550973 五、發明說明（1 ) [發明所屬之技術領域] : 本發明爲有關一種利用有機電發光（以下稱有機EL ) ， ’將具有由有機EL材料薄膜所形成的發光層之有機el · 元件’以矩陣狀配置所構成的有機EL顯示面板者。 . [從來的技術] 這種有機EL顯示面板是在第1電極（陽極）與第2電極（ 陰極）之間形成有機EL層。爲了要使有機EL層形成爲矩 陣配置的構成，在於形成有機EL層後，必須將第2電極 # 形成爲與第1電極交叉（正交）的平行帶狀者。然而，有機 EL材料是經不起水分，不能用濕法製程的光刻法形成第2 電極，在一般上是以蒸鍍法所形成。此時，爲了確保第2 電極與第1電極間的絕緣性及相鄰第2電極彼此之間的絕 緣性，是採用在相鄰第2電極之間設置與第2電極平行方 向延伸的隔牆者。 例如在特開平8- 3 1 5 9 8 1號公報中，所發表的是如第4 圖所示，是採用形成在與基板4 1上所形成的平行之陽極 42成正交方向（垂直於第4圖的紙面方向）之絕緣層43 Φ ，和形成在其上面的倒錐形狀之隔牆44的兩項設施，以 確保形成在有機EL層45上的陰極46彼此之間和陰極46 與陽極42之間的絕緣性者。 又，有機EL材料與氧氣或水分之反應性很高，如不在 於與外氣保持遮斷狀態下使用時，會由大氣中的氧氣或水 分而產生化學劣化，而會有所謂黑斑，不發光區域會擴大 之問題。而要防止此不妥情況時，必須將有機EL元件加 550973 五、發明說明（2) 以封閉。其封閉方法是有如第5圖（a)所示的，將金屬製 或玻璃製的封閉罩（封閉罐）47黏合於基板4 1上，以將 有機EL元件48封閉之方法。又，也有如第5圖（b)所示 的，使用氮化矽（SiN)等的防濕性優異的物質，用電漿化 學氣相澱積（以下稱PCVD)等的方法，形成數4〜數萬 nm厚度的防濕膜（保護膜）49，以將有機EL元件48封 閉之方法者。 [發明欲解決之問題] 然而，如用封閉罩47將有機EL元件48封閉時，有機 EL顯示面板的厚度會增加很多（起碼要2mm程度），而 會妨礙到薄型化。一方面，如用防濕膜49封閉時，對薄 型化並無問題，但，隱藏在側錐形下方的部分是難於被成 膜，因而會有如第6圖所示的，對有機EL層45的端部2 封閉，會成爲不完全之問題。 本發明乃有鑑於上述從來的問題，目的是在於提供一種 可確保形成在有機EL層上的第2電極彼此之間和第2電 極與第1電極之間的絕緣性，且要用薄膜封閉有機EL元 件時，可將有助於發光的有機EL元件確實的封閉之有機 EL顯示面板者。 [發明之解決手段] 爲達成上述目，申請專利範圍第1項所記載的發明是在 於將具有由有機EL材料的薄膜所形成的發光層之有機EL 元件，以矩陣狀配置所構成之有機EL顯示面板中，具備 :在其表面形成爲平行帶狀的第1電極之基板；除在上述550973 V. Description of the invention (1) [Technical field to which the invention belongs]: The present invention relates to an organic EL element that uses an organic electroluminescence (hereinafter referred to as an organic EL), which will have a light-emitting layer formed of a thin film of an organic EL material 'An organic EL display panel configured in a matrix arrangement. [Prior art] In this organic EL display panel, an organic EL layer is formed between a first electrode (anode) and a second electrode (cathode). In order to form the organic EL layer in a matrix configuration, after forming the organic EL layer, it is necessary to form the second electrode # into a parallel strip shape that intersects (or crosses) the first electrode. However, organic EL materials cannot withstand moisture, and cannot form a second electrode by a photolithography method using a wet process, and are generally formed by a vapor deposition method. At this time, in order to ensure the insulation between the second electrode and the first electrode and the insulation between adjacent second electrodes, a partition wall extending in a direction parallel to the second electrode is used between the adjacent second electrodes. By. For example, in Japanese Unexamined Patent Publication No. 8- 3 1 5 9 8 1, as shown in FIG. 4, the anode 42 formed in parallel with the substrate 41 is formed in an orthogonal direction (perpendicular to In the direction of the paper surface in FIG. 4), the two layers of the insulating layer 43 Φ and the inverted cone-shaped partition wall 44 formed thereon ensure the cathodes 46 formed on the organic EL layer 45 and the cathodes 46 and Insulation between the anodes 42. In addition, the organic EL material has high reactivity with oxygen or moisture. If it is not used in a state of being blocked from outside air, it will be chemically deteriorated by oxygen or moisture in the atmosphere, and there will be so-called dark spots. The problem that the light emitting area will be enlarged. To prevent this problem, the organic EL element must be added with 550973. V. Invention Description (2) to close. The sealing method is as shown in Fig. 5 (a). A metal or glass sealing cover (closed can) 