TW550634B - Non-thermal plasma method for abatement of effluent species generated in a semiconductor processing unit - Google Patents
Non-thermal plasma method for abatement of effluent species generated in a semiconductor processing unit Download PDFInfo
- Publication number
- TW550634B TW550634B TW091102378A TW91102378A TW550634B TW 550634 B TW550634 B TW 550634B TW 091102378 A TW091102378 A TW 091102378A TW 91102378 A TW91102378 A TW 91102378A TW 550634 B TW550634 B TW 550634B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor processing
- processing unit
- abatement
- species generated
- effluent
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/32—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by electrical effects other than those provided for in group B01D61/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/905—Cleaning of reaction chamber
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Analytical Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Treating Waste Gases (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Description
550634 .93^2. 21 _案號 91102378_年月日__替換頁 五、發明說明(11) 12 電 源 供 應 裝 置 14 電 極 16 電 暈 放 電 區 18 導 管 20 反 應 夥 伴 22 導 管 24 導 管 26 第 二 減 少 裝 置 40 半 導 體 製 程 反應室 42 真 空 幫 浦 系 統 44 減 少 反 應 室 46 電 極 48 濕 式 擦 洗 裝 置 50 電 暈 放 電 區 52 電 源 供 應 裝 置 54 擦 洗 溶 劑 56 導 管 58 導 管 60 反 應 夥 伴
C:\ 總檔\91\91102378\91102378(替換)-2. ptb 第15頁
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/781,037 US6576573B2 (en) | 2001-02-09 | 2001-02-09 | Atmospheric pressure plasma enhanced abatement of semiconductor process effluent species |
Publications (1)
Publication Number | Publication Date |
---|---|
TW550634B true TW550634B (en) | 2003-09-01 |
Family
ID=25121480
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW091102378A TW550634B (en) | 2001-02-09 | 2002-02-08 | Non-thermal plasma method for abatement of effluent species generated in a semiconductor processing unit |
Country Status (4)
Country | Link |
---|---|
US (1) | US6576573B2 (zh) |
AU (1) | AU2002306554A1 (zh) |
TW (1) | TW550634B (zh) |
WO (1) | WO2002065500A2 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106030755A (zh) * | 2014-03-06 | 2016-10-12 | 应用材料公司 | 含有重原子的化合物的等离子体减量 |
CN107004563A (zh) * | 2014-12-16 | 2017-08-01 | 应用材料公司 | 使用水蒸气连同氢气或含氢气体的等离子体减量 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2825295B1 (fr) * | 2001-05-31 | 2004-05-28 | Air Liquide | Application des plasmas denses crees a pression atmospherique au traitement d'effluents gazeux |
KR100459712B1 (ko) * | 2002-04-29 | 2004-12-03 | 삼성전자주식회사 | 함불소 화합물 분해장치 및 이를 이용한 함불소 화합물처리 시스템 |
US20040194886A1 (en) * | 2003-04-01 | 2004-10-07 | Deyoung James | Microelectronic device manufacturing in coordinated carbon dioxide processing chambers |
US7278831B2 (en) * | 2003-12-31 | 2007-10-09 | The Boc Group, Inc. | Apparatus and method for control, pumping and abatement for vacuum process chambers |
US20050148199A1 (en) * | 2003-12-31 | 2005-07-07 | Frank Jansen | Apparatus for atomic layer deposition |
FR2898066B1 (fr) * | 2006-03-03 | 2008-08-15 | L'air Liquide | Procede de destruction d'effluents |
GB0521842D0 (en) * | 2005-10-26 | 2005-12-07 | Boc Group Plc | Apparatus for treating a gas stream |
GB0602506D0 (en) * | 2006-02-08 | 2006-03-22 | Boc Group Plc | Method of treating a gas stream |
GB0612814D0 (en) * | 2006-06-28 | 2006-08-09 | Boc Group Plc | Method of treating a gas stream |
US9997325B2 (en) | 2008-07-17 | 2018-06-12 | Verity Instruments, Inc. | Electron beam exciter for use in chemical analysis in processing systems |
DE112009003819T5 (de) | 2008-12-23 | 2012-06-06 | Mks Instruments, Inc. | Containment- bzw. Sicherheitsbehältersystem für reaktive Chemikalien |
US8747762B2 (en) | 2009-12-03 | 2014-06-10 | Applied Materials, Inc. | Methods and apparatus for treating exhaust gas in a processing system |
US20160042916A1 (en) * | 2014-08-06 | 2016-02-11 | Applied Materials, Inc. | Post-chamber abatement using upstream plasma sources |
KR102102615B1 (ko) | 2016-04-15 | 2020-04-21 | 어플라이드 머티어리얼스, 인코포레이티드 | 산소 플라즈마 세정 사이클의 사용에 의한 플라즈마 저감 고체들의 방지 |
CN106731542B (zh) * | 2016-12-26 | 2024-03-26 | 浙江工商大学 | 一种磷化氢气体的电化学处理装置及方法 |
JP7021237B2 (ja) | 2017-02-09 | 2022-02-16 | アプライド マテリアルズ インコーポレイテッド | 水蒸気および酸素の反応物を利用するプラズマ軽減技術 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5759237A (en) * | 1996-06-14 | 1998-06-02 | L'air Liquide Societe Anonyme Pour L'etude Et, L'exploitation Des Procedes Georges Claude | Process and system for selective abatement of reactive gases and recovery of perfluorocompound gases |
US5955037A (en) * | 1996-12-31 | 1999-09-21 | Atmi Ecosys Corporation | Effluent gas stream treatment system having utility for oxidation treatment of semiconductor manufacturing effluent gases |
US6475350B2 (en) * | 1997-07-18 | 2002-11-05 | Noxtech Inc | Method for removing NOx and other pollutants from gas streams using a plasma assisted catalyst |
US6027616A (en) | 1998-05-01 | 2000-02-22 | Mse Technology Applications, Inc. | Extraction of contaminants from a gas |
KR100335737B1 (ko) * | 1999-12-22 | 2002-05-09 | 고석태 | 유해개스 처리를 위한 플라즈마 처리 시스템 |
-
2001
- 2001-02-09 US US09/781,037 patent/US6576573B2/en not_active Expired - Fee Related
-
2002
- 2002-02-07 AU AU2002306554A patent/AU2002306554A1/en not_active Abandoned
- 2002-02-07 WO PCT/US2002/005133 patent/WO2002065500A2/en not_active Application Discontinuation
- 2002-02-08 TW TW091102378A patent/TW550634B/zh not_active IP Right Cessation
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106030755A (zh) * | 2014-03-06 | 2016-10-12 | 应用材料公司 | 含有重原子的化合物的等离子体减量 |
TWI595113B (zh) * | 2014-03-06 | 2017-08-11 | 應用材料股份有限公司 | 含有重原子之化合物的電漿減量 |
US10449486B2 (en) | 2014-03-06 | 2019-10-22 | Applied Materials, Inc. | Plasma abatement of compounds containing heavy atoms |
CN106030755B (zh) * | 2014-03-06 | 2020-01-03 | 应用材料公司 | 含有重原子的化合物的等离子体减量 |
US11185815B2 (en) | 2014-03-06 | 2021-11-30 | Applied Materials, Inc. | Plasma abatement of compounds containing heavy atoms |
CN107004563A (zh) * | 2014-12-16 | 2017-08-01 | 应用材料公司 | 使用水蒸气连同氢气或含氢气体的等离子体减量 |
Also Published As
Publication number | Publication date |
---|---|
WO2002065500A2 (en) | 2002-08-22 |
US20020111045A1 (en) | 2002-08-15 |
WO2002065500A3 (en) | 2002-11-14 |
AU2002306554A1 (en) | 2002-08-28 |
US6576573B2 (en) | 2003-06-10 |
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Legal Events
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GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |