TW548709B - Method to improve uniformity of development - Google Patents

Method to improve uniformity of development Download PDF

Info

Publication number
TW548709B
TW548709B TW91108821A TW91108821A TW548709B TW 548709 B TW548709 B TW 548709B TW 91108821 A TW91108821 A TW 91108821A TW 91108821 A TW91108821 A TW 91108821A TW 548709 B TW548709 B TW 548709B
Authority
TW
Taiwan
Prior art keywords
developer
developing solution
patent application
item
concentration
Prior art date
Application number
TW91108821A
Other languages
Chinese (zh)
Inventor
Jia-Peng Peng
Original Assignee
Au Optronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Au Optronics Corp filed Critical Au Optronics Corp
Priority to TW91108821A priority Critical patent/TW548709B/en
Application granted granted Critical
Publication of TW548709B publication Critical patent/TW548709B/en

Links

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

A method to improve uniformity of development is disclosed, wherein a substrate and a developing solution supplying device are provided firstly, the developing solution supplying device is connected to the first pipe member and the second pipe member, the concentration of the second developing solution provided by the second piping member is less than that of the first developing solution provided by the first piping member. When the developing solution supplying device moves from one end of the substrate toward the other end of the substrate, the coated amount of the developing solution provided by the first pipe member is a constant, the coated amount of the developing solution provided by the second pipe member gradually decreases with the moving of the developing solution supplying device.

Description

548709 五、發明說明(1) 本,明是有關於-種微影製程(Li thQgraphy 勻τ:方法且特別是有關於-種改善微影製程中之顯影均 牛驟2 說是整個半導體製程中,最舉足輕重的 影製程包括了光阻塗佈、曝光與_ 不益基板的大型化,顯影步驟中員 問題,特別县力士别:ϋ k L k T ^让币』洲* 1&7 1 af多 + 士 疋在大型基板上進行顯影液之塗佈時,由於盔 液塗佈在大型基板上之每-部位,因此,: =基板上進行顯影步料,就容易產生有顯影不均句之 間之ί丨置圖示所^圖’其綠7F為f知顯影液供應裝置與基板之 晋ini參照第1圖’習知應用於大型基板之顯影液供應裝 $ 一 〇·、>配置在^一基板100之上方,且顯影液供應裝置102 與一官件104連接,用以輸送顯影液。而在顯影 液供應裝置102朝向基板100的部分則是配置有複數個喷頭 、,不),用以將顯影液喷掃至基板1〇〇之表面。 利用顯影液供應裝置102以在基板1〇〇上喷灑顯 :式,利用當顯影液供應裝置1〇2對基板1〇。== 守,將顯影液供應裝置102由基板〗〇〇之一端往基板1〇〇之 ,一端平行移動,使得顯影液得以喷灑至基板丨〇〇之所有 部位。然而,由於顯影液供應裝置1〇2停留在基板1〇〇兩端548709 V. Description of the invention (1) This is clearly related to-a kind of lithography process (Li thQgraphy uniform τ: method and especially related to-a kind of improvement in the development of lithography process) 2 It is said that the entire semiconductor process The most important filmmaking process includes photoresist coating, exposure, and unfavorable substrate size, problems in the development process, especially the county ’s Lishibei: ϋ k L k T ^ Jianyuan 『Continent * 1 & 7 1 af DUO + Shiye applies the developer solution on a large substrate, because the helmet solution is applied to every part of the large substrate, so: = = development unevenness on the substrate is prone to produce uneven development. The image is shown in the figure below. Its green 7F is the developer supply device and the substrate. Refer to Figure 1 for the developer supply device used in large substrates. It is above a substrate 100, and the developer supply device 102 is connected to an official member 104 for conveying developer. The part of the developer supply device 102 facing the substrate 100 is provided with a plurality of nozzles. ) For spraying the developer to the surface of the substrate 100. The developing solution supply device 102 is used to spray the substrate 100 on the substrate 100, and the developing solution supply device 102 is used to align the substrate 10. == Keep, the developer supply device 102 is moved from one end of the substrate to the substrate 100, and one end is moved in parallel, so that the developer is sprayed on all parts of the substrate. However, since the developer supply device 102 stays at both ends of the substrate 100,

