201115150 六、發明說明： 【發明所屬之技術領威】 [0001] 本發明為有關/種垂直式探針卡，尤指一種每一探針可 獨立更換之垂直式探針卡。 C先前技術3 [0002] 晶圓測試時’測試儀器通常透過一探針卡（pr〇be card) 獲取待測物（device under test，^τ)的電氣訊號。 探針卡通常包含若干個尺寸精密的探針，利用探針接觸 肖測物上尺寸微小的銲塾或凸塊，藉探針傳送-測試訊 ^ 號，並配合軟體控制達到量測的目的。 闺f知之垂直式探針卡，探針部分多為一機械加工後的金 屬線材’藉由探針呈彎錄賴態;料所產生的 彈I1 生來吸收抵觸待測物產生的外力，或是將探針設計具 彈性變形也力’如日本專利公開第2GG3-240800號之 探十針頭為中空越頭（hammerhead)結構；或是配合其 匕〇P件來吸收外力，如日本專利公開第2002-48818號所 Ο *露.请參閲「咖」所示，探針卡包含複數個探針ιοί “及對應每—探針1{)1之導線1G2。該導線1G2形成複數 曲部103、1〇4 ’提供探針1()1吸收外力的彈性。因 4專利公開案所使用之導線102尺寸細長，且形成複數個 ^部103、104 ’因此必須設置下支持板1〇5以及上支 持板106來提供導線1()2支撐力，且該公開專利案利用人 工組裝導線102，導線102的線徑大約在5〇~100/ηπ，須 *置在複數個支持板1G5、1G6所開設的貫穿孔内，因此 組袭不易；再者’導線102須形成多處彎曲型態而不易製 098135922 表單編號A0101 第3頁/共27頁 0982061620-0 201115150 造。在晶片尺寸逐漸微小化下，探針的尺寸精度和密度 增加，以傳統製造和人工組裝的方式並無法滿足此潮流 的要求。 [0004] [0005] [0006] [0007] 另外，如日本專利公開第2002-134570號所揭露，於探 針上方加設具彈性之異方性導電薄膜，利用異方性導電 薄膜本身的彈性吸收外力。然而，異方性導電薄獏具導 電方向性，薄膜上下兩點須確實接觸方能導通，因此當 異方性導電薄膜受到每一探針產生的不同位移量時，探 針間容易相互產生干涉’造成裸針與薄膜接觸不良而影 響導通，造成測試的偏差卜〇 習知之垂直式探針卡，其探針大多固定於探針卡上而無 法自由拆裝，如美國公開專利第2〇〇7/〇2〇5783號，其包 含—片狀探針（sheet-like probe)，該片狀探針固設 複數個探針。因此，當某些探針損壞或需要更換時，無 法獨立更換，而須更換該片狀探針而大幅增加成本。 【發明内容】 本發明之目的在於提供一種垂直式寒針卡，其每一探針 ❹ 可隨使用需求，獨立自由更換，而減少成本支出。 本發明之另一目的，在於提供一種垂直式探針卡，其探 針或從動件可透過微機電系統（MEMS)或半導體製程製造 而獲致精度較高且尺寸較小而可緊密排列。 為達上述目的，本發明提供之垂直式探針卡，包含一多 層模、且i數個具變形能力之從動件、-絕緣導引板以 及複數個探針。該多層模經包含-空間轉換層，可供從 098135922 表單編號A0101 第4頁/共27頁 0982061620-0 [0008] 201115150 動件固設於其上，絕 一探針可滑移裝卸於^引板開設複數個導孔，致使每 當使探針财層模組電性相連；…=::::，_受力在一， 勒件可抵制探針的位移而變形。 [0009] Ο [⑻ 10] 透過本發明提出之垂以探針卡當探針受損時，僅需 針對受損探針進行替換或祕，因此可節省大量成本； 此外，本發明之料可於麵_由祕，如此可加速組裝，並減少針髅的磨^有關本發明的詳細技術内容 及實施例’配合圖式說明如後。 【實施方式】 ·.，‘ ：；; 有關本發明之詳細說明及技術内容，現就配合圖式說明 如下： [0011]❹ 請參閱「圖卜1」*「圖卜2」所示，為本發明—實施例 之結構剖面圖，如圖所示：本發明提出之垂直式探針卡 10，包含一多層模組11、複數個具變形能力的從動件12 、一絕緣導引板13和複數個探針14。 [0012] 098135922 該多層模組11可包含印刷電路板（printed circuit board，PCB)111、蓋板（cover)ii2、加強件 (stiffener)U3、保護板（圖中未示）、載板（圖中未示 )等探針卡習知的多層結構，且該多層模組1丨之測試侧包 含一空間轉換層（space transformer) 114。在一實施 例中，該空間轉換層114實質上可為一電路基板，包含第 一表面114a及相對該第一表面1 i4a另一側的第二表面 表單編號 A0101 第 5 頁/共 27 s 0982061620-0 201115150 iHb ’第一表面1143具複數個金屬接點，第二表面114b 亦有相對應的金屬接點，第一表面114a的金屬接點可經 空間轉換層114的内部線路，與第二表面U4b上的一個以 上的金屬接點電性相連；該空間轉換層114第一表面114& 的金屬接點電性連接至印刷電路板Π1，致使電性訊號可 自探針14傳遞至多層模組π。空間轉換層U4基材選擇自 絕緣材質，實質上可為一陶瓷基板、陶瓷基座或有機材 料基板' [0013] 從動件12為導電材質，一端固設於該空間轉換層114的第 二表面114b，且與第二表面π社的義一個以上的金 屬接點電性相連，另一端則為自由端12】，可與探針14接 觸而電性相連。須瞭解到，每一從動件為一具變形能 力或彈性的結構，其外觀或實質形式變化甚多，故不以 圖式揭露者為限；此外，從動件12與探針14為可分離結 構，如此可方便更換探針14。該些從動件12透過空間轉 :：1 …i 換層114内部的導線（圖中耒示），與印刷電路板1U電性 相連。從動件12受力時’可吸收外力而整體變形達到平 衡’無須額外設置其他輔件吸收外力或提供支撐。該些 從動件12可利用微機電系統系統 (micro-electro-mechanical system，MEMS)或半導 體製程（semiconductor manufacturing process)技 術形成，其固設於該空間轉換層114上，因此可獲致尺寸 較小、排列緊密整齊之特性。 絕緣導引板13開設複數個導孔131，該些導孔131貫通絕 緣導引板13，實質上以垂直貫通者為考量，致使對應探 098135922 表單編號A0101 第6 1/共27頁 0982061620-0 [0014] 201115150 針14可自由滑移設置於導孔丨3 i内。該絕緣導引板丨3可以 螺絲鎖固或塗膠30黏合（請見「圖卜3」之示意）等方式固 設於該多層模組^，為方便更換探針14，固設的方式以 螺絲鎖固者為考量》「圖卜丨」至「圖卜3」顯示絕緣導 引板13之不同實施例：「圖卜丨」顯示絕緣導引板13直接 固鎖於該多層模組11的蓋板112，「圖卜2」則顯示絕緣 導引板丨3自該第二表面U4b固鎖於空間轉換層Π4。「 圖1-3」顯示之絕緣導引板丨3則與前述蓋板112為一體的 結構’其直接固設於該多層模組11的印刷電路板111上。 3 [0015] 「圖2-1」與「圖3-1」分別為本發明從動件12的不同實 施例，而「圖2-2」與「圖3-2」.則為對應「圖2-1」與 「圖3-1」測試時之作動圖。「圓2一〗」所顳示之從動件 12實質上為一懸臂結構，包含一懸臂122和一固定該懸臂 122於空間轉換層114的基座123，懸臂122與基座123可 透過微機電系統系統（MEMS)或是半導體製程技術形成， 並可一體成形或是個別成形。 〇 [0016] 「圖4-1」至「圖4-4」為皋述從轉;件12為一懸臂結構之 不同實施例，該懸臂122可直接作為自由端121而接觸探 針14(如「圖4-1」、「圖4-2」），或於懸臂122底端具 一凸體124做為自由端121，再與探針14產生接觸（如「 圖4-3」、「圖4-4」）；另外，「圖4-1」至「圖4-4」 亦顯示從動件12的基座123可具有不同的實施樣態》 [0017] 098135922 圖5-1」和「圖5-2」顯示從動件12的另一實施例。為 提供懸臂122變形空間，節省整體體積，因此於該空間轉 換層114開設一空腔115。「圖5-1」顯示的從動件121藉 表單編號 A0101 % 7 1/^ 27 1 0982061620-0 201115150 由基座123固設於空間轉換層114之第二表面; 「圖 5~2」則省略「圖5-1」中從動件12的基座123部分，而 致使懸臂122直接固設於空間轉換層114第二表面1141)上 ，且與第二表面114b的一個或一個以上的金屬接點電性 相連。 [0018] 圖3~1」顯示從動件12之另一實施例，該從動件12實質 上形成一屈曲樑結構（buckling beam structure)， 可如「圖3-1」呈一傾斜狀，或如「圖6-1」至「圖6_5 」顯示之木同實施態樣，其結構實質上可為線狀、柱狀 或平板狀，或如「圖6-5」呈一彈餐結構；其截面積可為 一圓形或一矩形，但不以上述為限◊此類型之從動件可 利用上述微機電系統或半導艘製程的技術製造，或利用 自動或半自動打線（wire bonding)技術的方式製造，或 利用放電加工（electric discharge machining， EDM)技術的方式製造，將具彈性和變形能力的金屬導線 固接於空間轉換層114的第二表i mb土，且與第二表面 114b的一個或一値以上的金屬接點電性相連。上述金屬 導線之材質’可選自由金（Au)、鋁（A1)、銅（Cu)、銀 (Ag)以及鉑（Pt)所組成的群組；打線後的金屬導線，可 再透過塗層（coating)方式，包覆一金屬層以增加從動 件12整體的機械強度。上述金屬層之材質，可選自由鎳 (Ni)、鈷（Co)、鐵（Fe)、銅（Co)、金（Au)、鉑（Pt)、 銀（Ag) '铑（Rh)以及釕（Ru)所組成的群組。 此外，如「圖7」所示，在上述一實施例中，複數從動件 12靠近空間轉換層114之一端，可先組裝於一基板125， 098135922 表單編號A0101 第8頁/共27頁 0982061620-0 [0019] 201115150 再安裝於空間轉換層114之第二表面114b，致使每一從動 件12與第二表面H4b預設之接點電性相連，如此可增加 細裳時的彈性。在一實施例中，複數從動件12與第二表 面114b之接點是藉由錫球迴焊（refi〇w)的方式組裝。 [0020] Ο 晴參閲「圖2-2」與「圖3-2」所顯示測試時的作動狀態 ’當探針針尖142抵觸待側物2〇而於絕緣導引板13的導孔 131内部產生滑移時，由於從動件12具彈性及變形能力， 因此可吸收測試時產生的外力，而致使針尖142確實接觸 待侧物20，並且避免針尖142因過度施力而損壞。必須再 說明的是’當探針14與待侧物2〇接觸時，不同銲墊的高 度或不穩定的接觸壓力，均可能導致個別探針14於導孔 131内產生不同輕度的滑移，因此本發明之每一從動件12 均可獨立變形’可依據相對應探針14的滑移量，產生不 同的變形量’在應用上較靈活有彈性。 [0021] 〇 098135922 - ^ 厂"不，母一探針包含 頭P141與針4142。為避免探針㈣從動件η產生 相對位移而娜接觸，頭部141可具較大的接觸面積。另 夕’為達成探針14可順利抵制從動件12，探心長度以 大於該絕緣導引板13之厚度為老晉 ㈣較大接觸面積接觸於從動 空間轉換層114内部的導線（圖動件12透過 質上未示），使該些探針14實 質與該多層換組η電性相連，而將測試訊號傳輸至 刷電路板111以及測試機台（未 142接链‘ ’、）。虽探針14的針尖 142接觸待側物2〇時’探針 從動件咖倾些細心移^由滑移’而 移而變形，藉以吸收探 表單編號A0101 第9頁/共27頁 0982061620Ό 201115150 [0022] [0023] [0024] 098135922 針】4與待側物2〇接觸時所蓋生的外力。上述之 =加工形成，亦可利用微機《統或半導體製程： 如「圖8」所示，在另一實施例中，探針14 的頭部141可設計成錢频力或_龍構，如 配從動件12 ’獲致不同吸收外力和位移的效果。。 到’圖示中從動件12的形狀結構僅為了示意從動件^ =彈性變形能力之結構，可與上述探針有相補相成的 本發明之絕緣導㈣13可為-單層結構，或如「圖9 i 所不’為—多層可分離結構。探針卡測試、使料，探 :針尖142會隨使用次數而不斷耗損，耗損經研磨後的探 14長度會縮短，然而單層絕緣導引板無法適用過短的 =針1'，透過多層可分離之絕緣導引板13，當使用較短 長度縮減時’僅需移除部分分層之絕緣 I引板13(如圖9_2」㈣），_崎短之探針14 使用，較為環保並可減少成本支出。 综上所述’本發明提出之垂直式探針卡_利用探針14 於絕緣導板13内自由滑移，並透過從動件12吸收外力 ’大幅降低探㈣磨損與針尖142的耗損；透過本發明， 各探針1U1也可獨讀移而衫同滑移量，可增廣使用 範圍。再者，透過本發明，探針14於設計、製造以及组 敦上都較簡便容易’不但可大量生產，增長使用壽命， 更無須費時改良探針U結構。此外，由於本發明之探針 二=裝於：=:，者可根據不同的測 0982061( 201115150 試用途或是銲墊結構，對應設置不同的探針14魬合，無 須針對特殊用途購製對應的探針卡，藉此可增廣使用範 圍，而降低測試成本。承上，由於探針14可活動柝譽於 絕緣導引板13，當個別探針14斷裂或損壞時，維修上較 谷易，更換探針14時，也僅需針對個別探針14更換即可 ，不祕費額外成本更換整個探針卡1用微機電系統 或半導體製程技術製造從動件12或探針等部件，於效率 及精密細腻程度上均有所提升，探針14和從動件12可作 更緊密的排列，尤其對於針雜誠高精密、高規格的 〇 探針卡，均適用本梦哪》 剛惟以上《者，僅為本糾錢佳實_，非欲偈限本 發明專利之專龍護_，故舉凡運林發明說明書及 圖式内容所為之等效變化與修飾，均同理包含於本發明 之權利保護範圍，合予陳明。 【圖式簡單說明】 [0026]本發明的實施方式係結合圖式予以描述： 〇[_「圖卜1」為本發明-實施例之結構剖面圖； 國「圖卜2」為本發明另—實施例之結構剖面^ _「圖卜3」為本發明另一實施例之結構剖面圖； [0030] 「圖2_丨」為本發明從動件之一實施例. _「圖2_2」為「圖2义測試時之作動狀態圖； [〇〇32] 「圖3-1」為本發明從動件 τ心力一實施例； [0033] 「圖3-2」為本發明「圖3 姓201115150 VI. Description of the Invention: [Technical Leadership of the Invention] [0001] The present invention relates to a vertical probe card, and more particularly to a vertical probe card that can be replaced independently for each probe. C Prior Art 3 [0002] In the wafer test, the test instrument usually obtains the electrical signal of the device under test (^τ) through a probe card (pr〇be card). The probe card usually contains several probes of precise size. The probe is used to contact the small size solder bumps or bumps on the detector, and the probe transmits the test signal and cooperates with the software control to achieve the measurement.垂直f know the vertical probe card, the probe part is mostly a machined metal wire 'by the probe in a curved state; the material generated by the bomb I1 is generated to absorb the external force generated by the object to be tested, or The probe design is elastically deformed and also has the same function as the hammerhead structure of the Japanese Patent Publication No. 2GG3-240800; or the 匕〇P member is used to absorb the external force, such as Japanese Patent Publication No. 2002-48818 Ο *露. Please refer to the "Coffee", the probe card contains a plurality of probes ιοί "and corresponding to each probe 1{) 1 wire 1G2. The wire 1G2 forms a complex curvature 103 1〇4' provides the elasticity of the external force of the probe 1()1. The wire 102 used in the 4th patent publication is elongated and forms a plurality of portions 103, 104' so the lower support plate 1〇5 must be provided and The upper support plate 106 is used to provide the support force of the wire 1 () 2, and the disclosed patent uses the artificially assembled wire 102. The wire diameter of the wire 102 is about 5 〇 100 100 η π, and is placed on a plurality of support plates 1G5 and 1G6. The through hole is opened, so the attack is not easy; in addition, the wire 102 must be formed in multiple places. Bending type is not easy to make 098135922 Form No. A0101 Page 3 / Total 27 pages 0982061620-0 201115150. As the size of the wafer is gradually miniaturized, the dimensional accuracy and density of the probe increase, and the traditional manufacturing and manual assembly cannot [0004] [0006] [0006] [0007] In addition, as disclosed in Japanese Patent Publication No. 2002-134570, an elastic anisotropic conductive film is applied over the probe, using an anisotropy. The elasticity of the conductive film itself absorbs external force. However, the anisotropic conductive thin crucible has a conductive directivity, and the upper and lower points of the film must be in contact with each other to be conductive, so when the anisotropic conductive film is subjected to different displacement amounts generated by each probe When the probes easily interfere with each other', causing poor contact between the bare needle and the film, which affects the conduction, resulting in a deviation of the test. A conventional vertical probe card, the probe is mostly fixed on the probe card and cannot be freely disassembled. , for example, U.S. Patent No. 2,7/2,5,783, which contains a sheet-like probe that fixes a plurality of probes. When the needle is damaged or needs to be replaced, it cannot be replaced independently, and the sheet probe needs to be replaced to greatly increase the cost. SUMMARY OF THE INVENTION The object of the present invention is to provide a vertical cold needle card, which can be used with each probe Requires, independently and freely replaces, and reduces cost. Another object of the present invention is to provide a vertical probe card whose probe or follower can be manufactured through micro-electromechanical system (MEMS) or semiconductor manufacturing process. The present invention provides a vertical probe card comprising a multi-layer mold, and a plurality of deformable followers, an insulating guide plate, and a plurality of Probes. The multi-layer mold includes a space-converting layer, which is available from 098135922 Form No. A0101 Page 4/Total 27 Page 0982061620-0 [0008] 201115150 The moving member is fixed thereon, and the probe can be slidably loaded and unloaded. The board opens a plurality of guiding holes, so that the probe layer modules are electrically connected each time; ...=::::, _ is stressed, and the parts can be deformed by resisting the displacement of the probe. [0009] [(8) 10] According to the present invention, when the probe card is damaged, the probe only needs to be replaced or secreted for the damaged probe, thereby saving a large amount of cost; In the face of the secret, this can speed up the assembly, and reduce the grinding of the needles. The detailed technical content and examples of the present invention are described in conjunction with the drawings. [Embodiment] The detailed description and technical contents of the present invention will now be described as follows: [0011] ❹ Please refer to "图卜1"*"图卜2" as shown in A cross-sectional view of the structure of the present invention is as shown in the drawings. The vertical probe card 10 of the present invention comprises a multi-layer module 11, a plurality of followers 12 with deformability, and an insulating guide plate. 13 and a plurality of probes 14. [0012] 098135922 The multi-layer module 11 may include a printed circuit board (PCB) 111, a cover ii2, a stiffener U3, a protection board (not shown), and a carrier board. The conventional structure of the probe card is not shown, and the test side of the multilayer module 1 includes a space transformer 114. In one embodiment, the space conversion layer 114 can be substantially a circuit substrate, including a first surface 114a and a second surface relative to the other side of the first surface 1 i4a. Form number A0101 Page 5 / 27 s 0982061620 -0 201115150 iHb 'The first surface 1143 has a plurality of metal contacts, and the second surface 114b also has corresponding metal contacts. The metal contacts of the first surface 114a can pass through the internal lines of the space conversion layer 114, and the second One or more metal contacts on the surface U4b are electrically connected; the metal contacts of the first surface 114& of the space conversion layer 114 are electrically connected to the printed circuit board ,1, so that electrical signals can be transmitted from the probe 14 to the multilayer mode. Group π. The space conversion layer U4 substrate is selected from an insulating material, and may be substantially a ceramic substrate, a ceramic base or an organic material substrate. [0013] The follower 12 is a conductive material, and one end is fixed to the second of the space conversion layer 114. The surface 114b is electrically connected to one or more metal contacts of the second surface π, and the other end is a free end 12], and is electrically connected to the probe 14. It should be understood that each of the followers is a deformable or elastic structure, and its appearance or substantial form changes a lot, so it is not limited to the disclosure of the figure; in addition, the follower 12 and the probe 14 are The structure is separated so that the probe 14 can be easily replaced. The followers 12 are electrically connected to the printed circuit board 1U through the wires (shown in the figure) inside the layer 114 of the space change ::1 ... i. When the follower 12 is stressed, the external force can be absorbed and the overall deformation is balanced. There is no need to additionally provide other accessories to absorb external force or provide support. The followers 12 can be formed by a micro-electro-mechanical system (MEMS) or a semiconductor manufacturing process, which is fixed on the space conversion layer 114, so that a smaller size can be obtained. , arranged in a tight and tidy nature. The insulating guiding plate 13 defines a plurality of guiding holes 131, and the guiding holes 131 pass through the insulating guiding plate 13, which is substantially considered as a vertical through, so that the corresponding probe 098135922 form number A0101 is 6 1 / 27 pages 0982061620-0 [0014] The 201115150 needle 14 is freely slidably disposed within the guide hole 丨 3 i. The insulating guide plate 丨3 can be fixed to the multi-layer module by screwing or glue-bonding 30 (refer to the figure of FIG. 3), in order to facilitate the replacement of the probe 14, the manner of fixing is The screw locker considers different embodiments of the insulating guide plate 13 from "Dubb" to "Bob 3": "Bob" shows that the insulating guide plate 13 is directly locked to the multilayer module 11 The cover plate 112, "Fig. 2", shows that the insulating guide plate 丨3 is locked from the second surface U4b to the space conversion layer Π4. The insulating guide plate 3 shown in Fig. 1-3 is integrally formed with the cover plate 112, and is directly fixed to the printed circuit board 111 of the multilayer module 11. 3 [0015] FIG. 2-1 and FIG. 3-1 are respectively different embodiments of the follower 12 of the present invention, and FIG. 2-2 and FIG. 3-2 are corresponding diagrams. Actuation during the test of 2-1" and "Figure 3-1". The follower 12 shown in the "circle 2" is substantially a cantilever structure, and includes a cantilever 122 and a base 123 for fixing the cantilever 122 to the space conversion layer 114. The cantilever 122 and the base 123 are transparent. Electromechanical systems (MEMS) or semiconductor process technology are formed and can be integrally formed or individually formed. 〇[0016] "Fig. 4-1" to "Fig. 4-4" are subtle rotations; member 12 is a different embodiment of a cantilever structure, and the cantilever 122 can directly contact the probe 14 as a free end 121 (e.g. "Fig. 4-1", "Fig. 4-2"), or a convex body 124 at the bottom end of the cantilever 122 as a free end 121, and then contact with the probe 14 (such as "Fig. 4-3", "Fig. 4-4"); In addition, "Fig. 4-1" to "Fig. 4-4" also show that the base 123 of the follower 12 can have different implementations. [0017] 098135922 Fig. 5-1" and " Figure 5-2" shows another embodiment of the follower 12. In order to provide the cantilever 122 deformation space, the overall volume is saved, so that a cavity 115 is opened in the space conversion layer 114. The follower 121 shown in Fig. 5-1 is fixed on the second surface of the space conversion layer 114 by the pedestal 123 by the form number A0101 % 7 1/^ 27 1 0982061620-0 201115150; "Fig. 5~2" The portion of the base 123 of the follower 12 in "FIG. 5-1" is omitted, so that the cantilever 122 is directly fixed to the second surface 1141 of the space conversion layer 114, and one or more metals of the second surface 114b. The contacts are electrically connected. [0018] FIGS. 3-1" show another embodiment of the follower member 12. The follower member 12 substantially forms a buckling beam structure, which can be inclined as shown in FIG. Or the wood as shown in Figure 6-1 to Figure 6_5, the structure may be substantially linear, columnar or flat, or as shown in Figure 6-5; The cross-sectional area may be a circle or a rectangle, but not limited to the above, the follower of this type may be fabricated by the above-mentioned microelectromechanical system or semi-conductor process technology, or by automatic or semi-automatic wire bonding. Manufactured in a technical manner, or by means of electric discharge machining (EMM) technology, fixing the elastic and deformable metal wires to the second surface of the space conversion layer 114, and the second surface One or more metal contacts of 114b are electrically connected. The material of the above metal wire is selected from the group consisting of gold (Au), aluminum (A1), copper (Cu), silver (Ag) and platinum (Pt); the metal wire after the wire is re-permeable to the coating A coating method is applied to coat a metal layer to increase the mechanical strength of the follower 12 as a whole. The material of the above metal layer may be selected from nickel (Ni), cobalt (Co), iron (Fe), copper (Co), gold (Au), platinum (Pt), silver (Ag) '铑 (Rh) and 钌(Ru) consists of groups. In addition, as shown in FIG. 7 , in the above embodiment, the plurality of followers 12 are close to one end of the space conversion layer 114 and can be assembled on a substrate 125 first, 098135922 Form No. A0101 Page 8 / Total 27 pages 0982061620 [0019] 201115150 is further mounted on the second surface 114b of the space conversion layer 114, so that each of the followers 12 is electrically connected to the predetermined contact of the second surface H4b, so that the elasticity at the time of the thin skirt can be increased. In one embodiment, the junction of the plurality of followers 12 and the second surface 114b is assembled by solder ball reflow. [0020] 晴 参阅 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见 见When the internal slip occurs, since the follower 12 has elasticity and deformability, the external force generated during the test can be absorbed, so that the needle tip 142 does contact the side object 20, and the needle tip 142 is prevented from being damaged by excessive force. It must be explained again that 'the height of the different pads or the unstable contact pressure when the probe 14 is in contact with the side to be side 2 可能 may cause the individual probes 14 to have different slight slips in the guide holes 131. Therefore, each of the followers 12 of the present invention can be independently deformed 'according to the amount of slip of the corresponding probe 14 to produce different amounts of deformation', which is more flexible and flexible in application. [0021] 098 098135922 - ^ Factory " No, the mother probe includes a head P141 and a needle 4142. In order to prevent the probe (4) follower η from being displaced relative to each other, the head 141 can have a large contact area. In addition, in order to achieve the probe 14, the follower 12 can be smoothly resisted, and the length of the probe is greater than the thickness of the insulating guide plate 13 for the contact of the inside of the driven space conversion layer 114 with a larger contact area (Fig. The movable member 12 is transparently connected to the multi-layer switch n, and the test signal is transmitted to the brush circuit board 111 and the test machine (not connected to the chain ' ', . Although the tip 142 of the probe 14 is in contact with the side object 2 ', the probe follower is carefully moved by the slip and is deformed by the slipping, so as to absorb the probe form number A0101, page 9 / total 27 pages 0982061620 Ό 201115150 [0024] [0024] 098135922 needle] 4 external force covered when in contact with the side object 2 。. The above-mentioned = processing formation can also be performed by a microcomputer "system or semiconductor process: as shown in FIG. 8". In another embodiment, the head 141 of the probe 14 can be designed as a money frequency or a dragon structure, such as The matching follower 12' achieves different effects of absorbing external force and displacement. . The shape structure of the follower 12 in the illustration is merely a structure for indicating the follower member = elastic deformation capability, and the insulating guide (four) 13 of the present invention which can complement the above probe can be a single layer structure, or For example, "Figure 9 i does not" is - multi-layer separable structure. Probe card test, material, probe: the tip 142 will continue to wear out with the number of uses, the length of the worn probe 14 will be shortened, but the single layer insulation The guide plate cannot be applied to the short pin = 1', and the multi-layer separable insulating guide plate 13 is used. When the shorter length is used, it is only necessary to remove the partially layered insulating I lead plate 13 (Fig. 9_2). (4)), the use of the short probe 14 is more environmentally friendly and can reduce costs. In summary, the vertical probe card of the present invention slidably moves in the insulating guide 13 by the probe 14 and absorbs the external force through the follower 12 to greatly reduce the wear of the probe and the wear of the needle tip 142; According to the present invention, each of the probes 1U1 can also be read and moved by the same amount of slipping, and the range of use can be broadened. Furthermore, with the present invention, the probe 14 is relatively simple and easy to design, manufacture, and assemble. Not only can mass production be achieved, but the service life is increased, and the probe U structure is not required to be time-consuming. In addition, since the probe 2 of the present invention is installed in:=:, according to different measurements of 0982061 (201115150 trial route or pad structure, different probes 14 are arranged correspondingly, and it is not necessary to purchase for a specific use. The probe card can increase the range of use and reduce the test cost. Since the probe 14 can be moved to the insulation guide plate 13 when the probe 14 is broken or damaged, the maintenance is relatively high. Easy, when the probe 14 is replaced, it is only necessary to replace the individual probes 14. It is not necessary to replace the entire probe card with an extra cost, and the components such as the follower 12 or the probe are manufactured by using a micro-electromechanical system or a semiconductor process technology. The efficiency and precision are improved. The probe 14 and the follower 12 can be arranged more closely, especially for the needles, high precision, high specification 〇 probe cards, which are applicable to this dream. Just the above "only, this is just a matter of rectifying the money _, not to limit the patents of the invention, _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ In the scope of the protection of the present invention, BRIEF DESCRIPTION OF THE DRAWINGS [0026] Embodiments of the present invention are described in conjunction with the drawings: 〇[_"图卜1" is a cross-sectional view of the structure of the present invention - the embodiment "图卜2" is the present invention Further, a structural section of the embodiment ^ _ "图卜3" is a structural sectional view of another embodiment of the present invention; [0030] "Fig. 2_丨" is an embodiment of the follower of the present invention. _ "Fig. 2_2 "Fig. 3-1" is an embodiment of the follower τ heart force; [0033] "Fig. 3-2" is the figure of the present invention 3 surname
」測甙時之作動狀態圖； 098135922 奸織麵 ^ ^ 1/^ 27 I 201115150 [0034] 「圖4-1」至「圖4-4」為本發明從動件為一懸臂結構之 不同實施例示意圖； [0035] 「圖5」為本發明從動件為一懸臂結構之另一實施例示意 圖； [0036] 「圖6-1」至「圖6-5」為本發明從動件為一屈曲樑結構 之不同實施例示意圖； [0037] 「圖7」為本發明之複數從動件先組裝至一基板之示意圖 t [0038] 「圖8」為本發明探針結構之一實施例； [0039] 「圖9-1」為本發明絕緣導引板之另一實施例示意圖； [0040] 「圖9-2」為「圖9-1」之絕緣導引板移除若干層之示意 圖， [0041] 「圖10」為習知探針卡之細部結構剖面圖。 【主要元件符號說明】 [0042] 10 · · •••垂直式探針卡 [0043] 11 · · • ••多層模組 [0044] 12 · · • · ·從動件 [0045] 13 · · •••絕緣導引板 [0046] 14 · · • ••探針 [0047] 20 · · [0048] 30 · · • · · m 表單編號A0101 第12頁/共27頁 098135922 0982 0 61 6之 201115150 [0049] 111 · •···印刷電路板 [0050] 112 · • · ••蓋板 [0051] 113 · •···加強件 [0052] 114 · •···空間轉換層 [0053] 114a · [0054] 114b · •···第二表面 [0055] 115 · 〇 [0056] 121 · • · · ·自由端 [0057] 122 · .···懸臂 [0058] 123 · • · ••基座 [0059] 124 · • · ••凸體 [0060] 125 · [0061] 131 · [0062] 141 · • · ••頭部 [0063] 142 · • · ••針尖 098135922 表單編號 A0101 第 13 頁/共 27 頁 0982061620-0Actuation state diagram when measuring ; 098135922 奸织面 ^ ^ 1/^ 27 I 201115150 [0034] "Figure 4-1" to "Figure 4-4" is a different implementation of the follower of the present invention as a cantilever structure [0035] FIG. 5 is a schematic view showing another embodiment of the follower member in a cantilever structure; [0036] "FIG. 6-1" to "FIG. 6-5" are the followers of the present invention. Schematic diagram of different embodiments of a flexure beam structure; [0037] FIG. 7 is a schematic diagram of the first plurality of followers assembled to a substrate in the present invention. FIG. 8 is an embodiment of the probe structure of the present invention. [0039] FIG. 9-1 is a schematic view of another embodiment of the insulating guide plate of the present invention; [0040] FIG. 9-2 is an insulating guide plate of FIG. 9-1 with several layers removed. Schematic, FIG. 10 is a cross-sectional view showing a detailed structure of a conventional probe card. [Main component symbol description] [0042] 10 · · •••Vertical probe card [0043] 11 · · • ••Multilayer module [0044] 12 · · • · · Follower [0045] 13 · · •••Insulation Guide Plate [0046] 14 · · • • Probe [0047] 20 · · [0048] 30 · · • · · m Form No. A0101 Page 12 of 27 098135922 0982 0 61 6 201115150 [0049] 111 · •···Printed circuit board [0050] 112 · • · •• Cover [0051] 113 ·•···Reinforcement [0052] 114 · •···Space conversion layer [0053] 114a · [0054] 114b · •···Second surface [0055] 115 · 〇[0056] 121 · • · · · Free end [0057] 122 · .··· Cantilever [0058] 123 · • · •• Base [0059] 124 · • • • • Protrusion [0060] 125 · [0061] 131 · [0062] 141 · • • • • Head [0063] 142 · • • • • Tip 098135922 Form No. A0101 13 Page / Total 27 pages 0982061620-0