47 is adhered to the substrate 41 to seal the organic EL element 48. Also, as shown in FIG. 5 (b), there is a method using plasma chemical vapor deposition (hereinafter referred to as PCVD) using a material having excellent moisture resistance such as silicon nitride (SiN), and the number is 4 A method of encapsulating the organic EL element 48 with a moisture-proof film (protective film) 49 having a thickness of tens of thousands of nanometers. [Problems to be Solved by the Invention] However, if the organic EL element 48 is closed by the sealing cover 47, the thickness of the organic EL display panel will increase significantly (at least about 2 mm), which will hinder thinning. On the one hand, if it is closed with the moisture-proof film 49, there is no problem in reducing the thickness. However, the part hidden under the side cone is difficult to be formed. Therefore, as shown in FIG. 6, the organic EL layer 45 The closed end 2 will become an incomplete problem. The present invention has been made in view of the above-mentioned problems, and an object thereof is to provide an organic EL layer that can secure the insulation between the second electrodes and between the second electrodes and the first electrode, and seal the organic layer with a thin film. In the case of an EL element, an organic EL display panel that can reliably close an organic EL element that contributes to light emission can be used. [Means for Solving the Invention] In order to achieve the above object, the invention described in the first patent application scope is an organic EL device having an organic EL element having a light-emitting layer formed of a thin film of an organic EL material in a matrix arrangement. The display panel includes: a substrate having first electrodes formed in a parallel strip shape on a surface thereof;
550973 五、發明說明（3) 第1電極上的所定位置保留作爲形成多數的上述有機EL 元件用之區域外，在其餘部分所設置的，與上述第1電極 成交叉狀態之絕緣性隔牆；形成在上述區域上的有機EL 層；和至少可將上述有機EL層加以覆蓋，且形成爲平行 帶狀之第2電極；而，上述絕緣性隔牆是由越靠近於其與 上述第1電極面對的一側，其寬度會越窄的形成爲倒錐形 狀之兩條凸條，和沿著該兩凸條的外側，形成爲其底面側 成爲寬幅的錐形狀之絕緣層所構成者。 在此發明中，互爲平行的第2電極彼此之間的絕緣是由 構成隔牆的倒錐形狀之兩條凸條所確保。又，由於有設在 上述兩條凸條外側的錐形狀絕緣層之存在，因而，要封閉 有機EL元件時如使用SiN等的薄膜時，可由該薄膜將具 顯示功能的部分之有機EL層確實的覆蓋。 申請專利範圍第2項的發明是在於申請專利範圍第1項 所記載的發明中，上述絕緣層是用正抗蝕劑所形成者。因 此，本發明中，與使用負型抗蝕劑的情形相比，是較容易 的在隱藏於倒錐形狀凸條下面的部分形成絕緣層。 申請專利範圍第3項的發明是在於申請專利範圍第1 或第2項所記載的發明中，在上述有機EL元件上，係形 成有將其覆蓋之保護膜者。因此，本發明中與使用金屬製 或玻璃製的封閉罩的構成相比，是較可使有機EL顯示面 板薄型化。 [發明之實施形態] 以下參照第1圖〜第3圖說明本發明的具體化之一實施 550973 五、發明說明（4) 形態。 _ 如第1圖（a)所示，有機EL顯示面板1是例如由：在作 · 爲基板的彩色濾光片2的表面上，形成多數的平行帶狀之 ’ 第1電極（陽極）3，第1電極3是由錫銦氧化物（ITO)等 . 所構成；又，在彩色濾光片2上，除在其所定位置保留作 爲形成多數的有機EL元件5用之區域外，在其餘部分形 成與第1電極3成正的平行帶狀之絕緣性隔牆4 ;在彩色 濾光片2上，以緊靠於隔牆4的形成有機EL層6 ;並在 φ 有機EL層6上形成第2電極7 (陰極）7所構成者。 有機EL層6是例如由從第1電極3側依序層疊空注入 層、空穴輸送層、發光層及電子輸送層的4層所構成。而 由有機EL層6和將有機EL層6夾在中間而形成在其兩 側的第1電極3及第2電極7構成爲1只有機EL元件5 。第1電極3及第2電極7是各個都形成爲多數的平行帶 狀，且配置成爲互爲正交狀態，因而，有機EL元件是在 兩電極3、7的交叉部分之彩色濾光片2上，被配置成爲 矩陣狀。 · 隔牆4是由越靠近於其與第i電極3面對的一側其寬度 會越窄的，形成爲倒錐形狀之兩條凸條4a、4b，和沿著 該兩條凸條4a、4b的外側，形成爲其底面側成爲寬幅的 錐形狀絕緣層8所構成。兩凸條4a、4b是由光抗蝕劑所 形成，絕緣層8是由正型抗蝕劑所形成者。 又，有機E L層6及第2電極7是在其與絕緣層8對應 的部分’沿著隔牆4形成爲錐形狀者。又，有機el層6 550973 五、發明說明（5) 之中具顯示功能之部分是位於隔牆4之間的平面部分9， 其與隔牆4及絕緣層8所對應的部分是不必要有顯示功能。 又，有機EL元件5的表面是被保護膜10所覆蓋。保護 膜的材質是例如使用具優異防濕性的二氧化矽Si02或氮 化矽SiN，而用PC VD法形成保護膜10者。又，在第1 圖（a)中，省略保護膜1〇的圖示。 以下說明如上述構成的有機EL顯示面板之製造方法。 首先，在圖案形成工程中，如第2圖所示的，在彩色濾 光片2上的對應於需要形成有機EL層的位置之部位，形 成多數的帶狀第1電極3。第1電極3是用蒸鍍法所形成。 接者’由隔牆形成工程，在第1電極3上，除在其所定 位置保留作爲形成有機EL元件用的區域外，在其餘部分 形成與第1電極3成正交的帶狀隔牆4。首先，用使用負 型抗蝕劑的光刻法，形成構成隔牆4的凸條4a、4b。即 ，用自旋塗層法等方法塗佈光抗蝕劑，經過熱處理使溶劑 乾燥後’用遮罩遮蔽，以僅在於需要形成凸條4a、4b部 分用紫外線曝光。然後，用經調整到可獲得適當錐形狀的 熱處理條件下，經過熱處理後，經由顯像，以形成如第3 圖（a)所不的相隔所定間隔（例如1 〇 μ ηι程度）之凸條4 a、 4b。 接著’用自旋塗層法等方法塗布光正型抗蝕劑，經過熱處 理使熔劑乾燥後，用遮罩遮蔽，以將對應於兩凸條4a、 4b的兩外側部位遮光，並照射紫外線後，經過顯像，以 形成如第3圖（b)所示之絕緣層8。在塗布光抗蝕劑之際， 550973 五、發明說明（6) 由表面張力的作用，在凸條4a、4b的近旁，抗蝕劑層1 1 會如第3圖（a)的鏈線所示，被塗布成較厚的狀態。由此 ，經過通常的曝光和顯像，會形成如第3圖（b)所示的順 錐形狀之絕緣層8。 接著，當隔牆4被完全乾燥後，由發光層形成工程（有 機EL層形成工程）形成有機EL層6。有機EL層6是用 真空蒸餾法依序形成構成有機EL層6的各層所形成。要 形成有機EL層時，是在於無遮蔽下進行真空蒸鍍者，因 而，在於不必形成有機EL層6的絕緣層8及凸條4a、4b 上，也會形成有機EL層。 接著，由第2電極形成工程形成也會覆蓋於有機EL層 6的、與第1電極成正交之平行帶狀第2電極7。第2電 極7是將鋁（A1)用其空蒸鍍所形成者，要蒸鍍鋁時也是在 於無遮蔽下所進行，因而，在於不必形成第2電極的隔牆 4上也會形成銘覆膜。 接著，使用PCVD裝置，在所定的成膜條件下，形成可 覆蓋於第2電極有機EL層6整體上之保護膜1 〇。用 PCVD法形成保護膜10時，是與用真空蒸鍍法所形成的 有所不同，其保護膜1 0是會以要繞回似的附著在有機EL 層6和第2電極7的端部，因而有機EL層6的端面也會 由保護膜1 〇所覆蓋。 此實施形態係具以下的效果。 (1)要將形成在第1電極3上的有機EL層6上，與第 1電極3成正交之帶狀第2電極7彼此之間加以絕緣的隔 550973 五、發明說明（7) 牆4 ’係具形成爲倒錐形狀之兩條凸條4a、4b。因而，在 用真空蒸鍍法形成第2電極7之際，可防止蒸鍍層的橫跨 於相鄰凸條4a、4b之間，而可防止第2電極7彼此之間 的短路。 (2) 隔牆4係具有沿著各凸條4a、4b的外側所形成之 順錐形狀絕緣層8。因而，在於要形成要將從平面部分9 連到隔牆4的有機EL層6及層疊在其上面的第2電極7 加以覆蓋的保護膜1 0時，也可由很薄的保護膜1 0就可確 實的將第2電極7覆蓋。即，如使用氮化矽（SiN)等的薄 膜作爲封閉有機EL層之用時，可將具顯示功能的平面部 9 (有助於發光的部分）的有機EL層6由上述薄膜確實的 覆蓋，而可提升對水分等所引起的劣化之可靠性。 (3) 絕緣層8是使用正型抗蝕劑所形成者。如使用負型 抗蝕劑時，必須對顯像前的抗蝕劑層1 1之應形成絕緣層 8的部分確實的曝光，可是，要曝光到隱藏在倒錐形狀凸 條4a、4b下方的部分是有所困難，而容易引起曝光硬化 的不完全。然而，如使用正型抗蝕劑時，比起使用負型抗 蝕劑的情形較容易的在隱藏於倒錐形狀凸條4a、4b下方 的部分也形成絕緣層8。 (4) 對有機EL元件5的封閉，是以形成保護膜8覆蓋於 有機EL元件5者。因而，比起使用金屬製成或玻璃製的 封閉罩以加以封閉之構成，較可使有機EL顯示面板1薄 型化。 本發明實施形態並不侷限於上述者，例如也可爲如下之 550973550973 V. Description of the invention (3) The predetermined position on the first electrode is reserved as an area for forming the majority of the above-mentioned organic EL elements, and an insulating partition wall is provided in the remaining part to intersect the first electrode; An organic EL layer formed on the above area; and a second electrode that covers at least the organic EL layer and is formed in a parallel strip shape; and the insulating partition wall is closer to the first electrode and the first electrode The opposite side will be formed by two convex strips formed into an inverted tapered shape, and an insulating layer formed with a wide tapered shape at the bottom side along the outer sides of the two convex strips. . In this invention, the insulation between the second electrodes that are parallel to each other is ensured by the two convex strips of the inverted cone shape constituting the partition wall. In addition, since there is a cone-shaped insulating layer provided on the outside of the two convex strips, when a thin film such as SiN is used to seal an organic EL element, the organic EL layer of the portion having a display function can be confirmed by the thin film. Of coverage. The invention according to the second patent application scope is the invention described in the first patent application scope, in which the insulating layer is formed of a positive resist. Therefore, in the present invention, it is easier to form an insulating layer in a portion hidden under an inverted tapered convex strip than in the case of using a negative resist. The invention in the third scope of the patent application is the invention described in the first or second scope of the patent application, in which the organic EL element is formed with a protective film covering the organic EL element. Therefore, in the present invention, the thickness of the organic EL display panel can be reduced compared to the configuration using