548709 五、發明說明(2) 的時間有所差異,亦即基板丨〇 〇上較 區^基板,。。上較後來才接觸= 不〜勻:問:此差異會造成顯影時間…’而產生顯影 第2圖所示,其繪示為於習知方法中,顯影液 =顯影=應裝置於基板上之位置之關係示意 效率示意圖。 方法中&板上各區域位置之顯影 旦請參照第2®,縱軸所表示的是由管件1〇4所提供之顧 ^液塗佈量,而橫軸所表示的是顯影液供應裝置ι〇2於基 反100上之位置。習知顯影液供應裝置1〇2 顯影液之過程中,其塗佈量係為一固定值。請參照第1麗 圖,,軸所表示的是基板100上之顯影效率,而橫軸所表 =的是在基板100上之位置。由於基板1〇〇上較先接觸到顯 衫液的區域與基板i 00上較後來才接觸到顯影液的區域會 有時間上之差異,因此由第3圖中可知基板100上各區域因 顯影液塗佈時間之差異,而造成基板100上不同的區域會 有不同的顯影效率,如此便產生了顯影不均勻之情形。而 _ 此顯於不均勻之情形,將隨著基板尺寸愈加大型化而愈加 嚴重。 因此’本發明的目的就是在提供一種改善顯影均勻度 的方法’以有效的解決在大型基板中,因無法同時將顯影 液塗佈在基板上之每一部位,而造成顯影不均勻之問題。 本發明之另一目的就是提供一種顯影液供應系統,利548709 V. The description of the invention (2) is different in time, that is, the area ^ substrate on the substrate. . Contacted only later = Unevenness: Q: This difference will cause the development time ... 'and development will occur as shown in Figure 2. It is shown in the conventional method, developer = development = should be installed on the substrate The relationship between the positions shows the efficiency diagram. In the method & development of each area on the board, please refer to Section 2®. The vertical axis indicates the amount of liquid coating provided by the tube 104, and the horizontal axis indicates the developer supply device. ι〇2 on the base 100 position. In the conventional developing solution supply device 10, the coating amount of the developing solution is a fixed value. Referring to the first image, the axis indicates the development efficiency on the substrate 100, and the horizontal axis indicates the position on the substrate 100. Since there is a time difference between the area on the substrate 100 that comes in contact with the developer solution first and the area on the substrate i 00 that comes into contact with the developer solution later, it can be seen from Figure 3 that each area on the substrate 100 is subject to development. The difference in the liquid coating time causes different regions on the substrate 100 to have different development efficiencies, which results in uneven development. _ This phenomenon of unevenness will become more serious as the size of the substrate becomes larger. Therefore, the object of the present invention is to provide a method for improving the uniformity of development to effectively solve the problem of uneven development in large substrates because the developer cannot be applied to each part of the substrate at the same time. Another object of the present invention is to provide a developer supply system,

8l71twf.ptd 第5頁 548709 五、發明說明(3) 液之濃度與顯影時間,藉以改善大型基板上之 供-基ί 2 Ϊ二J :^顯影均勻度的方法,其係首先提 *二管;:;方第工::::置;與-第-管件與- 照-產品所需之顯影液濃度而;之= =度係依 褒置於基板上進行顯影液此顯影液供應 板喷顯影液時,將顯影液供應裝; 在基板之另-端移動,其中第-管件所;d; 之塗佈量係為一固定i,第二管件所提供‘ 塗佈:影液供應裝置之移動而逐漸遞; 供一改善顯影均句度的方法,其係首先提 ϊ在ίίί:Γ應裝置’其中顯影液供應裝置係配 之::管件所提供之一第一顯影液=係依 裝置於基板上進行顯影液塗佈之方法,係當顯影液供應裝 置對基板喷灑顯影液時,將顯影液供應裝置由基板^二端 在基板之另一端移動,其中第一管件所提供之第一顯影液 之塗佈量(VI )對於第二管件所提供之第二顯影液之塗佈量 (V2)之比值(Vi/V2)係隨著顯影液供應裝置之移動而逐漸8l71twf.ptd Page 5 548709 V. Description of the invention (3) Solution concentration and development time to improve the supply on a large substrate-2 Ϊ 2 J: ^ Method for developing uniformity, which is firstly provided by two tubes ;: Fang Digong :::: set; and-第-管 件 和-照 -Product developer concentration required; and == Degree is based on the developer on the substrate for this developer supply plate spray When the developing solution is supplied, the developing solution is supplied; it is moved on the other end of the substrate, where the first tube is installed; d; the coating amount is a fixed i, provided by the second tube. Move and gradually pass; Provide a method to improve the uniformity of the development, which is first mentioned in the ίί: Γ 应 装置 'where the developer supply device is equipped with :: one of the first developer solution provided by the pipe = system dependent device The method for coating the developing solution on the substrate is when the developing solution supplying device sprays the developing solution on the substrate, and the developing solution supplying device is moved from the two ends of the substrate to the other end of the substrate. The coating amount (VI) of a developing solution for the second developing provided by the second pipe The coating amount (V2) of the ratio (Vi / V2) with the movement of the developer supply system of the apparatus is gradually

