527855 五 、發明説明（ Λ' B7 10 15 經 濟 部 t 夬 標 準 A 員 工 消 費 合 作 社 印 製 20 本發明係提供—種輪冑速 層電路板壓合方法及其結構，特別m· 2-之六! 内外層阻抗匹配，以降彳一、疋曰#此達到電路板| 板者。 降“速信號反射及電磁干擾之電路i ] 按’一般傳統板厚為12 i 」方。式係如弟一圖所示’該電路板之第一、三、四及六； 層為訊號走線層S1、ς；9、α κ n 、 及S4,第二層為接地層GND 及弟五層為電源層PWR;其中， 氣介質之一面係用於佈設跫件10. 及弟/、層面向空 „段入士 π 仰叹令件10，而該第三層與第四層之丨 二i 口有二8mll厚之第一絕緣層20，該第三層與第二層及i 弟四層與第五層之間分別麼人 . : \ 口有一 6mil厚之第二絕緣層; ’“弟二層與第—層及第五層與第六層之間分別塵合 f :厚之第三絕緣層22，而且，該第一絕緣層2〇與 弟—、、、巴、、’彖層22之材質目前在業界係為聚酯膠片成型，該第 ，2緣層21之材Μ為—紙f、_纖維之義基材；在 -、貫佈線（Layout)時，常會有訊號線要穿層之需要，而丨 如習知上述之各層板_合後之結構，會使得第—層板幻； 對第二層板GND之阻抗值Rsl和第六層板以對第五層板:： PWR之阻抗值Rs4皆為71歐姆，而第三層板幻對第二声丨 板GND及第五層板PWR之阻抗值Rs2 ;第四層板幻對^ ; 二層板GND及苐五層板PWR之阻抗值Rs3則為仞歐姆；； 然而，習知之壓合構造有下列缺點： (1)高速信號反射嚴重：當電路板在走高速訊號時，丨 其傳輸線路之阻抗值設計，亦就是層與層之間之阻抗值，： it 4 閲 面 r> _ 第4頁 本纸張&度i適闲中內國家標$ ( A4现格（：M0X297公皆 527855 A: 五、發明説明（ 10 15 經 濟 部 中 央 樣 準 消 費 合 作 社 印 製 20 依照Intel投定之規格理論值，應在55Ω± 10%最好，也就 是在49.5Ω〜60.5Ω之間，由此我們可以看出，若吾人定義 苐層板及弟六層板為外層板’且第三層板及第四層板為 内層板時，則第一層板（外層板）S1及第六層板（外層板） S4之阻抗值Rsi及rs4分別與第三層板（内層板π]及第四11 層板（内層板)S3之阻抗值RS2及RS3相差25歐姆，而此一 || 内外層板阻抗之差距會造成阻抗差距過大而造成阻抗不匹 配之狀況，以致在真實的佈線（layout)過程中，當一高速|| 訊號在此一電路板中傳輸時，該高速訊號從外層，（如第一μ 層或第六層）穿層至内層（如第三層板或第四層板）時，會導i 致该鬲速訊號之訊號反射，在這裡我們可以算出該高速訊| ! 號的反射係數係為P 一〇 A > 丨 μ Z/ + ZO船心2一。·21，因此當南速訊 I 號穿層時反射嚴重，進而導致波形嚴重變差，造成信號品丨 質不良；而依照上述高速線路設計要求之阻抗亦皆超出了丨 此一範圍，實不適於走高速訊號。 i (2)磁通抵消變差：因為該高速訊號之反射會產生駐」 座，且該駐波會使高速訊號之電磁波輻射增強，使並磁通丨 抵消作用變差，而造成過高之電磁波干擾。 /、 ^ 綜上所述，_知道了高速訊號在電路板上傳輸時」 S造成高速訊號之訊號反射及電磁波干擾之原因， 丨 因為電路板之内外層阻抗不匹配所導致， 電路板之缺失，是以，本案創作人这白知 乍人以累積多年經驗，積極， 九，終有本創作『適於高速線路之板厚為12_之六層i 第5頁 ί 訂 本紙浪尺度適用中闽國家標芊（CNS ) A4^f 527855 Λ, Β7 五、發明説明（ 5 10 15 經濟部中央標準局員工消費合作社印製 20 電路板壓合方法及其結構』之產生。 本創作之主要目的，係提供—種可 i 及電磁波干擾的效果狀高速線路之板厚為_ 電路板壓合方法及其結構，。 /'If 本創作之主要特徵係提供適於高速線路之板厚為If 之^之=層電路㈣合方法及其結構，其中，該電路板^ 、一、四及六層為訊號走線層，該第二層為接地層丨I 五f係為電源層’其中，該第三層與第四層之』賃 緣層；該第三層與第二層及第四層與第五F 層之間分襲合有-第二絕緣層；該第二層與第—層i 五層與第六層之間分別塵合有—第三絕緣層；藉改變各該i1 絕緣敎厚度;使得電路板之料相的阻抗能匹配，以降I 低傳輸汛號之訊號反射及電磁波干擾。 : Μ犮是，為達到上述目的，係'可在於該電路板之第三芦； ^四層之間μ合有—厚度在152_168mil之間之第一絕ς: 層’该弟三層與第二層及第四層與第五層之間分別塵合有： 一厚度在5.7.6.3iml之間之第二絕緣層；及該第二層盘第一； 層及第五層與第六層之間分別壓合有一厚度在4 : 4.725mil之間之第三絕緣層。 ·丨 有關本創作為達上述目的、特徵所採用的技術手段及| 其功效，茲例舉較佳實施例並配合圖式說明如下： ： 第一圖係習知六層電路板之各層間的壓合及厚度示意： 圖 第二圖係本創作較佳實施例之各層間的壓合及厚度示i 本紙張尺度適用中國國家標準 第6頁 ) 之 訂 527855 Λ 7 Β7 五、發明説明（4 ο 1Χ 5 11 經濟部中央標隼局員工消費合作杜印製 ο 2 意圖。 第三圖係為本較佳實施例之部分放大示意圖 第四圖係為本較佳實施例之部分放大示意圖 圖號對照表： S5、S6、S7、S8 第一、三、四、六層 GND 接地層 PWR 電源層 請參考第二圖所示，本較佳實施例係為一板厚1.2mm丨 之六層電路板；其中：該電路板之第一、三、四及六層係厂 | 為訊號走線層S5、S6、S7及S8，第二層為接地層GND，i ] 而第五層則為電源層PWR ;且該電路板第一層S5及第六I I ； i 層S8面向空氣介質之一面可佈設有零件。 \ # 其中，該電路板之第三層S6與第四層S7之間係壓合有丨 丨 一第一絕緣層30 ;第三層S6與第二層GND及第四層S7與第ΐ ^ ，五層PWR之間係壓合有一第二絕緣層31 ;且第二層GND與第| | 一層S5及第五層PWR與第六層S8之間係壓合有一第三絕緣丨g . 層32,且第一層板S5對第二層板GND之阻抗值為Rs5和： ί - 第六層板S8對第五層板PWR之阻抗值為Rs8，而第三層； 丨 板S6對第二層板GND及第五層板PWR之阻抗值為Rs6 ; : I ： i 第四層板S7對第二層板GND及第五層板PWR之阻抗值為； 丨 Rs7。 . | 為使達到阻抗匹配之目的，可藉由下列之公式，約略： Ϊ .' Ϊ 算出各絕緣層之厚度： ! I 公式一（外層阻抗Rs5及Rs8之計算公式）： I ； 第7頁 !527855 V. Description of the invention (Λ 'B7 10 15 Ministry of Economic Affairs 夬 Standard A Printed by Employee Consumer Cooperatives 20 The present invention provides a kind of lamination method and structure of circuit board lamination, especially m · 2-six! The impedance matching of the inner and outer layers is to reduce the circuit board and board by reducing the frequency. This "reduces the circuit of the speed signal reflection and electromagnetic interference i] Press 'the general traditional board thickness is 12 i'. The formula is as shown in Figure 1. 