lattice shape or the like to enhance the heat dissipation/heat removal effect. Alternatively, the heat dissipating component of the present invention may further include at least one fixing hole extending through the heat dissipating component. The fixing hole can be used to fix the heat dissipating component on the IC chip, for example, through a set of spring fasteners, and the spring clip is passed through the fixing hole to fix the heat dissipating component on the IC chip.

Since the ceramic heat dissipating element has a relatively high hardness after being sintered, the post-processing is difficult, and the processing tool is easily damaged. Therefore, the ceramic heat dissipating member having a special shape is difficult to manufacture. In contrast, the technique of the present invention allows the ceramic heat dissipating component to have any three-dimensional shape, which greatly breaks through the conventional ceramic heat sink technology.

In addition, since the material combination and the manufacturing method of the heat dissipating component of the present invention are different from those of the conventional ceramic heat sink, the heat dissipating component of the present invention has an insulating property superior to that of the conventional ceramic heat sink. And this characteristic has been confirmed by the inspection data of the third verification institution.

The heat dissipating member of the present invention preferably has a length of 25 mm or more, a width of preferably 25 mm or more, and a thickness of preferably 2 mm or less. Due to the unique technology of the present invention, the heat dissipating component produced can reach a thin product having a thickness of 1 mm and a length/width of 25 mm or more, thereby solving the problem that the conventional ceramic cannot be increased in size.

In the heat dissipating component of the present invention, the holes are preferably connected to each other to form a capillary structure, and the hot gas can be convected to the outside through the holes through which the heat is communicated. In detail, the chimney effect formed by the characteristics of the capillary structure of the heat dissipating member of the present invention can effectively raise the hot gas while allowing cold gas to enter from the side pores of the troposphere to form a cycle of heat convection to assist the heat generating layer. Warm up or give help to cool down.

In the heat dissipating component of the present invention, the material of the ceramic particles is preferably selected from the group consisting of niobium carbide, aluminum oxide, aluminum nitride, tantalum nitride (SiN), boron nitride, graphite, and a mixture thereof.

In the heat dissipating component of the present invention, the sintering aid is preferably selected from the group consisting of: aluminosilicate; a composite of alumina and ceria; a mixture of quartz, feldspar, borax, clay (ie, composition of glaze water); An oxide of an element; a group consisting of boron oxide (B ₂ O ₃ ); phosphorus oxide (P ₂ O ₅ ); and cordierite ceramic powder. Among them, the cordierite ceramic powder is a ceramic powder in which cordierite (2MgO‧2Al ₂ O ₃ ‧5SiO ₂ ) is a main phase.

In the heat dissipating member of the present invention, the porosity is preferably calculated according to the following [Formula 1].

[Formula 1]

Porosity = (weight of the heat sink element to absorb water - weight of the heat sink element not absorbed) / weight of the heat sink element not absorbed.

In the heat dissipating component of the present invention, the weight of the 100-300 mesh ceramic particles and the 300-600 mesh ceramic particles is preferably:

100-300 mesh ceramic particles: 300-600 mesh ceramic particles = (40-50): (55-70).

In the heat dissipating component of the present invention, the heat dissipating component is preferably used for heat dissipation of a semiconductor wafer.

In the present invention, the number of meshes (e.g., 100 mesh, 300 mesh, 600 mesh) is a unit commonly used in the art.

The invention further provides a method for preparing a heat dissipating component, comprising the steps of: (A) 85-98 parts by weight of a ceramic material, 5-10 parts by weight of a sintering aid, and 10-15 parts by weight of a solvent (for example, water) Mixing to form a starting slurry, wherein the ceramic material comprises 100-300 mesh ceramic particles and 300-600 mesh ceramic particles; (B) 5-15 parts by weight of a bonding plasticizer is added to the step ( A) the obtained starting slurry is mixed and formed into a gel; (C) the gel obtained in the step (B) is shaped to form a blank; (D) the step (C) is obtained. Embossing the blank to form a hardened blank; and (E) sintering the hardened blank obtained in the step (D) to obtain a heat dissipating component, the sintering temperature being 1100 ° C - 1500 ° C, the sintering The time is 3-6 hours (that is, it must be maintained at a temperature of 1100 ° C - 1500 ° C for 3-6 hours. The sintering time is adjusted according to the size of the blank, when the thickness or dimension is large, the time required Longer; wherein the adhesive molding agent of the step (B) is selected from the group consisting of: polyvinyl alcohol (PVA), polyethylene glycol (PEG), polyvinyl acetate (PVAc), glass a group of dimensions, dextrin, water-soluble acrylic resin (PMMA) and a mixture thereof (ie, a mixture of the above-mentioned polymer materials); the heat dissipating component has a plurality of holes, and the average of the holes The diameter is from 20 μm to 100 μm, the porosity of the hole is 16% to 30%, and the surface resistance of the heat dissipating member is from 1 x 10 ⁶ Ω to 1 x 10 ⁸ Ω.