548709 五 發明說明(4) 遞增。 本發明提出一種顯影液供應系統,包括一顯影液供應 裝置、一第一管件與一第二管件。其中顯影液供應裝置= 一輸出面配置有數個噴頭。第一管件係連接在顯 裝置之一輸人面,且第一管件所提供之一莖翻J t :: & 1干尸叮权供之弟一顯影液濃度 係依照一產品所需之顯影液濃度而定,並且第一管件 ,之第一顯影液塗佈量係為一固定值。一第二管件 ,顯影液供應裝置之輸入面,且第二管件所提供之一 j影液之濃度小於第一顯影液之濃度’並且第二管 = 供之第二顯影液塗佈量係為逐漸遞減。 捉 本發明提出一種顯影液供庫糸缔 々紅 n 裝置、一第一管件盥—第m:包括-顯影液供應 一 ^, 第一 &件。其中顯影液供應裝置之 裝置之一於入面,a笛一 吕件係連接在顯影液供應 俜ΐ ΐ 第一管件所提供之-第-顯影液濃产 :依照-產品所需之顯影液濃度而定, = 液供應裝置之輸入面,i第二总杜f::件亦連接在顯影 之濃度小於第-顯影液之濃声:一第二顯影液 二顯影液塗佈量係為V2。爱^第、一官件所提供之第 液之塗佈量(V。對於第二管:工::件戶:提供之第-顯影 量(V2)之比值(V1/V2)係隨著斤=之第二㈣液之塗佈 _遞增。 t ”、員衫液供應裝置之移動而逐 本發明之改善顯影均勻声 之顯影液以減緩基板上較早糸利用通入較低濃度 接觸到顯景^液的區域之顯影 548709 五、發明說明(5) 速率,以獲得較佳之顯影均勻度。 本^明之顯影液之 一高濃度之顯影液盥—f Ϊ統係利用二管件以分別輸入 中,藉由調整兩顯麥液夕^二顯影液於一顯影液供應裝置 勾度。 一之塗佈量,以改善基板上之顯影均 為讓本發明之上# 顯易懂,下文特兴一 * 〇 ^目的、特徵、和優點能更明 細說明如下: 里心口尸汀附圖式,作詳 圖式之標示說明: 100、400 :基板 ^ 102、402 :顯影液供應裝置 104、404、406 :管件 '實施例 供庫ΓΛ,//會示為依照本發明一較佳實施例之顯影液 供應糸統與基板之間之配置示意圖。 請參照第4 ®,本發明之顯影液供應系統 液供應裝置402、一第一管.件4〇4與第二管件4〇6。复= 應之裝一置係配置在基板4°〇之上方,且顯影液供應 裝置40 2之一輸入面係與一第一管件4〇4與一第二管件 連接,用以分別輸入一第一顯影液與一第二顯影液。而在 顯影液供應裝置402 —輸出面,亦即顯影液供應裝置4〇2朝 向基板400的部分,例如配置有複數個喷頭(未繪示),用 以將顯影液噴掃至基板4 0 〇之表面。 其中,第一管件4 04所提供之第一顯影液之濃度係依548709 Five invention description (4) Increment. The invention provides a developer supply system, which includes a developer supply device, a first pipe member and a second pipe member. Among them, the developer supply device = several output heads are arranged on one output surface. The first tube is connected to a human face of a display device, and one of the stems provided by the first tube is turned over. J t : & It depends on the density, and the first developer and the first developer coating amount of the first tube are a fixed value. A second tube, the input surface of the developer supply device, and the concentration of one of the shadow liquid provided by the second tube is less than the concentration of the first developer 'and the second tube = the amount of the second developer supplied is Gradually decreasing. The present invention proposes a developing solution supply reservoir association red n device, a first tube fitting-the m-th: includes-developing solution supply ^, the first & One of the devices of the developer supply device is on the input side, and a flute is connected to the developer supply 俜 ΐ ΐ The first tube provided by the -th-developing solution concentrated production: according to-the required concentration of the developing solution However, = the input surface of the liquid supply device, i the second total f :: pieces are also connected to the developing solution with a lower concentration than that of the first developing solution: the first developing solution and the second developing solution coating amount are V2. The coating amount of the first liquid (V. provided for the first and the first official parts) (for the second tube: the work :: the customer: the first-developed amount (V2) ratio (V1 / V2) is = The application of the second liquid solution_increment. T ", the liquid of the shirt liquid supply device is moved to improve the developing sound uniformly according to the invention to slow down the earlier on the substrate. Use a lower concentration to contact the display. Development of the area of the scene solution 548709 V. Description of the invention (5) rate to obtain better development uniformity. One of the developed solutions of the present invention is a high-concentration developer solution—f system uses two pipes to input separately. By adjusting the viscosity of the two developer solutions on a developer supply device. One coating amount to improve the development on the substrate is to make the present invention ## easy to understand. * 〇 ^ The purpose, characteristics, and advantages can be explained in more detail as follows: Lixinkou cadaver drawing drawing, detailed drawing description: 100, 400: substrate ^ 102, 402: developer supply device 104, 404, 406 : Pipe fittings' embodiment supply library ΓΛ, // will be shown as a developer supply according to a preferred embodiment of the present invention Schematic diagram of the arrangement between the application system and the substrate. Please refer to Section 4 ®, the developer supply system liquid supply device 402, a first tube 4 and a second tube 4 0 of the present invention. Complex = applicable An installation system is arranged above the substrate 4 °, and an input surface of the developer supply device 402 is connected to a first tube 404 and a second tube for inputting a first developer and A second developing solution. On the output side of the developing solution supply device 402, that is, the portion of the developing solution supply device 402 facing the substrate 400, for example, a plurality of nozzles (not shown) are configured to transfer the developing solution. Sprayed to the surface of the substrate 400. Among them, the concentration of the first developing solution provided by the first tube 404 is according to

第8頁 548709 五、發明說明(6) 照一產品之所需之顯影液濃度而定。而第二管件4〇6所提 供之第二顯影液之濃度則是小於第一顯影液之濃度。其 第一顯影液例如為2· 38 %之氫氧化四甲銨 彳又 ’、 (tetramethylammonium hydroxide , TMAH),笛 _ % 旦> 、 例如為0 · 4 %之氫氧化四曱銨。 顯影液供應裝置402對基板400噴灑顯影液之方式 當顯影液供應裝置402對基板400喷灑顯影液時,^与该 供應裝置402由基板400之一端往基板4〇〇之另一端平、 動’以將顯影液喷灑至基板4 〇 〇之所有部位。 仃 _ 本發明之顯影液供應系統時,顯影液 應裝置402於基板400上之位置關係如第5圖所示:第1 圖中之縱軸所表不的是管件4〇4、4 06所提供 與第二顯影液之塗佈量,而橫軸所表示= ==°,上:位置,本發明之: = ί = 之第-顯影液,其塗佈量係為一固定值,而y㈣=供 402之移Λ 佈量係隨著顯影液供應裝置 4 U ^ <移動而逐漸遞減。 由於第二顯影液之濃度較第一 影液供應裝置402 „从二」顯〜液之漠度低,且顯 時,係利iim板_上進行顯影液之塗佈 釋第-顯影因通:較多的第二顯影液,藉以稀 觸到顯影液之區域二顯男速了減^基板4〇0上較早先接 4〇2的移動,第速率。之後,隨著顯影供應裝置 第一官件4 0 6所提供之第二顯影液之塗佈量便Page 8 548709 V. Description of the invention (6) It depends on the required developer concentration of a product. The concentration of the second developing solution provided by the second tube 406 is less than that of the first developing solution. The first developing solution is, for example, tetramethylammonium hydroxide (TMAH) of 2.38%, tetramethylammonium hydroxide (TMAH), and tetramethylammonium hydroxide, for example, 0.4% of tetramethylammonium hydroxide. How the developer supply device 402 sprays the developer on the substrate 400 When the developer supply device 402 sprays the developer on the substrate 400, the supply device 402 is level with the supply device 402 from one end of the substrate 400 to the other end of the substrate 400. 'To spray the developer to all parts of the substrate 400.仃 _ In the developer supply system of the present invention, the positional relationship of the developer application device 402 on the substrate 400 is as shown in Fig. 5: The vertical axis in Fig. 1 shows the pipe fittings 404 and 4 06. Provides the coating amount with the second developer, and the horizontal axis indicates = == °, upper: position, the invention: = ί = the-developer solution, the coating amount is a fixed value, and y㈣ = For 402 shift Λ The amount of cloth gradually decreases as the developer supply device 4 U ^ < moves. Because the concentration of the second developing solution is lower than that of the first developing solution supply device 402 "From two", the degree of insolubility of the solution is low, and when it is displayed, the developer is coated and released on the iim board. In the area where more second developing solution is touched thinly, the second display man speeds down the movement of the 402 on the substrate 400 earlier, the first speed. After that, as the application amount of the second developing solution provided by the first official component 406 of the developing supply device is changed,

第9頁 548709 五、發明說明(7) 隨之遞減’以使基板4 0 〇上較後來才接 之顯影速率,較之前先接觸到顯影液域之^的區域 高。 i μ <顯影速率 利用本發明之顯影液供應系統時, 域位置之顯影效率如第6圖所示。第6圖中ς /各區 是顯影效率’而橫軸所表示的是在基板4〇〇上之〜斤表不的 於基板400上較早先接觸到顯影液的區域,1 f。由 影液濃度較低,但顯影液在此區域所停留之、 、’、、佈之顯 而於上較後來才接觸到顯影液的區域二部所= 之顯影液濃度較高,但顯影液在此區域所” 短。因此,藉由顯影液之濃度與顯影液於·.基 主可,4。0上較早先就接觸到顯影液之?域時: 较ΐ板上400較後來才接觸到顯影液之區域顯 衫效=一致,進而改善基板400上之顯影均勻度。 綜合以上所述,本發明具有下列優點: 产之1顧ΪΓ月Γ文善顯影均勾度的方法係利用通入較低浪 ^之顾衫液以減緩基板上較早先接觸到顯影液的區域之顯 影速率’因此可獲得較佳之顯影均勻度。 2二本發明之顯影液之供應系統係利用二管件以分別輸 入同/農度之顯影液與一低濃度顯影液於一顯影液#,裝 置中,藉由調整兩顯影液之塗佈量…文善基板上 均勻度。 ” —雖然本發明已以較佳實施例揭露如上,然其並非用以 限疋本發明,任何熟習此技藝者,在不脫離本發明之精神Page 9 548709 V. Description of the invention (7) Decreases accordingly ', so that the development rate on the substrate 400 later than later is higher than the area in which the developer solution has been contacted before. i μ < Developing rate When using the developer supply system of the present invention, the developing efficiency of the domain position is shown in FIG. 6. In FIG. 6 /, each area is the development efficiency, and the horizontal axis represents the area on the substrate 400 ~~, which is the area on the substrate 400 that earlier contacted the developing solution, 1 f. The concentration of the developing solution is low, but the developer stays in this area. The concentration of the developing solution is higher than that of the second part of the area where the developer was contacted later, but the developing solution is higher. The area in this area is very short. Therefore, by the concentration of the developer and the developer solution, the developer can be contacted earlier on 4.0? In the case of the domain: It is later than 400 on the slab. In the area of the developing solution, the effect is consistent, and the development uniformity on the substrate 400 is improved. In summary, the present invention has the following advantages: The method of producing uniformity of the developmental uniformity of the development method is to use Introduce the lower liquid Gu Gu liquid to slow down the development rate of the area on the substrate that earlier contacted the developing solution 'so that better developing uniformity can be obtained. 22 The supply system of the developing solution of the present invention uses two pipes to separate Input the developer with the same / agronomic level and a low-concentration developer in a developer #. In the device, by adjusting the coating amount of the two developers ... evenness on the Wenshan substrate. "— Although the present invention has been better The embodiment is disclosed as above, but it is not used to Cloth according to the present invention, any person skilled in this art, without departing from the spirit of the invention

548709548709

8171twf.ptd 第11頁 548709 圖式簡單說明 第1圖為習知顯影液供應裝置與基板之間之配置示意 圖, 第2圖為習知方法中,顯影液塗佈量與顯影液供應裝 置於基板上之位置關係示意圖; 第3圖為習知方法中,一基板上各區域位置之顯影效 率示意圖; 第4圖是依照本發明一較佳實施例之顯影液供應系統 與墓ί反之間之配置示意圖; 第5圖為利用本發明之顯影液供應系統時,顯影液塗 佈量與顯影供應裝置於基板上之位置關係示意圖;以及 第6圖為利用本發明之顯影液供應系統時,一基板上 各區域位置之顯影效率示意圖。8171twf.ptd Page 11 548709 Brief description of the diagram The first diagram is a schematic diagram of the configuration between a conventional developer supply device and a substrate, and the second diagram is a conventional method in which the developer coating amount and the developer supply device are on the substrate Schematic diagram of the positional relationship above; Figure 3 is a schematic diagram of the development efficiency of each region on a substrate in the conventional method; Figure 4 is a configuration between a developer supply system and a grave according to a preferred embodiment of the present invention Figure 5 is a schematic diagram of the relationship between the coating amount of the developer and the position of the developing supply device on the substrate when the developer supply system of the present invention is used; and Figure 6 is a substrate when the developer supply system of the present invention is used Schematic diagram of the development efficiency of each area.