a metal or glass closure. [Embodiment of the Invention] The following describes one implementation of the present invention with reference to Figs. 1 to 3 550973 5. Description of the Invention (4) Form. _ As shown in Fig. 1 (a), the organic EL display panel 1 is formed, for example, by forming a plurality of parallel strips on the surface of the color filter 2 as a substrate. The first electrode (anode) 3 The first electrode 3 is made of tin indium oxide (ITO) or the like. In addition, on the color filter 2, except for the area reserved for forming the majority of the organic EL element 5 in the predetermined position, the rest Partially formed an insulating partition wall 4 in the shape of a parallel strip that is positive to the first electrode 3; an organic EL layer 6 is formed on the color filter 2 so as to abut the partition wall 4; and is formed on the φ organic EL layer 6 A second electrode 7 (cathode) 7. The organic EL layer 6 is composed of, for example, four layers in which an empty injection layer, a hole transport layer, a light emitting layer, and an electron transport layer are sequentially stacked from the first electrode 3 side. The organic EL layer 6 and the first electrode 3 and the second electrode 7 formed on both sides of the organic EL layer 6 with the organic EL layer 6 interposed therebetween are configured as a single organic EL element 5. The first electrode 3 and the second electrode 7 are each formed in a plurality of parallel strips and are arranged to be orthogonal to each other. Therefore, the organic EL element is a color filter 2 at the intersection of the two electrodes 3 and 7. It is arranged in a matrix form. The partition wall 4 is narrower from the side closer to the side facing the i-th electrode 3, and is formed into two convex strips 4a, 4b in the shape of an inverted cone, and along the two convex strips 4a The outer sides of 4 and 4b are formed with a wide tapered insulating layer 8 on the bottom side. The two ridges 4a, 4b are formed of a photoresist, and the insulating layer 8 is formed of a positive resist. The organic EL layer 6 and the second electrode 7 are formed in a tapered shape along the partition wall 4 at a portion corresponding to the insulating layer 8 '. In addition, the organic el layer 6 550973 5. In the description of the invention (5), the part with a display function is a flat part 9 located between the partition walls 4, and the parts corresponding to the partition wall 4 and the insulation layer 8 are unnecessary. Display function. The surface of the organic EL element 5 is covered with a protective film 10. The material of the protective film is, for example, a silicon dioxide SiO2 or silicon nitride SiN having excellent moisture resistance, and the protective film 10 is formed by the PC VD method. In addition, in the first figure (a), the illustration of the protective film 10 is omitted. A method of manufacturing the organic EL display panel configured as described above will be described below. First, in the patterning process, as shown in FIG. 2, a plurality of first electrodes 3 in a band shape are formed on a portion of the color filter 2 corresponding to a position where an organic EL layer is to be formed. The first electrode 3 is formed by a vapor deposition method. The "connector" is formed by a partition wall. On the first electrode 3, a strip-shaped partition wall 4 orthogonal to the first electrode 3 is formed on the remaining portion except that an area for forming an organic EL element is reserved at a predetermined position. . First, the ridges 4a and 4b constituting the partition wall 4 are formed by a photolithography method using a negative resist. That is, a photoresist is applied by a method such as a spin coating method, and the solvent is dried after being subjected to a heat treatment ', and then masked with a mask so as to expose the portions 4a and 4b with ultraviolet rays only. Then, under heat treatment conditions adjusted to obtain an appropriate cone shape, after heat treatment, development is performed to form ridges separated by a predetermined interval (for example, about 10 μηι) as shown in Figure 3 (a). 4 a, 4b. Next, a photo-positive resist is applied by a method such as a spin coating method, and the flux is dried after heat treatment, and then shielded with a mask to shield the two outer parts corresponding to the two convex strips 4a and 4b, and then irradiate ultraviolet rays. After development, an insulating layer 8 is formed as shown in FIG. 3 (b). When applying photoresist, 550973 V. Description of the invention (6) Due to the effect of surface tension, the resist layer 1 1 will be near the ridges 4a and 4b as shown by the chain line in FIG. 3 (a). It is shown that it is applied in a thick state. Thus, after a normal exposure and development, an insulating layer 8 having a forward cone shape as shown in Fig. 3 (b) is formed. After the partition wall 4 is completely dried, the organic EL layer 6 is formed by a light-emitting layer formation process (organic EL layer formation process). The organic EL layer 6 is formed by sequentially forming the layers constituting the organic EL layer 6 by a vacuum distillation method. When the organic EL layer is to be formed, vacuum evaporation is performed without shielding. Therefore, it is not necessary to form the organic EL layer on the insulating layer 8 and the protrusions 4a and 4b of the organic EL layer 6. Next, the second electrode 7 is formed by a second electrode forming process to cover the organic EL layer 6 in a parallel stripe shape that is orthogonal to the first electrode. The second electrode 7 is formed by vapor-depositing aluminum (A1) by air, and when aluminum is vapor-deposited, it is performed without shielding. Therefore, an inscription is also formed on the partition wall 4 which does not need to form the second electrode. membrane. Next, a PCVD apparatus is used to form a protective film 10 that can cover the entirety of the second electrode organic EL layer 6 under predetermined film formation conditions. When the protective film 10 is formed by the PCVD method, it is different from that formed by the vacuum evaporation method. The protective film 10 is adhered to the ends of the organic EL layer 6 and the second electrode 7 in a winding-like manner. Therefore, the end surface of the organic EL layer 6 is also covered by the protective film 10. This embodiment has the following effects. (1) A strip-shaped second electrode 7 to be formed on the organic EL layer 6 formed on the first electrode 3 and orthogonal to the first electrode 3 is insulated from each other 550973 5. Description of the invention (7) Wall The 4 'tie is formed into two convex strips 4a, 4b having an inverted cone shape. Therefore, when the second electrode 7 is formed by the vacuum evaporation method, it is possible to prevent the vapor deposition layer from spanning between the adjacent ridges 4a and 4b, and to prevent a short circuit between the second electrodes 7. (2) The partition wall 4 has a forward-conical insulating layer 8 formed along the outer sides of the ridges 4a, 4b. Therefore, in order to form a protective film 10 that covers the organic EL layer 6 that is connected from the planar portion 9 to the partition wall 4 and the second electrode 7 laminated thereon, a thin protective film 10 can also be used. The second electrode 7 can be reliably covered. That is, when a thin film such as silicon nitride (SiN) is used as the sealing organic EL layer, the organic EL layer 6 having a flat portion 9 (a portion that contributes to light emission) having a display function can be surely covered with the thin film. , And can improve the reliability of deterioration caused by moisture and the like. (3) The insulating layer 8 is formed using a positive resist. If a negative resist is used, it is necessary to expose the parts of the resist layer 11 that should form the insulating layer 8 before development. However, it is necessary to expose the parts hidden under the inverted cone-shaped protrusions 4a, 4b. Part of it is difficult, and it is easy to cause incomplete exposure and hardening. However, if a positive type resist is used, it is easier to form the insulating layer 8 in the portions hidden under the inverted tapered protrusions 4a, 4b than when a negative type resist is used. (4) The organic EL element 5 is sealed by forming a protective film 8 to cover the organic EL element 5. Therefore, the organic EL display panel 1 can be made thinner than a configuration in which a metal or glass sealing cover is used to close it. The embodiment of the present invention is not limited to the above, and may be, for example, the following 550973
五、發明說明（8) 構成。 〇也可用正型抗蝕劑形成凸條4a、4b。但，是以使用 負型抗蝕劑較易形成倒錐形狀之凸條4a、4b。 〇也可用負型抗蝕劑形成絕緣層8。 〇抗蝕劑並不限於光抗蝕劑，而也可使用電子束抗蝕劑。 〇第2電極7並不限於與第1電極3成正交，而只要是 有交叉的構成就好。 ◦對於有機EL元件5的封閉，也可使用金屬製或玻璃 製的封閉罩等，以替代於形成保護膜1 0之構成。 將可從上述實施形態中撐握到的技術上的思想（發明） ，記載如下。 (•1 )在申請專利範圍第1〜3項中任一項所記載的發明 中，上述凸條是用負型抗蝕劑所形成者。 (2)本發明的有機EL顯示面板之製造方法是在於以矩 陣狀的配置著具有由有機EL材料薄膜所構成的發光層之 有機EL元件的有機EL顯示面板之製造方法中，包含： 在基板上將對應於上述發光層的多數第1電極形成爲帶狀 之圖案形成工程；於上述圖案形成工程完成後，除在上述 第1電極上的所定位置保留作爲形成上述有機EL元件用 的區域外，在其餘部分形成具有與上述第1電極交叉的兩 條倒錐形狀凸條，和形成在其外側的順錐形狀絕緣層的絕 緣性隔牆之隔牆形成工程；於上述隔牆形成工程完成後’ 在上述區域上形成有機EL層之發光層形成工程；及’於 上述發光層形成工程完成後’形成至少可將上述有機EL -10- 550973 五、發明說明（9) 層覆蓋，且與上述第1電極成正交的平行帶狀第2電極之 工程者。 [發明之效果] 如上所述，在申請專利範圍第1〜3項的發明中，要確 保形成在有機EL層上的第2電極彼此之間和第2電極與 第1電極之間的絕緣性，且，要用薄膜封閉有機EL元件 時，可確實的將有助於發光的有機EL膜加以封閉。 [附圖簡單說明] 第1圖（a)、第1圖（b)第1圖（a)是本發明一實施形態 的有機EL顯示面板的，省略其保護膜之槪略局部斜視圖 ，第1圖（b)是包括保護膜的狀態之局部模式斷面圖。 第2圖有機EL顯示面板的基板之槪略局部斜視圖。 第3圖（a)、第3圖（b)在於有機EL顯示面板製造工程 中的局部模式斷面圖。 第4圖從來技術的有機EL顯示面板之局部模式斷面 圖。 % 5圖（a)、弟5圖（b)第5圖（a)是設置封閉罐以作爲 封閉罩的有機EL顯示面板之模式斷面圖，第5圖（b)是設 置防濕膜以作爲封閉用的情形時之模式斷面圖。 第6圖設置防濕膜的模式斷面圖。 [符號之說明] 1 有機EL顯示面板 2 作爲基板用的彩色濾光片 3 第1電極 -11- 550973 « - k 五、發明說明（1 o) 4 隔牆 4a、4 b 凸條 5 有機EL元件 6 有機EL層 7 第2電極 8 絕緣層 10 保護膜 -12-5. Description of the invention (8) Composition. O The convex strips 4a and 4b may be formed using a positive resist. However, it is easier to form the inverted tapered ridges 4a, 4b using a negative resist. O The insulating layer 8 may be formed using a negative resist. The resist is not limited to a photoresist, but an electron beam resist may be used. 