TW536929B - Electronic device and its producing method - Google Patents

Abstract

The present invention provides a method of efficiently manufacturing highly reliable electronic components, which does not require complicated manufacturing process or manufacturing machines and does not generate solder burrs or solder dragging by suppressing solder cutting in dividing a collective substrate. Solder paste is applied on electrodes for component mounting and on perimeters of through holes and/or regions containing respectively a part of a through hole so as not to substantially fill the through holes formed in a collective substrate. Consequently, the amount of the solder paste inside the through holes is reduced, and highly reliable electronic components free from solder burrs and solder dragging caused by cutting solder in cutting the collective substrate are obtained. After shield cases are loaded on the collective substrate for assembly, the collective substrate on which shield cases are loaded is subjected to reflow soldering.

Description

536929 A7 V. Description of the Invention (I) [Technical Field] The present invention relates to an electronic component and a manufacturing method thereof. In detail, the present invention relates to an electronic component having a structure for accommodating a surface-mounted component mounted on a substrate in a shielding box and Its manufacturing method. [Conventional Technology] As shown in FIG. 16, a method for manufacturing an electronic component 60 having a structure in which a surface-mounted component 64 is housed in a shielding box 65 is disclosed in, for example, Japanese Patent Application Laid-Open No. 10-13078. With this method, the electronic component 60 is manufactured in the order described below. (1) First, as shown in Fig. II, a through-hole 62 is formed in a collective substrate 61 provided with a plurality of component-mounting substrates 51, and a shield case mounting electrode 63 is formed on a side surface of the through-hole 62. (2) Then, the surface-mounted element 64 is mounted on the collective substrate 61, and the surface-mounted element 64 is soldered to a bonding electrode (not shown) of the collective substrate 61. (3) Next, a paste 67 is filled in the through hole 62. (4) Then, the claw portions (engaging portions) 66 of the plurality of shielding boxes 65 are inserted into the through holes 62 filled with the paste 67. '(5) Next, the solder in the paste 67 is melted, and the plurality of masking boxes 65 {is dried on the collection substrate 61. In addition, the claw portion (engagement portion is welded to the shielding box mounting electrode 63 (FIG. 17) in the through hole 62), so that the shielding box M is connected and fixed to the collective substrate 61. (6) · Thereafter, Cut the collective substrate 61 along the A ~ a line with a cutter, etc. __ 3 This paper size is applicable to the country (CNS) A4 specification (21Q x 297 male f ---------- ----- ------------ (Please read the notes on the back before filling in this page) Xuan: .line 536929 A7 ____ §1-~ ^ 5. The description of the invention (y) is broken and you get Figure 16 Each of the electronic components shown is 60 °. [Problems to be Solved by the Invention] However, since a conventional method is used, in the above step (3), a paste 67 is filled in the through-hole 62 formed on the collective substrate 61. Then, in step (4), the shielding box 65 is mounted on the collective substrate 61. The claw portion 66 is inserted into the through hole 62 filled with the paste 67, and in the step (5), the container is filled with The paste 67 in the through hole 62 is melted, and the shielding box 65 is soldered to the shielding box mounting electrode 63 of the collective substrate 61. There is a deviation in the amount of solder in the through hole. In the above step (6), when the collection is cut and divided Solder fluff occurs on the substrate The object of the present invention is to provide a solution that does not require complicated manufacturing processes and manufacturing equipment. When the assembly substrate is cut or divided, cutting the solder can prevent the occurrence of solder burrs and solder. A method for manufacturing an electronic component having a problem such as dragging, and a high-reliability electronic component manufactured by this manufacturing method. In order to achieve the above object, the method for manufacturing an electronic component according to the present invention (the present invention 1) has a surface to be mounted on a substrate. Structure for mounting components housed in a shielding box: The manufacturing method of electronic components is characterized by the following steps: (a) a collective substrate that can be divided into a plurality of electronic components (the collective substrate has a plurality of engaging holes, An electrode for fixing the box is formed on the inner peripheral surface of the engaging hole. The engaging hole of the shielding box is inserted and electrically and mechanically connected and fixed to the engaging hole. The component is electrically and mechanically mounted on the surface of the assembly substrate. Connect and fix the component mounting electrodes, apply paste, and apply the Chinese National Standard (CNS) A4 specification (2 10 X 297 public love) -------------------- Order --------- line (Please read the precautions on the back before filling this page ) 536929 A7 _____B7__ 5. The description of the invention (^) does not include the method of filling the hole, the step of applying paste on the area around the hole and / or a part of the hole; (b) the surface-mounted component Steps for mounting on a collective substrate; (The welding of the collective substrate on which the surface-mounted components are mounted causes the surface-mounted components to be soldered to the component-mounting electrodes and to the surface of the box-fixing electrode in the engaging hole. A step of forming a plated pre-soldering film; (d) a step of installing the shielding box on the collective substrate by inserting the engaging portion of the shielding box into the engaging hole of the collective substrate; (0 by The step of welding the collective substrate with the shielding box installed again, and welding the engaging part of the shielding box with the electrode for fixing the box in the engaging hole with the pre-weld film in the engaging hole; and (f) welding the shielding box The step of cutting the collective substrate and dividing it into individual electronic components. Since the component mounting electrodes on the collective substrate and the area around the engaging holes and / or part of the engaging holes where the box fixing electrodes are formed on the inner peripheral surface, the engaging holes are not substantially filled. The method is to apply paste and fusion welding to solder surface-mounted components to the electrode for component mounting, and at the same time, form a plated pre-soldering film on the surface of the box-fixing electrode in the engaging hole, and then engage the shielding box. In the state where the part is inserted into the engaging hole, the collective substrate is welded again, and the engaging part of the shielding box and the electrode for fixing the box in the engaging hole are welded, and then the collective substrate is cut and divided into electronic components. When cutting or dividing the collective substrate, it is possible to suppress the cutting of the solder, avoid the occurrence of defects such as solder burrs and solder drag, and to efficiently manufacture highly reliable electronic components. 5 This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling out this page) «--line · 536929 A7 ____________ B7___ 5. Description of the invention (^ ~ ^ ^ That is, according to the manufacturing method of the electronic component of the present invention, since the paste is applied only to the component mounting electrode and the area around the engaging hole and / or a part of the engaging hole, the paste is substantially formed. It is not filled into the engagement hole, because =, in the step of cutting and dividing the collective substrate, it is possible to suppress and prevent the solder in the engagement hole from being cut, prevent solder burrs and solder dragging, and obtain high reliability. There is also a method for manufacturing an electronic component according to the present invention. Since the main steps of the electronic component manufacturing process are processed in the state of a collective substrate, the production efficiency is high, and because the shielding box is mounted on the The work on the collective substrate can be performed with general equipment such as a solder printing machine (coater), component mounting machine (mounting machine), and welding furnace. Special machines for mask box assembly are not required, which can improve productivity. In addition, according to the manufacturing method of the electronic component of the present invention, in the step of remelting and welding the collective substrate assembled with the shielding box, the solder is concentrated on the engaging portion and the card of the shielding box due to capillary phenomenon. The soldering portion of the fixing electrode in the joint hole can prevent the solder from staying in the area where the jig for cutting the collective substrate passes through the engagement hole. Even from this point, the occurrence of solder burrs can be reliably prevented. Occurrence of solder dragging. Also, since a solder printing machine for surface-mount component mounting can be used to simultaneously perform solder printing for shielding box fixing, the amount of solder can be stabilized and the consumption of solder can be reduced. In addition, In the present invention, the so-called paste is applied to the area around the engagement hole and / or a part of the engagement hole, which means that the area around the engagement hole in plan view, and the Part of the overlapping area 6 ----------------- ίPlease read the notes on the back before filling in this page) Order · -line · 夂 Paper size applies to Chinese national standards (C NS) A4 specification (210 x 297 mm) 536929 A7 V. Description of invention (S) Domain printing paste and coating paste. -------------- Packing—— (Please read the precautions on the back before filling out this page) Someone also applies paste to the electrode for component mounting, and the so-called package S is The paste is applied around the engagement hole and / or a part of the engagement hole in such a manner that it is not substantially filled in the engagement hole. This means that the paste is included on the component mounting electrode and around the engagement hole. And / or when a paste is applied to an area f of a part of the engagement hole at the same time; and when the paste is applied to the electrode for mounting a component, the paste is applied to an area including the periphery of the engagement hole and / or a part of the engagement hole Missing in both cases. In addition, when the paste is applied to the electrode for mounting the component, and the paste is applied to a region including the periphery of the engagement hole and / or a part of the engagement hole, various methods can be used as the method of applying the paste, for example, You can add paste to the former by screen printing, and apply paste to the latter with a dispenser. The method for manufacturing an electronic component carrying the present invention (the second aspect of the patent application) is a method for manufacturing an electronic component having a structure in which a surface-mounted component mounted on a substrate is housed in a shielding case, and is characterized in that Steps: (a) On a collective substrate that can be divided into a plurality of electronic components (the collective substrate is provided with a plurality of engaging holes, a box fixing is formed on the inner peripheral surface of the engaging holes: the electrodes are used to shield the engagement of the box The component is inserted and electrically and mechanically connected and fixed to the engaging hole), and the step of applying paste to the component mounting electrode for electrical and mechanical connection and fixing on the surface of the assembly substrate is applied; (b) surface mounting Steps for mounting the component on the collective substrate; (c) Step 7 of applying paste to the area of the collective substrate including the periphery of the engaging hole and / or a part of the engaging hole in a manner that does not substantially fill the engaging hole. Paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) '536929 A7 ____B7__ V. Description of invention (b)

J (d) a step of welding a surface-mount component to an electrode for component mounting by fusing the collective substrate and forming a plated pre-soldering film on the surface of the electrode for fixing the box in the engaging hole; e) the step of installing the shielding box on the collective substrate by inserting the engaging 邰 of the shielding box into the engaging hole; (f) re-welding the collective substrate with the shielding box mounted thereon to engage A step of soldering the engaging portion of the shielding box and the electrode for fixing the box in the engaging hole by a pre-soldering film in the hole; and (g) cutting the assembly substrate to which the shielding box is soldered and dividing it into individual electronic components. After the surface-mount component is mounted on the collective substrate to which the paste is applied on the component-mounting electrode, the area of the collective substrate including the periphery of the engagement hole and / or a part of the engagement hole is substantially reduced in the engagement hole. The paste for fixing the shielding box is applied in a filled manner, and then, when the collective substrate is welded, the same as the method of manufacturing the electronic component of the invention 1 described above, it is possible to efficiently manufacture a highly reliable electronic component. . In addition, according to the method of the present invention 2, since a solder dispenser is used, a step of applying solder to the area around the engaging hole and an area covering a part of the engaging hole is additionally provided. Although the steps are increased, the step of inserting the coating step The degree of freedom becomes higher. In addition, 'the type of paste can be easily changed considering the characteristics of electronic components, etc.' The amount of use, the amount of flux, etc. can also improve the characteristics of the components and the reliability of the connection of the shielding case. 8 Paper Size—China iii ^ s) A4 Regulation 1Q χ Tear- • ---------------- (Please read the notes on the back before filling this page) · 536929 A7 ^ _ B7 V. Description of the invention (7) There is also a method for manufacturing an electronic component of the present invention (item 3 of the scope of patent application) is the manufacture of an electronic component having a structure in which a surface-mounted component mounted on a substrate is housed in a shielding box. The method is characterized by having the following steps: (a) forming a box fixing electrode on an inner peripheral surface of the mounting substrate on a collective substrate that can be divided into a plurality of electronic components (the collective substrate has a plurality of engaging holes) A step of inserting the engaging portion of the shielding box and electrically and mechanically connecting and fixing it to the engaging hole), and applying a paste on the component mounting electrode for electrically and mechanically connecting and fixing the component mounting surface on the surface of the collective substrate ; (B) a step of applying a paste on the area of the collective substrate including the area around the engaging hole and / or a part of the engaging hole in a manner that does not substantially fill the engaging hole (0, the surface-mounted component is mounted on the collective substrate The above steps; (d) wrongly welding the collective substrate The step of soldering the surface-mounted component to the component mounting electrode and forming a plated pre-soldering film on the surface of the box fixing electrode in the engaging hole; (e) by engaging the shielding box Step of inserting the shielding box on the collective substrate by inserting the part into the engaging hole; (f) re-welding the collective substrate on which the shielding box is mounted, and engaging the display box with the inside of the bayonet hole And (g) cutting the assembly substrate of the soldered shielded box and dividing it into individual electronic components. A paste is applied to the electrode for mounting the component. (Please read the notes on the back before filling in this page.)

9 536929 A7 _B7___ V. Description of the invention (f) After applying paste on the area around the engaging hole and / or part of the engaging hole so that the filling hole is not substantially filled, the surface mount component is mounted, and When the collective substrate is welded, the same as the case of the method for manufacturing an electronic component of the invention 1 or 2 described above, it is possible to efficiently manufacture a highly reliable electronic component. Furthermore, in the method for manufacturing an electronic component according to the fourth aspect of the present invention, the flux is applied and / or added to an area including the surface of the pre-solder film before the collective substrate assembled with the shielding box is re-soldered. Apply solder. After the shielding box is assembled on the collective substrate, at least one of the application of the flux and the additional application of the solder is performed on the area including the surface of the pre-solder film, thereby improving the solder wettability, Insufficient amounts of solder (paste) are supplemented, and even if another step must be inserted between the component mounting step of the collective substrate and the shielding box mounting step, a reduction in solderability can be avoided. In the method for manufacturing an electronic component according to the fifth aspect of the present invention, in the step of applying a paste to the area including the periphery of the engaging hole and / or a part of the engaging hole, the component mounting surface is mounted from the surface of the collective substrate. A paste is supplied to a region including the periphery of the engaging hole and / or a part of the engaging hole on the back side. Since the paste is supplied from the rear side of the mounting surface of the assembly substrate to the area including the periphery of the engagement hole and / or a part of the engagement hole, there is no interference with previously mounted surface-mounted components. The paste is supplied to the area so that the present invention can be more effective. There is also a method of manufacturing the electronic component of the present invention 6, which uses: 0) Bending or bending the engaging portion of the shielding box; i Paper rule National Standard (CNS) A4 specification (21〇χ 297 public love) ---- ---------------- (Please read the notes on the back before filling this page) · 丨 line · 536929 A7 __B7___ V. Description of the invention (?) (B) in The engaging portion of the shielding box is provided with a protruding portion contacting the electrode for fixing the box in the engaging hole; at least one of the methods, the engaging portion of the shielding box and the inner peripheral surface of the engaging hole are elastically pressed. Abut. At least one of (a) bending or bending the engaging portion of the shielding box, and (b) providing a protruding portion on the engaging portion of the shielding box that is in contact with the electrode for fixing the box in the engaging hole. Due to the elastic pressure generated by the elasticity, the engaging portion of the shielding box can be brought into contact with the electrode for fixing the box in the engaging hole. In this state, fusion welding can be performed, and more reliable welding can be performed. For example, The front end of the zigzag portion of the engaging portion and the protrusion with a dowel shape abut on the inner peripheral surface of the engaging hole. Since the molten solder is easily concentrated on the abutting portion, the shielding box can be soldered with a small amount of solder. On the substrate, the present invention can be made more effective. In addition, the so-called abutment of the engagement portion of the shielding box on the inner peripheral surface of the engagement hole by the elastic pressure generated by elasticity means that the engagement portion is formed on the inner peripheral surface of the engagement hole by the elastic pressure generated by elasticity. The idea that the fixed electrodes of the box are in contact with each other, and "in the case where a paste or a pre-soldering film is applied to the inner peripheral surface of the engaging hole" means that the inner periphery of the engaging portion and the engaging hole are passed through these. The thought that the face (the box fixed electrode) abuts. Furthermore, the manufacturing method of the electronic component of the present invention 7 uses: (a) bending or bending the engaging portion of the shielding box; (b) providing a protruding portion on the engaging portion of the shielding box; at least one of In the method, the engaging portion of the shielding box is brought into close contact with the inner peripheral surface of the engaging hole. 11 Wood paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) ----------------- (Please read the precautions on the back before filling this page) Order · 丨 Line 536929 A7 B7 " _Law mlm ___ '.............. I 丨 V. Description of the Invention (γ) Since (a) the card of the shielding box is used The engaging portion is bent or bent, and (b) at least one of the methods of providing a protruding portion on the engaging portion of the shielding box makes it possible for the engaging portion of the shielding box to approach the inner peripheral surface (electrode for box fixing) of the engaging hole. In this state, welding is performed, for example, the front end of the zigzag portion of the engaging portion and the protrusion with a dowel shape are partially close to the inner peripheral surface of the engaging hole, and the shielding box can be soldered to the substrate with a small amount of solder. Can make the present invention more effective. That is, as in the case of the present invention 6, the engagement portion of the shielding box is brought into abutment with the inner peripheral surface of the engaging hole by the elastic pressure generated by the elasticity. Of course, the shielding box can be reliably welded to the housing with a small amount of solder. On the substrate, when the engaging portion of the shielding box is brought close to the inner peripheral surface of the engaging hole (electrode for box fixing) as in the invention 7, the shielding box can be reliably soldered to the substrate with a small amount of solder. In addition, the electronic component of the present invention (item 8 in the scope of application for patent) has the following characteristics: ~ The surface mounting component is soldered to the component mounting electrode on the substrate, and the shielding box engaging portion that houses the surface mounting component A small amount of solder that does not fill the engagement recess is soldered to the box fixing electrode formed on the inner peripheral surface of the engagement portion formed on the side surface of the substrate. 7 In the electronic component of the present invention (item 8 in the scope of patent application), since the oxygen incubation surface-mounting component is soldered to the component mounting electrode on the substrate, I, the engaging portion of the shielding box is engaged with non-fullness. A small amount of solder in the concave part, which is connected to the inner surface of the engaging recess formed on the side surface of the substrate. There are seven structures for fixing the box. Therefore, no solder burrs and solder dragging occur. Please fill out this page again} Ten packs -------- Order --------- Margin- ¥ Paper size is applicable to Chinese country ^ (CNS) A4 size (210 X 297 mm) ^ 536929 A7 ____ B7____ 5. Description of invention (M) (Please read the notes on the back before filling out this page) In addition, the electronic components of the present invention (item 8 in the scope of patent application) can be any of the present invention 1 ~ 5 The aforementioned method is efficiently produced. In the electronic component of the present invention 9, (a) the engaging portion of the shielding box is bent or bent, and / or (b) is disposed on the engaging portion of the shielding box. And a protruding portion formed on the side surface of the substrate The electrode for fixing the box on the inner peripheral surface of the engaging recess is configured to be in contact. The electronic component of the present invention 9 has an engaging portion of the shielding box that is bent or bent, and / or a protruding portion is provided on the engaging portion of the shielding box. In addition, the zigzag or curved portion or the protruding portion is in contact with the box fixing electrode formed on the inner peripheral surface of the engaging recessed portion formed on the side of the substrate. The engaging portion of the shielding box is formed by elasticity. Welding is performed in a state where the spring is in contact with the electrode for fixing the box in the engaging hole. Therefore, the engaging part of the shielding box is reliably welded to the electrode for fixing the box in the engaging hole with a small amount of solder. An electronic component having high reliability is mounted on a substrate of the shielding box. In the electronic component of the invention 10, (a) the engaging portion of the shielding box is bent or bent, and / or (b) the card is in the shielding box. The engaging portion is provided with a protruding portion, and the aforementioned meandering or bending portion or the protruding portion is brought into close contact with the box fixing electrode formed on the inner peripheral surface of the engaging recessed portion formed on the side surface of the substrate. The electronic component of the invention 10 has a shielding case. Snap-in Fold or bend, and / or provide protrusions on the engaging portions of the shielding box, and make the bent or curved portions or the protrusions formed with the box fixing electrode formed on the inner peripheral surface of the engaging recess on the substrate side. Proximity structure, under this state, 13 paper sizes are applicable to Chinese National Standard (CNS) A4 (210 X 297 mm) 536929 A7 ____B7 V. Description of the invention (β) Welding, the engaging part of the shielding box requires a small amount The solder can be reliably soldered to the electrode for fixing the box in the engaging hole, and can provide a highly reliable electronic component mounted on the substrate of the shielding box. In addition, the electronic component of the present invention (applicable patent scopes 9 and 10) can be provided. Efficient production by the method of patent application No. 6 or 7. [Brief description of the drawings] Fig. 1 is a diagram showing one step of a method for manufacturing an electronic component according to an embodiment (embodiment 丨) of the present invention. Fig. 2 is a diagram showing another step of the method for manufacturing an electronic component according to an embodiment (Embodiment 1) of the present invention. Fig. 3 is a diagram showing another step of the method for manufacturing an electronic component according to an embodiment (Embodiment 1) of the present invention. Fig. 4 is a diagram showing another step of the method of manufacturing an electronic component according to an embodiment (Embodiment 1) of the present invention. Fig. 5 is a diagram showing another step of the method for manufacturing an electronic component according to an embodiment (Embodiment 1) of the present invention. Fig. 6 is a diagram showing another step of the method for manufacturing an electronic component according to an embodiment (Embodiment 1) of the present invention. FIG. 7 (a) is a diagram showing an electronic component manufactured by the method for manufacturing an electronic component according to an embodiment (Embodiment 1) of the present invention, and (b) and (c) are masks showing a modification (Modification 1). Construction diagram of the box. FIG. 8 (a) shows a state where the zigzag-shaped engaging portion of the modified example (Modification 1) of the embodiment of the present invention is inserted into the engaging hole of the collective substrate. CNS) A4 specification (210 X 297 mm) ----------------- (Please read the precautions on the back before filling this page) .--Line 536929 A7 _____B7__ V. DESCRIPTION OF THE INVENTION (A) '(b) is a diagram showing a state where a dowel-shaped engaging portion of Modified Example 1 is inserted into an engaging hole of a collective substrate. 9 is a structural view showing an engaging portion of a shielding box according to another modification (Modification 2) of Embodiment 1 of the present invention, (a) is a plan view, (b) is a side view, (c) is a bottom view, (D) is a sectional view along line AA in FIG. 9 (a). FIG. 10 is a view showing another structure of a shielding box engaging portion according to Modification 2 of Embodiment 1 of the present invention, in which (a) is a plan view, (b) is a side view, (c) is a bottom view, and (d) is an edge view. Fig. 9 (a) is a cross-sectional view taken along the line B-B. FIG. 11 (a) is a view showing a state in which an engaging portion formed with a raised portion according to Modification 2 of the present invention is inserted into an engaging hole of a collective substrate, and shows a state in which a ridgeline portion F is formed in a long direction. A state diagram of the engaging portion inserted into the engaging hole of the collective substrate. Fig. 12 is a flowchart showing a method of manufacturing an electronic component according to an embodiment (embodiment 丨) of the present invention. Fig. 13 is a flowchart showing a method of manufacturing an electronic device according to another embodiment (Embodiment 2) of the present invention. Fig. 14 is a flowchart showing a method of manufacturing an electronic component according to another embodiment (Embodiment 3) of the present invention. Fig. 15 is a flowchart showing a method for manufacturing an electronic element according to another embodiment (Embodiment 4) of the present invention. FIG. 16 is a perspective view showing a conventional electronic component. FIG. 17 is a view showing a conventional method of manufacturing an electronic component. [Symbol description] _ 15 This paper size is applicable to China National Standard (CNS) A4 specification (21〇x 297 mm) I (Please read the precautions on the back before filling this page): Install i]. '线 536929 A7 _______ __B7_____

V. Description of the invention (, .〇J 1 a set of substrates, 2—engagement holes, 4—surface mount components, 4a ~ external electrodes of surface mount components, 5—shield boxes, 5a, 5b—openings, 6 1 card Joint, 7 — paste, 7a — solder, 10, 10a — electronic component, u — substrate, 12 — component mounting electrode, 13 — box fixing electrode, 17 — pre-solder film, D — protrusion, E —Bulge, F—Edgeline. [Embodiment] The following describes the embodiment of the present invention, and its features will be described in more detail. (Embodiment 1) Refer to FIG. 1 to FIG. 7 and FIG. The flowchart shown below explains a method for manufacturing an electronic component according to an embodiment of the present invention (in the first embodiment, for example, a high-frequency electronic component such as a VCO for a communication device). T (1) First, as shown in FIG. An engaging hole 2 (step 1 (FIG. 12)) into which the engaging portion (FIG. 5) of the shielding box 5 is inserted is formed in the collective substrate 1 (2) Then, on one side of the collective substrate 1 (in this embodiment) The upper part of the middle system) forms a wiring pattern (not shown in the figure) and an element mounting electrode 12 constituting a part of the wiring pattern. At this time, the box fixing electrode 13 (Fig. 1) is formed from the inner peripheral surface of the engaging hole 2 to the peripheral portion of the engaging hole 2 on the upper and lower sides of the assembly substrate 1 (step 2 (Fig. 12)). The electrode 12 is a bonding electrode that connects and fixes the external electrode 4 a of the surface-mounted component 4, and the box fixing electrode 13 is inserted and i dry-connected to the engaging portion 6 of the cover 5 to constitute the cover 5 electrical and mechanical 16 This paper size applies to China National Standard (CNS) A4 specification (210 x 297 mm) I ------------------ (Please read the precautions on the back before filling this page ) Order · ·-wire · A7 536929 V. Description of the invention () The electrodes that are connected and fixed in the first embodiment constitute the function of the ground electrode. (3) Next, the component mounting electrode I2 is used to The engaging portion 0 of the shielding box 5 is inserted, electrically, mechanically connected, the peripheral area of the fixed engaging hole, and covers the engaging hole. 2-Part of the area, the card is substantially filled with screen printing method without substantially filling the card The paste is applied in the state of the hole 2 (Fig. 2) (step 3 (Fig. 12)). In addition, in the first embodiment, the paste is printed by the screen printing method. 7. It is also possible to apply the paste by applying the paste with a coating device or supplying the paste with a dispenser, and there is no particular limitation on the method of applying the paste. There is also a 'peripheral area of the engaging hole 2 of the collective substrate 1 When the paste 7 is applied to a part of the area covering the engaging hole 2, the peripheral area of the engaging hole 2 and / or the part including the engaging hole 2 can be used from the back side of the mounting surface of the surface mounting element 4. (4) Then, as shown in FIG. 3, the external electrodes 4a and the paste 7 are fully brought into contact with each other, and a plurality of surface-mounting elements 4 are mounted on an automatic mounting machine and applied to the The element 7 is placed on the paste 7 on the electrode 12 for loading (step 4 (FIG. 12)). In addition, the surface mounting element 4 can usually be mounted using an automatic mounting machine. (5) Then, put the collective substrate on which the surface-mounted components 4 are mounted, and put it in a 2 welding furnace, melt the solder 7a in the paste 7, and cool it, and then solder the external electrodes 4a of the surface clothing 4 On the element mounting electrode 12 (step in the drawing) (FIG. 12)). Temple, supplying the solder in the paste 7 surrounding the engaging hole 2 and the paste 7 covering the opening 2-the divided area to form a plated pre-soldering film on the surface of the engaging hole 2 _ box fixing electrode 13 17. National standard of this paper size-(Please read the precautions on the back before filling this page) Installation reference 536929 A7 _______B7__ V. Description of the invention (ιΛ) (6) Then 'as shown in Figure 5, it will be shaded from multiple The claw-shaped engaging portion 6 protruding downward from the side of the side of the box 5 is inserted into the engaging hole 2 of the collective substrate 1 and the surface-mounted component 4 is mounted on the collective substrate 1 in a state of being accommodated therein (step 6 (Fig. 12)). In addition, the length of the claw-shaped engaging portion 6 is from the surface on which the shielding case 5 on the collective substrate 1 is mounted, passes through the engaging hole 2 but does not protrude from the back side. (7) Then "put the collective substrate 1 on which the shielding box 5 is mounted into a fusion furnace, melt the solder 7a in the paste 7, and cool it, and solder the engaging portion 6 of the shielding box 5 to the collective substrate 1 The electrode 13 for box fixing in the engaging hole 2 (FIG. 6) (step 7 (FIG. 12)). In the step of remelting the collective substrate 1 on which the shielding box 5 is mounted, 'the solder 7a is concentrated on the welding portion 6 of the shielding box 5 and the welding portion of the box fixing electrode 13 due to the capillary phenomenon due to the capillary phenomenon, which can more reliably suppress The solder 7 a is stored in an area in the engaging hole 2 through which the jig for cutting the collective substrate 1 passes. (8) Thereafter, the assembly substrate 1 on which the plurality of surface-mounting elements 4 and the shielding box 5 are mounted and soldered is cut and divided according to the area in which each shielding box 5 is mounted, as shown in FIG. 7 (a). In this way, each electronic component 10 having a structure in which the surface-mounted component 4 is mounted on the substrate n and is housed in the shielding case 5 (step 8 (FIG. 12)). As described above, since the solder 7a is concentrated on the soldering portion of the engaging portion 6 of the shielding box 5 and the box fixing electrode 13 due to the capillary phenomenon, it is possible to prevent the solder 7a from remaining on the cutting line when the collective substrate 1 is cut. In the case of cutting the collective substrate, it can prevent the occurrence of solder burrs and 18 due to solder dragging. This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm). (Please read the notes on the back and fill in this page again.) Assembling and wiring 536929 A7 _ B7___ V. The occurrence of the defect of the invention description (θ) can efficiently manufacture high-reliability electronic components. In addition, in the first embodiment, since the paste for mounting the surface-mounted components and the paste for fixing the shielding box are applied at the same time, the number of steps can be reduced. Further, since the paste is applied by the screen printing method, Since the amount of solder used can be accurately managed, and the amount of solder used can be reduced, the weight of the product can be reduced. Furthermore, users of electronic components can reduce the occurrence of solder balls during mounting. (Modification 1) In the first embodiment described above, as shown in FIG. 7 (a), the case where the shielding box 5 is provided with the claw-shaped engaging portion 6 protruding from the side to the bottom is described as an example. As shown in FIG. 7 (b), the engaging portion 6 has a claw-like shape (bent shape), or as shown in FIG. 7 (c), the engaging portion 6 has a shape of a protrusion D (The tenon has a tenon shape.) When the engaging portion 6 of the shielding box 5 is inserted into the engaging hole, as shown schematically in Figs. 8 (a) '(b), it can also have elasticity due to elasticity. The zigzag portion of the engaging portion 6 and the protrusion D having the dowel-shaped portion are configured to abut the inner peripheral surface (the pre-soldering film 17 and the like) of the engaging hole 2. When the engaging portion 6 is formed into a zigzag shape (Fig. 7 (b)) or a dowel shape (Fig. 7 (c)), as shown in Figs. 8 (a) and (b), "When the engaging portion 6 When the zigzag portion or the protrusion D with a dowel-shaped portion abuts on the inner peripheral surface of the engaging hole 2 (pre-soldering film 17 and the like), the molten solder is likely to accumulate at the abutment 19 _ This paper size applies China National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling out this page) Binding--Line 536929 A7 __ _ B7 _ V. The description of the invention () can be used in a small amount The amount of solder soldering the shielding box to the substrate can make the present invention more effective. (Modification 2) In the above modification 1, although the engaging portion 6 is formed into a zigzag shape as shown in FIG. 7 (b) or a dowel shape as shown in FIG. 7 (c), the engaging portion 6 The zigzag portion and the protrusion D with the dowel-shaped portion are in abutment with the inner peripheral surface of the engaging hole. However, as shown in FIG. A raised portion E is provided in the central portion, or as shown in FIG. 10, the main portion including the front end side of the engaging portion 6 is formed into a curved shape such that a ridge portion F is formed in the longitudinal direction, and the engaging portion 6 of the shielding box 5 is shielded. When inserted into the engagement hole, as shown in the modes (a) and (b) of FIG. 11, the bulged portion E and the ridge line portion F of the engagement portion 6 may approach the inner peripheral surface of the engagement hole 2 (preliminarily). The solder film 17 and the like are configured. · The ridge portion E (FIG. 9) or the ridge portion F (FIG. 10) is formed in the engaging portion 6 to bend it, and the ridge portion F of the ridge portion E of the engagement portion 6 approaches the card. In the case of the inner peripheral surface of the joint hole 2 (pre-soldering film 17 and the like), as in the case of the above-mentioned modification 1, since the molten solder is easily concentrated on the proximal portion, the shielding box can be soldered to the substrate with a small amount of solder. This enables the present invention to be made more effective. In addition, as shown in FIG. 9, when a raised portion E is provided at a slightly central portion except for a part of the front end of the engaging portion 6, a region from the front end of the engaging portion 6 to the raised portion E is tapered. When inserting the engaging part 6 of the shielding box 5 into the engaging hole 2, the side of the engaging hole 2 and the top 20 of the engaging part 6 are in accordance with the Chinese national standard (CNS) A4 specification (210 X 297 male). (Li) -------------- Installation-(Please read the precautions on the back before filling this page) Order--line 536929 A7 __ B7_____ V. Clearance at the end of the description of the invention ("1") Larger, it is easier to insert, and it is possible to prevent the insertion error caused by the engaging portion 6. In addition, the engaging portion 6 is formed into a zigzag shape (Fig. 7 (b)) or a dowel shape as in the above-mentioned modification 1. In the case of FIG. 7 (c), the zigzag portion of the engaging portion 6 or the protrusion D having a dowel shape can be brought into close contact with the inner peripheral surface of the engaging portion 2 (the pre-soldering film 17 and the like) without abutting. In this case, the same effect as in the above-mentioned modification 2 can be obtained in such a case. Also, as in the above-mentioned modification 2, the front end of the engaging portion 6 When the shape of the bulged portion E is provided at an extra substantially central portion (FIG. 9), and the main portion including the front end side of the engaging portion 6 is formed into a curved shape such as a ridge portion F in the longitudinal direction (FIG. 10), Not only can the raised portion E or the ridge line portion F of the engaging portion 6 be brought into close contact with the inner peripheral surface (pre-soldering film 17 and the like) of the engaging hole 2, but also the inner peripheral surface (pre-welding) of the engaging hole 2 can be partially made. (Film 17 etc.) are configured to be in contact with each other. In that case, the same effects as those of the first modification can be obtained. (Embodiment 2) FIG. 13 shows a method for manufacturing an electronic component according to Embodiment 2 of the present invention. In the first embodiment described above, in the paste supply step of step 3 (FIG. 12), the screen printing method is used to cover and engage the area around the engagement hole 2 on the component mounting electrode 12 and the engagement hole 2. A paste 7 for surface-mount component mounting and shielding box fixing is simultaneously applied to a part of the area of the hole 2. In the second embodiment, 'the step 3 of FIG. 13 is applied to the surface of the component mounting electrode 21 sheets of paper Standards apply to China National Standard (CNS) A4 (210 X 297 mm) ( Notes on the back read and then fill this page)

536929 A7 _______B7___ V. Description of the Invention (^) After installing the paste for component mounting, at any stage of Figure 13 (a) or (b), use a solder dispenser to cover the area around the hole and the hole. A part of the area is supplied with a paste for fixing the box. In addition, the other steps of the method for manufacturing an electronic component according to the second embodiment are based on the case of the first embodiment, and the description is omitted here to avoid repetition. As in Embodiment 2, after applying the surface-mounting component mounting paste to the component-mounting electrode in step 3, (1) step 3 of FIG. 13 (a) applying the paste to the component-mounting electrode and At any stage between step 4 of mounting the surface mount component and (2) step 4 of mounting the surface mount component of FIG. 13 (b) and step 5 of welding the surface mount component by fusion welding The solder dispenser is used to supply paste on the area around the engaging hole and the area covering a part of the engaging hole. As in the case of the first embodiment described above, when cutting the collective substrate, solder burrs or solder dragging can be prevented. , And local efficient manufacturing of reliable electronic components.

In addition, according to the second embodiment, since the step of applying solder to the area around the engagement hole and the area covering the engagement hole to a part with the solder dispenser is additionally provided, the number of steps is increased, but the step of inserting the coating step is added. The degree of freedom has increased. V In addition, considering the characteristics of electronic components, the type and amount of paste, and the amount of flux can be easily changed, and the characteristics of the product and the reliability of the connection of the shielding box can be improved depending on the situation. (Embodiment 3) 22 This paper size applies the Chinese National Standard (CNS) A4 specification (210 X love) shoulder ~ ------------ 1 1 --- (Please read the note on the back first (Please fill in this page again for the items.) Order · —line · 536929 A7 ^ ____ B7 ______— 15. Explanation of the invention (y) FIG. 14 is a flowchart showing the manufacturing process of the manufacturing method of the electronic component according to the third embodiment of the present invention. In the third embodiment, in step 3 (FIG. 14), the paste is supplied from the back side of the surface mounting component mounting surface of the assembly board component mounting surface to the periphery of the engagement hole and a region including a part of the engagement hole. In step 4, a paste is applied to the electrode for component mounting by a screen printing method or a solder dispenser. In addition, the other steps of the method for manufacturing an electronic component according to the third embodiment are the same as those in the first embodiment, and the description is omitted here to avoid repetition. In the case of the method according to the third embodiment, the engaging portion of the shielding box can be reliably welded to the ground electrode in the engaging hole of the collective substrate, and the reliability can be further improved. In addition, according to the method of Embodiment 3, the step of applying the paste may sometimes occur due to the mounting state of the previously mounted surface-mounted components, making it impossible to print solder on the component connection electrodes and simultaneously to the periphery of the engagement hole. In the case where a paste is applied to a region including a part of the engagement hole, in such a case, by supplying the paste from the back side of the surface mounting element mounting surface, it is possible to supply sufficient paste in a necessary region. (Embodiment 4) FIG. 15 is a flowchart showing a manufacturing process of an electronic component manufacturing method according to Embodiment 4 of the present invention. $ Open ^% 2, 1 case-like, by the screen printing method, in the fourth embodiment, the paste supply step of step 3 (FIG. 15) is the same as that of the previous embodiment, 23

536929 A7 _____B7____ 5. Description of the invention (〆) -------------- Installation --- (Please read the precautions on the back before filling out this page) Around the electrodes for mounting components and the holes On the area and the area covering a part of the engagement hole, a paste for mounting the surface-mounted component and fixing the shielding box is applied, the surface-mounted component is mounted (step 4), and the surface-mounted component is soldered by welding (step 5) In the subsequent stage (c) of FIG. 15, on the area including the surface of the pre-solder film, flux is applied and / or additional solder is applied by a screen printing method or a method such as a solder dispenser. As in the fourth embodiment, the screen printing method and solder are used at a stage between (1) and step 5 of FIG. 15 (c) for surface-mounting component welding by fusion welding and step 6 of mounting a shadow box. The dispenser method can provide paste to the area around the engagement hole and the area covering a part of the engagement hole, which can improve the solder wettability and solder adhesion, and can further reliably weld the engagement portion of the masking box to Collecting the box-fixing electrodes in the substrate-engaging holes further improves reliability. In addition, according to the method of the fourth embodiment, if it is necessary to insert another step between the component mounting step and the shielding box mounting step of the collective substrate, the decrease in solderability can be avoided. In addition, although the first to fourth embodiments are described by taking the manufacture of high-frequency electronic components such as VC0 used in communication equipment and the like as an example, the present invention can be further applied to the case of manufacturing other types of electronic components. Furthermore, in other points, the present invention is not limited to the foregoing 1 to 4 and is also open: ^ state 'about the shape of the collective substrate, the pattern of the electrode for mounting the component and the electrode for fixing the box, the shielding box and its engaging portion The specific shape and structure can increase various applications and deformations within the scope of the present invention. 24 This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) '-536929 A7 _______B7_ V. Description of the invention (A) [Effect of the invention] As mentioned above, the present invention Item) The method of manufacturing an electronic component is performed on the electrode for mounting the component on the collective substrate and on the inner peripheral surface of the region including the periphery of the engaging hole and / or a part of the engaging hole in which the box fixing electrode is formed. The paste is applied to the engagement hole in a manner that is not substantially filled. The surface-mounted component is welded to the component mounting electrode by fusion welding, and a plate-like preform is formed on the surface of the box fixing electrode in the engagement hole. Soldering film "After the engaging part of the shielding box is inserted into the engaging hole, the collective substrate is fusion-welded again, and the engaging part of the shielding box and the electrode for fixing the box in the engaging hole are welded." Cutting the collective substrate and dividing it into individual electronic components' When cutting the collective substrate and dividing it, it is possible to suppress the cutting of the solder, and it is possible to efficiently manufacture high-reliability electronic components without causing defects such as solder burrs and solder dragging. . That is, according to the manufacturing method of the electronic component of the present invention, since the paste is applied only to the component mounting electrode and the area around the engagement hole and / or the area including a part of the engagement hole, the paste is not substantially filled into the card. In the joint hole, in the step of cutting the collective substrate and dividing, it is possible to suppress and prevent the solder in the engagement hole from being cut and prevent the occurrence of solder burrs and solder dragging, and a highly reliable electronic component can be obtained. v Also, according to the method of manufacturing an electronic component according to the present invention, in the step of remelting the collective substrate on which the shielding box is mounted, the solder is concentrated in the engaging portion of the shielding box and the fixing hole due to capillary phenomenon due to capillary phenomenon. On the soldering portion of the electrode, it is possible to suppress the accumulation of solder on the area through which the jig for cutting the collective substrate passes through the engagement hole. In this regard, it is also possible to more reliably use the 25-paper standard in China. Standard (CNS) A4 specification (210 X 297 mm) .---------------- (Please read the precautions on the back before filling this page) Order · Thread · 536929 A7- ____ Β7 1 ------- ------ 1. · 丨 丨 ― 5. Description of the invention (outside) Prevent the occurrence of solder burrs and solder drag. Further, for example, since the solder printing for fixing the shadow box can be performed simultaneously with a solder printer for mounting surface-mounted components, the amount of solder can be stabilized and the consumption of solder can be reduced. In addition, as in the method for manufacturing an electronic component of the present invention (the second aspect of the patent application), a surface-mount component is mounted on a collective substrate to which a paste is applied on a component mounting electrode, and then the substantially substantially the inside of the engaging hole is obtained. In a non-filled manner, a paste for fixing the shielding box is applied to an area of the collective substrate including the periphery of the engaging hole and / or a part of the engaging hole, and then, when the collective substrate is welded, As in the case of the method for manufacturing an electronic component according to the first aspect of the present invention, a highly reliable electronic component can be manufactured with high efficiency. In addition, the method according to item 2 of the scope of patent application is different from the step of forming a paste on the electrode for component mounting, because a solder dispenser is provided on the area around the engagement hole and the area covering a part of the engagement hole. Although the number of steps of the step of applying solder is increased, it is possible to increase the degree of freedom in inserting the coating step. In addition, considering the characteristics of electronic components, it is possible to easily change the type and amount of the paste, and the amount of soldering flux. According to the situation, it is possible to improve the product size and reliability of the connection of the shielding box. In addition, as in the method for manufacturing an electronic component according to the present invention (item 3 of the scope of patent application), the assembly substrate having the paste applied to the electrode for mounting the component is formed so that the engaging hole is not substantially filled. After the paste is applied to the area around the engaging hole and / or part of the engaging hole, the surface mounting element is mounted on the surface of the assembly substrate, and when welding the assembly substrate, it is also within the scope of the aforementioned patent application. ______ 26 (Please read the back first (Please note this page before filling in this page) Binding · The size of the thread paper is applicable to the Chinese National Standard (CNS) A4 specification (21〇χ 297 mm) 536929 B7 V. Description of the invention (4) The electronic components of item 1 or 2 In the case of the manufacturing method, it is possible to efficiently manufacture highly reliable electronic components. In addition, as in the manufacturing method of the electronic component of the present invention (item 4 of the scope of patent application), after the shielding box is assembled on the collective substrate, the flux is applied and soldered on the area including the pre-welded Baiwu surface. In the case of at least one of them, the wettability of the solder can be improved, the insufficient amount of solder (paste) can be supplemented, and the steps of mounting the components on the collective substrate and the mounting step of the shielding box can be improved. In cases where it is necessary to insert other steps, the reduction of solder adhesion can also be avoided. In addition, as in the method for manufacturing an electronic component according to item 5 of the patent application, since the paste is supplied from the back side of the surface of the assembly substrate on which the surface-mount component is mounted, to the area including the periphery of the engagement hole and / or part of the engagement hole. Therefore, it is possible to supply the paste on a predetermined area without being hindered by the previously mounted surface-mounted components, which can make the present invention more effective. (Also, if the method of manufacturing an electronic component according to item 6 of the patent application 'is to (a) bend or bend the engaging portion of the shielding box, (b) provide an engaging hole in the engaging portion of the shielding box In the case where at least one of the protrusions of the electrode for abutment of the inner box is in contact with each other, the engaging portion of the shielding box can be brought into abutment with the electrode for the box-fixing in the engaging hole by an elastic force generated by elasticity. Performing fusion welding in such a state enables more reliable welding. At the same time, for example, the front end of the zigzag portion of the engaging portion and the protrusion with the dowel-shaped portion partially abut against the inner peripheral surface of the engaging hole and melt. The solder can easily be concentrated on the abutting portion, and the shielding box can be soldered to the substrate with a small amount of solder, which can make the present invention more effective. 27 The size of the paper is applicable to China National Standard (CNS) A4 (210 X 297) Li) -------------- Installation · 1, f Please read the notes on the back before filling this page} · -line- 536929 A7 ___ Β7__ 5. Description of the invention (4) For example, the manufacturing method of the electronic component under the scope of patent application No. 7 At least one of the method of bending or bending the engaging portion of the shielding box, and (¾) providing a protruding portion on the engaging portion of the shielding box can enable the engaging portion of the shielding box and the inner peripheral surface of the engaging hole. (Electrode for box fixing) Form close contact and perform fusion welding in the state of seeding. For example, the zigzag part of the engaging part and the protrusion with a dowel shape part are in close contact with the inner peripheral surface of the engaging hole. The soldering of the shielding case to the substrate can make the present invention more effective. In addition, the electronic component of the present invention (the scope of the patent application No. 8) is surface-mounted on the component mounting electrode on the substrate, and The engaging portion of the shielding box has a small amount of solder that can not fill the engaging recessed portion. The shielding box engaging portion is welded to the box fixing electrode formed on the inner peripheral surface of the engaging recessed portion on the side of the substrate. Solder burrs and solder drag have high reliability. In addition, the electronic component of the present invention (item 8 in the scope of patent application) can be efficiently manufactured by the method in any of the scope 1 to 5 of the scope of patent application. , The electronic component according to claim 9 has a zigzag or curved portion of the shielding box engaging portion, and / or a protruding portion is provided on the shielding box engaging portion, and the zigzag or curved portion or the protruding portion has The box-fixing electrodes on the inner peripheral surface of the engaging recesses on the side of the substrate form abutting structures. Since the engaging portions of the shielding box are connected to the box-fixing electrodes in the engaging holes due to the spring pressure caused by the early nature The soldering is performed in the abutting state, so the shielding box's engaging pin can indeed be soldered to the box fixing electrode in the engaging hole with a small amount of solder, which can provide the shielding box with a highly reliable electronic component mounted on the substrate 28 t 2. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ------------- Installation-(Please read the precautions on the back before filling this page) Order --Line 536929 A7 _B7 V. Description of the invention (d) In addition, the electronic component of the patent application No. 10, the shielding box engaging portion is twisted or bent, and / or is arranged on the engaging portion of the shielding box The protruding portion, and the meandering or bending portion, or the protruding portion has a shape The box-fixing electrodes on the inner peripheral surface of the engaging recess on the side of the substrate form a close structure. Since the welding is performed in that state, the shielding box engaging portion can be reliably welded into the engaging hole with a small amount of solder. The box fixing electrode can provide a shielding box with a substrate with high reliability for mounting electronic components. In addition, the method of applying the patent scope 6 or 7 can be used to efficiently manufacture the electronic components of the patent scope 9 and 10. ------------------ (Please read the notes on the back before filling out this page) Order · 29 This paper size applies to China National Standard (CNS) A4 (210 X 297 Mm)

Claims (1)

536929 A8 B8 C8 D8 6. Scope of Patent Application1. An electronic component manufacturing method is a method of manufacturing an electronic component having a structure in which a surface-mounted component mounted on a substrate is housed in a shielding box, which is characterized by the following steps: : (A) On a collective substrate that can be divided into a plurality of electronic components (the collective substrate has a plurality of engaging holes, an electrode for fixing the box is formed on the inner peripheral surface of the engaging hole, and the engaging portion of the shielding box is inserted (Electrically and mechanically connected and fixed to the engaging hole), and the component is electrically and mechanically connected and fixed to the electrode for mounting the component on the surface of the collective substrate, and the paste is applied, and the engaging hole is not substantially filled. Method, a step of applying a paste to an area including the periphery of the engaging hole and / or a part of the engaging hole; (b) a step of mounting a surface-mounted component on a collective substrate; (0 by mounting a surface-mounted component The assembly substrate is welded to solder the surface-mounted components to the component mounting electrodes, and at the same time, a plate-like preform is formed on the surface of the box fixing electrode in the engagement hole. (D) the step of installing the shielding box on the collective substrate by inserting the engaging portion of the shielding box into the engaging hole of the collective substrate; (e) by installing the shielding box on the collective substrate; The assembly substrate is re-soldered again, and the pre-welding mesh in the engaging hole is used to weld the engaging portion of the shielding box and the electrode for fixing the box in the engaging hole; and ν-β) the assembly substrate to which the shielding box is welded. The step of cutting and dividing into individual electronic components. 2 · A method for manufacturing an electronic component, which is a method for manufacturing an electronic component having a structure in which a surface-mounting element mounted on a substrate is housed in a shielding box, and is characterized by having the following steps: This paper rule is suitable for China National Standard (CNS) ^ Specifications (21〇x 2 ^ mm) --- (Please read the precautions on the back before writing this page), ιι, 11 line 536929 C8 D8 VI. Scope of patent application (a) in An assembly substrate that can be divided into a plurality of electronic components (the assembly substrate has a plurality of engagement holes, and a box fixing electrode is formed on the inner peripheral surface of the engagement holes, so that the engagement portion of the shielding box is inserted and the electrical and mechanical properties are (Connecting and fixing to the engaging hole), applying the paste to the component mounting electrodes for electrical, mechanical connection and fixing on the surface of the assembly substrate; (b) mounting the surface-mounted components on the assembly substrate Step; (c) a step of applying a paste on a region of the collective substrate including the periphery of the engaging hole and / or a part of the engaging hole in a manner that does not substantially fill the engaging hole (d) by melting the collective substrate To weld The step of welding the surface-mounting component to the electrode for mounting the component, and forming a plated pre-soldering film on the surface of the electrode for fixing the box in the engaging hole; (e) shielding the engaging part of the box The step of installing the shielding box on the collective substrate by inserting into the engaging hole; (f) re-welding the collective substrate on which the shielding box is mounted, and pre-soldering the film in the engaging hole to cover the shielding box; A step of welding the engaging portion and the electrode for fixing the box in the engaging hole; and (g) a step of cutting the assembly substrate to which the shielding box is soldered and dividing it into individual electronic components. 3. A method of manufacturing an electronic component, which is a method of manufacturing an electronic component having a structure in which a surface-mounted component mounted on a substrate is housed in a shielding box, and is characterized by having the following steps: (a) the device can be divided into A collective substrate of a plurality of electronic components (the collective substrate has a plurality of engaging holes, and a box fixing is formed on the inner peripheral surface of the engaging holes. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 x 2927 mm)- -(Please read the precautions on the back before filling in this page)-One line 536929 C8 D8 VI. Patent application scope electrode, insert the engaging part of the shielding box and electrically and mechanically connect and fix it in the engaging hole) Step of applying paste to the component mounting electrodes for electrical, mechanical connection, and fixing of component mounting on the surface of the collective substrate; (b) the card is included in the collective substrate without substantially filling the engaging holes; The step of applying paste around the joint hole and / or a part of the engagement hole (0 step of mounting surface-mounted components on the collective substrate; (d) welding the collective substrate to secure the surface The step of mounting the component on the component mounting electrode and forming a plated pre-soldering film on the surface of the box fixing electrode in the engaging hole; (e) inserting the engaging portion of the shielding box into the engaging Step of mounting the shielding box on the collective substrate in the hole; (f) The welding of the collective substrate on which the shielding box is installed is performed by welding again, and the pre-soldering film in the hole is used to engage the locking portion and the card of the shielding box. Steps of welding the electrodes for fixing the box in the joint hole; and (g) cutting the assembly substrate to which the shielding box is soldered, and dividing it into individual electronic components. 4 · A method for manufacturing an electronic component as described in item 丨 of the scope of patent application Among them, before the collective substrate on which the shielding box is mounted is re-soldered, flux coating and / or additional application of solder is performed on the area including the surface of the aforementioned pre-solder film. 5 · As for the electronic item in the scope of the patent application The manufacturing method of the component, which is applied to the area including the surrounding of the engaging hole and / or a part of the engaging hole. This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (please read the back first) Please note this page) -t ·, \: 口 536929 A8 B8 C8 D8 VI. In the patent application step, from the back side of the assembly board where the surface mounting components are installed, The paste is supplied around the joint hole and / or a part of the joint hole. 6 · For the manufacturing method of the electronic component in the scope of patent application No. 1, it adopts: (a) Bending or bending the engaging part of the shielding box; (b) providing a protruding portion at the engaging portion of the shielding box that is in contact with the electrode for fixing the box in the engaging hole; at least one of two methods, the engaging portion of the shielding box is contacted with the elastic pressure generated by the elasticity. The inner peripheral surface of the engaging hole abuts. 7 · If the method of manufacturing an electronic component according to item 丨 of the patent application is adopted: (a) Bending or bending the engaging portion of the shielding box; (b) Providing a protruding portion at the engaging portion of the shielding box; In at least one of the methods, the engaging portion of the shielding box is brought into close contact with the inner peripheral surface of the engaging hole. 8 · An electronic component characterized in that a surface-mounted component is soldered to a component-mounting electrode on a substrate, and a shielding box engaging portion containing the surface-mounted component is a small amount that does not fill the engaging recessed portion. Welding: It is formed by welding to the box fixing electrode formed on the inner peripheral surface of the engaging recess on the side surface of the substrate. 9 · The electronic component according to item 8 of the scope of patent application, wherein (a) the engaging portion of the shielding box is bent or bent, and / or (b) a protrusion is provided on the engaging portion of the shielding box 'and Make the aforementioned zigzag or curved parts, or protrusions, and __4 This paper size applies to the national standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before writing this page) Order The line 536929 B8 C8 D8 applies for a patent. The box fixing electrode formed on the inner peripheral surface of the engaging recess on the side surface of the substrate is in contact with each other. f 10 · According to the electronic component in the scope of the patent application, it is (a) the engaging portion of the shielding box is bent or bent or (b) a protruding portion is provided at the engaging portion of the shielding box, and the aforementioned tortuous or curved portion Or, the protrusion is in close contact with the electrode for fixing the box formed on the inner peripheral surface of the engaging recess on the side of the substrate (please read the precautions on the back before writing this page). The paper size is applicable to the Chinese National Standard (CNS). A4 size (210 X 297 mm)