CN100390976C - Porous structive coramic cooling fin and its making method - Google Patents
Porous structive coramic cooling fin and its making method Download PDFInfo
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- CN100390976C CN100390976C CNB021600910A CN02160091A CN100390976C CN 100390976 C CN100390976 C CN 100390976C CN B021600910 A CNB021600910 A CN B021600910A CN 02160091 A CN02160091 A CN 02160091A CN 100390976 C CN100390976 C CN 100390976C
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Abstract
The present invention relates to a porous structural ceramic heat radiating fin and a preparation method thereof. The heat radiating fin is composed of a heat radiating layer, a heat conducting layer and a fan, wherein the heat radiating layer has the structure that emulsion slurry is not uniformly dispersed, and a ceramic powder tiny bag is formed and is combined with sub micro powder; the heat radiating layer in a hollow crystal porous structure is formed by sintering; the heat conducting layer is arranged between the heat radiating layer and a heat source contact surface, and the heat of the heat source is absorbed by the heat conducting layer; the heat is radiated by the hollow crystal porous structure of the heat radiating layer through the forced convection effect of the fan. The present invention has the advantages of large contact area with air, high mechanical strength, heat radiation, simple preparation process, low cost of raw materials and high economic value. The present invention can be widely used for heat radiation of various integrated circuit chips and heating electronic devices.
Description
Technical field
The present invention relates to a kind of fin and preparation method thereof, refer in particular to a kind of hole structural ceramics fin and preparation method thereof.
Background technology
Along with the development of digitized processing equipment, semiconductor spare is high frequencyization day by day, is that the processing speed of the digit chip of representative is maked rapid progress especially with central processing unit (CPU).But high processing rate also can bring high temperature to device, how the heat of electronic device generation is discharged effectively, and it is turned round under suitable working temperature, has become the emphasis that each enterprise falls over each other to develop.
With the computer is example, and existing central processing unit all is equipped with radiator, to assist to discharge the heat that chip produces.And radiator mostly is provided with fin, fin is again the fin of different shape, and fit with central processing unit, also be provided with a fan on the radiator, be used for producing cross-ventilation, with the heat band that absorbs from going out fin (computer inner space and designing requirement are looked in exhausting or air-supply), to reduce temperature.Though existing fin has all adopted the copper of heat conduction and good heat dissipation effect, aluminium alloy to make, yet, still have the space of improvement because the effect of heat conduction and heat radiation is not best.More than being the existing defective of prior art, also is the difficult problem that those skilled in the art demand urgently overcoming.
Summary of the invention
The technical problem to be solved in the present invention provides and a kind ofly can improve the surface area contacted hole structural ceramics of thermal convection fin, and the method for preparing this hole structural ceramics fin, this fin perfect heat-dissipating has higher economic value added, and its manufacture method is simple.
For reaching the technical scheme that this purpose takes be:
A kind of hole structural ceramics fin, comprise heat dissipating layer, heat-conducting layer and fan, heat-conducting layer overlays on the contact surface of heat dissipating layer and thermal source, fan is fixed on a side of fin, heat dissipating layer is mixed and made into the hole structure of hollow crystalline solid by emulsion state slurry and ceramic material, this its porosity of heat dissipating layer with hole structure is 5-40%, and the ceramic material particle diameter is 0.09-0.30 μ m, and the emulsion state slurry comprises organic solvent, dispersant and polymer binder.Organic solvent is ethanol and toluene, and polymer binder is a polyvinyl alcohol, and ceramic material is titanium dioxide, barium monoxide, strontium oxide strontia, alundum (Al and zirconic mixture.The heat-conducting layer material contains argent.
A kind of preparation method of hole structural ceramics fin may further comprise the steps:
(1) size mixing: ceramic material, organic solvent ethanol and toluene, dispersant is even, and viscosity is controlled at 5-10cp; Grind again and stir into time micron powder slurry, diameter of particle 0.09-0.30 μ m.
(2) preparation adhesive: polyvinyl alcohol added in the entry stir, making polyvinyl alcohol content is 3-5%.
(3) preparation liliquoid: time micron powder slurry that step (1) is made mixes, stirs with the adhesive that step (2) makes, and makes liliquoid, and the ratio of inferior micron powder slurry and adhesive is 1: 1.
(4) drying: blocks of solid is made in the liliquoid oven dry, made the hole structural material.
(5) granulation: place mortar levigate above-mentioned hole structural material, strike out the heat dissipating layer of reservation shape again.
(6) sintering: the hole structure heat dissipating layer that the heat dissipating layer of reservation shape is sintered into tool hollow crystalline solid.
(7) print surface heat-conducting layer: by the screen painting mode macromolecule silver paste is printed onto hole structure heat dissipating layer surface, hole structural ceramics fin is made in oven dry.
Wherein:
Ceramic material in the step (1) is titanium dioxide, barium monoxide, strontium oxide strontia, alundum (Al and zirconic mixture.
Organic solvent ethanol consumption in the step (1) is the 17.5-18.5% of ceramic material; The toluene consumption is the 25.5-27.5% of ceramic material; Dispersant dosage is the 1.5-2.5% of ceramic material.
Process of lapping in the step (1) adopts zirconia or aluminium oxide abrading-ball to grind, and the diameter of abrading-ball is 3-30mm, differs in size.
Theoretical foundation of the present invention is:
1, the microcosmic principles of chemistry:
Liquid-liquid phase changes (liquid-liquid phase transformation)
The present invention utilizes existing in the organic system slurry two kinds of organic solvent-toluene and ethanol, with hydrophilic be that the macromolecule adhesive mixes.In this process, ethanol can mix fully with water, but toluene and hydrophilic functional group can repel mutually, utilize toluene that the immiscible characteristic of hydrophilic functional group is stirred, painstakingly be deployed into emulsion state slurry (seeing the latex district that Fig. 1 is represented), and then ceramic powders glue is coupled in the latex.Particle size dispersion analogous diagram as shown in Figure 2, big particle diameter powder is because Fan Dewaerli assembles more at once in the latex, small particle diameter is then filled up in big particle diameter powder ball periphery, macromolecule adhesive and inorganic material form stable covalent bond simultaneously, shown in Fig. 2-1 be homodisperse structure wherein, shown in Fig. 2-2 is inhomogeneous dispersed structure.So, yet ceramic post sintering can be produced, form the hole structure from uniform space.
2, physical principle:
With regard to nano material, has the physical characteristic of general same material, as character such as optics, magnetic, hot biography, diffusion and machineries.For making its powder have above-mentioned characteristic equally, must mix by the ceramic powders of different-grain diameter.Adopt the small particle diameter powder to get final product with sub-micron grade (as 0.13 μ m), if particle diameter adopts nanoscale, sintering will cause porosity too little, and influence its heat dissipation characteristics.But its capacity of heat transmission will promote to some extent, and mechanical strength will promote greatly simultaneously.Intensification condition control when noting sintering in addition is to obtain the best porosity and the proportioning of mechanical strength.Generally speaking, powder diameter is big more, and porosity is more little behind the sintering, and the mechanical strength of material correspondingly will reduce significantly simultaneously.
3. object heat transfer principle:
The heat transfer of all objects can be divided into three kinds, conduction, convection current, radiation.Generally speaking the energy that can remove of radiation is too little, can not consider.Therefore when the preparation fin, most important heat transfer mechanism is exactly conduction and convection current.In computer radiating apparatus, heat conducting importance is heat energy is sent to the heat-dissipating thing surface, as shown in Figure 3.Thermal convection is the most important to the influence of cooling, the heat energy that the computer CPU wafer produces is taken away through cross-ventilation because be.The factor that influences the thermal convection maximum just belongs to area of dissipation.Q (convection current)=h * A (surface area) * Δ T, wherein Q is an energy, and K is the coefficient of heat conduction, and A is a media area, and Δ X is a dielectric thickness, Δ T is a temperature difference.
Pore space structure fin of the present invention, mainly be to constitute by heat dissipating layer and heat-conducting layer, this heat dissipating layer is to utilize the microcosmic chemical liquid phase to change principle, with the inhomogeneous dispersion of emulsion state slurry, form little pack arrangement of ceramic powder, and combine with inferior micro-powder, the hole structure heat dissipating layer that reburns and form the hollow crystalline solid, itself and heat source-contacting surface have a heat-conducting layer, absorbing the thermal source heat with heat-conducting layer, by the hole structure of heat dissipating layer hollow crystalline solid, is the heat radiation media with the air again, apply with conditions of forced convection (as fan), improve the heat-sinking capability of fin.According to the heat radiation needs, heat dissipating layer can be made into plate or fin-type, and other adopts silver-colored Ag as heat-conducting layer, and its coefficient of heat conduction K=421W/mK is if use the more Heat Conduction Material of high heat-conduction coefficient, more helpful to the lifting meeting of heat-sinking capability.
The invention has the beneficial effects as follows: amass because the fin of hole structure has very large air contacting surface, this surface area exceeds thousands of times more than the compact texture fin, so its heat-sinking capability is good.Though the coefficient of heat conduction of pore space structure pottery is relatively poor,,, has very high mechanical strength simultaneously, its impact strength position 17-28Kg/cm so the heat energy that can take away in the unit interval is very high because its unit area of dissipation is 50886 times that copper is used
2Prepare fin with the hole structural material, can solve the not good defective of aluminum metal radiating fin radiating effect of present large volume fully, have the simple and low advantage of the cost of raw material of production technology simultaneously concurrently, can be widely used in the various electronic installation heat radiations that can generate heat.
Description of drawings
Below in conjunction with accompanying drawing the specific embodiment of the present invention is done to describe in further detail.
Fig. 1 is liquid-liquid phase change figure of the present invention.
Fig. 2 is a particle size dispersion simulation drawing of the present invention.
Fig. 3 is medium heat conduction key diagram.
Fig. 4 is the present invention setting figure that heats up.
Fig. 5 is that milling time of the present invention is to the particle diameter graph of a relation.
Fig. 6 is a pore space structure fin profile of the present invention.
Fig. 7 is fin testing apparatus figure of the present invention.
Fig. 8 heats up to the heat absorptivity comparison diagram of fin for thermal source.
Fig. 9 heats up to the thermal diffusivity comparison diagram of fin for thermal source.
Figure 10 is the heat-sinking capability comparison diagram.
Number in the figure is described as follows:
1, heat dissipating layer 2, heat-conducting layer
Embodiment
A kind of hole structural ceramics fin, comprise heat dissipating layer 1, heat-conducting layer 2 and fan, heat-conducting layer 2 overlays on the contact surface of heat dissipating layer and thermal source, fan is fixed on a side of fin, heat dissipating layer 1 is mixed and made into the hole structure of hollow crystalline solid by emulsion state slurry and ceramic material, porosity is 20%, and this its porosity of heat dissipating layer with hole structure is 5-40%, and the ceramic material particle diameter is 0.20 μ m.
Wherein, the emulsion state slurry comprises organic solvent, dispersant and polymer binder.Organic solvent is ethanol and toluene, and polymer binder is a polyvinyl alcohol, and ceramic material is titanium dioxide, barium monoxide, strontium oxide strontia, alundum (Al and zirconic mixture.The ethanol consumption is 18% of a ceramic material; The toluene consumption is 26% of a ceramic material, and dispersant dosage is 2% of a ceramic material.The heat-conducting layer material is a silver paste.
A kind of preparation method of hole structural ceramics fin may further comprise the steps:
(1) size mixing: get ceramic material (Dielectric Ceramics) 137.87g, ethanol (EtoH) 25.06g toluene (Toluene) 37.06g and dispersant (BYK-111) 2.76g mixing and be deployed into uniform slurry, wherein the main component of ceramic material is titanium dioxide TiO
2, barium monoxide BaO, strontium oxide strontia SrO, alundum (Al Al
2O
3With scandium oxide ZrO, the BYK of dispersant is the German company title, and model is 111, and its composition is a kind of copolymer that contains acidic-group, acid number is 129mg/KOHg, density is 1.16g/ml, and BYK-111 is a kind of commercially available prod, and its adapted amount is equivalent to 2.0% of dielectric ceramic material, the viscosity of slurry is controlled at 5-10cp, to guarantee even dispersion.Put into Φ=3mm: 10mm: 30mm, ratio and be 5: 3: 2 zirconia ball in slurry, low speed grinds and stirred 12 hours, makes the powder particle diameter reach 0.13 μ m.The zirconia ball that employing is mixed with above-mentioned three kinds of different-grain diameters carries out the low speed grinding to powder, more now can save 1/2 above milling time with method.About particle diameter to the relation of milling time referring to table one and Fig. 5.
Table one
| Time (hr). | Diameter (μ m) | Viscosity (cp) 12rpm | BYK-111 |
| 5 | 0.491 | 53.5 | 1.2％ |
| 7.5 | 0.189 | 26.6 | 1.2％ |
| 10 | 0.132 | 10 | 2.0％ |
| 12.5 | 0.125 | 8.6 | 2.0％ |
| 17.5 | 0.09 | 7.9 | 2.0％ |
(2) preparation adhesive: get polyvinyl alcohol (PVA) 0.4g and add in the 9.6g water, be deployed into polyvinyl alcohol content after stirring and be 4% adhesive.
(3) preparation liliquoid: get powder 5g made in the step (1), particle diameter is 0.13 μ m, and adding 5g polyvinyl alcohol content is 4% adhesive, and high degree of agitation is up to generating liliquoid.
(4) drying: liliquoid is dried into blocks of solid, makes the hole structural material.
(5) granulation: place mortar levigate above-mentioned hole structural material, get the 0.5g fine powder again and place special fixture to strike out the heat dissipating layer of fin shape.
(6) sintering: the heat dissipating layer of above-mentioned reservation shape is put into sintering furnace,, yet form the hole structure heat dissipating layer that has from homogeneous space and hollow crystalline solid with three sections thermostatic mode sintering.
Wherein the intensification establishing method of syllogic constant temperature sintering processing is referring to table two and Fig. 4.
Table two
| |
1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 |
| Temperature ℃ | 150 | 250 | 250 | 550 | 550 | 800 | 1040 | 1040 |
| Setting-up |
30 | 60 | 120 | 90 | 120 | 120 | 120 | 180 |
(7) print surface heat-conducting layer: by the screen painting mode macromolecule silver paste is printed onto on the above-mentioned hole structure heat dissipating layer with hollow crystalline solid, forms heat-conducting layer, again with 140 ℃-160 ℃ oven dry 2 minutes.
The heat dissipating layer of this radiator is to utilize the microcosmic chemical liquid phase to change principle, with the inhomogeneous dispersion of emulsion state slurry, form little pack arrangement of ceramic powder, and combine with inferior micro-powder, sinter the hole structure heat dissipating layer of tool hollow crystalline solid into, heat dissipating layer and heat source-contacting surface are provided with a heat-conducting layer, absorb the thermal source heat by heat-conducting layer, are dispelled the heat by the forced convertion effect of fan by the hole structure of heat dissipating layer hollow crystalline solid again.
Can test the fin of making by said method by the following method.
Design apparatus utilizes the absorption of the thermal conduction characteristic discussion heat energy of material as shown in Figure 7, opens the heat-sinking capability that fan is observed material afterwards.
More following four kinds of materials: the following characteristic of copper sheet, aluminium flake, water absorption pottery, pore space structure pottery:
1, heat up to the heat absorptivity of fin as table three and thermal source shown in Figure 8,
Table three
2, heat up to the heat dissipation characteristics (fan is 5Volt/0.4W) of fin as table four and thermal source after opening fan shown in Figure 9.
3, heat-sinking capability as shown in figure 10, promptly same time point endothermic temperature deducts the heat-sinking capability of exothermic temperature.
By above simple analysis of experiments, the heat-sinking capability of hole pottery is best, and increase in time simultaneously can learn that heat-sinking capability will be better by last figure.It is long-pending that reason is that pore space structure has very large air contacting surface, exceeds thousands of times more than compact texture.What it was relevant is calculated as follows:
Below calculate and only compare with regard to copper radiating rib and pore space structure ceramic heat-dissipating sheet
Thermal source provides 1573joule/sec=1573W
Pore space structure pottery average grain diameter=0.13 μ m, porosity=18%
Copper sheet A=2.56 * 10
-4m
2Δ X=2.0 * 10
-3m
Pore space structure pottery A=6.76 * 10
-4m
2Δ X=1.7 * 10
-3m
Heat conduction formula: Q=KT Δ T/ Δ X
Spheroid volume company: 4/3 * π r
3
Spherome surface amasss formula: 4 π r
2
The calculating of being done by above data sees also table five.
| The fine copper metal | The hole pottery | |
| Coefficient of heat conduction K | 384W/mK | 250～300W/mK |
| Unit interval is taken away heat | 344.1W/Sec | 1548.8W/sec |
| The unit area of dissipation | 6.56e-4m 2/cm 3 | 33.23m 2/cm 3 |
Though the coefficient of heat conduction of the hole structural ceramics shown in the table five is relatively poor, because its unit area of dissipation is 50886 times that copper is used, just can be so high so can take away heat energy in the unit interval.Have mechanical strength simultaneously concurrently, its impact strength can reach 17-28Kg/cm
2
With fin of the present invention to the Industrial Technology Research Institute of Taiwan's material " foaming metal heat dispersion heat sink " (patent No. 105890) compare.The heat-sinking capability of its foaming aluminum metal is 5W/cm
2, to pass coefficient be 0.5W/Gm for equivalent advection heat
2℃.And the heat-sinking capability of ceramic heat-dissipating sheet of the present invention is 229.1W/cm
2, to pass coefficient be 12.06W/cm for equivalent advection heat
2℃, be superior obviously than this patent.
Prepare fin by the hole structure, can solve the not good defective of aluminum metal radiating fin radiating effect of present large volume fully, have the advantage that manufacturing process is simple, the cost of raw material is low simultaneously, can be widely used in the heat radiation of various integrated circuit (IC) chip and heating electronic installation.
Claims (10)
1. hole structural ceramics fin, comprise heat dissipating layer, heat-conducting layer and fan, heat-conducting layer overlays on the contact surface of heat dissipating layer and thermal source, fan is fixed on a side of fin, it is characterized in that: described heat dissipating layer is mixed and made into the hole structure of hollow crystalline solid by emulsion state slurry and ceramic material, this its porosity of heat dissipating layer with hole structure is 5-40%, and the ceramic material particle diameter is 0.09-0.30 μ m.
2. hole structural ceramics fin according to claim 1 is characterized in that: described emulsion state slurry includes following composition: organic solvent, dispersant, polymer binder.
3. hole structural ceramics fin according to claim 2, it is characterized in that: described organic solvent is ethanol and toluene, polymer binder is a polyvinyl alcohol, and ceramic material is titanium dioxide, barium monoxide, strontium oxide strontia, alundum (Al and zirconic mixture.
4. hole structural ceramics fin according to claim 3 is characterized in that: the ethanol consumption is the 17.5-18.5% of ceramic material; The toluene consumption is the 25.5-27.5% of ceramic material.
5. hole structural ceramics fin according to claim 2 is characterized in that: described dispersant dosage is the 1.5-2.5% of ceramic material.
6. hole structural ceramics fin according to claim 1 is characterized in that: described heat-conducting layer material contains argent.
7. preparation method of hole structural ceramics fin according to claim 1 is characterized in that through following steps:
(1) size mixing: ceramic material, organic solvent ethanol and toluene, dispersant is even, and viscosity is controlled at 5-10cp; Grind again and stir into time micron powder slurry, diameter of particle 0.09-0.30 μ m;
(2) preparation adhesive: polyvinyl alcohol added in the entry stir, making polyvinyl alcohol content is 3-5%;
(3) preparation liliquoid: time micron powder slurry that step (1) is made mixes, stirs with the adhesive that step (2) makes, and makes liliquoid, and the ratio of inferior micron powder slurry and adhesive is 1: 1;
(4) drying: blocks of solid is made in the liliquoid oven dry, made the hole structural material;
(5) granulation: place mortar levigate above-mentioned hole structural material, strike out the heat dissipating layer of reservation shape again;
(6) sintering: the hole structure heat dissipating layer that the heat dissipating layer of reservation shape is sintered into tool hollow crystalline solid;
(7) print surface heat-conducting layer: by the screen painting mode macromolecule silver paste is printed onto hole structure heat dissipating layer surface, hole structural ceramics fin is made in oven dry.
8. according to the preparation method of claim 7 described hole structure fin, it is characterized in that: the ceramic material described in the step (1) is titanium dioxide, barium monoxide, strontium oxide strontia, alundum (Al and zirconic mixture.
9. according to the preparation method of claim 7 described hole structure fin, it is characterized in that: the organic solvent ethanol consumption described in the step (1) is the 17.5-18.5% of ceramic material; . the toluene consumption is the 25.5-27.5% of ceramic material; Dispersant dosage is the 1.5-2.5% of ceramic material.
10. according to the preparation method of claim 7 described hole structure fin, it is characterized in that: the process of lapping in the step (1), adopt zirconia or aluminium oxide abrading-ball to grind, the diameter of abrading-ball is 3-30mm, differs in size.
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|---|---|---|---|
| CNB021600910A CN100390976C (en) | 2002-12-31 | 2002-12-31 | Porous structive coramic cooling fin and its making method |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101238575B (en) * | 2005-08-11 | 2010-06-16 | 三菱电机株式会社 | Heat radiator and its making method |
| US8371367B2 (en) | 2005-08-11 | 2013-02-12 | Mitsubishi Denki Kabushiki Kaisha | Heat sink and fabricating method of the same |
| KR20100014769A (en) * | 2007-01-10 | 2010-02-11 | 오스람 게젤샤프트 미트 베쉬랭크터 하프퉁 | Electronic component module and method for production thereof |
| CN103910535B (en) * | 2012-12-31 | 2016-12-07 | 华越科技股份有限公司 | Porous ceramics fin and preparation method |
| CN104752375A (en) * | 2013-12-27 | 2015-07-01 | 奇鋐科技股份有限公司 | Semiconductor heat dissipation structure |
| CN108172554B (en) * | 2018-03-27 | 2024-02-06 | 梧州三和新材料科技有限公司 | High-heat-conductivity and high-heat-radiation sheet and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0878587A (en) * | 1994-08-31 | 1996-03-22 | Toshiba Transport Eng Kk | Power semiconductor device cooling device |
| CN1289145A (en) * | 1999-09-16 | 2001-03-28 | 钦品科技股份有限公司 | Radiating pin for integrated circuit and its manufacture |
-
2002
- 2002-12-31 CN CNB021600910A patent/CN100390976C/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0878587A (en) * | 1994-08-31 | 1996-03-22 | Toshiba Transport Eng Kk | Power semiconductor device cooling device |
| CN1289145A (en) * | 1999-09-16 | 2001-03-28 | 钦品科技股份有限公司 | Radiating pin for integrated circuit and its manufacture |
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