'The first, third, fourth, and sixth of this circuit board are shown; layers are signal routing layers S1, ς; 9, α κ n, and S4, the second layer is the ground layer GND and the fifth layer is the power layer PWR Among them, one side of the gas medium is used to lay out the pieces 10. The floor and the floor are facing the empty section, and the order piece 10 is sighed, and the third and fourth floors have two 8mll. Thick first insulating layer 20, the third layer and the second layer, and the fourth layer and the fifth layer, respectively.: \ There is a second insulation layer 6mil thick; -The layer and the fifth layer and the sixth layer are respectively dusty f: a thick third insulating layer 22, and the first insulating layer 20 and the brother-,,, 'The material of the ply layer 22 is currently formed in the industry for polyester film molding. The material M of the second edge layer 21 is-paper f, _ fiber meaning substrate; in-, continuous wiring (Layout), there are often The signal line needs to pass through the layers, and the structure of the above-mentioned layers will make the first-layer board magic. The impedance value Rsl of the second-layer board GND and the sixth-layer board will be opposite to the fifth. Layer board :: The resistance value Rs4 of PWR is 71 ohms, while the third layer board is paired with the second sound 丨 board GND and the fifth layer board is PWR resistance Rs2; the fourth layer board is paired with ^; the second layer board is GND And the resistance value Rs3 of the PWR of the five-layer board is 仞 ohm; However, the conventional compression structure has the following disadvantages: (1) High-speed signal reflection is serious: When the circuit board is traveling at high-speed signals, the impedance of its transmission line Value design, which is the impedance value between layers: it 4 reading surface r> _ page 4 this paper & degree i leisure Chinese national standard $ (A4 present grid (: M0X297 Gong 527855 A V. Description of the invention (10 15 Printed by the Central Prototype Consumer Cooperative of the Ministry of Economic Affairs 20 According to the theoretical value of the specifications set by Intel, it should be at 55Ω ± 10%. OK, that is, between 49.5Ω ~ 60.5Ω. From this we can see that if we define the plywood and the sixth layer as the outer layer, and the third and fourth layers are the inner layer, Then the impedance values Rsi and rs4 of the first layer (outer layer) S1 and the sixth layer (outer layer) S4 are respectively the impedances of the third layer (inner layer π) and the fourth 11th layer (inner layer) S3. The difference between the values RS2 and RS3 is 25 ohms, and this || the difference in the impedance between the inner and outer layers will cause the impedance gap to be too large and cause impedance mismatch, so that in a real layout process, when a high-speed || When transmitting in this circuit board, the high-speed signal passes from the outer layer (such as the first μ layer or the sixth layer) to the inner layer (such as the third layer or the fourth layer), which will cause the high speed. The signal reflection of the signal, here we can calculate the reflection coefficient of the high-speed signal |! Is P 10A > 丨 μ Z / + ZO ship center 21. · 21, so when the South Speed Signal I penetrates the layer, the reflection is serious, which causes the waveform to be seriously deteriorated, resulting in poor signal quality. And the impedances in accordance with the above high-speed line design requirements also exceed this range, which is really uncomfortable. For high-speed signals. i (2) The magnetic flux cancellation becomes worse: because the reflection of the high-speed signal will generate a stand, and the standing wave will enhance the electromagnetic wave radiation of the high-speed signal, making the combined magnetic flux and offsetting effect worse, resulting in an excessively high level. Electromagnetic wave interference. /, ^ In summary, _ know the reasons for high-speed signal transmission and electromagnetic wave interference when high-speed signals are transmitted on the circuit board, 丨 due to the impedance mismatch between the inner and outer layers of the circuit board, the absence of the circuit board Therefore, the creator of this case, Bai Zhizha, has accumulated many years of experience, and is active. Nine, finally, this creation "The thickness of the board suitable for high-speed lines is 12_ 的 六层 i page 5 Fujian National Standards (CNS) A4 ^ f 527855 Λ, Β7 V. Description of the invention (5 10 15 Printed circuit board bonding method and structure of the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs ”The main purpose of this creation The board thickness of high-speed lines that provide an effect that can be interfered with by electromagnetic waves is _ circuit board pressing method and structure. / 'If The main feature of this creation is to provide a board thickness suitable for high-speed lines. ^ 的 = Layer circuit bonding method and structure, wherein the circuit board ^, one, four, and six layers are signal routing layers, the second layer is a ground layer, and I and f are power layers. Marginal layer ; The third layer and the second layer and the fourth layer and the fifth F layer are separated into a second insulation layer; the second layer and the first layer i and the sixth layer are dusty respectively Yes-the third insulation layer; by changing the thickness of each of the i1 insulating cymbals; making the impedance of the material phase of the circuit board match, so as to reduce the signal reflection and electromagnetic interference of the transmission signal I: Μ 犮 is to achieve the above purpose, It can be the third reed of the circuit board; ^ There are μ between the four layers-the first insulation layer with a thickness of 152_168mil: layer 'the third layer and the second layer and the fourth layer and the fifth layer There are respectively: a second insulating layer with a thickness between 5.7.6.3iml; and the first layer of the second layer disk; a thickness of 4 is laminated between the fifth layer and the fifth layer and the sixth layer: The third insulation layer between 4.725mil. · 丨 About the technical means and effects used in this creation to achieve the above-mentioned purposes and features, the preferred embodiment is illustrated below with the illustration of the drawings: The schematic illustration of the bonding and thickness between the layers of the conventional six-layer circuit board: Figure 2 is the bonding and bonding between the layers of the preferred embodiment of this creation. Dimensions i This paper size applies to the Chinese National Standards page 6) 527855 Λ 7 Β7 V. Description of the invention (4 ο 1 × 5 11 Staff consumption cooperation printing by the Central Bureau of Standards of the Ministry of Economic Affairs ο 2 intentions. The third diagram This is a partially enlarged schematic diagram of the preferred embodiment. The fourth figure is a partially enlarged schematic diagram of the preferred embodiment. Figure number comparison table: S5, S6, S7, S8 First, third, fourth, and sixth layers of GND ground layer PWR power supply Please refer to the second figure for the layers. This preferred embodiment is a six-layer circuit board with a thickness of 1.2mm. Among them: the first, third, fourth, and sixth-layer systems of the circuit board Layers S5, S6, S7 and S8, the second layer is the ground layer GND, i] and the fifth layer is the power layer PWR; and the first layer S5 and the sixth II of the circuit board; i layer S8 faces one side of the air medium Can be equipped with parts. \ # Among them, a third insulating layer 30 is laminated between the third layer S6 and the fourth layer S7 of the circuit board; the third layer S6 and the second layer GND and the fourth layer S7 and the ΐ ^ There is a second insulation layer 31 laminated between the five layers of PWR; and a third insulation layer g laminated between the second layer GND and the first | S5 and the fifth layer PWR and the sixth layer S8. 32, and the resistance value of the first layer S5 to the second layer GND is Rs5 and: ί-The resistance value of the sixth layer S8 to the fifth layer PWR is Rs8, and the third layer; The impedance values of the second layer GND and the fifth layer PWR are Rs6;: I: i The impedance values of the fourth layer S7 to the second layer GND and the fifth layer PWR are; 丨 Rs7. . | In order to achieve the purpose of impedance matching, the following formula can be approximated: Ϊ. 'Ϊ Calculate the thickness of each insulation layer:! I Formula One (the formula for calculating the outer layer resistance Rs5 and Rs8): I; page 7 !
主:K張尺度適用中國國家標寒（CNS ) Λ4規格（公# 527855 Λ 7 Β7 五 發明説明（ 其中’如第三圖所示，五4.5 • 係為介雷舍者+ · Η，係為介電厚度，亦即第一〃 _ ， 層與第六層間之第三絕緣層32的厚度V、弟二層間，第」 W=6mil，係為走線線寬； 丁 =1.4mi卜係為走線厚度’· 公式二里拉Rs6及Rs7之計算公式）Main: K Zhang scales are applicable to China National Standard Cold (CNS) Λ4 specifications (public # 527855 Λ 7 Β7 Five invention descriptions (where 'as shown in the third picture, five 4.5 • Department of Leisher + + Η, Department of The dielectric thickness, that is, the thickness V of the third insulating layer 32 between the first layer and the sixth layer, and the second layer between the second layer, the second "W = 6mil, which is the line width; D = 1.4mi is Trace thickness' · Formula 2 Lira Rs6 and Rs7 calculation formula)
Zo2: 1 一 r ^ τ — ^(A + D-hT) j ΊΕ • - -- I · til. · 幅衣丨 (請先間讀背面之/.'^意事項再迖寫本1| —111 1 ji J_----------- -------- 1_ I」 ο 11 經濟部.中央標準局負工消費合作社印製 本 5 lx ο 2 /ί 尸、 其中’凊參考第四圖，尸—45，在达 少 D，係為介電常數 A ’係為介電厚度，亦g 地声之Η另π啼土 丌即釩唬走線層S2與^ ^層之間及《走線層S3與電源層之間的第二絕緣層」 D ’料介電厚度，亦即訊號走線層S2與言 號走線層S3之間的第一絕緣層； 丁 =1·4 ’係為走線厚度； 首先，Zol及Ζο2之值必須落在49 5Ω〜6〇5Ω之間习 能符合設計要求，故可先從公式一中，分別代入ζ〇ι=49· Ω及.Ζο1，.5Ω ’而求得η之值係介於—範圍中，女 ^5πη1〜6.0mil，又如第二圖所示，我們知道各層之板厚佳 第-層至第六層分別為〇.7mil、14mil、14mil、14恤、14加 及0.7mil’可求得總板厚為7mii;且因為電路板之板厚篇 第8頁 #1 -¾用中關冑料.ί ^Γ7λ4^7ΙιZo2: 1 a r ^ τ — ^ (A + D-hT) j ΊΕ •--I · til. · Blouse 1 ji J _----------- -------- 1_ I ”ο 11 Ministry of Economic Affairs. Printed copy of the Central Standards Bureau's Consumer Cooperatives 5 lx ο 2 / ί, where '凊 Refer to the fourth picture, corpse-45, in Da Shao D, the dielectric constant A 'is the dielectric thickness, and g is the sound of the ground, and the other is the vanadium wiring layer S2 and the ^ ^ layer. And "the second insulating layer between the wiring layer S3 and the power supply layer" D 'the dielectric thickness of the material, that is, the first insulating layer between the signal wiring layer S2 and the signal wiring layer S3; D = 1 · 4 'is the thickness of the trace; first, the values of Zol and ZO2 must fall between 49 5Ω ~ 605Ω, and the habit can meet the design requirements, so you can first substitute ζ〇ι = 49 · from formula one respectively. Ω and .Zο1, .5Ω ', and the value of η is in the range, female ^ 5πη1 ~ 6.0mil, and as shown in the second figure, we know that the thickness of each layer is good. 7mil, 14mil, 14mil, 14shirt, 14plus and 0.7mil ', respectively, to obtain a total board thickness of 7mii; and For the board thickness of the circuit board Page 8 # 1-¾ using Zhongguan materials. ^ ^ Γ7λ4 ^ 7Ιι
< 297 公 I 527855 Λ ___ Β7 五、發明説明（6 ) ；10 1 15 ? 經< 297 public I 527855 Λ ___ Β7 V. Description of the invention (6); 10 1 15?
準 工 消 費 合 社 印 製 20 1.2mm=48mil，故可得出 2H+2A+D=48mil—7mil=41mil，j 2A+D=41mil—2H，即2A+D=42mil〜43mil之間，繼而在公式丨 1一中’分別代入一 A及D之值計算出Zo2，並比較z〇l與Zo21 | 兩者數值的差距，及兩者是否皆落在55士 1〇%Ω (49,5Ω〜6〇.5|| I rib Ω)之間’再依此分別調整η、A及D之數值，再代入公式丨f 一及公式二中計算出另一 Z〇l及Zo2值，再相互比較；利11 用如此反覆試誤（Try anci Error)的方法，來調整η、A及|ΐ D的厚度大小，即能求出z〇l與ζ〇2最接近之值，並且兩 者之值皆在55士10%〇(49.5〇〜60.5〇)之間，且114及1)^ 之最適當厚度因而確定，使得2H+2A+D+各層板厚（7MIL)d 電路板之板厚丨 藉由上述之公式及求解過程，再經測試找出最佳值，： 可求得當 H=4. 5mil，A=6mil 及 D=16mil 時，Ζο1=55Ω，Zo2=56 Ω ’ 皆在 55士 1〇%Ω(49·5Ω〜60.5Ω)之内，而且 2H+2A+D+各：層板厚和（7mil>電路板板厚（48mil，即L2mm)，内外層I 阻抗值相差甚少，故達到阻抗匹配。 藉由上述構造，可達到之實用功效如后： (1) 降低向速訊號之反射：當高速訊號在此電路板 中傳輸時，因内外層阻抗匹配，該高速訊號之訊號反射量（駐i 波）大幅減少，且符合Intd設定其層與層之間的阻抗值規； 格在55Ω ±10%之規格理論值，訊號品質大大改善。 (2) 磁通抵消變佳：由於訊號反射量變小，自然降低 了電磁波之干擾。 (3) 在Lay〇ut時，雖然走線穿至不同層，由於壓以： HO / 527855 IT： A ； H7 發明説明（ 控制，所以不需改變線寬，而仍可達到阻抗控制的優點， 可達到lay out的時效性。 綜上所述，本創作之『適於高速線路之板 i 之六層電路板Μ合方法及其結構』， 絕緣層厚度纽變層與層之.阻抗值，料達到各 的阻抗匹配，且申清雨未見於刊物亦未公二丨 型專利之新穎、進步等要件。 1使用付a新iThe quasi-industrial consumer cooperative printed 20 1.2mm = 48mil, so we can get 2H + 2A + D = 48mil—7mil = 41mil, j 2A + D = 41mil—2H, that is, between 2A + D = 42mil ~ 43mil, and then Calculate Zo2 by substituting the values of A and D in formula 丨 1, and compare the difference between z〇l and Zo21 | and whether they both fall within 55 ± 10% Ω (49,5Ω ~ 6〇.5 || I rib Ω) ', and then adjust the values of η, A, and D respectively, and then substitute them into formula 丨 f one and formula two to calculate another value of ZO and Zo2, and then mutually Compare; Li 11 Use this method of Try anci Error to adjust the thickness of η, A, and | ΐ D, that is, the closest value of z〇l and ζ〇2 can be obtained, and The values are between 55 ± 10% 〇 (49.5〇 ~ 60.5〇), and the optimal thickness of 114 and 1) ^ is determined, so that 2H + 2A + D + board thickness of each layer (7MIL) d board thickness 丨Based on the above formula and solution process, the best value is found after testing: It can be found that when H = 4.5mil, A = 6mil and D = 16mil, Zο1 = 55Ω, Zo2 = 56 Ω 'are all at 55 ± Within 10% Ω (49 · 5Ω ~ 60.5Ω), and 2H + 2A + D + each: layer (7mil > circuit board thickness (48mil, L2mm), the impedance difference between the inner and outer layer I is very small, so impedance matching is achieved. With the above structure, the practical effects can be achieved as follows: (1) Reduce the speed signal Reflection: When the high-speed signal is transmitted in this circuit board, due to the impedance matching of the inner and outer layers, the signal reflection amount (standing i wave) of the high-speed signal is greatly reduced, and it conforms to Intd's set of impedance values between its layers; The theoretical value of the specification is 55Ω ± 10%, and the signal quality is greatly improved. (2) The magnetic flux cancellation becomes better: As the signal reflection amount becomes smaller, the interference of electromagnetic waves is naturally reduced. (3) In Lay〇ut, although the wiring Wear to different layers, because of pressing: HO / 527855 IT: A; H7 invention description (control, so there is no need to change the line width, but still can achieve the advantages of impedance control, can reach the timeliness of lay out. To sum up , "The six-layer circuit board M-combining method and structure of the board i suitable for high-speed lines" in this creation, the thickness of the insulation layer and the impedance value of the layer and the layer are expected to reach the impedance matching, and Shen Qingyu has not been seen in the publication Also not public Lee's novel, progress and other elements. 1 using a new i pay
惟，上揭圖式及說明，僅為本創 I 為限定本創作之實施；大凡熟悉該項 只e例而已，巧 10 請 先 閲 面 — 注 意 事 項 再 填 寫 本 特徵範疇所作其他等效變化或修飾，比π人仕，依本創作| 之申請專利範圍内。 白應/函盍在以下本g 15 經濟部中央標準局員工消費合怍社印製 ο 2 爭尺管,适用中國國穿 第10頁However, the above-mentioned diagrams and descriptions are only for the purpose of limiting the creation of this creation. Those who are familiar with this example are only familiar with it. Please read it first—Notes before filling in other equivalent changes made in this feature category or Modified, than π person official, according to this creation | patent application scope. Bai Ying / Han Ying printed in the following g 15 Printed by the Consumers' Union of the Central Bureau of Standards of the Ministry of Economic Affairs ο 2 Measure Rule, Applicable to Chinese National Clothing Page 10