〇 The second electrode 7 is not limited to be orthogonal to the first electrode 3, but may be a structure having a cross. ◦In order to seal the organic EL element 5, a metal or glass sealing cover may be used instead of forming the protective film 10. The technical ideas (inventions) that can be grasped from the above embodiments are described below. (• 1) In the invention described in any one of claims 1 to 3 in the scope of patent application, the ridges are formed with a negative resist. (2) The method for manufacturing an organic EL display panel of the present invention is a method for manufacturing an organic EL display panel in which an organic EL element having a light-emitting layer composed of an organic EL material film is arranged in a matrix, and includes: a substrate Most of the first electrodes corresponding to the light-emitting layer are patterned into a strip-shaped pattern; after the pattern-forming process is completed, a predetermined position on the first electrode is reserved as a region for forming the organic EL element. , Forming a partition wall forming process of an insulating partition wall having two inverted cone-shaped ridges intersecting the above-mentioned first electrode and a tapered cone-shaped insulating layer formed on the outside thereof in the remaining part; the above-mentioned partition wall forming project is completed After the formation of the light-emitting layer forming the organic EL layer on the above area; and after the completion of the light-emitting layer formation, the formation of at least the above-mentioned organic EL -10- 550973 V. Description of the invention (9) layer, and The engineer who made the said 1st electrode into the orthogonal parallel strip-shaped 2nd electrode. [Effects of the Invention] As described above, in the inventions of claims 1 to 3 in the scope of patent application, it is necessary to ensure insulation between the second electrodes formed on the organic EL layer and between the second electrodes and the first electrode. Moreover, when the organic EL element is to be sealed with a thin film, the organic EL film that contributes to light emission can be surely sealed. [Brief description of the drawings] FIG. 1 (a), FIG. 1 (b), and FIG. 1 (a) are an organic EL display panel according to an embodiment of the present invention, and a partial partial perspective view of a protective film is omitted. FIG. 1 (b) is a partial schematic cross-sectional view of a state including a protective film. FIG. 2 is a partial perspective view of a substrate of an organic EL display panel. Fig. 3 (a) and Fig. 3 (b) are partial sectional views in the manufacturing process of the organic EL display panel. Fig. 4 is a partial cross-sectional view of a conventional organic EL display panel. Figure 5 (a), Figure 5 (b), Figure 5 (a) is a schematic cross-sectional view of an organic EL display panel with a closed can as a closed cover, and Figure 5 (b) is a moisture-proof film A sectional view of the model when used as a closed case. Fig. 6 is a sectional view of a mode in which a moisture-proof film is provided. [Explanation of Symbols] 1 Organic EL display panel 2 Color filter as substrate 3 First electrode-11-550973 «-k 5. Description of the invention (1 o) 4 Partition wall 4a, 4 b convex strip 5 Organic EL Element 6 Organic EL layer 7 Second electrode 8 Insulating layer 10 Protective film -12-