TW531632B - Laminated heat transfer device and method of producing thereof - Google Patents

Laminated heat transfer device and method of producing thereof Download PDF

Info

Publication number
TW531632B
TW531632B TW091106203A TW91106203A TW531632B TW 531632 B TW531632 B TW 531632B TW 091106203 A TW091106203 A TW 091106203A TW 91106203 A TW91106203 A TW 91106203A TW 531632 B TW531632 B TW 531632B
Authority
TW
Taiwan
Prior art keywords
heat transfer
transfer device
sheets
laminated
sheet
Prior art date
Application number
TW091106203A
Other languages
Chinese (zh)
Inventor
Wing-Ming Siu
Original Assignee
Convergence Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Convergence Technologies Ltd filed Critical Convergence Technologies Ltd
Application granted granted Critical
Publication of TW531632B publication Critical patent/TW531632B/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D53/00Making other particular articles
    • B21D53/02Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
    • B21D53/04Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers of sheet metal
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/10Heat sinks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/12Laminated parts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/4935Heat exchanger or boiler making

Abstract

A laminated heat transfer device for cooling or thermal energy transport applications and a method of manufacture thereof. In various implementations, the laminated heat transfer device provides complex duct channels for efficient cooling. The various implementations are compatible and integrateable with each other. The method of producing a laminated heat transfer device includes specifying a three-dimensional structure as a plurality of laminae, producing the laminae from sheets of working material, stacking the laminae according to a predetermined sequence with a guiding structure, and connecting the laminae.

