TW546478B - Suspension-arm type testing card and its manufacturing method - Google Patents

Abstract

The present invention provides a suspension-arm type testing card and its manufacturing method, in which micro-electro mechanical technique and method of sacrificial layer are utilized to manufacture a suspending and integrated metal suspension-arm structure for forming a suspension-arm type testing card. Different types of metal material are used to manufacture a metal suspension arm and a metal probe for forming a bimorph structure. With the stress difference caused by different types of metal material in the bimorph, the metal suspension arm and metal probe form a slightly warped metal suspension arm structure to provide an effect of buffering the stress in performing a test, thereby assuring that each probe can come into touch with the metal contact to be tested and decreasing the damage to the metal contacts.

Description

546478

V. Description of the invention (1) ^ ~ --- [Inventive application range 5J] The following uses a microcomputer: :: $ ； ° type card and its manufacturing method ', especially the manufacturing method. ^ Technical manufacturing of one-piece cantilever test card and ^ [Background of the invention] Because the integrated electrical makeup test is a quality test, a product must pass strict power requirements before it leaves the factory. Cooperate with today's product j to ensure that the quality of integrated circuit components meets f. It tends to go directly to the other.

Dr〇bin λ, ^ on the wafer of the knife (on wafer, which is beneficial to early detection of defective products to save the cost of subsequent manufacturing _ β. In addition, as the circuit element = = ί Pitch is getting narrower and narrower , / / 0 line is getting higher and higher: ^ At first, it also increases the difficulty of measurement. The epoxy resin test card used by the official (in terms of its production method, the next WP.) xy Probe card) Not only 4; = Pins are welded to electricity one by one, which is not economical; ^ Producer: It takes a lot of time and people to control quality and improve yield. There will be difficulties with the highest probe density. Quot; This test takes a small distance and is not wide, and it is difficult in 1: the f performance cannot be improved and the application range is broken. ☆ pressure When the probe is too large, it can accommodate solder joints and bumps. In order to improve the performance of the traditional test card, the technology is read together (e 1 ~ t) 1 yyy wide cow tl pieces r'nf 9 ^ EjeCtr〇nic Component and Technology A new article named "New Probe"

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^ rrr " ei〇r FUU_Wafer 'C ——be Wenzao, the test card described therein has a needle structure, and the buffer effect temple wood needles through the cantilever-type probe structure can all contact the Pads and bumps and reduce damage to the pad X bumps by the probe. But this structure requires ^ to control. It takes a lot of time and effort ”and its reliability and yield are difficult. [Objective and Overview of the Invention] In order to solve the problems of the above-mentioned conventional technology, and to produce low-cost, 言 Mgh Pln count, narrow pitch (Fine pUch) and testing that can be large = production, etc. The present invention provides a cantilevered test card, which is 2 micrometers, and a curved cantilevered structure provides cushioning so that each probe can contact the pad to be measured. With the bump and reducing the damage of the probe to the pad and the bump, the metal cantilever and the probe are integrally formed, so that the appropriate reliability can be achieved. Tian The cantilever test card and its manufacturing method of the present invention use the micro electromechanical (M EMS ’micro electro-mechanical system) technology to manufacture an integral test card, without the need for additional bonding or welding probes. The present invention applies the concept of a sacri ficcial layer to manufacture a cantilever structure, and then cooperates with the bimetal layer (bim〇rph) to design the degree of cantilever micro-warpage according to the difference in stress generated by different metals; Micro-electro-mechanical technology 'probes can be made into the form of an array (array) to meet the trend of smaller and smaller sizes and increasing numbers of wafer contacts (including solder pads and bumps).

M6478 V. Description of the invention (3) According to this card, it contains holes and is filled with continuity; and pins, metal suspension, metal suspension connection. The material is formed, each of the micro-warped gold shields is connected to the wafer according to the test layer of the card; the micro-holes in the sacrificial layer are filled with conductive metal probe sacrificial layers to form different metal materials of the same kind. The thickness of the metal forming a micro-warped probe is determined by its warpage to make the invention uncovered:-a conductive gold-metal arm is connected to the metal arm by a metal suspension The table covers sacrificial metals; and the bending structure and selectivity of a material shaped by a metal material. According to the formula of the present invention, the test L, the electrical metal material formed by the circuit metal probe that is worn, forms a different result, and the touch-and-extinguish type just tries to form the sacrificial sacrifice at the shape of the perforated surface and removes the use of non-probe and metal. The present invention provides a 'cantilever substrate, which has a penetrating through the substrate to provide the substrate surface to the substrate bottom cantilever.' The top surface of the metal cantilever has metal probes made of different types of metal materials on the substrate. The perforated arm and the metal probe filled with conductive metal are made of different kinds of stress differences between different metals, which can generate stress buffering effect during testing and contact with the wafer contacts (including solder pads and bumps). According to the disclosed technology, the present invention provides a cantilever comprising: providing a substrate, defining a micro hole on the surface of the substrate, and depositing a metal layer to the filling layer to form a perforation penetrating the substrate and connected to the micro hole of the sacrificial layer; the metal The layer fits the metal probe position to define a metal layer cantilever. Among them, the metal cantilever is formed with a metal probe, and the difference in stress between the metal cantilever and the metal probe is used to make the metal cantilever and gold 'its micro- Zhaoqu structure can use the purpose and structural characteristics of the stress caused by different kinds of metal materials And its functions are further 1 11 _ 1 II 1 Page 6 546478 V. Description of the invention (4) Understand that the detailed description of the bismuth coordination diagram is as follows: [Detailed description] is beneficial: :: cantilever test card and its manufacturing method Specific implementation method of micro electro-.echan.cal system) technology to manufacture-body forming test cards, and the application of the concept of "layers" to manufacture slightly warped county arms. And "; and Taiyun This book and the high pin count tht are matrix matrixes to meet the requirements of low production ^, ^.. S Pln Count), fine pitch (fine Pltch;), and monthly production. ^ J Micro-electro-mechanical technology implementation process of the present invention The details are as follows: Drawing: It is not intended for the cantilever type process of the present invention. The clothing of the embodiment of the cantilever test card of the present invention includes the following steps: a substrate 10 is provided and formed on the surface of the substrate 10; Layer 20 (such as (Shown in Figure 1); a pair of microholes 2 1, 2 2 are defined on the sacrificial layer surface using photolithography (as shown in Figure 2); copper metal is deposited by electroplating to form a first metal layer 3. To fill the micro holes 21, 22 and cover the sacrificial child layer 20 (as shown in FIG. 3); deposit nickel metal by electroplating to form a second metal layer 40 to cover the first metal layer 30 (as shown in FIG. 4) (Shown); forming a pair of perforations u, 12 penetrating through the substrate, and then filling the perforations U, 12 with copper metal by electroplating, and the perforations 丨, 丨 2 are aligned with the micro holes connected to the sacrificial layer, 21, 22 (as shown in FIG. 5); the second metal layer 40 is defined by photolithography technology to form a pair of metal probes 41, 42 (as shown in FIG. 6); The position is defined by the photolithography technology. The first metal layer 3 〇 forms a metal cantilever 3 1, 3 2 (as shown in FIG. 7); finally, the sacrificial layer 2 〇 is removed to form a

546478 V. Description of the invention (5) The micro-warped metal cantilever structure 50 of the bimetal layer (as shown in FIG. 8) In the manufacturing method of the embodiment of the present invention described above, the test method is made of copper and nickel respectively. Manufactured *, an embodiment of the present invention; the difference between the cantilever and the nickel metal probe of different types of metal materials, until the metal cantilever and the metal probe form a slightly warped knot, and: ：: cantilever and metal The difference in stress caused by the thickness of the probe controls its second degree. The metal cantilever and the metal probe of the present invention can be used to make light and slightly curved knots by selecting the ^ king metal material to cause the difference in stress. Metal is only one example. That's it.

In addition, the metal cantilever and metal probe of the present invention need to be made of metal materials with better properties and appropriate stress differences to make the micro-two-bimetal layer structure, and a metal with appropriate hardness should be used as a metal picking needle to facilitate During the test, it can penetrate the surface of the pad or bump smoothly: = layer, but it will not cause damage to the pad or bump. Therefore, the metal suspension is formed of one of copper and metal, and the metal probe is formed of one of metal and metal. Fill the through hole of the substrate to provide a conductive metal for conducting the circuit from the substrate to the bottom surface of the substrate. Metal materials with better conductive properties, such as copper, metal, gold, nickel, and silver, can be used. Partially identical metals to reduce interface resistance. The method of forming a metal layer and depositing a metal is not limited to the use of electroplating, and one of sputtering, evaporation, electroplating, and chemical vapor deposition methods may be selected; the substrate used in the present invention may be single crystal silicon ( slUcon wafer), quartz (quartz), glass (Hass) and ceramic (ceram); the application of the micro-electromechanical technology used in the present invention can

546478 — — —, Description of the invention (6) Test integrated circuit wafer The metal probe is made to further illustrate the present invention by applying the embodiments, ... A cantilevered test card of the invention is shown in Figure 9 of the circuit board Shown that this type of test card contains:-substrate 10, this substrate = two = cantilever perforations 11, 12, invention perforation u, 12r 1 into the conduction band two pairs of through the substrate to the bottom of the substrate circuit conduction; And: ":" to provide the top surface of the substrate cantilever structure 50 with metal probes: two_50, metal 32 and metal probes 41, 42 form a double metal layer, and a sharp cone cantilever 31, = caused by the same metal The difference in stress makes the metal cantilever between the two W layers, the metal cantilever structure 50 is aligned and connected to the United States ^ to form a micro warped hole to achieve electrical connection. As shown in Figure 9, Guangben's filled with conductive metal shout card can Joining—Provide the actual measurement needs of the cantilever type measurement of the present invention. The jade ", u printed circuit board 60 to cooperate with the [effect of the invention] Eight cantilever type test cards of the present invention 1 system, only two of them can be combined. Mechatronics technology This sublayer of the layer has another reliability problem; the cantilever structure of the plate forming, due to the 7 micro-warped cantilever structure, and 2 is the use of a bimetallic layer system to ensure that each probe is compatible with, and =: Provides the effect of stress buffering and contacts, and the chip contacts (including solder pads and bumps) of the wafer contacts at the same time ::: Used by MEMS :: Will be reduced. In addition, the application of the present invention is compatible with low cost, high pin count (two pin needles are made into a matrix and Pltch), and mass production can be 13111 counts), narrow pitch (fine although the implementation of the present invention: " i 露 上 上) ", But it is not used for 546478. V. Description of the invention (7) Anyone skilled in the art can make some changes and retouch without departing from the spirit and scope of the invention. Therefore, the invention The scope of patent protection shall be determined by the scope of the patent application attached to this specification. Page 546478 Brief description of the drawings Figures 1 to 8 show the cantilever test card of the present invention and its manufacturing method. A schematic diagram of the manufacturing process of the embodiment; and FIG. 9 shows a schematic diagram of a cantilevered test card bonding circuit board of the present invention. [Illustration of Symbols] 10 base 11 wear 12 wear 20 sacrifice 21 micro 22 micro 30 31 gold 32 gold 40th 41 gold 42 gold 50 gold 60 printing plate hole hole layer layer hole hole 1 metal layer belongs to the cantilever cantilever two metal layer belongs to the probe belongs to the cantilever structure brush circuit board

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Claims (1)

546478 VI. Application patent scope 1. A cantilever test card, comprising: a substrate having a perforation filled with a conductive metal, the perforation penetrating the substrate to provide circuit conduction from the substrate surface to the substrate bottom surface; And a metal cantilever, the top surface of which has a metal probe, the metal cantilever and the metal probe are respectively formed of different kinds of metal materials, using the metal cantilever and the different kinds of metal materials selected by the metal probe The difference in stress causes the metal cantilever and the metal probe to form a micro-warped structure. The metal cantilever is aligned and connected to the perforated position of the substrate. 2. The cantilever test card described in item 1 of the scope of the patent application, wherein the micro-warped structure formed by the metal cantilever and the metal probe can be selected from different thicknesses of the metal cantilever and the metal probe and different types of The stress difference caused by the metal material controls the degree of warpage. 3. The cantilever test card as described in item 1 of the scope of patent application, wherein the substrate is one of a silicon wafer, a quartz, a glass, and a ceramics substrate . 4. The cantilever test card as described in item 1 of the scope of patent application, wherein the conductive metal material is one of copper, metal, gold, nickel, and silver metal materials. 5. As described in item 1 of the scope of patent application The cantilever type test card, wherein the metal cantilever is formed of one of copper and Ming metal material. 6. The cantilevered test card according to item 1 of the patent application scope, wherein the metal probe is formed of one of nickel and chromium metal materials. Page 12 546478 6. Application patent scope 7. A method for manufacturing a cantilever test card, comprising: providing a substrate, forming a sacrificial layer on the surface of the substrate; defining a micro-hole on the surface of the sacrificial layer, depositing a metal Layer to fill the micro hole and cover the sacrificial layer; forming a perforation filled with a conductive metal on the substrate; the perforation penetrates the substrate and aligns the micro hole connected to the sacrificial layer; on the surface of the metal layer Forming a metal probe, the metal layer and the metal probe are respectively formed of different metal materials; and defining the metal layer according to the position of the metal probe, and removing the sacrificial layer to form a metal cantilever, the metal cantilever and the The metal probe forms a micro-curvature structure due to the stress difference. 8. The method of manufacturing a cantilevered test card as described in item 7 of the scope of patent application, wherein the micro-curved structure formed by the metal cantilever and the metal probe can be selected from different thicknesses of the metal cantilever and the metal probe The difference in stress caused by the material controls its degree of warpage. 9. The method of manufacturing a cantilevered test card according to item 7 of the scope of the patent application, wherein the method for depositing the metal layer is one of a sputtering method, an evaporation method, an electric ore method, and a chemical vapor deposition method. 10. The method for manufacturing a cantilever test card as described in item 7 of the scope of the patent application, wherein the substrate is monocrystalline (si 1 ic ο nwafer), quartz (quartz), glass (glass), and Taumann ( ceramics) one of the substrates-〇1 1. The method of manufacturing a cantilever test card as described in item 7 of the scope of patent application ', wherein the conductive metal material is copper, Ming, gold, nickel and silver metal materials Page 13 546478 VI. Patent Application Scope One of the materials is expected. 1 2. The method of manufacturing a cantilevered test card according to item 7 of the scope of patent application, wherein the metal cantilever is formed of one of copper and Shao metal materials. 1 3. The method of manufacturing a cantilevered test card as described in item 7 of the scope of patent application, wherein the metal probe is formed of one of a recording and a metal material. Page 14