8171twf ptd 第12頁8171twf ptd Page 12

Claims (1)

548709 六、申請專利範圍 1 · 一種改善顯影均勻度的 提供-基板與一顯影液署包:下列步驟: 裝置係配置在該基板之上方^二,/、中§亥顯影液供應 Γ管件與一第二管件連:,;;= = :係;: 液濃度低於該第-管件所提供之—;=二;7 端移液供應裝置由該基板之—端往該基板之另-==同時’該第一管件所提供之該第一顯影液之塗佈 η:固定值,㈣二管件所提供之該第二顯影液之塗 佈1係隨者該顯影液供應裝置之移動而逐漸遞減。 、2·如申請專利範圍第1項所述之改善顯影均勻度的方 法’其中該顯影液供應裝置朝向該基板之部分具有複數個 喷頭用以將該第一顯影液與該第二顯影液喷灑至該基板 法 3 ·如申請專利範圍第1項所述之改善顯影均勻度的方 其中該第一顯影液包括氫氧化四甲銨。 法 4 ·如申請專利範圍第1項所述之改善顯影均勻度的方 、 其中該第一顯影液之濃度係依照一產品所需之顯影液 濃度而定。 法 5 ·如申請專利範圍第3項所述之改善顯影均勻度的方 其中該第一顯影液之濃度係為2· 38%。 法 6 ·如申請專利範圍第1項戶斤述之改善I員影均勻度的方 其中該第二顯影液包括氫氧化四甲鑄。 7·如申請專利範圍第6項所述之改善顯影均勻度的方 ^171twf.ptd 548709548709 VI. Scope of patent application1. Provide a method to improve the uniformity of development-the substrate and a developer solution package: the following steps: The device is arranged above the substrate The second pipe fitting:, ;; = =: Department ;: The liquid concentration is lower than that provided by the-pipe fitting —; = two; 7-end pipetting supply device from the-end of the substrate to the other-== At the same time, the coating of the first developer provided by the first tube η: a fixed value, and the coating of the second developer provided by the second tube 1 is gradually decreased as the developer supply device moves . 2. The method for improving development uniformity as described in item 1 of the scope of the patent application, wherein the portion of the developer supply device facing the substrate has a plurality of nozzles for the first developer and the second developer Spraying onto the substrate method 3. The method for improving the uniformity of development as described in item 1 of the scope of patent application, wherein the first developing solution includes tetramethylammonium hydroxide. Method 4: The method for improving the uniformity of development as described in item 1 of the scope of the patent application, wherein the concentration of the first developer is determined according to the concentration of the developer required for a product. Method 5: The method for improving the uniformity of development as described in item 3 of the scope of the patent application, wherein the concentration of the first developing solution is 2.38%. Method 6: The method for improving the uniformity of the shadow of the I member as described in the first item of the patent application range, wherein the second developing solution includes tetramethyl hydroxide. 7 · Methods for improving development uniformity as described in item 6 of the scope of patent application ^ 171twf.ptd 548709 六、申請專利範圍 法’其中該第二顯影液之濃度係為0 · 4 %。 8· —種顯影液供應系統,包括·· 一顯影液供應裝置,其中該顯影液供應裝置之— 面配置有複數個喷頭; 苐 管件’連接在該顯影液供應裝置之一輸入面, 其中該第一管件所提供之一第一顯影液塗佈量係為一 值;以及 U疋 一第二管件,連接在該顯影液供應裝置之該輸入面, 其中該第二管件所提供之一苐二顯影液之濃度小於該第— 顯衫液之遭度,且該第二顯影液之塗佈量係逐漸遞減。 9·如申請專利範圍第8項所述之顯影液供應系統,其 中該第一顯影液包括氫氧化四甲銨。 、 1 0 ·如申請專利範圍第8項所述之顯影液供應系統,其 中該第一顯影液之濃度係依照一產品所需之顯影液濃度^ 定。 11 ·如申請專利範圍第9項所述之顯影液供應系統,其 中該第一顯影液之濃度係為2· 38 %。 、 1 2 ·如申請專利範圍第8項所述之顯影液供應系统,其 中該第二顯影液包括氫氧化四甲鉉。 、6. Method of applying for a patent method 'wherein the concentration of the second developing solution is 0.4%. 8. A developer supply system, including a developer supply device, wherein a plurality of nozzles are arranged on a surface of the developer supply device; a pipe fitting is connected to an input surface of the developer supply device, wherein A coating amount of a first developer provided by the first tube is a value; and a second tube is connected to the input surface of the developer supply device, wherein one of the second tube is provided by the first tube. The concentration of the second developing solution is less than that of the first developing solution, and the coating amount of the second developing solution gradually decreases. 9. The developer supply system according to item 8 of the scope of patent application, wherein the first developer comprises tetramethylammonium hydroxide. 10. The developer supply system according to item 8 of the scope of the patent application, wherein the concentration of the first developer is determined according to the developer concentration required for a product. 11. The developer supply system according to item 9 of the scope of the patent application, wherein the concentration of the first developer is 2.38%. 1. The developer supply system according to item 8 of the scope of the patent application, wherein the second developer comprises tetramethylammonium hydroxide. , 1 3 ·如申請專利範圍第丨2項所述之顯影液供應系統, 其中該第二顯影液之濃度〇 · 4 %。 14 · 一種改善顯影均勻度的万法’包括下列步驟: 提供一基板與一顯影液供應裝置,其中該顯影液供應 裝置係配置在該基板之上方,真该顯影液供應裝置係與一1 3 · The developer supply system as described in item 2 of the patent application scope, wherein the concentration of the second developer is 0.4%. 14 · A method for improving development uniformity 'includes the following steps: providing a substrate and a developer supply device, wherein the developer supply device is disposed above the substrate, and the developer supply device is connected with a 548709 六、申請專利範圍 第:官件與一第二管件連接,該第二管件所提供之一第二 顯影液濃度低於該第一管件所提供之一第一顯影液濃度; 以及 山當该顯影液供應裝置由該基板之一端往該基板之另一 =移動的同時,該第一管件所提供之該第一顯影液之塗佈 里係為v 1 ’該第二管件所提供之該第二顯影液之塗佈量係 ,V2 其中第一管件所提供之第一顯影液之塗佈量^對於 第二管件所提供之第二顯影液之塗佈量V2之比值V1/V2係 隨著顯影液供應裝置之移動而逐漸遞增。 < 1 5.如申請專利範圍第丨4項所述之改善顯影均勻度的 · 方法’其中該顯影液供應裝置朝向該基板之部分具有複數 個喷頭’用以將該第一顯影液與該第二顯影液喷灑至該基 板上。 、 、1 6·如申請專利範圍第丨4項所述之改善顯影均勻度的 方法’其中該第一顯影液包括氫氧化四甲銨。 1 7·如申請專利範圍第1 4項所述之改善顯影均勻度的 方法,其中該第一顯影液之濃度係依照一產品所需之顯影 液濃度而定。 、 1 8.如申請專利範圍第〗6項所述之改善顯影均勻度的 方法’其中該第一顯影液之濃度係為2· 38%。 1 9·如申請專利範圍第丨4項所述之改善顯影均勻度的 方法,其中該第二顯影液包括氫氧化四甲銨。 2〇·如申請專利範圍第19項所述之改善顯影均勻度的 方法’其中該第二顯影液之濃度係為〇· 4 %。548709 Sixth, the scope of the patent application: the official document is connected to a second pipe, and the concentration of a second developing solution provided by the second pipe is lower than that of the first developing solution provided by the first pipe; When the developer supply device moves from one end of the substrate to the other of the substrate, the coating inside of the first developer provided by the first tube is v 1 'the first tube provided by the second tube The coating amount of the two developing solutions is V2, in which the coating amount of the first developing solution provided by the first pipe fitting ^ and the ratio V1 / V2 of the coating amount V2 of the second developing solution provided by the second pipe fitting is The movement of the developer supply device is gradually increased. < 1 5. The method of improving development uniformity as described in item 4 of the scope of the patent application, wherein the portion of the developer supply device facing the substrate has a plurality of nozzles, used to connect the first developer with The second developing solution is sprayed onto the substrate. , 16. The method for improving the uniformity of development as described in item 4 of the patent application scope ', wherein the first developing solution includes tetramethylammonium hydroxide. 17. The method for improving the uniformity of development as described in item 14 of the scope of patent application, wherein the concentration of the first developing solution is determined according to the concentration of the developing solution required for a product. 18. The method for improving the uniformity of development as described in item 6 of the scope of the patent application, wherein the concentration of the first developing solution is 2.38%. 19. The method for improving the uniformity of development as described in item 4 of the patent application scope, wherein the second developing solution comprises tetramethylammonium hydroxide. 20. The method for improving the uniformity of development as described in item 19 of the scope of the patent application, wherein the concentration of the second developing solution is 0.4%. 548709 =、申請專利範圍 21 · 一種顯影液供應系統,包括: 面配置i:f供應裝置’其中該顯影液供應裝置之-輸出 囬配置有複數個喷頭; 复中# ϊ 一 ϊ件,連接在該顯影液供應裝置之一輸入面, 及宁3亥弟一管件所提供之一第—顯影液塗佈量係為νι;以548709 =, patent application scope 21 · A developer supply system, including: a surface configuration i: f supply device 'wherein the developer supply device-output back is configured with a plurality of nozzles; 复 中 # ϊ one piece, connection On one input surface of the developer supply device, and one of the first provided by Ning 3 Haidi a pipe fitting-the coating amount of the developer is νι; + ϊ —官件,連接在該顯影液供應裝置之該輸入面, 顯^第二管件所提m二顯影液之濃度小於該第-二=液之=度,且該第二顯影液之塗佈量係為v2 ;其中第 B提供之第一顯影液之塗佈量VI對於第二管件所提 :t第二顯影液之塗佈量V2之比值V1/V2係隨著顯影液供 應裝置之移動而逐漸遞增。 1 Φ I2\如申請專利範圍第2 1項所述之顯影液供應系統, 八中該第一顯影液包括氫氧化四甲銨。 並2 3、如申請專利範圍第2 1項所述之顯影液供應系統, 八中該第一顯影液之濃度係依照一產品所需之顯影液濃度 而定。 盆24·如申請專利範圍第22項所述之顯影液供應系統, 一中該第一顯影液之濃度係為2· %。+ ϊ — official part, connected to the input surface of the developer supply device, showing that the concentration of the m-th developer developed by the second tube is less than the -2 = degree of the liquid, and the coating of the second developer The amount of cloth is v2; the coating amount VI of the first developing solution provided by B to the second pipe is mentioned: The ratio V1 / V2 of the coating amount V2 of the second developing solution is based on the developing solution supply device. Move and gradually increase. 1 Φ I2 \ The developer supply system according to item 21 of the scope of the patent application, wherein the first developer in the eighth solution includes tetramethylammonium hydroxide. And 2. 3. According to the developer supply system described in item 21 of the scope of the patent application, the concentration of the first developer in the eighth is based on the developer concentration required for a product. Basin 24. The developer supply system described in item 22 of the scope of the patent application, wherein the concentration of the first developer is 2.%. 25·如申請專利範圍第21項所述之顯影液供應系統, 其中該第二顯影液包括氫氧化四甲銨。 26·如申請專利範圍第25項所述之顯影液供應系統, 其中該第二顯影液之濃度0.4%。25. The developer supply system according to item 21 of the application, wherein the second developer comprises tetramethylammonium hydroxide. 26. The developer supply system according to item 25 of the scope of patent application, wherein the concentration of the second developer is 0.4%.
TW91108821A 2002-04-29 2002-04-29 Method to improve uniformity of development TW548709B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW91108821A TW548709B (en) 2002-04-29 2002-04-29 Method to improve uniformity of development

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW91108821A TW548709B (en) 2002-04-29 2002-04-29 Method to improve uniformity of development

Publications (1)

Publication Number Publication Date
TW548709B true TW548709B (en) 2003-08-21

Family

ID=29998036

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91108821A TW548709B (en) 2002-04-29 2002-04-29 Method to improve uniformity of development

Country Status (1)

Country Link
TW (1) TW548709B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103207541A (en) * 2012-01-13 2013-07-17 昆山允升吉光电科技有限公司 Developing machine with which different developing section lengths can be selected

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103207541A (en) * 2012-01-13 2013-07-17 昆山允升吉光电科技有限公司 Developing machine with which different developing section lengths can be selected

Similar Documents

Publication Publication Date Title
TWI268544B (en) Resist pattern forming method, semiconductor apparatus using said method, and exposure apparatus thereof
TW200500644A (en) Patterned phase difference plate, method of manufacturing patterned phase difference plate, liquid crystal display panel, and liquid crystal display apparatus
TW200507063A (en) Linking unit, exposure apparatus and method for manufacturing device
EP1653501A4 (en) Exposure apparatus, device producing method, and exposure apparatus controlling method
WO2002002244A3 (en) Coating apparatus and methods of applying a polymer coating
US7658147B2 (en) Printing system and method for manufacturing liquid crystal display device using the same
WO2014169614A1 (en) Developing method
TW548709B (en) Method to improve uniformity of development
TW200625012A (en) Method for forming photoresist pattern by use of double-layer anti-reflection film
JP4921184B2 (en) Method of applying film adhesive to pellicle frame
WO2009041306A1 (en) Method and apparatus for manufacturing semiconductor device and resist material
CN100498544C (en) Method for reducing critical dimension of photoresist contact hole pattern
US20080000372A1 (en) Printing device system, patterning method using the same, and method of fabricating liquid crystal display device using the same
JP2007075746A (en) Method for forming coating film
JPH11233406A (en) Method and device for substrate processing
TW594422B (en) Edge remover with gas nozzle capable of preventing splash back of chemical solvent
JP2006093721A5 (en)
KR20080066600A (en) Reflow treatment unit and reflow teatiment method
WO2020038029A1 (en) Alignment film coating device
TW200407955A (en) Pattern developing device of substrate
JP2003007581A (en) Developing method and developer
JP2008010893A5 (en)
WO2006043253A3 (en) Dynamic development process with de-ionized water puddle
TW200619836A (en) A system and method for manufacturing semiconductor devices using an anti-reflective coating layer
TWI232493B (en) Method for photo-resistor coating

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees