TW522745B - Method for manufacturing condenser microphone - Google Patents
Method for manufacturing condenser microphone Download PDFInfo
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- TW522745B TW522745B TW90114945A TW90114945A TW522745B TW 522745 B TW522745 B TW 522745B TW 90114945 A TW90114945 A TW 90114945A TW 90114945 A TW90114945 A TW 90114945A TW 522745 B TW522745 B TW 522745B
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522745 五、發明說明(1) 發明領域 本發明係有關於一種製造電容式麥克風的方法,特別 是有關於一種能夠直接接合場效電晶體(Field Effect Transistor,以下簡稱FET)晶片之電容式麥克風的製造 方法。其中,該FET晶片與一印刷電路板接合,因之達到 縮小電容式麥克風體積及增進其功能的目的。 發明背景 一般的電容式麥克風含有一電容,該電容中一隔膜的 導電薄膜與一固定電極平行配置,其係用以將聲波震動轉 換為電訊號輸出。 此種電容式麥克風可應用於麥克風、電話或是錄音機 中。 圖一顯示傳統電容式麥克風的結構分解圖;圖二顯示 圖一之傳統電容式麥克風的剖面圖。 如圖所不5傳統的電容式麥克風包括:一^殼體8 ^其 頂面中央具有一聲波導入孔9 ; 一過濾器11,其係裝設於 殼體8之上,用以防止灰塵、濕氣及異物藉由聲波導入孔9 + 進入殼體8内;一隔膜環7,其係裝設於殼體8之内,用以 在殼體8内部隔出一空間,當聲波由聲波導入孔9傳入殼體 8後,能藉由此一空間將震動導入;一隔膜6,其係裝設於 隔膜環7的底端,能夠隨著該導入的聲波而震動;一間隙522745 V. Description of the invention (1) Field of the invention The present invention relates to a method for manufacturing a condenser microphone, in particular to a condenser microphone capable of directly bonding a Field Effect Transistor (hereinafter referred to as a FET) chip. Production method. Among them, the FET chip is bonded to a printed circuit board, so that the purpose of reducing the volume of the condenser microphone and improving its function is achieved. BACKGROUND OF THE INVENTION A general condenser microphone includes a capacitor, in which a conductive film of a diaphragm is arranged in parallel with a fixed electrode, and is used to convert sound wave vibration into electrical signal output. This condenser microphone can be used in a microphone, telephone or recorder. Fig. 1 shows an exploded view of a conventional condenser microphone; Fig. 2 shows a sectional view of the conventional condenser microphone of Fig. 1. As shown in Fig. 5, the conventional condenser microphone includes: a casing 8 having a sound wave introduction hole 9 in the center of its top surface; a filter 11 installed on the casing 8 to prevent dust, Moisture and foreign objects enter the casing 8 through the sound wave introduction hole 9 +; a diaphragm ring 7 is installed in the casing 8 to isolate a space inside the casing 8 when the sound waves are introduced by the sound waves After the hole 9 is introduced into the housing 8, vibration can be introduced through this space; a diaphragm 6, which is installed at the bottom end of the diaphragm ring 7, can vibrate with the introduced sound wave; a gap
522745 五、發明說明(2) " 塾f 5 ’其係裝設於隔膜6的底端,用以保持隔膜6的振動 狀態’使得能夠傳遞聲波震動;一架座3,其係裝設於間 隙塾圈5的底端,用以支撐及固定麥克風各元件,並防止 麥克風因内部元件移位而變形;一背孔板4裝設於架座3 内’藉由間隙墊圈5而與隔膜6間保持一預設的間隙,其係 用以維持該聲波震動狀態,並用以偵測電容,其中該電容 係隨隔膜6的振動程度而變化;一連接環1〇裝設於架座3 内’位於背孔板4的底部,其係用以將背孔板4與場效電晶 體FET2的閘極連結;一印刷電路板1,其上具有由導電物 貝構成的電路,場效電晶體F E T 2與印刷電路板1連結,其 係用以將該聲波震動放大並轉換為電訊號。 上述的FET2係由一半導體廠製造及封裝。FET2的封裝 過程如下所述··首先,一晶圓依照預設值劃分為複數個晶 格(c e 11 ),且劃分出的每一個晶格即成為一個f e τ。將 FET從晶圓片上切割出來之後,在其閘極上連結一預設長 度的針,並在FET晶片底部形成其汲極和源極。其後,對 每一 FET實施一封膠程序,其係藉由環氧樹脂(邛〇χγ resin )來達成,如此便完成FET2的製造。 傳統的電谷式麥克風製造方法,需利用以上述方法製成的 FET2 。 、 圖一所示,為一以傳統方法製造出的電容式麥克風之 結構圖。其中,隔膜環7、隔膜6、間隙墊圈5、背孔板4及 架座3係依照上述順序裝設於殼體9内。再者,印刷電路板 1及接合於其上的FET2係固接於架座3和殼體9的底部。如522745 V. Description of the invention (2) " 塾 f 5 'It is installed on the bottom end of the diaphragm 6 to maintain the vibration state of the diaphragm 6' so that it can transmit sound vibration; a stand 3, which is installed on The bottom end of the gap ring 5 is used to support and fix the components of the microphone and prevent the microphone from being deformed due to the displacement of the internal components. A back hole plate 4 is installed in the base 3 'through the gap washer 5 and the diaphragm 6 A predetermined gap is maintained between them to maintain the acoustic vibration state and to detect a capacitor, where the capacitor varies with the degree of vibration of the diaphragm 6; a connecting ring 10 is installed in the base 3 ' It is located at the bottom of the back hole plate 4 and is used to connect the back hole plate 4 with the gate of the field effect transistor FET 2. A printed circuit board 1 has a circuit made of conductive material on it, and the field effect transistor FET. 2 is connected to the printed circuit board 1 and is used to amplify and convert the sound wave vibration into an electric signal. The above-mentioned FET2 is manufactured and packaged by a semiconductor factory. The packaging process of FET2 is as follows ... First, a wafer is divided into a plurality of lattices (c e 11) according to a preset value, and each divided lattice becomes a f e τ. After the FET is cut from the wafer, a gate of a predetermined length is connected to its gate, and its drain and source are formed at the bottom of the FET wafer. Thereafter, a glue process is implemented for each FET, which is achieved by epoxy resin (邛 〇χγ resin), thus completing the manufacture of FET2. The traditional manufacturing method of the electric valley microphone requires the use of the FET2 made by the above method. Figure 1 shows the structure of a condenser microphone manufactured by a traditional method. Among them, the diaphragm ring 7, the diaphragm 6, the gap washer 5, the back hole plate 4, and the holder 3 are installed in the casing 9 in the above order. Furthermore, the printed circuit board 1 and the FET 2 bonded thereto are fixed to the bottom of the base 3 and the case 9. Such as
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五、發明說明(3) 此便完成一電容式麥克風的製造。 焊接方式接合,其過程 上述FET2和印刷電路板1藉由 如下述: 首先,FET2的閘極、源 對應的孔洞接合。FET2的閘 係藉由點接觸法或連接環1 〇 較廣為使用。 極、汲極與印刷電路板1上相 極且與为孔板4連結,該連結 達成。近來尤以連接環接合法 為了將FET2與印刷電路板丨接合,FET2的閘極、源 極、汲極的接腳末端須以一預設角度向印刷電路板丨彎 曲。 FET2的閘極、源極、没極之彎曲端係插入印刷電路板 1的-透通孔中。且FET2的閘極、源極、汲極的端點,經 由該透通孔穿過印刷電路板1,由印刷電路板1的背面伸 出。而FET2的閘極、源極、汲極突出於印刷電路板i背面 的部分,再依據一預設角度向印刷電路板丨折曲,使得能 夠環繞印刷電路板1,以達到FET2和印刷電路板丄暫時固定 的效果。在此製造程序完成之後,上述被折曲用以暫時固 定FET2和印刷電路板1的每一個端腳,將被折回原先的角 度。 上述FET2和印刷電路板i的接合,係藉由焊接法或一灿 表面黏著元件(Surface Mount Device,SMD)來達成。 元成F E T 2和印刷電路板1的接合後,再將印刷電路板1 組裝於殼體9内,而製成一電容式麥克風。 電容式麥克風的體積係取決於FET2的大小,若一電容5. Description of the invention (3) This completes the manufacture of a condenser microphone. The process of bonding by soldering is as follows: First, the FET2 gate and source corresponding holes are bonded. The gate of FET2 is widely used by the point contact method or the connection ring 10. The electrode and the drain electrode are connected to the phase electrode on the printed circuit board 1 and connected to the orifice plate 4, and the connection is achieved. Recently, the connection ring bonding method has been particularly used. In order to bond the FET2 to the printed circuit board, the terminal ends of the gate, source, and drain of the FET2 must be bent toward the printed circuit board at a predetermined angle. The curved ends of the gate, source, and end of the FET 2 are inserted into the through-holes of the printed circuit board 1. The gate, source, and drain terminals of the FET 2 pass through the printed circuit board 1 through the through hole and protrude from the back surface of the printed circuit board 1. The gate, source, and drain of the FET2 protrude from the back of the printed circuit board i, and then bend toward the printed circuit board according to a preset angle, so that the printed circuit board 1 can be surrounded to reach the FET2 and the printed circuit board.丄 Temporarily fixed effect. After this manufacturing process is completed, each of the pins bent to temporarily fix the FET 2 and the printed circuit board 1 will be folded back to the original angle. The above-mentioned bonding of the FET2 and the printed circuit board i is achieved by a soldering method or a bright surface mount device (SMD). After Yuan Cheng F E T 2 and the printed circuit board 1 are joined, the printed circuit board 1 is assembled in the casing 9 to form a condenser microphone. The volume of a condenser microphone depends on the size of the FET2.
第7頁 522745 五、發明說明(4) 夕見風所採用的F E 丁 2係以上述方法製造,則該電容式麥 八*的尽度L可能達到i,5mm之譜。 由然而,傳統的電容式麥克風引發了一些問題:其一, &FET2的閘極、源極、汲極的接腳經過反覆彎折,其折 處可能會斷離;其二,由於FET2和印刷電路板1係由焊 ^法接合’可能因接觸電阻而產生雜音;其三,若為了佈 、欠而在印刷電路板1的背面加熱,則F E T 2的端腳可能會斷 離。 另一方面,傳統的電容式麥克風製造方法中,重要元 件FET的製造技術和供給量完全仰賴晶圓廠,而使得電容 式麥克風的產量大受限制。 發明概要 ίΓ月公第一目的係提供一種製造電容式麥克風的方 法’ 中’ FET晶片係直接與一印刷電路板接合,以 因FET端腳斷離而產生的功能缺陷, 容式麥克風的體積。 去除雜《並減少電 為達成本發明的目的,本發明提出_種製 克風的方法,其中,該電容式麥克風 ,夕 環、一隔膜、一間隙墊圈、一架座、—=a又肢、一隔膜 環、一FET晶片、一印刷電路板,該月孔板、一連接 挪· 邊衣造方法包括下列步Page 7 522745 V. Description of the invention (4) The F E Ding 2 used by Xi Jianfeng is manufactured by the above-mentioned method, and the degree of fullness L of the capacitive microphone 8 * may reach the spectrum of i, 5mm. However, conventional condenser microphones have caused some problems: First, the gate, source, and drain pins of & FET2 have been repeatedly bent, and their folds may be broken; second, because FET2 and The printed circuit board 1 is bonded by soldering. Noise may be generated due to contact resistance. Third, if the back surface of the printed circuit board 1 is heated for cloth or underheating, the pins of the FET 2 may be disconnected. On the other hand, in the traditional manufacturing method of condenser microphones, the manufacturing technology and supply of important component FETs are completely dependent on the wafer fab, so that the production of condenser microphones is greatly restricted. SUMMARY OF THE INVENTION The first object of the invention is to provide a method for manufacturing a condenser microphone. In the method, the FET chip is directly bonded to a printed circuit board to reduce the functional defects caused by the disconnection of the FET pins, and the volume of the condenser microphone. In order to reduce the cost and reduce electricity, in order to achieve the purpose of the invention, the present invention proposes a method for restraining wind, wherein the condenser microphone includes a ring, a diaphragm, a gap washer, a stand, and a == a limb. , A diaphragm ring, a FET chip, a printed circuit board, the moon hole plate, a connection and a side garment manufacturing method include the following steps
522745 五、發明說明(5) 將該FET晶片之閘極端固定於該£p 位置,並©化(curi^ )之; ’電路板上的對應 將該FET晶片之汲極與源極端分別 & 板上的對應位置,其係藉由金屬線為之疋於該印刷電路 印刷電路板的該FET晶片封膠,並固化之’將固接於該 將該隔膜環、該隔膜、該間隙塾圈、▲力 板、該連接環以及固接有該FET晶片 忒架座、該背孔 依照上述順序組裝於該殼體内。 、/印刷電路板 發明詳細說明 為充分揭露 圖式三詳細說明 圖三係為依 電容式麥克風的 如圖所示, 一殼體3 8,其係 並維持該電容式 聲波導入孔39 ; 以防止灰塵、濕 内;一隔膜環3 7 部隔出一空間, 藉由此一空間將 隔膜環37的底端 式麥克風製造 式麥克風的截 電容式麥克風 容式麥克風的 形狀,殼體38 其係裝設於殼 聲波導入孔3 9 内部,其係用 導入孔3 9傳入 本發明之電容 如下。 據本發明電容 一特定部分。 依據本發明的 用以保護該電 麥克風的外部 一過濾器41, 氧及異物藉由 裝設於殼體38 當聲波由聲波 該聲波震動導 ,能夠隨著該 方法,茲配合 面圖,顯示該 包括: 内部各元件, 的頂面具有一 體38外部,用 進入殼體38 以在殼體3 8内 殼體38後,能 入;一隔膜36,其係裝設於 導入聲波震動而震動;一間522745 V. Description of the invention (5) Fix the gate terminal of the FET chip at the £ p position and make it (curi ^); 'The corresponding on the circuit board separates the drain terminal of the FET chip from the source terminal & The corresponding position on the board is to seal the FET chip of the printed circuit printed circuit board with a metal wire, and cure it to be fixed to the diaphragm ring, the diaphragm, and the gap ring. The force plate, the connecting ring, the FET chip holder, and the back hole are assembled in the casing in the above order. / / Detailed description of the printed circuit board invention to fully disclose Figure III Detailed description Figure III is a condenser microphone as shown in the figure, a housing 38, which is and maintains the capacitive acoustic wave introduction hole 39; to prevent Dust, wet inside; a diaphragm ring 37 separates a space, and the space of the diaphragm ring 37's bottom-end microphone-manufactured microphone is the shape of the condenser microphone condenser microphone. The capacitor provided in the acoustic wave introduction hole 3 9 of the shell is introduced into the capacitor with the introduction hole 3 9 as follows. Capacitors according to the present invention have a specific part. According to an external filter 41 for protecting the electric microphone according to the present invention, oxygen and foreign matter are installed in the housing 38 when the sound wave is guided by the sound wave and the sound wave vibration, which can be displayed along with the method in accordance with the plan view. Including: the internal components, the top surface has an integrated 38 exterior, can be accessed after entering the casing 38 to the inside of the casing 38, 8; a diaphragm 36, which is installed to introduce acoustic vibration and vibrate; between
522745 五、發明說明(6) _ "" "— 隙墊圈35裝設於隔膜36的底端,其係用以保持隔膜%的振 動狀態,使得能夠傳遞該聲波震動;一架座33裝設於間隙 墊圈35的底端,其係用以支撐及固定該電容式麥克風的各 =件,並防止該電容式麥克風因内部元件移位而變形;— 背孔板34裝設於架座33内部,其係藉由間隙墊圈35而與隔 膜36間保持一預設大小的間隙,用以維持該聲波震動爿欠阳 態,並用以偵測電容,其中該電容係隨隔膜36的振動程产 2變:匕,·-連接環40裝設於架座33内,位於背孔板以“ 面,其係用以將背孔板34與FET32的閘極連結;一 一 路板31,其上佈有由導電物質構成的電路;場效電晶雕 FET32與印刷電路板31連結,其係用以將該 曰月且 並轉換為電訊號。 耳及裊動放大 上述依據本發明的電容式麥克風 述。 、心衣仏方法如下所 首先,將一晶圓(disc wafer )分自丨成★ 其中,該晶圓係由作為半導體積體電^成稷數個晶片, 成。上述晶圓之分割,ΐ = = = 4料的單晶石夕所構 託·^001)或鋸割法(sawing method)為:Criblng 皆係按照預設值,於水平及垂直兩種方向^兩種方法 之分割成複數個晶片,只是切割法係以该晶圓,將 而鋸割法則是以輪型鋸刀為之。近年來扭切刀為之, 用,其原因在於該方法造成的切面較平整較廣為使 緻的晶圓分割。此步驟中,由晶圓分割的完成較細 為0· 4mm X 〇. 4mm。 的日日片,其大小522745 V. Description of the invention (6) _ " " " — The gap washer 35 is installed at the bottom end of the diaphragm 36, which is used to maintain the vibration state of the diaphragm, so that the acoustic vibration can be transmitted; a stand 33 Mounted on the bottom end of the gap washer 35, which is used to support and fix the components of the condenser microphone and prevent the condenser microphone from being deformed due to the displacement of internal components;-the back hole plate 34 is installed on the stand Inside 33, a gap of a preset size is maintained between the diaphragm 36 and the diaphragm 36 through a gap washer 35 to maintain the acoustic vibration in a non-positive state and to detect a capacitor, where the capacitor follows the vibration path of the diaphragm 36 Product 2 change: dagger,-the connecting ring 40 is installed in the base 33, located on the back hole plate to "face," which is used to connect the back hole plate 34 and the gate of the FET 32; A circuit composed of a conductive material is laid on it; a field effect electric crystal engraving FET 32 is connected to the printed circuit board 31, which is used to convert the moon and the moon into an electrical signal. The above-mentioned capacitive type according to the present invention is amplified by ears and vibration The microphone is described as follows: First, a wafer (dis c wafer) is divided into 丨 ★ Among them, this wafer is formed by semiconductor wafers into several wafers. The above wafer is divided by ΐ = = = 4 monocrystalline stones. ^ 001) or sawing method: Criblng is divided into a plurality of wafers in both horizontal and vertical directions according to a preset value. ^ Both methods are divided into multiple wafers, but the cutting method is based on the wafer. The sawing rule is based on a wheel saw blade. In recent years, a twist cutter has been used. The reason is that the cut surface caused by this method is flatter and wider, resulting in wafer division. In this step, the wafer division The finished thinner is 0.4mm X 0.4mm. Japanese-Japanese film, its size
第10頁 522/43 發明說明(7) 另以銲膏=成-FET32晶片。 背面:導電物質佈有電路:沿〜,其中印刷電路板3丄之 上述CV的定路板31上,^ 閘極、源極、汲桎接腳f法係為:將FET 32晶片的 31上的對應位置,並中用以進疒=物貝固疋於印刷電路板 的底面伸出。該黏著物質係為的各接腳係由FET 32 合而得之一半導性物質。”、、/、糸將金屬銀與環氧樹脂混 3 1的接合,得阳获片士間/亟/源極、沒極的接腳與印刷電路板 與沒極接腳的接合部分Ά二二其中,fet 32之源極 結,^Mf I π 係”印刷電路板31底面的線路連 卩㈣音訊號輸出端連結。 環4〇連結而形成電流通路 j腳接合的部分,則與連接 形成電流通路。 連〜環4 〇再與背孔板3 4相接而 ΜίΐΤ 印刷電路板31的接合,係藉由紹線 Φ 脂為CR-20 00或CRH-210,且ς=3〇心,採用的環減 度烘m. 5小時乾燥之。 者後的連結物再以攝氏15° 之封谬㈣ding),以防止板歹31= 士合/吏,再以環氧樹脂將 紅 止邊連結物遭到異物侵入或腐 傲。 將FET晶片32與印刷電路板31接合後,遂進行一測試Page 10 522/43 Description of the invention (7) Another solder paste = -FET32 chip. Back: Conductive material is provided with circuits: along ~, where the CV routing board 31 of the printed circuit board 3 丄 above, the gate, source, and drain pin f method is: 31 on the FET 32 chip Corresponding position, and is used to enter into the bottom of the printed circuit board protruding from the bottom. Each pin of the adhesive substance is a semi-conductive substance obtained by combining the FET 32. ",,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, and ,,, Two of them, the source junction of fet 32, the ^ Mf I π series "on the bottom surface of the printed circuit board 31 is connected to the audio signal output terminal. The loop 40 is connected to form a current path. The portion where the j pin is joined is connected to the current path. The connection ~ ring 4 〇 and the back hole plate 3 4 are connected and the connection of the ΜΙΤ printed circuit board 31 is through the use of the wire Φ grease is CR-20 00 or CRH-210, and ς = 30. Reduced drying m. 5 hours to dry it. The following link is then dinged at 15 ° Celsius) to prevent the plate 31 = Shihe / Li, and then the red end link is invaded or corrupted with epoxy resin. After bonding the FET wafer 32 to the printed circuit board 31, a test is performed
522745 、發明說明(8) 少鄉’以檢驗其電導性,測試該連結物是否能正常運 將隔膜環37、隔膜36、間隙墊圈35、架座33、背。 34、連接環40以及固接有^^了晶片32的印刷電路板31化J反 上述順序組裝於殼體3 8内,以產生一電容式麥克風。如、、、 述之FET晶片32的厚度為〇· 2min,而整個電容式麥克 上 厚度則為〇· 8至1· 〇mm之譜。 < 的 如上所述,本發明提供的一種製造電容式麥 法,係具有下列優點: 、方 其一,由於晶圓上的一FET晶片係直接與一印刷 板的線路接合,故能大幅減少產品的體積, %格 ohm: 妝積,達到產品微 雜 音; 況發 其一’此夠減少因為F E T晶片接腳焊接所導致的 其三,能夠防止FET晶片接腳因焊接古、攻 生,因而能消除因接腳斷離而產生/槪而斷離的狀 |生的瑕疵。 522745 圖式簡單說明 第圖顯示傳統電容式麥克風的分解結構圖。 第二圖顯示圖一所示部分的截面圖。 第二圖顯示依據本發明方法所製造的電容式 面圖。 夕兄風的戴 主要元件編號 1 印刷電路板(printed circuit board) 2 場效電晶體(field effect transistor,FET)522745, Description of Invention (8) Shaoxiang ’To check its electrical conductivity and test whether the joint can operate normally. Diaphragm ring 37, diaphragm 36, gap washer 35, stand 33, back. 34. The connection ring 40 and the printed circuit board 31 to which the wafer 32 is fixed are assembled in the above order in order to produce a condenser microphone. The thickness of the FET wafer 32 described above is 0.2 minutes, and the thickness of the entire capacitive microphone is 0.8 to 1.0 mm. < As described above, the present invention provides a method for manufacturing a capacitive microphone, which has the following advantages: First, because a FET wafer on a wafer is directly bonded to a circuit of a printed board, it can be greatly reduced. Product volume,% grid ohm: Make-up product, to achieve product noise. One of the problems is that it can reduce the third caused by FET chip pin welding, and can prevent the FET chip pins from being welded and attacked. It can eliminate the defects caused by the pin disconnection. 522745 Brief description of the figure The figure shows the exploded structure of a conventional condenser microphone. The second figure shows a sectional view of the part shown in figure 1. The second figure shows a capacitive sectional view made according to the method of the present invention. Xi Xiongfeng's Wear Main component numbers 1 printed circuit board 2 field effect transistor (FET)
3 架座(supporter) 4 背孔板(back-pole plate) 5間隙墊圈(spacer) 6 隔膜(di aphragm) 7 隔膜環(diaphragm ring) 8 殼體(case) 9 聲波導入孔(wave inflow hole) 10 連結環(connection ring) 過濾器(fi Iter)3 Supporter 4 Back-pole plate 5 Spacer 6 Diaphragm 7 Diaphragm ring 8 Case 9 Wave inflow hole 10 connection ring filter (fi Iter)
31印刷電路板 3 2场政電晶體 33架座 3 4背孔板 3 5間隙塾圈 36隔膜31 printed circuit board 3 2 field power transistor 33 stand 3 4 back hole plate 3 5 gap ring 36 diaphragm
第13頁 522745Page 13 522745
第14頁Page 14
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TW90114945A TW522745B (en) | 2001-07-10 | 2001-07-10 | Method for manufacturing condenser microphone |
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TW90114945A TW522745B (en) | 2001-07-10 | 2001-07-10 | Method for manufacturing condenser microphone |
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