In the present invention, the ceramic powder is mixed with a sintering aid, water, a binder, and the like, and then formed into a blank by injection molding, and sintered into a body through a high-temperature furnace to have an irregular pore-like capillary. structure. When used, after combining the materials related to the heat conductive layer, it can be fixed on any surface of the heat generating layer, and the temperature difference between the Tc temperature (heating body surface temperature) and the Ta temperature (ambient temperature) is utilized, and the characteristics of the capillary structure are utilized. The chimney effect creates an effective rise of the hot gas while allowing cold gas to enter from the side pores of the troposphere to form a cycle of heat convection to assist the heating layer from heating up or providing cooling.

In the method for producing a heat dissipating member of the present invention, the forming in the step (C) is preferably carried out by injecting the gel into a forming mold by an injection molding machine. Since the method for producing a heat dissipating member of the present invention utilizes an injection molding technique, it can be formed into various three-dimensional shapes, and is not limited to a two-dimensional sheet-like conventional ceramic fin.

Since the ceramic heat dissipating element has a relatively high hardness after being sintered, the post-processing is difficult, and the processing tool is easily damaged. Therefore, the ceramic heat dissipating member having a special shape is difficult to manufacture. In contrast, the technique of the present invention allows the ceramic heat dissipating component to have any three-dimensional shape, which greatly breaks through the conventional ceramic heat sink technology. Moreover, due to the unique technology of the present invention, the heat dissipating component produced can reach a thin product having a thickness of 1 mm and a length/width of 25 mm or more, thereby solving the problem that the conventional ceramic cannot be increased in size.

In addition, since the material combination and the manufacturing method of the heat dissipating component of the present invention are different from those of the conventional ceramic heat sink, the heat dissipating component of the present invention has an insulating property superior to that of the conventional ceramic heat sink. And this characteristic has been confirmed by the inspection data of the third verification institution.

In the method for fabricating the heat dissipating component of the present invention, the holes are preferably connected to each other to form a capillary structure, and the hot gas can be convected to the outside by the holes communicating therewith. In detail, the chimney effect formed by the characteristics of the capillary structure of the heat dissipating member of the present invention can effectively raise the hot gas while allowing cold gas to enter from the side pores of the troposphere to form a cycle of heat convection to assist the heat generating layer. Warm up or give help to cool down.

In the method for preparing the heat dissipating component of the present invention, before the sintering step of the step (E), it is preferred to further comprise a step (E0): heating the hardened blank from a normal temperature to 1100 between 5 and 8 hours. °C-1500 ° C; and, after the sintering step of the step (E), further comprises a step (E1): between 6 and 10 hours, the sintered hardened blank is cooled to the normal temperature. The present invention uses a special heating and cooling curve to produce a heat dissipating component having a high surface resistance.

The method for preparing a heat dissipating component of the present invention, wherein the normal temperature is preferably from 0 ° C to 40 ° C, for example, room temperature of 25 ° C.

The method for preparing the heat dissipating component of the present invention, wherein the baking temperature of the step (D) is preferably 200-300 ° C, and the baking time is preferably 2.5-3.5 hours. The intention is to vaporize the water in the embryo to form a hardened embryo.

The method for preparing the heat dissipating component of the present invention, wherein the solvent of the step (A) is preferably water.

The method for preparing a heat dissipating component of the present invention, wherein the step (A) further comprises a step of powdering, which is preferably a ceramic particle having a weight ratio of 100-300 mesh: 300-600 mesh ceramic particles = (40-50): (55-70) ceramic particles are mixed to form the ceramic material.

The method for preparing the heat dissipating component of the present invention, wherein the material of the ceramic particles in the step (A) is preferably selected from the group consisting of niobium carbide, aluminum oxide, aluminum nitride, tantalum nitride SiN, boron nitride, graphite, and The group of its mix.

The method for preparing the heat dissipating component of the present invention, wherein the sintering aid of the step (A) is preferably selected from the group consisting of: aluminosilicate; composite material of alumina and ceria; quartz, feldspar, borax, clay a mixture (ie, a composition of glaze water); an oxide of a rare earth element; a group of boron oxide (B ₂ O ₃ ); phosphorus oxide (P ₂ O ₅ ); and a cordierite ceramic powder.

The method for preparing a heat dissipating component of the present invention, wherein the porosity is preferably calculated according to the following [Formula 1].

[Formula 1]

Porosity = (weight of the heat sink element to absorb water - weight of the heat sink element not absorbed) / weight of the heat sink element not absorbed.

The method for fabricating a heat dissipating component of the present invention, wherein the heat dissipating component is preferably used for heat dissipation of a semiconductor wafer such as an IC wafer.

[Example 1]

The heat dissipating member of this embodiment was prepared in accordance with the following procedure.

Step 1: Pulverizing

About 40 to 45 parts by weight of 100 to 300 mesh ceramic powder particles (for example, 43 parts by weight of 250 mesh ceramic powder particles) and about 55 to 60 parts by weight of 300 to 600 mesh ceramic powder particles (for example, 55) The 400 parts by weight of the ceramic powder particles are mixed and put into a mixer for dry mixing of the powder. Stir for a certain period of time to make the mixing uniform. Further, a sintering aid (5 to 10 parts by weight of the aluminosilicate compound) is mixed with a certain ratio of water, and poured into the above-mentioned mixer through a line to be mixed with the ceramic powder to prepare a starting powder. Here, the aluminosilicate compound used may be, for example, an aluminosilicate; a composite of aluminum oxide and cerium oxide; a mixture of quartz, feldspar, borax, clay (ie, a composition of glaze water); Oxide; boron oxide (B ₂ O ₃ ); phosphorus oxide (P ₂ O ₅ ); or cordierite ceramic powder.

Step 2: Gelation

After the above step 1 is completed, about 5-15 parts by weight of the polymer plastic (PVA) as a bonding plasticizer is heated by a heater to form a liquid, and is input into a mixer through a line to be mixed with the above starting powder, and continues. Stir to form a gelatinous material.

Step 3: Injection molding

The gel-like raw material formed in the step 2 is sent to a holding barrel of an injection molding machine via a line to maintain a liquid state. The raw material is injected into the forming blank mold (this metal mold is made of aluminum alloy or steel) by the injection pressure of the injection molding machine so as to have a blank having the shape shown in Fig. 1. This blank has a length of 60 mm, a width of 25 mm, and a thickness of 2 mm. In addition, the molding die must be equipped with an automatic control system and a cooling pipeline. After the raw material is injected into the forming blank mold, the automatic control system can add cooling water to cool the forming mold, and also feed the raw material into the mold. The liquid turns into a solid shape, which is shaped into a blank.

Step 4: Dry

The blanks set in step 3 are fed into a high temperature oven at about 250 ° C for about 3 hours of baking, which is intended to vaporize the water in the embryos to form a hardened embryo.

Step 5: Sintering

The hardened blank of step 4 is sent to a special high-temperature sintering furnace, and the trapezoidal automatic temperature control method is adopted, and the temperature is gradually heated to 1300 ° C for sintering, and then the temperature is lowered. The entire sintering and cooling process takes about 18 to 22 hours (adjusted according to the size of the embryo). The temperature rise and temperature drop curves of the sintering are shown in Figure 2. First, between 5-8 hours, the hardened blank is heated from normal temperature (0 ° C - 40 ° C, for example, about 25 ° C) to 1100 ° C - 1500 ° C (such as 1300 ° C); then, at this high temperature for 3-6 hours (such as 5 hours, the sintering time is adjusted according to the size, shape and volume of the blank); finally, between 6-10 hours, the hardening after sintering The embryos were cooled to room temperature. In this step, the ceramic powder is crystallized by the high temperature, and the polymer plastic is vaporized to form the desired capillary pores in the ceramic body, so that the heat dissipating member of the present embodiment is obtained.

Step 6: Clean and dry

Optionally, the ceramic heat dissipating component that has been sintered in step 5 can be sent to a washing machine for vibration cleaning, and the surface and the plastic residue in the structure are cleaned, and then the quality is screened, and the screened product is sent to the drying. The machine removes water.

Surface resistance analysis

The heat dissipating component obtained in this embodiment was tested and analyzed by Integrated Service Technology Inc., and its surface resistance was measured to be about 2.74 x ^{10 7} Ω, which is much larger than the surface resistance value of a commercially available product ( About 1.2x10 ³ Ω). Therefore, it was confirmed that the heat dissipating member of the present invention does enhance the insulating effect of the heat dissipating member.

Porosity analysis

In addition, the heat dissipation element obtained in the present embodiment is subjected to porosity measurement, and is calculated according to the following [Formula 1].

[Formula 1]

Porosity = (the weight of the heat sink to absorb water - the weight of the heat sink is not absorbed) / the weight of the heat sink without water absorption,

As a result of measurement, the heat dissipation member obtained in the present embodiment has a porosity of about 16% to 30%. Other test characteristics are shown in Table 1 below. The data in Table 1 is the result of inspection and analysis by Yi Te Technology.

In the present invention, the porosity of the heat dissipating member can be adjusted in accordance with the length of the sintering time. For example, when the sintering time is long, the porosity obtained is low. Conversely, when the sintering time is short, the resulting porosity is higher.

Scanning electron microscopy

As shown in FIG. 3, it is a scanning electron micrograph of the heat dissipating component obtained in the present embodiment (measured by SGS Taiwan Limited). As can be seen from the results shown in the figure, the average diameter of the heat dissipating member holes of the present embodiment is about 20 μm to 100 μm, and the holes are in communication with each other, so that the hot air can be convected to the outside through the holes which are communicated therewith.

The chimney effect formed by the characteristics of the capillary structure of the heat dissipating member of the present invention can effectively raise the hot gas while allowing cold gas to enter from the side pores of the troposphere to form a cycle of heat convection to assist the heat generating layer from heating up or giving Cooling help.

[Example 2-4]

The heat dissipating component of the embodiment is prepared by the same method and material as described in the embodiment 1. However, the difference is that the size of the heat dissipating component in the embodiment is as shown in Table 2 below, and the shape of the heat dissipating component is not convex. Flaky.

The heat dissipating components of the above embodiments 1-4 have all been successfully finished, and it has been confirmed that the technique of the present invention can indeed make a thinned product which cannot be achieved by the prior art.

In summary, the present invention uses two or more different sizes of ceramic particles to mix and pulverize, and forms a heat dissipating component having excellent insulation effect, and the heat dissipating component produced by the present invention is formed by injection molding, thereby making it possible Various three-dimensional shapes are not limited to two-dimensional sheet-shaped conventional ceramic heat sinks. Since the ceramic heat dissipating element has a relatively high hardness after being sintered, the post-processing is difficult, and the processing tool is easily damaged. Therefore, the ceramic heat dissipating member having a special shape is difficult to manufacture. In contrast, the technique of the present invention allows the ceramic heat dissipating component to have any three-dimensional shape, which greatly breaks through the conventional ceramic heat sink technology.

When the heat dissipating component of the present invention is used, after the finished material of the heat conducting layer is combined, it can be fixed on any surface of the heat generating layer, and the temperature difference between the Tc temperature (heating body surface temperature) and the Ta temperature (ambient temperature) is utilized. The chimney effect formed by the characteristics of the capillary structure causes the hot gas to rise effectively, while allowing cold gas to enter from the side pores of the troposphere to form a cycle of heat convection to assist the heating layer to no longer heat up or to provide cooling.

In addition, since the material combination and the manufacturing method of the heat dissipating component of the present invention are different from those of the conventional ceramic heat sink, the heat dissipating component of the present invention has an insulating property superior to that of the conventional ceramic heat sink. And this characteristic has been confirmed by the inspection data of the third verification institution.

The above-mentioned embodiments are merely examples for convenience of description, and the scope of the claims is intended to be limited to the above embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic view showing the shape of a blank of a preferred embodiment of the present invention.

2 is a graph showing the temperature rise and fall of sintering of a preferred embodiment of the present invention.

Figure 3 is a scanning electron micrograph of a preferred embodiment of the present invention.

Claims (19)

A heat dissipating component comprising: 85-98 parts by weight of a ceramic material comprising 100-300 mesh ceramic particles and 300-600 mesh ceramic particles; and 5-10 parts by weight of a sintering aid The heat dissipating component has a plurality of holes, the average diameter of the holes is 20 μm-100 μm, the porosity of the holes is 16%-30%, and the surface resistance of the heat dissipating component is 1×10 ⁶ Ω to 1×10 ⁸ Ω. The heat dissipating component according to claim 1, wherein the heat dissipating component has a length of 25 mm or more, a width of 25 mm or more, and a thickness of 2 mm or less. The heat dissipating component according to claim 1, wherein the holes are connected to each other to form a capillary structure. The heat dissipating component according to claim 1, wherein the ceramic material is selected from the group consisting of: tantalum carbide, aluminum oxide, aluminum nitride, tantalum nitride (SiN), boron nitride, graphite, and a mixture thereof. The group formed. The heat dissipating component according to claim 1, wherein the sintering aid is selected from the group consisting of: aluminosilicate; a composite of alumina and ceria; a mixture of quartz, feldspar, borax, clay (ie, The composition of the glaze water; the oxide of the rare earth element; the boron oxide (B ₂ O ₃ ); the phosphorus oxide (P ₂ O ₅ ); and the group of the cordierite ceramic powder. The heat dissipating component according to claim 1, wherein the porosity is calculated according to the following [Formula 1], [Formula 1] Porosity = (the weight of the heat dissipating component and the weight of the heat dissipating component ) / The weight of the heat sink element is not absorbed. The heat dissipating component according to claim 1, wherein the weight ratio of the 100-300 mesh ceramic particles to the 300-600 mesh ceramic particles is: 100-300 mesh ceramic particles: 300-600 mesh. Ceramic particles = (40-50): (55-70). The heat dissipating component of claim 1, wherein the heat dissipating component is used for heat dissipation of a semiconductor wafer. A method for preparing a heat dissipating component, comprising the steps of: (A) mixing 85-98 parts by weight of a ceramic material, 5-10 parts by weight of a sintering aid, and 10-15 parts by weight of a solvent to form a starting slurry, wherein The ceramic material comprises 100-300 mesh ceramic particles and 300-600 mesh ceramic particles; (B) 5-15 parts by weight of a bonding plasticizer is added to the starting slurry obtained in the step (A). And mixing to form a gel; (C) shaping the gel obtained in the step (B) to form a blank; (D) baking the blank obtained in the step (C) to form a hardened hair And (E) sintering the hardened blank obtained in the step (D) to obtain a heat dissipating member, the sintering temperature is 1100 ° C - 1500 ° C, and the sintering time is 3-6 hours; The adhesive molding agent of the step (B) is selected from the group consisting of polyvinyl alcohol (PVA), polyethylene glycol (PEG), polyvinyl acetate (PVAc), glass fiber, dextrin, water-soluble pressure. a group consisting of PMMA, and a mixture thereof, the heat dissipating component has a plurality of holes, and the holes have an average diameter of 20 μm to 100 μm. The porosity of 16% -30% based, and the surface resistance of the heat dissipation element of the system to 1x10 ⁶ Ω to 1x10 ⁸ Ω. The method for producing a heat dissipating member according to claim 9, wherein the molding in the step (C) is formed by injecting the gel into a forming mold by an injection molding machine. The method for preparing a heat dissipating component according to claim 9, wherein before the sintering step of the step (E), the method further comprises a step (E0): between 5 and 8 hours, the hardened blank is Heating at a normal temperature to 1100 ° C - 1500 ° C; and, after the sintering step of the step (E), further comprising a step (E1): cooling the sintered hardened blank to the normal temperature between 6-10 hours . The method for preparing a heat dissipating component according to claim 11, wherein the normal temperature is 0 ° C to 40 ° C. The method for preparing a heat dissipating component according to claim 9, wherein the baking temperature of the step (D) is 200-300 ° C, and the baking time is 2.5-3.5 hours. The method for preparing a heat dissipating component according to claim 9, wherein the solvent of the step (A) is water. The method for preparing a heat dissipating component according to claim 9, wherein the step (A) further comprises a step of pulverizing, which is a ceramic granule having a weight ratio of 100-300 mesh: 300-600 mesh. The ceramic particles = (40-50): (55-70) ceramic particles are mixed to form the ceramic material. The method for preparing a heat dissipating component according to claim 9, wherein the material of the ceramic particle of the step (A) is selected from the group consisting of: niobium carbide, aluminum oxide, aluminum nitride, tantalum nitride SiN, and nitriding. a group consisting of boron, graphite, and mixtures thereof. The method for preparing a heat dissipating component according to claim 9, wherein the sintering aid of the step (A) is selected from the group consisting of: aluminosilicate; a composite of alumina and ceria; quartz, feldspar a mixture of borax, clay (ie, the composition of glaze water); an oxide of a rare earth element; a boron oxide (B ₂ O ₃ ); a phosphorus oxide (P ₂ O ₅ ); and a group of cordierite ceramic powders. The method for preparing a heat dissipating component according to claim 9, wherein the porosity is calculated according to the following [Formula 1], [Formula 1] Porosity = (The weight of the heat sink component is saturated with water - the heat dissipating component is not The weight of the water absorption) / the weight of the heat dissipating component that does not absorb water. The method for fabricating a heat dissipating component according to claim 9, wherein the heat dissipating component is used for heat dissipation of a semiconductor wafer.