TW527018U - Heat dissipation module of 3D stacked package - Google Patents

Heat dissipation module of 3D stacked package

Info

Publication number
TW527018U
TW527018U TW90215641U TW90215641U TW527018U TW 527018 U TW527018 U TW 527018U TW 90215641 U TW90215641 U TW 90215641U TW 90215641 U TW90215641 U TW 90215641U TW 527018 U TW527018 U TW 527018U
Authority
TW
Taiwan
Prior art keywords
heat dissipation
dissipation module
stacked package
stacked
package
Prior art date
Application number
TW90215641U
Other languages
Chinese (zh)
Inventor
Chun-Kai Liou
Shin-Terng Chiang
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW90215641U priority Critical patent/TW527018U/en
Publication of TW527018U publication Critical patent/TW527018U/en

Links

TW90215641U 2001-09-12 2001-09-12 Heat dissipation module of 3D stacked package TW527018U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW90215641U TW527018U (en) 2001-09-12 2001-09-12 Heat dissipation module of 3D stacked package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90215641U TW527018U (en) 2001-09-12 2001-09-12 Heat dissipation module of 3D stacked package

Publications (1)

Publication Number Publication Date
TW527018U true TW527018U (en) 2003-04-01

Family

ID=28450933

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90215641U TW527018U (en) 2001-09-12 2001-09-12 Heat dissipation module of 3D stacked package

Country Status (1)

Country Link
TW (1) TW527018U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7187070B2 (en) 2003-09-08 2007-03-06 Advanced Semiconductor Engineering, Inc. Stacked package module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7187070B2 (en) 2003-09-08 2007-03-06 Advanced Semiconductor Engineering, Inc. Stacked package module

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model