Description

531632 A7 '— *_______ B7 五、發明説明(" ' 技術背景 本發明係有關用以冷卻或作熱能傳遞應用的一疊層熱 傳遞裝置。 且曰… 熱是電子系統的副產物,而有效地移開熱為避免電子 叙置故障的重要因素。就電子裝置而言,最常見的熱移除 方法是使用散熱器,散熱管以及帕爾鐵(Peltier)裝置。 散熱器(散熱片)為一種傳導一對流裝置,其藉由自一 既定源傳導熱,然後經由對流將熱轉換成一具功能性流體 而移除熱。散熱器平衡傳導及對流方法,使得傳導阻力不 太大,而對流阻力十分小。一般而言,傳導阻力會由於散 熱片没計之改變以產生較小的對流阻力而增加。散熱器可 為導管式或多孔的設計。管式散熱器使來自一熱源的流體 在槽中流動,使得流體在散熱器的一最大範圍上流動。此 在政熱器之尺寸較風扇為大的時候特別重要,且無在槽 中流動的功能,則僅有較小的表面承受對流冷卻。相反地, 多孔式的散熱器不會使流體在槽中流動,但允許流體以三 個方向流動。其中的一實例為多孔金屬泡沫,其中流體可 來自任何三個垂直方向,因此這些散熱器在流動區較散熱 器的狀況下十分有用。 熱管是-種依賴具功能性流體之蒸發及凝結的熱傳遞 震置。-般而言,流體自熱側(蒸發機側)蒸發,並以水滴 形悲進入冷部側,在该處其凝結回流體(稱為凝結機側)。 然後,流體必須回到蒸發機側,使得循環再開始,基本上 是利用多孔濁怒及流體的毛細作用。由於蒸發的熱基本上 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公I) (請先閲讀背面之注意事項再填寫本頁) 訂 ---------------線- 4 531632 A7 _______B7_ 五、發明說明(2 ) 很多’熱管大體上可達成一種相當大的熱傳遞率。事實上, 複雜的燭芯構造體之熱流可達到2〇W/sq-cm。 帕爾鐵(Peltier)裝置是一種熱電子裝置,其中熱被吸 收並以電流方式射出通過不類似的導體。目前的帕爾鐵 (Peltier)裝置具有熱回流的功能。 摘要 疊層熱傳遞裝置可為一種疊層導管式散熱器,被至一 一體成型之底的疊層多孔式散熱器,疊層熱管,疊層本體 分離的帕爾鐵(Peltier)裝置,或這些的任何組合。 疊層管式散熱器包括導管槽,以允許有效率的氣流。 在一實施例中,自然對流的散熱器包括具有不同的加速流 動之橫截面區,以備置無風扇的裝置。在另一實施例中, 導管式散熱器包括橫連桿組,以較佳地使用在引導葉片之 間的空間。該裝置較譬如輻射管式的複雜散熱器價廉。此 外’此種裝置可與疊層熱管以及/或疊層拼合體帕爾鐵 (Peltier)裝置配合使用。 疊層多孔式散熱器包括--體成型的底構造體,其縮 小接觸阻力至最小。底深度及其接地面積之可改變以適合 特定的熱需求。此裝置容納一空間上可改變的多孔構造 體,以較佳地平衡傳導及對流熱阻力。此裝置亦可與疊層 熱管以及/或$層拼合體帕爾鐵(peltier)裝置配合使用。 疊層熱管為一種價廉的熱管。此疊層熱管可製成不同 的尺寸’且可有不同的燈芯構造體,而不使用燒結步驟。 燈芯構造體為整個熱管的一部份,以藉由疊層使得成品為 本紙張尺度適用中國國家標準(CNS) Α4規格(21〇\297公爱) (請先閲讀背面之注意事項再填寫本頁) -、τ :線| :中空殼體’而燈芯構造體來自疊層之組合以及/或使用 夕孔層而減少熱阻力。該裝置可與疊層散熱器以及 層拼合體帕_(pelti咐置配合使用。 — 疊層拼合體帕爾鐵(Peltier)裝置為—種 爾鐵㈣㈣裝置的低價車輛。此實施㈣置多層使Λ ,專片為由Ρ.型及Ν-型材料構成的—電傳導元件。此裝置亦 可與豐層散熱器以及/或疊層拼合體帕爾鐵㈣㈣裝置配 合使用。 、本發明亦備置-種製造不同的疊層熱傳遞裝置之方 法。該方法包括:設計一立體構造體成為-系列平面元件 (薄片),其依據立體之要求可或可不為連續的;藉由壓印, 打孔,蝕刻,切割,電鍍或其他材料成形的習知方法由材 料片製成疊層,·依據一預定之順序疊置疊層在一起;並藉 由擴散接合,料,編織,錢與互連材料接合或任何互 連方式或互連及材料成形方法之組合或上述方法之組合功 能性地連接各W之部份。可地,薄片可由疊層材料 1成。疊置方法藉由引導構造體的使用而完成,其可與也 可不與成品整合。連接步驟藉由加熱,加Μ,聲波,化學 驅動方法或其組合完成。連接步驟亦可包括額外的界面二 料且可在疊置部份或全部薄片時或在其後執行。 一個或數個實施例將配合圖式在下文中說明,使得本 發明的特徵及優點更為清楚。 圖式之簡要說明 實施例已揭露於所附圖中,其中·· 531632 A7 ____B7 五、發明説明(4 ) 第1 a圖為疊層管式散熱器之一實施例; 第lb圖為第1 a圖之個別薄片的剖面立體圖; 第lc圖為備置橫連桿組的疊層管式散熱器之一實施 例; 第2a圖為備置一一體成型之底的疊層多孔式散熱器; 第2b圖為第2a圖之多孔構造體的橫截面圖; 第2c圖為第2a圖之各別薄片的剖面立體; 第2d圖為第2a圖之各別薄片的另一剖面立體; 第2e圖為備置多孔的一多孔式散熱器之各別薄片的另 一剖面立體圖; 第3a圖用於自然對流應用之一疊層導管式散熱器的一 實施例; 第3b圖為第3a圖中之各別薄片的剖面立體圖; 第4a圖為一疊層熱管; 第4b圖為一備置一整合燈芯構造體的疊層熱管之各別 薄片的剖面立體圖; 第4c圖為備置另一整合燈芯構造體的疊層熱管之另一 别面立體圖; 第4d圖為備置另一燈芯構造體的熱管之薄片的一封閉 圖, 第5a圖顯示一疊層拼合體之帕_鐵(1^1仏1〇裝置; 第5b圖為第5a圖之裝置的各別薄片的一剖面立體圖; 第6a圖顯示備置——體成型的熱管之一多孔散熱器之 一實施例;以及 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) •訂— 531632 A7 B7 五、發明説明(5 ) ' 第6b圖顯示備置一一體成型的熱管之一拼合體帕爾鐵 (Peltier)裝置之一實施例。 在各圖式中的類似元件以類似標號表示。 詳細說明 第1a圖為一疊層導管式散熱器100的一實施例。可選 擇地’該散熱器可具有一螺旋形-葉片構形。該散熱器100 包括一底110以及葉片130。底110自源如電子裝置(未顯示) 傳導熱至葉片130。底110以熱傳導材料,如銅製成,而其 厚度與施加於葉片上之氣流及熱氣的功能有關。一般而 θ ’施加熱氣越大,底需要越大的厚度,以確保熱分散在 底的大部份上。基本上,底110大約為5mm。 第lb圖顯示兩個引導桿1丨1,其經由干擾性安裝,化 學性接合,燒結,鍍金或類似的習知技藝功能性地連接至 底11〇。引導桿ill以金屬或聚合物製成,並引導疊置的薄 片120通過引導孔121。各薄片具有散熱片122以及一傳導 芯體123,使得熱自底110通過傳導芯體123朝向散熱片122 傳導。當傳導芯體123減少整個熱阻力時,其直徑須大到 足以使熱有效地在最小阻力下自底11〇流至最高薄片。實 際的直徑依衝擊在構造體上的流動率而定,而傳導芯體123 的直徑大體上在5至20mm之間。 散熱片122射出熱至具功能性流體中。散熱片的寬度 在〇_5至2mm之間。散熱片122之底可接觸傳導芯體123或 可與其分隔。除射出熱之外,薄片12〇之散熱片122形成成 品100之葉片130,以備置具功能性流體的徑向之導管輸 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公爱〉 (請先閲讀背面之注意事項再填寫本頁)531632 A7 '— * _______ B7 V. Description of the invention ("' Technical background 'The present invention relates to a laminated heat transfer device for cooling or for heat energy transfer applications. And ... heat is a by-product of electronic systems and is effective Ground removal heat is an important factor to avoid electronic placement failures. For electronic devices, the most common heat removal method is to use a heat sink, heat pipe, and Peltier device. The heat sink (heat sink) is A conduction convection device that removes heat by conducting heat from a given source, and then converting the heat into a functional fluid through convection. The heat sink balances conduction and convection methods so that the conduction resistance is not too large, but the convection resistance Very small. Generally speaking, the conduction resistance will increase due to the inadvertent change of the heat sink to produce a small convection resistance. The radiator can be a ducted or porous design. The tube radiator allows the fluid from a heat source to flow in the groove Medium flow, so that the fluid flows over a maximum range of the radiator. This is particularly important when the size of the heater is larger than the fan, and there is no flow in the tank Yes, only a small surface can withstand convective cooling. Conversely, a porous radiator does not allow fluid to flow in the tank, but allows fluid to flow in three directions. One example is porous metal foam, where fluid They can come from any of three vertical directions, so these radiators are very useful in the flow zone compared to radiators. Heat pipes are a type of heat transfer shock that relies on the evaporation and condensation of functional fluids. The hot side (evaporator side) evaporates and enters the cold section side in the shape of a drop, where it condenses back to the fluid (called the condenser side). Then, the fluid must return to the evaporator side so that the cycle can begin again, basically The above is the use of porous turbulence and capillary action of the fluid. Due to the heat of evaporation, the paper size is basically applicable to the Chinese National Standard (CNS) A4 specification (210X297 male I) (Please read the precautions on the back before filling this page) Order- -------------- Line-4 531632 A7 _______B7_ V. Description of the invention (2) Many 'heat pipes can generally achieve a considerable heat transfer rate. In fact, the complex wick structure Body The heat flow can reach 20W / sq-cm. A Peltier device is a type of thermoelectronic device in which heat is absorbed and emitted as a current through a dissimilar conductor. Current Peltier devices have heat The function of reflow. Abstract The laminated heat transfer device can be a laminated ducted heat sink, a laminated porous heat sink, a laminated heat pipe, and a Peltier separated from the laminated body. ) Devices, or any combination of these. Laminated tube heat sinks include duct slots to allow efficient airflow. In one embodiment, natural convection heat sinks include cross-sectional areas with different accelerated flows for preparation Fanless device. In another embodiment, the ducted radiator includes a set of cross links to better use the space between the guide vanes. The device is cheaper than a complex radiator such as a radiant tube. In addition, such devices can be used in conjunction with laminated heat pipes and / or laminated Peltier devices. Laminated porous heat sinks include a body-shaped base structure that reduces contact resistance to a minimum. The depth of the base and its ground area can be changed to suit specific thermal requirements. This device accommodates a spatially variable porous structure to better balance conduction and convective thermal resistance. This device can also be used in conjunction with laminated heat pipes and / or layered peltier devices. The laminated heat pipe is an inexpensive heat pipe. This laminated heat pipe can be made in different sizes' and can have different wick structure without using a sintering step. The wick structure is a part of the entire heat pipe, so that the finished product is based on the paper size by applying the Chinese National Standard (CNS) A4 specification (21〇 \ 297 public love) by stacking (please read the precautions on the back before filling in this (Page)-, τ: Line |: Hollow case ', and the wick structure comes from the combination of lamination and / or the use of a porous layer to reduce thermal resistance. This device can be used in conjunction with a laminated radiator and a layered peltier (pelti). — The laminated peltier (Peltier) device is a low-cost vehicle with a stell iron device. This implementation uses multiple layers. The Λ, the special piece is made of P. type and N-type materials-electrical conductive elements. This device can also be used in conjunction with the layered heat sink and / or the laminated complex Par iron device. The invention also Preparation-a method for manufacturing different laminated heat transfer devices. The method includes: designing a three-dimensional structure as a series of flat elements (sheets), which may or may not be continuous according to the requirements of the three-dimensional; Conventional methods of holes, etching, cutting, electroplating, or other material forming are made from a stack of sheets of material, stacked together in a predetermined order; and by diffusion bonding, material, weaving, money and interconnection Material bonding or any interconnection method or a combination of interconnection and material forming methods or a combination of the above methods functionally connects the parts of each W. Alternatively, the sheet may be made of laminated material 1. The stacking method guides the structure by usage of It can be completed with or without integration with the finished product. The connection step is completed by heating, adding M, sonic, chemical driving methods or a combination thereof. The connection step can also include additional interface materials and can be stacked on some or all of the sheets It will be executed at or after. One or several embodiments will be described below in conjunction with the drawings to make the features and advantages of the present invention clearer. Brief descriptions of the drawings The embodiments have been disclosed in the attached drawings, among which ... 531632 A7 ____B7 V. Description of the invention (4) Figure 1a is an embodiment of a laminated tube heat sink; Figure lb is a cross-sectional perspective view of individual sheets of Figure 1a; Figure lc is a set of horizontal connecting rods Fig. 2a is a laminated porous heat sink provided with an integrally formed bottom; Fig. 2b is a cross-sectional view of the porous structure of Fig. 2a; Fig. 2c Fig. 2a is a cross-sectional perspective view of each sheet in Fig. 2a; Fig. 2d is another cross-sectional perspective view of each sheet in Fig. 2a; Fig. 2e is another cross-section view of each sheet in which a porous radiator is provided. Perspective view; Figure 3a is used for natural convection applications An embodiment of a laminated duct-type heat sink; FIG. 3b is a sectional perspective view of each sheet in FIG. 3a; FIG. 4a is a laminated heat pipe; and FIG. 4b is a diagram of an integrated wick structure. Sectional perspective view of individual sheets of laminated heat pipe; Figure 4c is another perspective view of another laminated heat pipe with another integrated wick structure; Figure 4d is a closure of a sheet of heat pipe with another wick structure. Fig. 5a shows a slab-iron (1 ^ 1 仏 10 device of a laminated composite body; Fig. 5b is a cross-sectional perspective view of each sheet of the device of Fig. 5a; Fig. 6a shows a prepared body An example of a porous heat sink that is a shaped heat pipe; and this paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page) • Order — 531632 A7 B7 V. Description of the invention (5) 'FIG. 6b shows an embodiment of a Peltier device which is a composite body of one integrated heat pipe. Similar elements in each drawing are indicated by similar reference numerals. DETAILED DESCRIPTION FIG. 1a illustrates an embodiment of a laminated ducted heat sink 100. FIG. Alternatively, the heat sink may have a spiral-blade configuration. The heat sink 100 includes a base 110 and a blade 130. The base 110 conducts heat from a source such as an electronic device (not shown) to the blade 130. The base 110 is made of a thermally conductive material, such as copper, and its thickness is related to the function of the airflow and hot gas applied to the blade. In general, the greater the heat applied to θ ', the greater the thickness of the bottom is required to ensure that the heat is dispersed over most of the bottom. Basically, the bottom 110 is approximately 5 mm. Figure lb shows two guide rods 1-1 which are functionally connected to the base 11 via interference mounting, chemical bonding, sintering, gold plating or similar conventional techniques. The guide rod ill is made of metal or polymer, and guides the stacked sheets 120 through the guide hole 121. Each sheet has a heat sink 122 and a conductive core 123, so that heat is conducted from the bottom 110 through the conductive core 123 toward the heat sink 122. When the conductive core 123 reduces the overall thermal resistance, its diameter must be large enough to allow heat to efficiently flow from the bottom 11 to the highest sheet with minimal resistance. The actual diameter depends on the flow rate of the impact on the structure, and the diameter of the conductive core 123 is generally between 5 and 20 mm. The heat sink 122 emits heat into a functional fluid. The width of the heat sink is between 0-5 and 2mm. The bottom of the heat sink 122 may contact the conductive core 123 or may be separated therefrom. In addition to the emitted heat, the heat sink 122 of the sheet 120 forms the blade 130 of the finished product 100, which is provided with a radial conduit with a functional fluid. (Please read the notes on the back before filling out this page)

531632 A7 ' -----— B7_____ 五、發明説明(ό ) " ''—'— 送。薄片120之形狀可依據形成成品1〇〇之要求而相同或不 同。各薄片120為一熱導體且最好必須以金屬製成。薄片12〇 可藉由打印,打孔,蝕刻以及/或電鍍步驟以具功能性材 料製成。各薄片之厚度由薄片製造方法決定。譬如,一壓 印步驟可施加於厚度大約為lmm或小於lmm的銅材料。然 而,具功能性材料越厚,則需要完成一成品所須薄片之數 目越大。使用壽命,生產率以及產品品質之間的平衡是決 定產品底線的操作因素。薄片12〇疊置並功能性地連接在 一起以產生成品100。在薄片12〇之間的連接以及與底n〇 的連接可以燒結,電鍍,熔接,鍍銅,化學接合,擴散接 口或任何習知類似方法完成。疊置方法可經由上述的引導 桿111或一適當的對齊配件(未顯示)完成。此外,疊置及 接合可在一個或數個步驟中完成。 疊層導管式散熱器的另一實施例包括在引導葉片之間 的橫連桿組。如第lc圖所示,備置橫連桿組141之薄片14〇 週期地注入’以形成可有效地使用在引導葉片之間的空間 的一構造體。這些橫連桿組141增加對流表面區之量以及 熱傳導路徑之數量。 第2a圖為備置--體成型底的一疊合多孔式散熱器。 此散熱器200包括一底210以及一多孔構造體220。如第2b 圖所示,該多孔構造體允許具功能性流體以三個方向通 過。如第2c圖所示,此點藉由疊積第一薄片221及具有不 同之孔設計的第二薄片222而完成,使得底210形成總成200 的一個部份。可選擇地,第一及第二薄片221,222可垂直 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) (請先閱讀背面之注意事項再填寫本頁)531632 A7 '-----— B7_____ V. Description of invention (ό) "' '—'— Send. The shape of the sheet 120 may be the same or different depending on the requirements for forming the finished product 100. Each sheet 120 is a thermal conductor and preferably must be made of metal. The sheet 120 may be made of a functional material by printing, punching, etching, and / or plating steps. The thickness of each sheet is determined by the sheet manufacturing method. For example, an embossing step can be applied to a copper material having a thickness of about 1 mm or less. However, the thicker the functional material, the larger the number of sheets required to complete a finished product. The balance between service life, productivity, and product quality are the operating factors that determine the bottom line of a product. The sheets 120 are stacked and functionally connected together to produce a finished product 100. The connection between the sheets 120 and the connection to the bottom no can be performed by sintering, electroplating, welding, copper plating, chemical bonding, diffusion interface or any other similar method. The stacking method can be performed by the above-mentioned guide rod 111 or an appropriate alignment fitting (not shown). In addition, stacking and joining can be done in one or several steps. Another embodiment of a laminated ducted heat sink includes a set of transverse links between the guide vanes. As shown in Fig. 1c, the sheet 14 of the horizontal link group 141 is prepared to be periodically injected 'to form a structure that can effectively use the space between the guide vanes. These cross link groups 141 increase the amount of convection surface area and the number of heat conduction paths. Figure 2a shows a stacked porous radiator with a body-shaped bottom. The heat sink 200 includes a base 210 and a porous structure 220. As shown in Figure 2b, this porous structure allows functional fluids to pass in three directions. As shown in FIG. 2c, this is accomplished by stacking the first sheet 221 and the second sheet 222 with different hole designs, so that the bottom 210 forms a part of the assembly 200. Alternatively, the first and second sheets 221, 222 can be vertical. The paper size is applicable to China National Standard (CNS) A4 (210X297 mm) (Please read the precautions on the back before filling this page)

9 531632 A7 B7 五、發明説明(7 ) ^^' (請先閱讀背面之注意事項再填寫本頁) 於底地疊置(第2d圖)。在薄片上的孔為矩形的,但也可為 橢圓形’圓形或任何其他一般形狀。此外,在各別薄片上 的孔體積可不一樣,以使散熱片成品備置空間上不同的孔 (第2e圖)。此構成允許熱傳導路徑相對於流體之流動達成 最理想的狀況。一般而言,疊置及連接薄片的厚度,材料 及方法均類似於以上所述。 第3a圖中所示的另一實施例為作自然對流應用的一疊 層管式散熱器300。此散熱器300包括一底31〇,一進氣口 320,一對流管330,引導葉片340及一傳導桿35〇。在操作 時’ 一熱源(未顯示)施加於底3 1 〇之底部上,其傳導熱至 引導葉片340並至傳導桿350。此散熱器300直徑必須足夠 的大以允許熱向上傳導,但亦必須小到足以形成與體積成 比例的一大的表面區。一般而言,傳導桿35〇之直徑大約 為3至5mm,且此桿可為直的或為葉脈狀,以使熱傳遞至 大氣中的效率達到最高。散熱器300直接定位在熱源上, 使得大部份的熱會向上移動至此傳導桿35〇並至毗鄰的空 氣中,且空氣因浮力而上升。當空氣上升時,其為收斂管 330加速,其後藉由創造一低壓狀況而在進氣口 32〇吸入空 氣。引導葉片340可徑向地向内引導空氣,同時自底31〇傳 導熱至收斂管330,其另加熱空氣並增加其内的流動率。 收斂管330必須為一熱傳導材料,最好是如鋁或鋁的金屬。 此外,一風扇(未顯示)可置於散熱片之底部,以備置強迫 的對流冷卻,在此狀況下引導葉片34〇可完成散熱片的功 能。如上述,散熱器300藉由疊置及連接入口薄片32〇以及 本紙張尺度適用中國國家標準(CNS) A4規格(21〇><297公釐) 10 五 531632 、發明説明(8 管薄片331在一起而形成,如第3b圖所示。藉由疊置入口 薄片321即可形成薄片320以及引導葉片34〇,且管薄片331 疊置並功能性地接合在這些入口薄片321上,以形成收斂 管330。一般而言,薄片之厚度,材料以及疊置及接合方 法類似於以上所述,但唯一的例外是管薄片331需要足夠 的薄以形成一平滑的曲度。一般而言,這些薄片之厚度大 約為0.5mm,但亦可使用適當截角的較厚的薄片。在使用 前,疊置方法可透過引導桿311或一適當的對齊配件(未顯 示)而執行。 另一實施例為第4a圖中所示的疊層熱管。此熱管4〇〇 包括交替地疊置之第—41〇及第二42〇薄片,且其兩端上為 端板430。第-及第二薄片41〇, 42〇具有中間孔因而使 這些薄片形成環。該孔可為矩形,圓形,觀形式任何其 他習知形狀,而在薄片411,421上留下的材料量必須足以 使薄片之間具密封的關係。此外,在第一及第二薄片41〇, 4·20上的孔之尺寸可猶微不同(大約〇2至,以在薄片 疊置在一起時形成毛細凹槽44〇(第朴圖)。這些毛細凹槽 440可具有燈4之功能,且可在平面方向上循環凝結之流 體。整個單元藉由功能性地接合兩個備置端板43〇的薄片 410 ’ 420而密封。此密封可在熱管注入流體之後,之中或 之前執行,若在之前一闕(未顯示)須置於端板上。此密封 步驟可為力以及/或溫度起動方法,包括賴,燒結, 熔接,化學性接合或任何類似的習知方法。 為進一步改善循環,第一及第二薄片41〇,42〇穿孔 本紙張尺度適财關家標準Tws) A4規格(2Κ)Χ297公釐)9 531632 A7 B7 V. Description of the invention (7) ^^ '(Please read the precautions on the back before filling this page) Stack on the ground (Figure 2d). The holes in the sheet are rectangular, but can also be oval 'circular or any other general shape. In addition, the volume of the holes in the individual sheets can be different, so that the finished heat sink can be prepared with different holes (Figure 2e). This configuration allows the heat conduction path to achieve an optimal state with respect to the flow of the fluid. In general, the thickness, materials and methods of stacking and connecting sheets are similar to those described above. Another embodiment shown in Figure 3a is a stacked tube heat sink 300 for natural convection applications. The radiator 300 includes a bottom 31 °, an air inlet 320, a pair of flow tubes 330, guide vanes 340, and a conductive rod 35 °. In operation, a heat source (not shown) is applied to the bottom of the bottom 3 10, which conducts heat to the guide vanes 340 and to the conductive rod 350. The diameter of this heat sink 300 must be large enough to allow heat to conduct upwards, but it must also be small enough to form a large surface area proportional to the volume. Generally speaking, the diameter of the conductive rod 350 is about 3 to 5 mm, and the rod may be straight or veined to maximize the efficiency of heat transfer to the atmosphere. The radiator 300 is directly positioned on the heat source, so that most of the heat will move upward to the conductive rod 35 and into the adjacent air, and the air rises due to buoyancy. When the air rises, it accelerates for the converging tube 330, and then inhales the air at the inlet 32 by creating a low pressure condition. The guide vane 340 can guide the air radially inward, while conducting heat from the bottom 31 to the converging tube 330, which additionally heats the air and increases the flow rate therein. The converging tube 330 must be a thermally conductive material, preferably a metal such as aluminum or aluminum. In addition, a fan (not shown) can be placed on the bottom of the heat sink to prepare for forced convection cooling. Under this condition, the guide vane 34 can perform the function of the heat sink. As described above, the radiator 300 is stacked and connected to the inlet sheet 32 and the paper size is in accordance with the Chinese National Standard (CNS) A4 specification (21〇 > < 297 mm) 10 531632, invention description (8 tube sheet 331 are formed together, as shown in FIG. 3b. Sheet 320 and guide vane 34 can be formed by stacking inlet sheets 321, and tube sheet 331 is stacked and functionally joined to these inlet sheets 321 to A convergent tube 330 is formed. In general, the thickness, material, and stacking and joining methods of the sheet are similar to those described above, but the only exception is that the tube sheet 331 needs to be thin enough to form a smooth curvature. In general, The thickness of these sheets is about 0.5mm, but thicker sheets with appropriate truncations can also be used. Prior to use, the stacking method can be performed through the guide rod 311 or an appropriate alignment accessory (not shown). Another implementation An example is the laminated heat pipe shown in Figure 4a. This heat pipe 400 includes the -41th and the second 42o sheets that are alternately stacked, and end plates 430 on both ends. The-and the second Sheet 41〇, 42〇 with middle hole These sheets form a ring. The holes can be rectangular, circular, or any other conventional shape, and the amount of material left on the sheets 411, 421 must be sufficient to provide a sealed relationship between the sheets. In addition, in The size of the holes in the first and second sheets 41, 4, 20 may be slightly different (approximately 0 to 2, so as to form capillary recesses 44 when the sheets are stacked together (top view). These capillaries The slot 440 may have the function of the lamp 4 and circulate the condensed fluid in a planar direction. The entire unit is sealed by functionally joining the two sheets 410 '420 of the end plates 43. This seal can inject fluid into the heat pipe Performed after, during or before, if the previous stack (not shown) must be placed on the end plate. This sealing step can be a force and / or temperature starting method, including laminating, sintering, welding, chemical joining or any similar In order to further improve the circulation, the first and second sheets are perforated on this paper (standard 40s, 40s, Tws), A4 size (2K) x 297 mm)

(請先閲讀背面之注意事項再填寫本頁) 訂----- 11 531632 A7 __________B7 _____ 五、發明説明(9 ) 412,422,使得當薄片疊置在一起時,這些孔412,422形 成跨過薄片並朝向兩端板430的毛細槽45〇。如第4c圖所 示,當兩個備置細孔的額外板460加在端板43〇之前以完成 毛細之迴路。毛細槽450必須小到足以進行流動,但也不 能太小而阻止薄片之間的精確對齊。一般而言,這些槽大 約直徑為0·1至0.5mm。此外,可增加如第4d圖所示的孔, 以進一步增加毛細作用。最後,薄片之厚度,材料及疊置 及接合方法類似於前一實施例。 苐5a圖為稱為拼合體帕爾鐵(peitier)裝置的另一實施 例。該裝置500包括薄片510,而薄片包括熱電接合部,使 得一組接合部511功能性地連接至底52〇,而第二組接合部 512以一段距離隔絕熱以形成一拼合體的構造體。在操作 上,在頂上的組512為熱接合部,而底上的組511為冷接合 邛。連接至底的步驟可以一化學劑(可固化黏著劑)擴散接 合,熔接,燒結或任何類似的習知方法完成。底515必須 為一熱導體並經由氧化物或聚合物(未顯示)與薄片51〇作 電力的絕緣。各薄片大約厚度為〇2至2mm,且由以壓印, 蝕刻,電鍍以及/或打孔方式由不類似電導體獲得的z字形 之N-型及P-型材料製成。接合部5U,512以熔接,電鍍, 熔接,擴散接合或其他習知類似方法功能性地接合?_型513 及N-型514材料而形成。 除了兩端516之外,各別博片藉由使用一氧化劑或聚 合物塗層(未顯示)而作電絕緣,並以類似於第一實施例的 方法疊置/接合在一起。各薄片之兩端516未作電絕緣,以 本紙張尺度適用中國國家標準(CNs) A4規格(210X297公董)(Please read the notes on the back before filling this page) Order ----- 11 531632 A7 __________B7 _____ V. Description of the invention (9) 412, 422, so that when the sheets are stacked together, these holes 412, 422 form Capillary grooves 45 across the sheet and towards the end plates 430. As shown in Fig. 4c, when two additional holes 460 with fine holes are added before the end plate 43, the capillary circuit is completed. The capillary groove 450 must be small enough to flow, but not too small to prevent precise alignment between the sheets. Generally, these grooves have a diameter of about 0.1 to 0.5 mm. In addition, holes can be added as shown in Figure 4d to further increase capillary effects. Finally, the sheet thickness, material, and stacking and joining method are similar to the previous embodiment. Figure 5a shows another embodiment of a so-called peitier device. The device 500 includes a sheet 510, and the sheet includes thermoelectric joints so that a group of joints 511 are functionally connected to the bottom 52o, and a second group of joints 512 is insulated from the heat by a distance to form a structure of a split body. In operation, the group 512 on the top is a hot-joined portion, and the group 511 on the bottom is a cold-bonded 邛. The step of connecting to the bottom can be performed by a chemical agent (curable adhesive) diffusion bonding, welding, sintering or any similar conventional method. The base 515 must be a thermal conductor and be electrically insulated from the sheet 51 by an oxide or polymer (not shown). Each sheet has a thickness of about 0 to 2 mm, and is made of zigzag-shaped N-type and P-type materials obtained by embossing, etching, electroplating, and / or punching from dissimilar electrical conductors. The joints 5U, 512 are functionally joined by welding, plating, welding, diffusion bonding, or other conventionally similar methods? _Type 513 and N-type 514 materials. Except for the two ends 516, the respective blogs are electrically insulated by using an oxidizing agent or a polymer coating (not shown), and are stacked / bonded together in a similar manner to the first embodiment. The two ends 516 of each sheet are not electrically insulated, and the Chinese paper standard (CNs) A4 is applied to this paper size (210X297).

;線丨 (請先閲讀背面之注意事項再填寫本頁); Line 丨 (Please read the notes on the back before filling this page)

、τ. -12 - 531632 五、發明説明 使電流可在薄片連接在一起後通過其中。兩個基本的•置 組合依據是否各別薄片系列地或平行地以電連接而定。然 後,電線517功能性地連接兩端516,以與一外電源相連。 第1至5圖中所示的裝置可以不同方法結合,以適於最 終之執行目標,譬如,如第6a圖所示,疊層散熱器及叠層 熱管可形成一單元。可選擇地,疊層熱管及疊層拼合體小曰白 爾鐵(Peltier)裝置可使用相同的方法製造(第仙圖)。 以上揭露了數個實施例。然而,須暸解的是其可作不 同的改良。因此,其他實施例在以下申請專利範圍内。 (冰相先閲讀背面之注意事項再填寫本頁) •、\t— 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公楚) 531632 A7 B7 五、發明説明(11 ) 元件標號對照 100 疊層導管式散熱器 340 引導葉片 110 底 350 傳導桿 111 引導桿 400 熱管 120 薄片 410 第一薄片 121 引導孔 411 薄片 122 散熱片 412 穿孔 123 傳導芯體 420 第二薄片 130 葉片 421 薄片 140 薄片 422 穿孔 141 橫連桿組 430 端版 200 散熱器 440 毛細凹槽 210 底 450 毛細槽 220 多孔構造體 460 額外板 221 第一薄片 500 拼合體帕爾鐵裝置 222 第二薄片 510 薄片 300 散熱器 511 冷接合部 310 底 512 熱接合部 311 引導桿 513 P-型 320 進氣口 514 N-型 321 入口薄片 515 底 330 收斂管 516 兩端 331 管薄片 517 電線 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 14Τ. -12-531632 V. Description of the invention The current can be passed through the sheets after they are connected together. The two basic combinations are based on whether the individual sheets are electrically connected in series or in parallel. The electric wire 517 is then functionally connected to both ends 516 to be connected to an external power source. The devices shown in Figures 1 to 5 can be combined in different ways to suit the final execution goal. For example, as shown in Figure 6a, the laminated heat sink and laminated heat pipe can form a unit. Alternatively, a laminated heat pipe and a laminated composite Peltier device can be manufactured using the same method (Fig. 1). Several embodiments have been disclosed above. However, it is important to understand that it can be modified differently. Therefore, other embodiments are within the scope of the following patent applications. (Please read the precautions on the back of the ice phase before filling in this page) •, \ t— This paper size applies the Chinese National Standard (CNS) A4 specification (210X297). 531632 A7 B7 V. Description of the invention (11) Component reference number 100 Laminated tube radiator 340 guide blade 110 bottom 350 conductive rod 111 guide rod 400 heat pipe 120 sheet 410 first sheet 121 guide hole 411 sheet 122 heat sink 412 perforated 123 conductive core 420 second sheet 130 blade 421 sheet 140 sheet 422 Perforated 141 Horizontal link group 430 End plate 200 Radiator 440 Capillary groove 210 Bottom 450 Capillary groove 220 Porous structure 460 Extra plate 221 First sheet 500 Split Parr device 222 Second sheet 510 Sheet 300 Radiator 511 Cold Joint 310 bottom 512 thermal joint 311 guide rod 513 P-type 320 air inlet 514 N-type 321 inlet sheet 515 bottom 330 convergence tube 516 both ends 331 tube sheet 517 electric wire (please read the precautions on the back before filling in this Page) This paper size is in accordance with Chinese National Standard (CNS) A4 (210X297 mm) 14

Claims (1)

531632 1年1皆正 申請專利範圍531632 1 year and 1 year are all patent applications 弟91106203號專利申★主安 ^種疊層熱傳遞專職_正本91年12月20日 、I ’其包括·· 底;以及 由數個薄片形成—葉片 及一傳導芯體,其中專片具有數個散熱 τ厚片依據一預定順戽A罟 2·如申請專利範圍第丨 、且置在起 引導h 、的》層熱傳遞裝置,其另包括: 引令溥片之疊置的至少一引導桿。 3·如申請專利範圍第丨 貝的宜層熱傳遞裝置,其另包括: 引^缚片之疊置的-對齊配件。 4.如申請專利範圍第丨 寸相同或相異。κ層熱傳錢置,其中薄片的 5·如申請專利範圍第1項的疊層熱傳遞裝置,其中薄片塑 成似一輪的輪輻。 6·如申請專利範圍第1項的疊層熱幽置,其中至少薄 之一塑形成一長條。 7. Γ請專利範圍第1項的疊層熱傳遞裳置,其中散熱器 政熱片形成螺旋形。 8. 如申請專利範圍第i項的叠層熱傳遞裝置,其中散熱器 一導管式散熱器。 9· 一種疊合熱傳遞裝置,其包括·· 一底;以及 “由數個第一及第二薄片形成的—多孔構㈣,而各 薄片具有數個塑形孔,其中薄片依據—預定順序疊置在 一起。 片 尺 形 片 之 為 本紙張尺度朝家標準(CNS) μ規格⑵οχ”7公楚)----^ __ 15 、1% % 猶凡The patent application No. 91106203 ★ The main security ^ a kind of laminated heat transfer full-time_Original December 20, 91, I 'which includes ... bottom; and formed from several sheets-blades and a conductive core, of which the special sheet has A plurality of heat-dissipating τ slabs are based on a predetermined sequence 戽 A 罟 2. If the scope of the patent application is 丨, and is located at the starting and guiding layer, the layer of heat transfer device further includes: at least one of the laps of the 溥Guide bar. 3. The layer-appropriate heat transfer device according to the scope of the patent application, further comprising: a stacking-aligning fitting of the lead-in binding piece. 4. If the scope of patent application is the same or different. The κ layer is a heat transfer device, of which the lamination is 5. The laminated heat transfer device as in item 1 of the scope of patent application, wherein the lamination is shaped like a spoke. 6. The laminated thermal lamination according to item 1 of the patent application, wherein at least one of the thin layers is formed into a long strip. 7. Γ asks for the laminated heat transfer skirt of item 1 of the patent, in which the heat sink and the heat sink are formed in a spiral shape. 8. The laminated heat transfer device according to item i of the application, wherein the radiator is a ducted radiator. 9. A superimposed heat transfer device comprising: a bottom; and "a porous structure formed by a plurality of first and second sheets, each sheet having a plurality of shaped holes, wherein the sheets are based on a predetermined order Stacked together. The ruler-shaped film is based on the paper standard (CNS) μ specifications ⑵οχ "7 Kung Chu) ^ __ 15 、 1%% ABC D 申請專利範圍 10.如申請專利範圍第9 -.¾ u . „ +j7 .、的龙層熱傳遞裝置,其中第一及第 一溥月父替地疊詈,B好丄 ^ 1 1 ^ Φ ^ ^ /、中薄片水平或垂直地疊置。 11·如申请專利範圍第9項 貝的宜層熱傳遞裝置,其中 塑形孔平均或不平均 12.如申請專利範圍第9項轟 宜s熱傳遞裝置,其中各薄片的 塑形孔具有-致或不—致的尺寸。 片的 13·如申請專利範圍第9項的疊層熱 塑形孔為矩形,橢圓形或圓形。 各厚片的 Μ·如申請專利範圍第9項的疊層熱傳遞裝置,其中薄片具有 相同或相異的尺寸。 15·如申請專利範圍第9項 貝的:c層熱傳遞裝置,其中疊層埶傳 遞裝置為一散熱器。 …寻 I6·如申請專利範圍第15項 貝的:!:層熱傳遞裝置,其中散熱器 為一多孔式散熱器。 …口 π.如申請專利範圍第9項的疊層熱傳遞裝置,其另包括: 兩端板;且 其中第-及第二薄片之孔尺寸不同,以在薄片疊置 在一起時形成毛細凹槽。 18. :申請專利範圍第17項的疊層熱傳遞裝置,其中第一及 第一溥片牙孔,使得當薄片疊置在一起時孔形成跨過薄 片朝向端板的毛細凹槽。 19. 如申巧專利範圍第17項的疊層熱傳遞裝置,其另包括: 兩板’各板備置數個長孔在定位在各別端板之前。 20.如申明專利範圍第17項的疊層熱傳遞裝置,其中疊層 本紙張尺度適用中國國家標準(CMS) A4規格(21〇><297公楚) 16 / 申M專利範圍 熱傳遞裝置為一熱管。 21·—種疊層熱傳遞裝置,其包括· 一底;以及 數個備置熱電接合部的薄 5念以一 ^ 片’其中弟一組薄片遠接 至底,弟二組薄片以熱隔一 置在一起。 、 W依據一預定川貝序疊 22:申請專利範圍第21項的疊層熱傳遞裝置,其中疊㈣ 傳遞裝置為一拼合體帕爾鐵(Peltier)裝置。 ""^,、、、 23. —種疊層熱傳遞裝置,其包括 其包含-底W形成 二二Γ “有數個散熱片"導芯體,其中 银、择_此 疋夷序且置在-起’以及與該疊層熱 傳遞疋件-體成型的-疊層熱傳遞元件,其包含—底; 二及由數個第一及第二薄片形成的一多孔構造體,而各 :片具有數個塑形孔’其中薄片依據一預定順序疊置在 d、中第-及第二薄片之孔尺寸不同,以在薄片疊 置在一起時形成毛細凹槽;與兩端板。 24. —種疊層熱傳遞裝置,其包括 -疊層熱傳遞元件,其包括一底;以及由數個第一及第 一薄片形成的一多孔構造體,而各薄片具有數個塑形 孔其中该等薄片依據一預定順序疊置在一起;以及與 4 oc層熱傳遞元件一體成型的一疊層熱傳遞元件,其包 含一底;以及由數個第一及第二薄片形成的一多孔構造 體,而各薄片具有數個塑形孔,其中薄片依據一預定順 7A4規格(210X297公爱Γ" 17ABC D patent application scope 10. If the patent application scope is 9-. ¾ u. „+ J7., The dragon layer heat transfer device, the first and the first month of the father are stacked on the ground, B is good ^ 1 1 ^ Φ ^ ^ /, the middle and thin sheets are stacked horizontally or vertically. 11. If the layer is suitable for the heat transfer device of the patent application No. 9 shell, wherein the shaped holes are average or uneven 12. Such as the patent application scope No. 9 It should be a heat transfer device, in which the shaped holes of each sheet have a size that is the same or not. 13. The laminated thermoplastic holes of item 13 of the patent application scope item 9 are rectangular, oval or circular. M of each slab, such as the laminated heat transfer device in the ninth scope of the patent application, wherein the sheets have the same or different dimensions. 15. In the patent scope, the ninth layer: the c-layer heat transfer device, The layered transfer device is a radiator.… See I6 · As in the 15th patent application:!: The layered heat transfer device, where the radiator is a porous radiator.… Port. The laminated heat transfer device of 9 items, further comprising: two end plates; and -The hole size of the second sheet is different from that of the second sheet to form a capillary groove when the sheets are stacked together. 18 .: The laminated heat transfer device of the 17th patent application scope, wherein the first and first diaphragms have perforations, When the sheets are stacked together, the hole forms a capillary groove that crosses the sheet toward the end plate. 19. The laminated heat transfer device of item 17 of Shenqiao Patent, which further includes: two plates, each plate is provided with several The long holes are positioned before the respective end plates. 20. The laminated heat transfer device as claimed in item 17 of the declared patent scope, wherein the paper size of the laminated paper conforms to the Chinese National Standard (CMS) A4 specification (21〇 > < 297 (Gongchu) 16 / The scope of the patent application for the heat transfer device is a heat pipe. 21 · —A laminated heat transfer device, which includes: · a bottom; and a number of thin 5 pieces of thermoelectric junctions. One set of lamellas is connected far to the bottom, and the other two sets of lamellas are placed together with a thermal barrier. W is based on a predetermined Chuanbei order 22: a laminated heat transfer device for the 21st patent application, where the stack transfer device is A split Peltier device. &Quot; " ^ ,,,, 23.-A laminated heat transfer device, which includes-bottom W to form two two Γ "There are several heat sinks" guide core, wherein At-from 'and a laminated heat-transfer element formed integrally with the laminated heat-transfer member, comprising a bottom; two and a porous structure formed by a plurality of first and second sheets, each : The sheet has several shaped holes. 'The sheets are stacked in d, middle- and second sheets according to a predetermined order. The hole sizes are different to form capillary grooves when the sheets are stacked together; and the two end plates. 24. A laminated heat transfer device comprising: a laminated heat transfer element including a bottom; and a porous structure formed by a plurality of first and first sheets, each sheet having a plurality of shapes The holes in which the sheets are stacked together in a predetermined order; and a laminated heat transfer element integrally formed with a 4 oc layer heat transfer element, which includes a bottom; and a first and second sheet formed of a plurality of Porous structure, and each sheet has several shaped holes, wherein the sheet is based on a predetermined 7A4 specification (210X297 public love Γ " 17 予豎置在一起且J:中篦 u ^ -中弟-及弟二薄片之孔尺寸不同,以 置在—起時形成毛細凹槽;與兩端板。 25·—種《層熱傳遞裝置,其包括 一疊層熱傳遞元件,盆 一广 少 /、包3 一底;以及由數個第一及第 y成白勺夕孔構造體,而各薄片具有數個塑形 一:中騎薄片依據一預定順序疊置在一起且其中第 :及第二薄片之孔尺寸不同,以在薄片疊置在—起時形 毛細凹槽;與兩端板;以及與該4層熱傳遞元件一體 :型的-疊層熱傳遞元件’其包含—底;以及數個備置 :電接合部的薄片,其中第—組薄片連接至底,第二組 缚片以熱隔絕,而薄片依據一預定順序疊置在一起。 26.一種製造疊層熱傳遞裝置的方法,其包括·· 指定一立體構造體作為數個薄片; 由具功能性材料薄片形成薄片; 以一引導構造體依據一預定順序疊置薄片。 U-種製造中請專利範圍第26項的疊層傳遞裝置的方法, 其中疊層熱傳遞裝置為一散熱器。 28. -種製造申請專利範圍第26項的疊層傳遞裝置的方法, 其中疊層熱傳遞裝置為一熱管。 29. -種製造f請專㈣圍第26項的疊層傳遞裝置的方法, 其中疊層熱傳遞裝置為一拼合體式帕爾鐵(pe】t㈣裝置。 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 18Yu is erected together and the pores of J: Zhong 篦 u ^-zhongdi-and xi's two sheets have different hole sizes, so that they form capillary grooves when placed at the top; and the two end plates. 25 · —a layered heat transfer device, which includes a laminated heat transfer element, a pot with a wide base, a bag with a bottom, and a base; and a plurality of first and y-thick pore structures, and each sheet There are several shaping one: the Zhongqi sheets are stacked together according to a predetermined order and the hole sizes of the first and second sheets are different to form a capillary groove when the sheets are stacked on top of each other; and two end plates; And integrated with the 4-layer heat transfer element: a type-laminated heat transfer element 'which includes a bottom; and a plurality of sheets provided with electrical junctions, wherein the first group of sheets is connected to the bottom, and the second group of straps is Thermally isolated, while the sheets are stacked together in a predetermined order. 26. A method of manufacturing a laminated heat transfer device, comprising: designating a three-dimensional structure as a plurality of sheets; forming a sheet from a sheet of functional material; and stacking the sheets in a predetermined order with a guide structure. A method for manufacturing a laminated transfer device in the 26th category of the patent application, wherein the laminated heat transfer device is a heat sink. 28. A method of manufacturing a laminated transfer device with the scope of patent application No. 26, wherein the laminated heat transfer device is a heat pipe. 29. A method for manufacturing a laminated transfer device specifically designed for item 26, wherein the laminated heat transfer device is a split-type Par iron (pe) t device. This paper size applies to the Chinese National Standard (CNS) A4 size (210X297 mm) 18
TW091106203A 2001-04-09 2002-03-28 Laminated heat transfer device and method of producing thereof TW531632B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US28217001P 2001-04-09 2001-04-09

Publications (1)

Publication Number Publication Date
TW531632B true TW531632B (en) 2003-05-11

Family

ID=23080377

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091106203A TW531632B (en) 2001-04-09 2002-03-28 Laminated heat transfer device and method of producing thereof

Country Status (3)

Country Link
US (1) US20020144809A1 (en)
TW (1) TW531632B (en)
WO (1) WO2002082536A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104053337A (en) * 2013-03-15 2014-09-17 君瞻科技股份有限公司 Electronic device with heat radiating function and radiating module thereof

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060196640A1 (en) * 2004-12-01 2006-09-07 Convergence Technologies Limited Vapor chamber with boiling-enhanced multi-wick structure
TWI274539B (en) * 2005-04-01 2007-02-21 Delta Electronics Inc Heat dissipating assembly with composite heat dissipating structure
US7800904B2 (en) * 2008-01-15 2010-09-21 Mcgough William L Electronic assembly and heat sink
US7914182B2 (en) * 2008-09-30 2011-03-29 GE Lighting Soutions, LLC Decorative light fixture including cooling system
US10103089B2 (en) * 2010-03-26 2018-10-16 Hamilton Sundstrand Corporation Heat transfer device with fins defining air flow channels
CN102798103B (en) * 2011-05-24 2016-06-01 奥斯兰姆有限公司 Module radiator for LED
US9275931B2 (en) * 2012-01-12 2016-03-01 Huang-Han Chen Heat dissipating module
US20160069622A1 (en) * 2013-04-23 2016-03-10 Alexiou & Tryde Holding Aps Heat Sink Having a Cooling Structure with Decreasing Structure Density
DE102013223461A1 (en) * 2013-11-18 2015-05-21 Rohde & Schwarz Gmbh & Co. Kg Heat sink to remove heat
KR101414290B1 (en) * 2014-01-14 2014-07-01 공관식 Laminating structure
US10030916B2 (en) * 2014-07-29 2018-07-24 Intel Corporation Fluid flow channel for enhanced heat transfer efficiency
US10004156B2 (en) * 2016-09-26 2018-06-19 Asia Vital Components Co., Ltd. Heat radiation fin structure
US10004159B2 (en) * 2016-09-26 2018-06-19 Asia Vital Components Co., Ltd. Water-cooling radiator unit and device thereof
US9986661B2 (en) * 2016-09-26 2018-05-29 Asia Vital Components Co., Ltd. Water cooling heat radiation device and module thereof
US10378836B2 (en) * 2016-09-26 2019-08-13 Asia Vital Components Co., Ltd. Water-cooling radiator assembly
US11587798B2 (en) * 2020-01-03 2023-02-21 Rolls-Royce North American Technologies Inc. High heat flux power electronics cooling design

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6218056A (en) * 1985-07-17 1987-01-27 Hitachi Ltd Semiconductor cooling device
US5051814A (en) * 1987-04-15 1991-09-24 The Board Of Trustees Of The Leland Stanford Junior University Method of providing stress-free thermally-conducting attachment of two bodies
JPH0666397B2 (en) * 1989-10-24 1994-08-24 住友金属工業株式会社 Radiating fin for IC package and manufacturing method thereof
US5892656A (en) * 1993-10-19 1999-04-06 Bass; John C. Thermoelectric generator
US5437328A (en) * 1994-04-21 1995-08-01 International Business Machines Corporation Multi-stage heat sink
US5583746A (en) * 1994-12-12 1996-12-10 Tennmax Trading Corp. Heat sink assembly for a central processing unit of a computer
JP3669792B2 (en) * 1996-10-24 2005-07-13 松下電器産業株式会社 Heat sink and manufacturing method thereof
JPH1147960A (en) * 1997-08-04 1999-02-23 Showa Alum Corp Heat exchanger
US6152215A (en) * 1998-12-23 2000-11-28 Sundstrand Corporation High intensity cooler

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104053337A (en) * 2013-03-15 2014-09-17 君瞻科技股份有限公司 Electronic device with heat radiating function and radiating module thereof

Also Published As

Publication number Publication date
US20020144809A1 (en) 2002-10-10
WO2002082536A3 (en) 2003-08-07
WO2002082536A2 (en) 2002-10-17

Similar Documents

Publication Publication Date Title
TW531632B (en) Laminated heat transfer device and method of producing thereof
US5860472A (en) Fluid transmissive apparatus for heat transfer
US5823249A (en) Manifold for controlling interdigitated counterstreaming fluid flows
TWI803460B (en) Converging split-flow microchannel evaporator and method of evaporatively cooling surface
US7156159B2 (en) Multi-level microchannel heat exchangers
US5884691A (en) Fluid transmissive moderated flow resistance heat transfer unit
US7305843B2 (en) Heat pipe connection system and method
JP5895301B2 (en) Heat exchanger
JP4101174B2 (en) Heat exchanger
CN103994675B (en) Heat exchanger
WO2006074583A1 (en) A plate radiator of a heat pipe type
TW200848683A (en) Heat transfer device
WO2007119783A1 (en) Cooling apparatus and power converter
US20020195231A1 (en) Laminated heat transfer device and method of producing thereof
CN113465430B (en) Ultrathin thermal diode based on gas-liquid coplanar structure and preparation method thereof
TWI542850B (en) Flat plate heat pipe structure and manufacturing method thereof
CN214507714U (en) Split type thermosiphon phase change radiator and industrial control equipment
JP2014142143A (en) Heat pipe
CN102012183B (en) Heat radiator and manufacturing method thereof
WO2011036854A1 (en) Heat exchanger
JP4013883B2 (en) Heat exchanger
JP2005229102A (en) Heatsink
TW201128160A (en) Allocation structure of capillary tissue in uniformizing plate, and allocation method thereof
JP2005201536A (en) Heat exchanger
TWI593935B (en) Assembling structure of heat dissipation device

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent