TW200522504A - Piezoelectric oscillator and electronic equipment and method for producing piezoelectric oscillator - Google Patents

Abstract

To provide a piezoelectric oscillator suitable for miniaturization and thinning, and an electronic apparatus using the piezoelectric oscillator. A piezoelectric oscillator 10 comprises: a plurality of packaging leads 12, each of which includes a packaging terminal 24 connected to a packaging substrate; an electronic component electrically connected with the plurality of packaging leads 12; a piezoelectric vibrator 18 overlapped on the vertical direction of the electronic component; and a connection means for electrically connecting the external terminal of the piezoelectric vibrator 18 and connecting terminals 30 provided in the electronic component. The external terminal is formed opposite to the electronic component of the piezoelectric vibrator 18, and the connecting terminals are installed on the internal side of the external rim of the electronic component. The connection means may be a metal ball, or the assembly of lead frame and wire-bonding.

Description

200522504 (1) IX. Description of the invention [Technical field to which the invention belongs] * The present invention relates to a piezoelectric oscillator, a refrigerator, and a method for manufacturing a piezoelectric oscillator suitable for miniaturization and thinning. [Prior art] The piezoelectric oscillator of the prior art has a larger area than a horizontally arranged piezoelectric vibrator and a semiconductor integrated circuit (1C). Φ A 1C wafer is mounted on the wafer pad, and a piezoelectric vibrator is provided on the side of the 1C wafer. In addition, at least two pin terminals are provided on the side of the wafer pad, and the pin terminals and the electrodes provided on the 1C chip are connected by wire bonding to be conducted. In addition, such pin terminals are extended near the piezoelectric vibrators and are electrically connected to the piezoelectric vibrators. In addition, a molding material such as resin is used to mold the periphery of the piezoelectric vibrator and the 1C wafer to form a resin-encapsulated package (for example, refer to Patent Document 1). [Patent Document 1] Japanese Unexamined Patent Publication No. 7-1 62236 φ [Contents of the Invention] (Problems to be Solved by the Invention) In recent years, with the miniaturization of electronic devices equipped with piezoelectric oscillators, piezoelectric oscillators or mounting Piezoelectric vibrators for piezoelectric oscillators have also been reduced in size and thickness. Therefore, the size of the piezoelectric vibrator is reduced to the same size as that of the 1C chip. However, in the conventional technology in which a piezoelectric vibrator and a 1C chip are installed in parallel -4- 200522504 (2) In the configuration of a piezoelectric oscillator, if the wiring length of a pin terminal becomes longer, there is a problem that the floating capacitance increases. . In recent years, although there are many electronic devices using a high frequency band, there is a problem that the higher the frequency, the larger the floating capacitance. In addition, when a temperature compensation function is provided in the IC chip as a temperature-compensated piezoelectric oscillator, since the distance between the 1C chip and the piezoelectric vibrator is large, heat generated from the 1C chip and the heat of the piezoelectric vibrator may occur. Temperature difference. Therefore, high-precision temperature compensation cannot be performed, and there is a problem that instantaneous compensation cannot be performed. In addition, it is necessary to provide a bonding space for bonding the pin terminal and the 1C chip with a wire, which hinders the miniaturization of the piezoelectric oscillator. The present invention has been developed in order to solve the above-mentioned problems, and an object thereof is to provide a piezoelectric oscillator that can be miniaturized by reducing the plane size. Another object is to provide an electronic device equipped with a piezoelectric oscillator. Another object is to provide a method for manufacturing a piezoelectric oscillator. (Means for Solving the Problems) In order to achieve the above-mentioned object, a characteristic of the piezoelectric oscillator of the present invention includes: a plurality of mounting pins, which are formed by a pin holder and have mounting terminals connected to a mounting substrate; An electronic component is electrically connected to the plurality of mounting pins described above; a piezoelectric vibrator has an external terminal and is electrically connected to the above-mentioned electronic component-5-200522504 (3); and a connecting means is electrically connected The external terminal for connecting the piezoelectric vibrator and the connection terminal provided on the electronic component are exposed; and the mounting terminal of at least the plurality of mounting pins is exposed, and the lead frame and the above are sealed with a molding material. The periphery of the electronic component y The connection portion between the connection means and the external terminal of the piezoelectric vibrator is formed inside the outer shape of the electronic component. Conventionally, it has been necessary to electrically connect an electronic component and a piezoelectric vibrator in a planar shape on the outside of the electronic component and on the inside area of the oscillator shape. However, if the present invention is used, there is no such design limitation and piezoelectric oscillation can be achieved. Device miniaturization. In addition, if the operation of the piezoelectric vibrator and electronic components is checked before forming the piezoelectric oscillator, it can be confirmed that the operation is good or defective. Then, a piezoelectric vibrator and electronic parts can be combined to form a piezoelectric oscillator. Therefore, as in the prior art, after sealing the piezoelectric vibrator and electronic parts with a molding material, even if the piezoelectric oscillator is defective due to reasons other than the piezoelectric vibrator, the good piezoelectric vibrator will be replaced. Discarded together, thus reducing manufacturing costs. Further, the connection means is a metal ball, and the connection terminal provided on the electronic component and the external terminal of the piezoelectric vibrator are connected via the metal ball. This makes it possible to reduce the thickness as compared with a piezoelectric oscillator in which a piezoelectric vibrator and an electronic component are connected via a leg stand. When the electronic component is a 1C chip having an oscillation circuit and a temperature compensation function, the above-mentioned temperature compensation can be performed by using a temperature sensor provided in the 1C chip. & Yes, the piezoelectric vibrator is connected directly above the 1C chip, so the temperature difference between the IC chip and the piezoelectric vibrator becomes smaller, so temperature compensation can be performed with high accuracy. In addition, the use of metal balls with high thermal conductivity enables more accurate temperature compensation. The connection means is a connection terminal and a wire bonding formed on the pin holder, and the wire connection is used to connect the connection terminal of the electronic component and the connection terminal of the pin holder, and connect the connection terminal of the pin holder and the crimping member. The above external terminal of the electric vibrator. In this case, a stand as a heat conducting member may be interposed between the electronic component and the piezoelectric vibrator. Here, depending on the type of electronic component, the position of the wire bonding pad is changed. In addition, depending on the type of the piezoelectric vibrator, the position of the external terminal is changed. However, when wire bonding is implemented, it has the freedom of drawing wire bonding. Therefore, regardless of the position of the wire bonding pads installed on the electronic parts or the position of the external terminals of the piezoelectric vibrator, the wire bonding can be used to conduct the pressure. Electric vibrator and electronic parts. In addition, since a heat conducting member is provided between the electronic component and the piezoelectric vibrator, heat is easily conducted from the electronic component to the piezoelectric vibrator. Accordingly, when the electronic component is a temperature-compensated oscillation circuit, temperature compensation can be performed with high accuracy. The electronic component is a semiconductor integrated circuit, and further includes a wafer pad formed by a lead frame and placed on a circuit side (active surface side) of the semiconductor integrated circuit. With the above-mentioned wafer pad, the heat generated from the circuit surface side of the semiconductor integrated circuit (1C) can be dissipated to the piezoelectric vibrator side, and the temperature difference between the 1C and piezoelectric 200522504 (5) vibrator can be eliminated. In addition, since the temperature sensor 1C is provided with a temperature sensor on the road surface side, the temperature difference between the piezoelectric vibrator and the temperature sensor can be reduced. In addition, when wire bonding is performed between the 1C and the lead frame, there is a space between the circuit surface of the 1C other than the wire bonding pad and the piezoelectric vibrator, so as long as this space is used as a space for the wafer pad, It is possible to reduce the space portion of the conventional wafer pads arranged under 1C, and to reduce the size and thickness of the piezoelectric oscillator. In addition, the semiconductor integrated circuit and the wafer pad are connected by an insulating adhesive, and the connection terminals of the wafer pad and / or the lead frame are formed to prevent the insulating adhesive from flowing out to be formed on the wafer. Bonding of semiconductor integrated circuits and the prevention of outflow of solder pads. The outflow prevention means can prevent the insulative connection material from flowing into the wire bonding pad. Moreover, a pull-out prevention means is formed in the mounting terminal. With the pull-out prevention means, the connection strength between the mounting pins and the molding material can be improved. Therefore, the mounting strength when the piezoelectric oscillator is mounted on the mounting substrate by solder can be improved. Further, a molding material may be used to seal the periphery of the piezoelectric vibrator. With this configuration, the molding material can perform the task of reinforcing the connection strength between the piezoelectric vibrator and the connection portion, and thus can increase the connection strength between the piezoelectric vibrator and the connection portion. Further, in the piezoelectric oscillator, an adjustment terminal is provided on the leg holder, and the adjustment terminal and the electronic component are electrically connected. Electronic components are semiconductor products with oscillation circuits and temperature compensation. -8-200522504 (6) When the body circuit (IC) chip is formed, the 1C chip can also be written into the 1C chip by adjusting the terminal after forming the piezoelectric oscillator. The adjustment terminal is a terminal for checking the characteristics of an electronic component, a piezoelectric oscillator, adjusting the characteristics, and / or confirming the continuity between the piezoelectric vibrator and the connection terminal. Also, the "characteristic inspection" refers to an operation inspection of an electronic component after resin molding, or a characteristic inspection of a piezoelectric oscillator. In addition, the characteristic adjustment means that when the electronic component is a 1C chip with an oscillation circuit and a temperature compensation function, the output frequency of the piezoelectric oscillator is matched with an arbitrary frequency, or when a temperature compensation circuit is added to the 1C chip, the piezoelectric oscillation is corrected The frequency change caused by the temperature of the device, or when the function of changing the frequency by input voltage is added to the 1C chip, the change sensitivity is adjusted. The electronic device of the present invention is characterized in that the above-mentioned piezoelectric oscillator is mounted. By mounting the above-mentioned piezoelectric oscillator, small and highly reliable electronic components can be realized. The method for manufacturing a piezoelectric oscillator according to the present invention is characterized in that: a lead frame is connected to the circuit surface side of the semiconductor integrated circuit, and the semiconductor integrated circuit and the lead frame are connected and connected with each other by wire bonding. The tripod is connected to an external terminal that conducts the piezoelectric vibrator. A conventional method of manufacturing a piezoelectric vibrator is to mount a semi-conducting volume circuit (1C) on a lead frame and then perform wire bonding. However, according to the present invention, the lead frame is connected to the circuit surface side of 1C and wire bonding is performed, so that the piezoelectric oscillator can be miniaturized and thinned. Furthermore, the method for manufacturing a piezoelectric oscillator of the present invention is characterized in that an electronic component is connected to a lower leg stand including a mounting pin, and the electronic component is connected to a piezoelectric device with a -9-200522504. The connecting means of the vibrator is connected with the upper leg, and is connected between the lower leg and the electronic component, and the upper leg and the electronic component are connected by wire bonding, and are connected through the connecting means. Conduct the above-mentioned electronic parts and the piezoelectric vibrator. Thereby, the piezoelectric vibrator can be connected to the upper surface of the electronic component via a connection means such as a connection terminal provided on the inner side of the external shape of the electronic component or a conductive connecting material. This makes it possible to reduce the size and thickness of the piezoelectric oscillator. The electronic component may be 1C or a capacitor.

明 Description of jpr voltage and oscillating voltage. The invention is described in the 1J formula below, and the best embodiment of the manufacturing method of the actual rL oscillator is described below. First, the first embodiment will be described. FIG. 1 is an exploded perspective view showing a piezoelectric oscillator. FIG. 1 shows a state in which the resin-sealed package is removed. FIG. 2 is a side cross-sectional view showing a line A-A in FIG. 1. The piezoelectric oscillator 10φ of the first embodiment is provided with a pin holder 11 below the piezoelectric oscillator 10, and a semiconductor integrated circuit (1C) chip 1 constituting an oscillation circuit or the like is mounted on the pin holder 11 4. The piezoelectric vibrator 18 is connected to the 1C chip 14 by a connecting means, that is, a conductive connecting material 16, and a molding material is used to form a seal. In addition, in the side sectional view of FIG. 2, the shapes of the 1C chip _, wire bonding, conductive connecting material, and piezoelectric vibrator are also shown for the sake of explanation. FIG. 3 is a plan view showing the leg stand 11. The stand is made of metal such as copper or 42 alloy. -10- 200522504 (8) In the center portion of the frame portion 20 of this pin holder 11 is formed a wafer pad 22 on which a 1C wafer 14 is mounted, and is connected to short sides of both sides of the frame portion 20. In addition, a part of the mounting pins 12 is formed near the four corners of the frame portion 20, and the L-shaped mounting terminals 24 are formed near the four corners of the frame portion 20 so that the L-shaped long side faces the wafer pad 22 side . Further, the long-side front end of the mounting terminal 24 provided on the short side of one side of the frame portion 20 is connected to the wafer pad 22 along the short-side direction of the frame portion 20. The long side of the mounting terminal 24 is connected to the long side of the frame portion 20. In addition, between the mounting terminals 24 on the long side of the frame portion 20, an adjustment terminal 28 for checking the characteristics of the 1C wafer 14 or adjusting the characteristics is formed. The characteristic inspection refers to inspecting the operation of the 1C wafer 14 or the characteristics of the piezoelectric oscillator 10 after sealing the 1C wafer 14 and the like with a molding material. In addition, the so-called characteristic adjustment means that when a temperature compensation circuit is added to the 1C chip 14, the frequency change caused by the temperature of the piezoelectric oscillator 10 is corrected, or the function of changing the frequency by input voltage is added to the 1C chip 14 , Adjust the change sensitivity, etc. The adjustment terminal 28 is along the wafer. In the longitudinal direction of the pad 22, an extension portion 28a is extended from a portion formed along the longitudinal direction in a direction orthogonal to the longitudinal direction, and then connected to the frame portion 20. The 1C wafer 14 is composed of an oscillating circuit, and a plurality of bonding pads are formed on the wafer 14 by bonding. In Fig. 1, the shape of the pad is four corners, but it may be circular or polygonal. At least two connection terminals 30 are provided on the upper surface of the 1C chip 14 to mount the piezoelectric vibrator 18 with the conductive connection material 16. If three or more connection terminals 30 are provided, the stability of the connection between the 1C chip 14 and the piezoelectric vibrator 18 will be improved. In addition to the oscillating circuit of the 1C chip 14, -11-200522504 (9) can add the function of changing the oscillation frequency by input voltage, or compensate the function of the frequency-temperature characteristic that the oscillation frequency changes with temperature. The 1C chip 14 may be an electronic component such as a resistor or a capacitor. FIG. 4 is a front sectional view showing a piezoelectric vibrator. In the piezoelectric vibrator 18, a seat electrode 34 'is formed in a package base 32 made of ceramic, metal, or the like, and a piezoelectric vibrating piece 42 is mounted on the seat electrode 34 using a conductive adhesive 36. The base electrode 34 is led out to a corner portion of the package base 32 described above, and communicates with the external terminal 26 formed on the back surface of the package base 32 via a castellation formed on a side surface. The outer terminal 26 is formed corresponding to the connection terminal 30 formed on the 1C wafer 14. The base electrode 34 may be electrically connected to the external terminal 26 through a hole or the like. The piezoelectric vibrating piece 42 may be a piezoelectric vibrating piece such as an AT slice or a BT slice, a tuning fork-type piezoelectric vibrating piece, or a surface acoustic wave element plate. A cover 38 is connected to the upper surface of the package base 32. The inside of the package is hermetically sealed. A method of connecting the cover 38 is, for example, connecting a glass cover 38 through a low-melting point glass, or joining a metal cover 38 by seam welding through a connecting material such as Kovar. When the package base 32 is formed of metal, an insulating member must be interposed between the wiring electrically connecting the piezoelectric vibrating piece 42 and the external terminal 26 and the package base 32. The method of forming the piezoelectric oscillator 10 is as follows. On the wafer pad 22, the 1C wafer 14 is mounted by using a connecting material. The pads and the mounting terminals 24 formed on the 1C wafer 14 and the pads and the adjustment terminals 28 are connected by wire bonding. In addition, a conductive connection material 16 is used on the top surface of the 1C wafer] 4 to electrically and mechanically connect the pressure -12- 200522504 (10) The electric vibrator 18. At this time, the connection terminal 30 formed on the 1C wafer 14 and the external terminal 26 formed on the back surface of the piezoelectric vibrator 18 are connected via a conductive connection material 16. The connection portion between the conductive connection material 16 and the external terminal 26 is located inside the outer shape of the 1C chip 14. The conductive connecting material 16 may be, for example, a metal ball made of a metal such as solder or gold, or an epoxy-based or silicone-based conductive adhesive containing a conductive filler such as silver, solder, or a metal member. Or conductive sheet. In FIG. 2, although the 1C chip 14 and the piezoelectric vibrator 18 are connected at two locations, three or more connection locations may be provided. Further, the periphery of the leg stand 11, the 1C wafer 14, the piezoelectric vibrator 18, and the like are sealed with a molding material such as a resin to form a resin-sealed package 40. After the formation of the resin-sealed package 40, the mounting terminal 24 is cut, and the terminal 28, the wafer pad 22, and the frame portion 20 are adjusted. This cutting position may be near the surface of the resin-sealed package 40 or protruded and cut from the resin-sealed package 40. The mounting terminal 24 is exposed on the back surface of the resin-sealed package 40, and the cover 38 of the piezoelectric vibrator 18 is exposed on the upper surface of the resin-sealed package 40. Since the product frequency of the piezoelectric vibrator 18, the manufacturing lot number, and the like are written on the cover 38, the cover 38 must be exposed and the product style must be written on the surface of the resin-sealed package 40. Alternatively, the cover 38 may be sealed inside the resin-sealed package 40 as appropriate. Alternatively, a molding material may be used to seal the mounting pins 12 and 1C chip 14 and wire bonding, and the piezoelectric vibrator 18 may not be sealed using a molding material. Since the piezoelectric oscillator 10 thus formed is connected to the piezoelectric vibrator 18 via the conductive connecting material 16 on the 1C chip 14, the piezoelectric vibrator 18 and the IC are arranged side by side with the package · 13 · 200522504 (11) The conventional piezoelectric oscillator of the chip 14 can be miniaturized compared with the conventional piezoelectric oscillator. The connection means between the 1C wafer 14 and the piezoelectric vibrator 18, that is, the conductive connecting material 16 is provided on the 1C wafer 14. Therefore, the piezoelectric oscillator 10 can be miniaturized as compared with the case where it is connected to the outside of the 1C chip and the inside area of the external shape of the piezoelectric oscillator. In addition, since the piezoelectric vibrator 18 and the 1C chip 14 are connected only by using the conductive connecting material 16, the thickness can be reduced compared with the case of electrical and mechanical connection using a pin stand and wire bonding. In addition, when a temperature-compensated piezoelectric oscillator is added to the 1C chip 14 to compensate for frequency-temperature characteristics, a piezoelectric vibrator is provided directly above the 1C chip with a built-in temperature sensor. Perform temperature compensation. In addition, by using a metal ball with high thermal conductivity in the conductive connecting material 16, temperature compensation can be performed with higher accuracy. In addition, in this embodiment, the chip pad 22 is connected to a part of the mounting terminals 24. Therefore, if the mounting terminal 24 is grounded, noise generated from the 1C chip 14 and the like or from the piezoelectric oscillator 10 can be reduced. External noise. Furthermore, as long as the number of connection terminals is increased to three, the cover of the piezoelectric vibrator and its mounting terminal 24 are electrically connected via the conductive connecting material 16 to reduce noise from above and outside the piezoelectric oscillator. Furthermore, wire bonding can be implemented freely between the 1C chip 14 and the adjustment terminal 28, and the 1C chip 14 and the mounting terminal 24. Therefore, even if the positions of the above-mentioned pads of the 1C chip 14 are changed a little, the same-shaped pin holder 1 can be used 1, which can further improve the design freedom of the piezoelectric oscillator 10. In addition, if -14-200522504 (12) Operation inspection and frequency adjustment of the piezoelectric vibrator 18 are performed before the piezoelectric vibrator 18 is mounted on the 1C chip 14, a defective piezoelectric vibrator will not be mounted. After the frequency of the piezoelectric vibrator 18 or the operation of the piezoelectric vibrator 10 is checked after the k-electric oscillator 10 is formed, defective products are sometimes found. At this moment, when the piezoelectric vibrator 18 is defective, even the 1C chip 14 which normally operates must be discarded, and the manufacturing cost becomes high. However, the piezoelectric oscillator 10 of this embodiment has no problem, so the manufacturing cost can be reduced. Next, a piezoelectric oscillator according to a second embodiment will be described. The second embodiment is a modification of the first embodiment, and the same reference numerals are given to the same parts as those in the first embodiment, and the description is omitted or omitted. Fig. 5 is a side sectional view showing a piezoelectric oscillator according to a second embodiment. The 1C wafer 14 mounted on the piezoelectric oscillator 10 is not mounted on a wafer pad, but is held in a resin-sealed package 40. The method of forming this piezoelectric oscillator 10 is shown next. In the frame portion, a lead frame for mounting the terminal 24 and the adjustment terminal, that is, the lead frame according to the first embodiment, mounts a frame on which a wafer pad is not formed on a thin adhesive tape. A 1C chip 14 is mounted on the center portion of the pin holder placed on the tape sheet. Then, the wire bonding pads and the mounting terminals 24 formed on the 1C wafer 14 and the wire bonding pads and the adjustment terminals are wire-bonded to make conduction. Further, the connection terminal formed on the 1C chip 14 is connected to the external terminal 26 of the piezoelectric vibrator 18 via the conductive connecting material 16, and the 1C chip 14 is electrically and mechanically connected to the piezoelectric vibrator 18. Then, the surroundings of the tripod, 1C chip, 4 and piezoelectric vibrator 18, etc. are sealed with a molding material to form a resin sealed package 40. -15-200522504 (13) Peel off the tape sheet to form a pressure Electric oscillator 10. Since the piezoelectric oscillator 10 has a 1C wafer 14 mounted on a wafer pad, the piezoelectric oscillator 10 can be made thin. FIG. 6 is an explanatory diagram showing a method of mounting the piezoelectric oscillator 10. When the piezoelectric oscillator 10 is mounted on a mounting substrate, it may be mounted via a metal ball made of solder, gold, or the like. In this case, a space can be formed between the mounting substrate and the back surface of the 1C wafer 14. Since the pattern of the piezoelectric oscillator 10 wiring on the mounting substrate does not contact the back surface of the 1C wafer 14, it is not necessary to avoid the pattern wiring on the back surface of the 1C wafer 14. Therefore, the degree of freedom of pattern wiring can be sufficiently ensured. In addition, the space can be used to easily remove the flux generated when the piezoelectric oscillator is mounted on the mounting substrate by cleaning. Next, a third embodiment will be described. The third embodiment also describes a modification of the first embodiment. The same reference numerals are given to the same parts as those in the first embodiment, and the descriptions are omitted or omitted. Fig. 7 is a side sectional view showing a piezoelectric oscillator according to a third embodiment. Fig. 8 is a plan view showing an enlarged portion of a mounting terminal of the pin holder according to the third embodiment. The mounting terminal 50 of the piezoelectric oscillator 10 according to the third embodiment includes a coupling portion 50a, an inclined portion 50b, and a mounting portion 50c. The joint portion 50a is provided along a direction orthogonal to the longitudinal direction of the 1C wafer 14, and is connected to the side of the frame portion 20 along the longitudinal direction of the 1C wafer 14. An inclined portion 50b is extended to the outside of the joint portion 50a, and the inclined portion 50b is lowered downward. A planar-shaped mounting portion 50c is extended to the outside of the inclined portion 5 Ob, and the mounting portion 50c and the wafer pad 22 are formed at a certain distance in parallel to form -16- 200522504 (14). If the mounting terminal 50 is formed in this way, the wafer pad 22 will be positioned above the mounting portion 50c. Once the resin-sealed package 40 is formed, the wafer pad 22 and the 1C wafer 14 connected to the wafer pad 22 will be held at In the mold. This prevents the wafer pads 22 from being exposed on the surface of the resin-encapsulated package 40, so that it is possible to improve shock resistance against external shocks and the like. Next, the fourth embodiment will be described. The fourth embodiment also describes a modification of the first embodiment. The same reference numerals are given to the same parts as those in the first embodiment, and the descriptions are omitted or omitted. Fig. 9 is a side sectional view showing a piezoelectric oscillator according to a fourth embodiment. On the lower surface of the 1C chip 54 mounted on the piezoelectric oscillator 10, a bonding pad 56 connected to the mounting terminal 24 and the adjustment terminal of the pin holder is provided. A connection terminal 57 connected to the external terminal 26 of the piezoelectric vibrator 18 is provided on the upper surface of the 1C chip 54. Further, in the 1C wafer 54, at least two through holes 58 are formed penetrating the lower surface and the upper surface, and the circuit terminals formed on the lower surface of the 1C wafer 54 are led out to the upper connection terminals 57 through the holes 58. The bonding pads 56 of the 1C chip 54 are connected to the lead frame through the flip-chip bonding 62, and the external terminals 26 of the piezoelectric vibrator 18 are connected to the connection terminals 57 of the 1C chip 54 through the conductive connecting material 16. The molding material is used to mold the surroundings of these parts to form the piezoelectric oscillator 10. With this, the flip-chip bonding 62 can also be used to form the piezoelectric oscillator 10 instead of connecting the mounting terminal 24 and the 1C chip 54 and the adjustment terminal and the 1C chip 54 to conduct conduction. Next, a fifth embodiment will be described. In the piezoelectric oscillator of the fifth embodiment, a 1C chip and a piezoelectric vibrator are connected under a -17-200522504 (15) via a stand. Fig. 10 is a plan view showing a leg stand of a fifth embodiment. FIG. 11 is a front sectional view showing a piezoelectric oscillator according to a fifth embodiment. Fig. 11 (a) is a cross-sectional view showing the formation of a piezoelectric oscillator, and Fig. 11 (b) is a cross-sectional view of the piezoelectric oscillator broken into a piezoelectric vibrator, a stand, and a 1C chip. A pad 78 connecting the 1C chip 74 and the piezoelectric vibrator 76 is formed in the center portion of the frame portion 72 of the leg holder 70, and this pad 78 is connected to one side of the frame portion 72. An inclined portion 78 a is formed between the pad 78 and the frame portion 72, and the inclined portion 78 a rises upward. In addition, mounting pins 80 are formed at the four corners of the frame portion 72. The mounting pin 80 is composed of a mounting terminal 80a, an inclined portion 80b, and a coupling portion 80c. The joint portion 80c is connected to the side of the frame portion 72 along the length direction of the 1C wafer 74, and is formed in a direction orthogonal to the length direction of the 1C wafer 74. An inclined portion 80b is formed on the outside of the joint portion 80c, and the inclined portion 80b is lowered downward. Mounting terminals 80a are formed on the outside of the inclined portion 80b, and the mounting terminals 80a are arranged at a predetermined distance from the frame portion 72. In addition, a plurality of adjustment terminals 82 are formed between the mounting pins 80 along the longitudinal direction of the 1C wafer 74. The adjustment terminal 82 is formed along the length direction of the 1C wafer 74, and an extension portion 8 2a is extended from a portion formed along the length direction in a direction orthogonal to the length direction, and then extends to the frame portion 72 connection. A connection terminal 84 is formed between the mounting pins 80 in a direction orthogonal to the longitudinal direction of the 1C chip 74. This connection terminal 84 extends along the longitudinal direction of the 1C chip 74 and extends to the lower side of the external terminal 86 formed on the back surface of the piezoelectric vibrator 76. In addition, -18-200522504 (16) the inclined portion 8 4 a is formed in the middle of the connection terminal 84 so that the front end side of the connection terminal 84 can be disposed on the upper side than the frame portion 72. That is, the front end side of the connection terminal 84 is formed in the same plane as the pad 78. A coupling portion 8 4 b is formed on the connection terminal 84. This joint portion 8 4 b is located at a position closer to the frame portion 72 than the inclined portion 8 4 a and extends in a direction orthogonal to the longitudinal direction of the 1C wafer 74. Next, a method for forming a piezoelectric oscillator will be described. First, the surface on the 1C chip 74 where the wire bonding pads are formed is connected to the lower surface of the pad 78 formed on the lead frame 70 and the lower surface of the connection terminal 84. At this time, the pad 78 is connected to the 1C chip 74 via a connection material, and the connection terminal 84 is connected to the 1C chip 74 via an insulating connection material such as an insulating adhesive or an insulating sheet. Then, the bonding portions 80c, 84b and the 1C chip 74, and the adjustment terminals 82 and the 1C chip 74 are wire-bonded to make conduction. The joints of the joints 80c, 84b and the adjustment terminals 82 exist on a plane substantially the same as the circuit surface of the 1C chip 74. In addition, the connection means is formed by bonding the connection terminal 84 and the conductive connection terminal 84 to the 1C chip 74 by wire bonding. Then, the connection terminal 84 and the piezoelectric vibrator 76 are connected via a conductive adhesive such as an epoxy-based or silicone-based conductive filler containing a conductive filler such as silver, a solder, a metal member, or a conductive thin plate. The external terminal 86 is connected to the lead frame 70 and the piezoelectric vibrator 76. Alternatively, the connection terminal 84 and the external terminal 86 may be directly connected. Here, the connection portion between the connection terminal 84 and the external terminal 86 is located inside the outer shape of the 1C chip 74. Furthermore, the piezoelectric vibrator 76 may be connected to the upper side of the pads 78 through a connecting material. Then, the piezoelectric vibrator 76 is sealed with a molding material such as resin so that the lower surface of the mounting terminal 80a of the piezoelectric oscillator 88 and the cover surface of the piezoelectric vibrator 76 can be exposed. Around the 1C chip 74 and the lead frame 70 and the like, and cutting only unnecessary portions of the lead frame 70 protruding from the molding portion, a resin-sealed piezoelectric oscillator 88 is formed. Since such a piezoelectric oscillator 88 connects the piezoelectric vibrator 76 and the 1C chip 74 up and down via the pin holder 70, the piezoelectric of the conventional technology in which the piezoelectric vibrator 76 and the 1C chip 74 are arranged in parallel with the package Compared with the oscillator 88, it can be miniaturized. In addition, since the 1C chip 74 and the piezoelectric vibrator 76 are electrically connected through the lead frame 70 which is electrically connected by wire bonding, even if a 1C chip located at a slightly offset position of the wire bonding pad is used, the 1C chip can still be used. The same pin holder 70 is used to form the piezoelectric oscillator 88. In addition, since the circuit surfaces of the bonding portions 80c, 84b and the 1C chip 74 will be approximately the same plane, there is almost no difference in height between the beginning and the end of the bonding, which can effectively prevent wire contact at the edge portion of the 1C chip 74. Yu's short circuit and so on. In addition, when a temperature-compensated piezoelectric oscillator 88 is added to the 1C chip 74 to compensate for frequency and temperature characteristics, a piezoelectric vibrator is provided directly above the 1C chip 74 with a built-in temperature sensor via a stand. 76, so the temperature difference between the 1C wafer 74 and the piezoelectric vibrator 76 becomes smaller. Thereby, temperature compensation can be performed with high accuracy. In addition, the base 70 uses a material having high thermal conductivity, and can perform temperature compensation with higher accuracy. In addition, if the bonding pad 78 disposed between the piezoelectric vibrator 76 and the 1C chip 74 is grounded, it is possible to reduce noise generated from the 1C chip 74 and the like to the outside or to receive noise from the outside of the piezoelectric oscillator 10 Noise. -20- 200522504 (18) In addition, if the operation inspection and / or frequency adjustment of the piezoelectric vibrator 76 is performed before the piezoelectric oscillator 88 is formed, the defective piezoelectric vibrator 76 will not be mounted on the piezoelectric The oscillator 88 can further reduce the manufacturing cost of the piezoelectric oscillator 88. In the present embodiment, a pad 78 is provided at the center of the leg holder 70. However, the pad 78 may be provided with an outflow prevention means, such as a cavity. When the 1C chip 74 and the bonding pad 78 are connected, if the bonding agent is used, the bonding agent will flow out to the bonding wire bonding pad formed on the IC chip 74, which may cause problems such as failure to perform bonding wire bonding. However, if a cavity is provided, excess adhesive will escape to the cavity, preventing the adhesive from flowing out to the wire bonding pad. Therefore, wire bonding can be implemented. Further, instead of the cavity portion, a concave-convex shape may be provided. Further, a cavity portion or a concave-convex shape may be provided on the connection terminal 84. Although the mounting pin 80 is configured to be bent inside the molding material, it may also be configured to J such that the mounting pin 80 is bent outside the molding material Pin or biplane shape. Alternatively, the pad 78 provided at the center portion of the lead frame 70 may be removed, and only the connection terminal 84 may be present. Alternatively, the solder pad 78 may be removed, and an insulating sheet or a thermally conductive sheet having a thickness of a lead frame may be provided at this portion. Next, a sixth embodiment will be described. The piezoelectric oscillator according to the sixth embodiment also connects the 1C chip and the piezoelectric vibrator up and down via a stand. Fig. 12 is a plan view showing a leg stand of a sixth embodiment. 13 is a front sectional view of a piezoelectric oscillator according to a sixth embodiment. In addition, Figure 13 (a) is a cross-sectional view showing the formation of a piezoelectric oscillator. -21-200522504 (19) The same figure (b) is a cross-sectional view showing a piezoelectric vibrator, a pin holder, a 1C chip, and a thin plate used in the formation of the piezoelectric oscillator. A pad 102 connecting the 1C chip 98 and the piezoelectric vibrator 100 is formed in a central portion inside the frame portion 96 of the leg holder 94. The pads 102 are connected to the opposite sides of the frame portion 96, respectively. . Further, an inclined portion 102a is formed at a position connected to the frame portion 96, and the inclined portion 102a is raised to the upper side so that the pad 102 can be positioned on the upper side than the frame portion 96. In addition, mounting pins 104 are formed at the four corners of the frame portion 96. The mounting pin 104 is composed of a mounting terminal 104a and a suspending portion 104b of a pull-out prevention means of the mounting terminal 104a. The mounting terminal 104a is provided at a corner portion of the frame portion 96. This mounting terminal 104a forms a connection when the piezoelectric oscillator 106 is mounted on a mounting substrate, and is also formed on the mounting terminal. The upper part of 104a is a bonding part which is connected with a wire to connect with the 1C chip 98. On the outside of the mounting terminal 104a, an inclined portion 104c is formed to rise, and a flat portion 104d is formed on the outside of the inclined portion 104c. This flat portion 104d is a hanging portion l that is located on the same plane as the pad 102, and has a pull-out prevention means for forming a connection strength between the mounting pin 104 and the molding material in the flat portion 104d and the inclined portion 104c. 〇4b. A plurality of adjustment terminals 108 are formed between the mounting pins 104 along the longitudinal direction of the 1C wafer 98. This adjustment terminal 108 has the same configuration as the adjustment terminal described in the fifth embodiment. A plurality of connection terminals 110 are formed between the mounting pins 104 in a direction orthogonal to the longitudinal direction of the 1C chip 98. This connection terminal 110 extends along the longitudinal direction of the 1C chip 98 and extends to the lower side of the external terminal 112 formed on the back surface of the piezoelectric vibrator -22-200522504 (20) 100. In addition, an inclined portion 1 10a is formed in the middle of the connection terminal 110, and the front end side of the connection terminal 1 10 can be arranged higher than the frame portion 96. Further, a connecting portion 110b is formed on the connection terminal 110. This joint portion 10b is located closer to the frame portion 96 side than the inclined portion 110a, and extends in a direction orthogonal to the longitudinal direction of the 1C wafer 98. Next, a method of forming the piezoelectric oscillator 106 will be described. First, the surface of the 1C wafer 98 on which the bonding pads are formed faces upward, and the 1C wafer 98 is placed on the thin plate 114. On the upper side of the 1C wafer 98, the lower side of the pad 102 formed on the lead frame 94 and the lower side of the connection terminal 110 are connected via a connecting material. Then, the bonding portions 110b and 1C wafer 98, the mounting terminals 104a and 1C wafer 98, and the adjustment terminals 108 and 1C wafer 98 are wire-bonded to make conduction. The piezoelectric vibrator 100 is connected to the upper side of the connection terminal 110 via the conductive connection material 16 and the upper side of the pad 102 via the connection material, and the piezoelectric vibrator 100 and the connection terminal 110 are electrically connected. In addition, the connection means is constituted by the connection terminal 110 and the wire bonding of the communication connection terminal 110 and the 1C chip 98. The connection portion between the connection terminal 11 and the external terminal 112 is located inside the outer shape of the 1C chip 98. Then, a molding material such as a resin is used to seal the underside of the mounting pin 104 of the piezoelectric oscillator 106 and the cover surface of the piezoelectric vibrator 100 can be exposed. The vibrator 100, the 1C wafer 98, the lead frame 94, and the like are cut off, and only unnecessary portions of the lead frame 94 protruding from the molding portion are cut off, and the thin plates 1 1 4 are peeled off to form a resin seal. Packaged piezoelectric oscillator 106. In addition, it is used for the connection between the bonding pad 102 and the piezoelectric vibrator 100, -23- 200522504 (21) connection terminal 110 and the piezoelectric vibrator 100, the bonding pad 102 and the 1C chip 98, and the connection terminal 110 and the 1C chip 98 As the connecting material, the same connecting material as in the fifth embodiment may be used. Such a piezoelectric oscillator 106 can obtain the same effect as that of the piezoelectric oscillator of the fifth embodiment. In addition, the bonding pad 102 and a part of the connection terminal 110 are wafer bonding pads for fixing the lead frame 94 and the 1C wafer 98, and are arranged on the circuit surface side of the 1C. Compared with the conventional piezoelectric oscillator of the pad, it can be reduced in size and thickness. In addition, the wafer pad may be connected to the terminal 11 instead of the pad 102. In addition, a mounting portion 104 may be provided on the mounting terminal 104a by a pull-out preventing means 104b to form the mounting pin 104, thereby improving the connection strength between the mounting pin 104 and the molding material. In this embodiment, a cavity portion may be provided in the pad 10 as in the piezoelectric oscillator of the fifth embodiment. Further, "apart from the cavity portion", a concave-convex shape may be provided. The cavity portion may be provided on the connection terminal 110. Alternatively, the mounting pins 80 may be configured as J-pin or double-winged frames. Next, a seventh embodiment will be described. The piezoelectric oscillator according to the seventh embodiment also connects the 1C chip and the piezoelectric vibrator up and down via a stand. Fig. 14 is a plan view showing a leg stand of a seventh embodiment. 15 is a front sectional view showing a piezoelectric oscillator according to a seventh embodiment. Fig. 15 (a) is a cross-sectional view showing the formation of a piezoelectric oscillator, and Fig. 15 (b) is a cross-sectional view showing a piezoelectric oscillator broken into a piezoelectric vibrator 'stand and a 1C chip. -24- 200522504 (22) A pad 124 connecting the 1C chip 120 and the piezoelectric vibrator 122 is formed at the center portion inside the frame portion 128 of the lead frame 126. The pads 124 are respectively connected to the opposite sides of the frame portion 128. Further, a hole portion 13o of an outflow prevention means is formed in a central portion of the pad 124. When the IC chip 120 and the bonding pad 1 24 are connected, if an adhesive is used, the adhesive will flow out to the wire bonding pad formed on the IC chip 120, which may cause problems such as wire bonding being impossible. occur. If the cavity portion 130 is provided, the excess adhesive will escape to the cavity portion, which can prevent the adhesive from flowing out to the wire bonding pad. Therefore, wire bonding can be implemented. It is also possible to provide a concave-convex shape instead of the hole portion. Further, a cavity portion or an uneven shape may be provided on the connection terminal 136. Further, an extension portion 124a as an outflow prevention means is formed in the lead frame 126 connecting the pad 124 and the frame portion 128 along the longitudinal direction of the 1C wafer 120. This extension portion 124a is provided so as to be positioned above the 1C wafer 120. The extension portion 12a is provided to make it difficult for the adhesive to flow to the wire bonding pad. In addition, mounting pins 132 are formed at four corners of the frame portion 128. The mounting pin 132 is composed of a bonding portion 132b of a mounting terminal 132a and a pull-out prevention means, and is connected to a side of the frame portion 128 in a direction orthogonal to the longitudinal direction of the 1C chip 120. More specifically, the first inclined portion 132c constituting a part of the mounting pin 132 is formed downward from the frame portion 128 in a direction along the longitudinal direction of the 1C chip 120. Here, the first inclined portion 132c is extended with a mounting terminal 132a, and the mounting terminal 132a is positioned below the pad 124. Further, a second inclined portion 132d is extended to the mounting terminal 132a, and the second inclined portion 132d is formed to rise upward. In addition, 200522504 (23), a planar portion 132e is extended on the second inclined portion 132d, and the planar portion 132e is positioned lower than the pad 124 and upper than the mounting terminal 132a. Furthermore, the second inclined portion 132d and the planar portion 132e constitute the joint portion 13 2b. The coupling portion 132b, the first inclined portion 132c, and the second inclined portion 132d are means for preventing removal of the mounting terminal 132a. In addition, a plurality of adjustment terminals 1 3 4 are formed between the mounting pins 1 3 2 along the longitudinal direction of the 1C chip 120. The adjustment terminal 134 is formed along the length direction of the 1C wafer 120, and an extension portion 13 4b is extended from a portion formed along the length direction in a direction orthogonal to the length direction, and then extends to the frame portion 128 connection. Further, an inclined portion 134a is formed at a connection portion between the extension portion 13 4b and the frame portion 128, and the inclined portion 134a is lowered downward. A connection terminal 136 is formed between the mounting pins 132 in a direction orthogonal to the longitudinal direction of the 1C chip 120. This connection terminal 136 extends along the longitudinal direction of the 1C chip 120 and extends to the lower side of the external terminal 136 formed on the back surface of the piezoelectric vibrator 122. Further, two inclined portions 136b are formed in the middle of the connection terminal 136, and from this inclined portion 136b, a joint portion 136a is formed in a direction orthogonal to the longitudinal direction of the 1C wafer 120. One of the inclined portions 136b is provided between the frame portion 128 and the coupling portion 136a, and is formed to descend downward. Further, the inclined portion 136b provided on the front end side of the connection terminal 136 from the joint portion 136a is formed to rise upward. The frame portion 128 and the front end side of the connection terminal 136 are located on the same plane. Next, a method for forming a piezoelectric oscillator will be described. First, the surface of the 1C chip 120 on which the bonding pads are provided is connected to the lower side of the pad 124 formed on the pin 200522504 (24) frame 126 and the lower side of the connection terminal 136 via a connecting material. In addition, bonding portions 132b, 136a, and 1C's sheet 120, mounting terminals 132a and 1C chip 120, and adjustment terminals 134 and 1C chip 120 are wire-bonded to make conduction. In addition, the connection means is formed by connecting the connection terminal 136 and the wire connection of the conduction connection terminal 136 and the 1C chip 120. The connection portion between the connection terminal 136 and the external terminal 138 is located inside the outer shape of the 1C chip 120. Then, the surroundings of the 1C chip 120 and the lead frame 126 are sealed with a molding material such as resin so that the upper surface of the leg frame 126 and the lower surface of the mounting pin 132 can be exposed. Next, the piezoelectric vibrator 122 is connected to the upper side of the bonding pad 1 24 via a connection material and the upper side of the connection terminal 1 36 via the conductive connection material 16 to conduct the piezoelectric vibrator 122 and the connection terminal 136. Then, if only the unnecessary portion of the leg holder 126 protruding from the molding portion is cut, the periphery of the 1C wafer 120 is molded, and the piezoelectric vibrator 122 is exposed at the molded portion. The piezoelectric oscillator 140 is sealed with a resin on the outside. The connection material used for the connection between the pad 124 and the connection terminal 136 and the piezoelectric vibrator 122 and the connection between the pad 124 and the connection terminal 136 and the 1C chip 120 may be the same as the connection material used in the fifth embodiment. Such a piezoelectric oscillator can achieve the same effects as the piezoelectric oscillators of the fifth and sixth embodiments. In addition, the mounting pins 132 of this embodiment may be configured as J-pin or double-wing-shaped frames. Next, an eighth embodiment will be described. The piezoelectric oscillator according to the eighth embodiment also connects the 1C chip and the piezoelectric vibrator to each other via a pin holder. -27- 200522504 (25). Fig. 16 is a plan view showing a leg stand of an eighth embodiment. 17 is a front sectional view showing a piezoelectric oscillator according to an eighth embodiment. Fig. 17 (a) is a cross-sectional view showing the formation of a piezoelectric oscillator, and Fig. 17 (b) is a cross-sectional view showing the piezoelectric oscillator broken down into a piezoelectric vibrator, a stand, and a 1C chip. Fig. 18 is a side view showing a piezoelectric oscillator according to an eighth embodiment. A pad 154 that connects the 1C chip 150 and the piezoelectric vibrator 152 is formed in the center portion of the frame portion 148 of the leg holder 146. The pad 154 is connected to one side of the frame portion 148. An inclined portion 154a is formed between the pad 154 and the frame portion 148, and the inclined portion 154a is lowered downward. In addition, in the frame section. Wire bonding terminals 156 are formed at the four corners of 148. This wire bonding terminal 156 is connected to the side of the frame portion 1 48 along the length direction of the 1C chip 150. Wire the terminals here! On the outer side of 5 6, an inclined portion 156 a is formed along the longitudinal direction of the 1C wafer 150, and the inclined portion 1 5 6 a is lowered downward. A flat portion 156b is formed at the tip of the inclined portion i 5 6 a, and this flat portion 156b is located on the same plane as the pad 154. The flat portion 156b and the inclined portion 156a are formed with a pull-out portion 15 6c for a pull-out prevention means for improving the connection strength of the wire bonding terminal 156 and the molding material. In addition, for the wire bonding terminal ι56, a notch is formed toward the inside of the wire bonding terminal i 56 on the opposite side of the holding portion 15 "from the side of the wire bonding terminal i 5 6 and 5 'in the direction along the length direction of the 1C chip 15 0. A plurality of adjustment terminals 158 are formed between the wire bonding terminals 156. This adjustment terminal 1 58 is the same structure as the adjustment terminal 5 8 described in the fifth embodiment. -28- 200522504 (26) In addition, the same as the 1C chip 150 A connecting terminal 160 is formed in the frame portion 148 in a direction orthogonal to the longitudinal direction of the frame. This connecting terminal 160 extends along the longitudinal direction of the 1C chip 150 and extends to the external terminal 1 62 formed on the back surface of the piezoelectric vibrator 152. Lower side. Further, an inclined portion 160a is formed in the middle of the connection terminal 160, and the front end side of the connection terminal 160 can be lowered than the frame portion 148. That is, the front end side of the connection terminal 160 is located at The bonding pads 154 are in the same plane. In addition, a connection portion 160b is formed on the connection terminal 160. This connection portion 160b is positioned closer to the frame portion 148 side than the inclined portion 160a and is orthogonal to the length direction of the 1C chip 150 Postponed The adjustment terminal 1 58 is extended to the outer frame portion 164, and is connected to the outer frame portion 164. Further, from the position where the wire bonding terminal 156 and the frame portion 148 are connected, is extended to the outer frame portion 164, and is connected to the outer frame. The portion 164 is connected. The front end of this extension is a mounting terminal 168 forming the piezoelectric oscillator 166. Next, the method of forming the piezoelectric oscillator 166 will be described. First, the circuit surface formed on the 1C chip 150 will face the lower side. The 1C chip 150 is connected to the upper side of the bonding pad 154 formed on the pin holder 146. At this moment, the 1C chip 150 and the bonding pad 154 are connected via a connecting material. Then, starting from the 1C chip 150, the wire bonding terminals 1 are respectively bonded. 5, 6, the adjustment terminal 1 58 and the bonding portion 160b are connected to each other by wire bonding, and the external terminal 162 is connected via a conductive connection material on the lower side of the connection terminal 160, and the connection material is connected on the lower side of the bonding pad 154. The piezoelectric vibrator 152 is connected. The connection terminal 160 and the conductive connection terminal 160 are connected to the 1C chip 150 with a wire bond -29-200522504 (27) to form a connection means. The connection terminal 160 and the external terminal 162 are connected. The connection is located on the 1C crystal The inner side of the outer shape of 150. Furthermore, in the manufacturing process of connecting the IC chip 150 and the lead frame 146 by wire bonding, turn upside down in FIG. 6 and place the leg frame 146 on the IC chip 150 so that The 1C chip 150 is mounted with the bonding surfaces of the lead frames 1 4 and 6 facing upwards. Then, the upper surfaces of the 1C chip 150, the adjustment terminals 158, and the bonding terminals 156 can be exposed, using resin, etc. The molding material is used to seal the periphery of the piezoelectric vibrator 152, the 1C chip 150, and the lead frame 146. Next, in addition to the frame forming the mounting terminal 168, the leg holders 146 protruding from the sealed portion of the molding material are cut. Then, the bent portion 168a of the frame forming the mounting terminal 168 faces downward and is concavely bent into a J-pin shape. In addition, the mounting pin 169 may have a double-wing shape. In addition, adjust terminal 158 and mounting pin 169. Part of the wire bonding terminals 1 5 6 will be exposed on the molding material respectively. Using this exposed portion, check the characteristics of electronic components, piezoelectric oscillators, adjust the characteristics, and / or confirm the continuity between the piezoelectric vibrator and the connection terminals. Alternatively, after sealing with a molding material, except for extending the mounting pins 169 and the adjustment terminal 158 to the outer frame portion 164, the pin holder 146 (not shown) protruding from the sealed portion of the molding material is cut Icon). After cutting, use the mounting pins 169 protruding from the part sealed by the molding material and the extended adjustment terminal 158 to perform characteristic check, characteristic adjustment, and the like. Then, the mounting pins 1 69 are bent into a J-pin shape, and the adjustment terminal 158 can also cut off a portion protruding from the molding material. -30- 200522504 (28) Also, the adjustment terminal 158 can be cut without cutting off. It can be bent into a J-pin shape like the mounting pin, and the front end can be used as a mounting terminal (not shown). Thereby, the mounting terminals are increased, and the mounting strength of the piezoelectric oscillator 166 to the mounting substrate can be increased. Such a piezoelectric oscillator 166 can obtain the same effect as that of the piezoelectric oscillator of the fifth embodiment. Next, a ninth embodiment will be described. A piezoelectric oscillator according to a ninth embodiment is a pin holder connected to the upper and lower sides of a 1C chip, and a piezoelectric vibrator is connected to the pin holder. Fig. 19 is a plan view showing a leg stand of a ninth embodiment. In addition, FIG. 19 (a) shows the lower side of the piezoelectric oscillator connected to the 1C chip, and it is arranged on the lower side of the piezoelectric oscillator. FIG. 19 (b) shows the upper side of the 1C chip and connected the piezoelectric vibration. The top of the child is a tripod. Fig. 20 is a plan view showing the mounting of a 1C wafer on a pin holder according to a ninth embodiment. Fig. 21 is a front sectional view showing a piezoelectric oscillator according to a ninth embodiment. Fig. 21 (a) is a cross-sectional view showing the formation of a piezoelectric oscillator, and Fig. 21 (b) is a cross-sectional view of a piezoelectric vibrator decomposed into a piezoelectric vibrator, a leg holder, and a 1C chip. A pad 25 6 on which a 1C chip 254 is mounted is formed at a central portion in a frame portion 2 52 of the lower leg holder 250, and this pad 25 6 is connected to one side of the frame portion 252. In addition, four corners of the frame portion 252 are provided with mounting pins 25 8 composed of mounting terminals 2 5 8a, inclined portions 2 5 8b, and joint portions 25 8c, and frame portions along the longitudinal direction of the pad 256. 252 connections. That is, the joint portion 25 8c 200522504 (29) is extended from the frame portion 2 52 in a direction orthogonal to the length direction of the bonding pad 2 56, and an inclined portion 2 5 8b is formed downwardly outside the joint portion 25 8c. A mounting terminal 2 5 8 a is formed on the outside of the inclined portion 2 5 8 b. The mounting terminal 258a is formed parallel to the pad 256 at a certain distance. Further, the joint portion 25 8c is extended to the inside. In addition, one mounting pin 258 extends from the portion extended to the inner side of the bonding portion 25 8c to the bonding pad 25 6 and connects the mounting pin 258 and the bonding pad 256. Further, a plurality of adjustment terminals 260 are formed between the mounting pins 258 along the longitudinal direction of the pad 256. The adjustment terminal 2 60 may be the same as the adjustment terminal shown in the fifth embodiment. The outer shape of the frame portion 264 of the upper leg holder 262 is the same as that of the frame portion 252 of the lower leg holder 250. Further, a connection terminal 266 is formed in the frame portion 264 of the upper leg holder 2 62 along a direction orthogonal to the longitudinal direction of the pad 256 formed on the lower leg holder 250. This connection terminal 266 is extended to the center of the frame portion 264, and is extended to the upper side of the 1C chip 254. In addition, an inclined portion 266b is provided in the middle of the connection terminal 266 and rises upward. In addition, in the connection terminal 266, the bonding portion 266a is extended in a direction orthogonal to the longitudinal direction of the 1C chip 2 54. The connection terminal 266 forms a connection means between the 1C chip 254 and the piezoelectric vibrator 268. Next, a method for forming a piezoelectric oscillator will be described. First, a 1C chip 254 is mounted on a bonding pad 256 of the lower leg mount 250 using a connection material. Then, the upper leg mount 262 is bonded to the lower leg mount 250 and the 1C chip 254. At this moment, the connection terminal 266 and the 1C chip 254 are connected inside the outer shape of the 1C chip 254. Then, the frame portion 252 of the lower leg holder 250 and the frame portion 264 of the upper leg holder 262 are joined by spot welding or the like. Also, -32- 200522504 (30) An adhesive may be applied to a part of the lower portion of the connection terminal 266 to connect the upper surface of the IC chip 254 and the lower surface of the connection terminal 266. Then, the mounting pins 2 5 8 and the 1C chip 25 4, the adjustment terminals 260 and the 1C chip 254, and the connection terminals 266 and the 1C chip 2 54 are wired and electrically connected. Furthermore, an external terminal 270 formed under the piezoelectric vibrator 268 is connected to the upper surface of the connection terminal 266 using solder or the like. At this moment, the external terminal 270 and the connection terminal 266 of the piezoelectric vibrator 268 are connected inside the outer shape of the 1C chip 254. Therefore, the connection portion connecting the piezoelectric vibrator 2 6 8 and the IC chip 2 5 4 is located inside the outer shape of the IC chip 2 5 4. Finally, the surface of the cover 272 of the piezoelectric vibrator 268 and the mounting surface of the mounting terminal 258a can be exposed. 'The piezoelectric vibrator 268, the 1C chip 254, the upper leg holder 262 and the lower leg are sealed with a molding material. A resin-sealed piezoelectric oscillator 274 is formed around the frame 250. Such a piezoelectric oscillator 274 can obtain the same effect as that of the piezoelectric oscillator of the fifth embodiment. In addition, the connection terminal 266 can be carried on the upper surface of the 1C chip 254 by this manufacturing method, and a connection portion can be provided inside the outer shape of the 1C chip 254. Further, in this embodiment, a cavity portion may be provided in the pad 25 6 in the same manner as the piezoelectric oscillator of the fifth embodiment. In addition to the cavity portion, an uneven shape may be provided. The cavity portion may be provided on the connection terminal 266. The adjustment terminal 260 may be formed on the upper leg stand 262 or on both leg stands. In addition, the connection terminals 266 may be arranged in the longitudinal direction with respect to the pad 256, and the adjustment terminal 260 may be arranged in a direction orthogonal to the length direction, or both of the terminals 260 may be arranged in the length direction. 200522504 (31) Next, the tenth embodiment will be described. The i0th embodiment is a modification of the connection terminal described in the fifth to eighth embodiments. In addition, this modification is described only for the 1C chip and the connection terminal. The first modification will be described first. Fig. 22 is a perspective view showing a connection terminal and a 1C chip according to a first modification. The connection terminal 174 is formed in an L-shape, and a stepped portion 182 is provided on a surface opposite to the 1C wafer 176. The step portion 182 can be easily formed by press working or etching. The connection terminal 174 is connected to the 1C chip 176 via an insulating connection material. In addition, the electrical connection path between the 1C chip 176 and the external terminal of the piezoelectric vibrator is connected from the wire bonding pad on the 1C chip 176 to the bonding portion 178 by wire bonding, and then on the step portion 182. It connects to an external terminal via a conductive connection material. Next, only the points different from the first modification will be described regarding the second modification. Fig. 23 is a perspective view showing a connection terminal and a 1C chip according to a second modification. A point different from the first modification is that the joint portion 192 is provided near the center of the IC chip 190. Next, the third modification will be described only with respect to the differences from the second modification. Fig. 24 is a perspective view showing a connection terminal and an IC chip according to a third modification. A point different from the second modification is that the connecting terminal 200 is provided with a slanted portion 206, and the flat portion 208 is connected to the external terminal via a connecting material on the upper side of the flat portion 208. The second modification is related to the fourth modification. Only points different from the third modification will be described. Fig. 25 is a perspective view showing a connection terminal and an IC chip according to a fourth modification. A point different from the third modification is that in the connection terminal 21, the joint portion 200522504 (32) 2 1 8 and the inclined portion 2 1 4 are provided at positions not overlapping with the vertical direction of the 1C chip 2 1 2. The lower surface of the planar portion 216 may be connected to the upper surface of the 1C chip 212 by using an insulating connection material, and the upper surface of the 1C wafer 212 may be directly carried on the planar portion 216 without a connecting material. In addition, in order to reduce the damage to the circuit surface formed on the 1C chip 212 by the insulating connecting material and the flat portion 216, a protective film such as polyimide may be mounted on the surface other than the wire bonding pads of the 1C chip 212. Next, the fifth modification will be described only with respect to the differences from the fourth modification. Fig. 26 is a perspective view showing a connection terminal and a 1C chip according to a fifth modification. A point different from the fourth modification is that two connection portions 224 are provided with two inclined portions 228, 232 and two flat portions 230, 234. This is a method in which the vertical portion of the wire bonding is such that a higher portion does not contact the lower surface of the piezoelectric vibrator. By connecting the terminal 224, the vertical distance between the 1C chip 226 and the piezoelectric vibrator is secured, In order to reduce the temperature difference between the 1C chip 226 and the piezoelectric vibrator, a part of the second flat portion 234 of the connection terminal 224 is connected to the 1C chip 226 through an insulating connection material. This is an effective example when a bonding pad is formed on the upper surface of the 1C wafer 226 and overlaps the planar portion 230 in a vertical direction. In addition, although the first and second modifications are provided with a stepped portion in the connection terminal, and the third to fifth modifications are provided with the inclined portion in the connection terminal, the first and second modifications may be provided with the inclined portion in the connection terminal. In the third to fifth modification examples, a step portion may be provided in the connection terminal. The piezoelectric oscillators according to the first to tenth embodiments can be mounted on electronic equipment such as a mobile phone or a personal computer that requires a reference signal source for control. • 35-200522504 (33) This makes it possible to realize small and reliable electronic devices. [Brief Description of the Drawings] FIG. 1 is an exploded perspective view showing a piezoelectric oscillator according to a first embodiment. FIG. 2 is a side sectional view showing a piezoelectric oscillator according to a first embodiment. Floor plan of the tripod. FIG. 4 is a front sectional view showing a piezoelectric vibrator. Fig. 5 is a side sectional view showing a piezoelectric oscillator according to a second embodiment. Fig. 6 is a side sectional view for explaining the mounting of the piezoelectric oscillator. Fig. 7 is a side sectional view showing a piezoelectric oscillator according to a third embodiment. Fig. 8 is a partial plan view showing an enlarged lead frame. Fig. 9 is a side sectional view showing a piezoelectric oscillator according to a fourth embodiment. Fig. 10 is a plan view showing a leg holder of the fifth embodiment. Fig. 11 is a front sectional view showing a piezoelectric oscillator according to a fifth embodiment. Fig. 12 is a plan view showing a leg stand of a sixth embodiment. Fig. 13 is a front sectional view showing a piezoelectric oscillator according to a sixth embodiment. Fig. 14 is a plan view showing a leg stand of a seventh embodiment. -36- 200522504 (34) Fig. 15 is a front sectional view showing a piezoelectric oscillator according to a seventh embodiment. Fig. 16 is a plan view showing a leg stand of an eighth embodiment. Fig. 17 is a front sectional view showing a piezoelectric oscillator according to an eighth embodiment. Fig. 18 is a side view showing a piezoelectric oscillator according to an eighth embodiment. Fig. 19 is a plan view showing a leg stand of a ninth embodiment. Fig. 20 is a plan view showing the mounting of a 1C chip on a pin holder according to a ninth embodiment. Fig. 21 is a front sectional view showing a piezoelectric oscillator according to a ninth embodiment. Fig. 22 is a perspective view showing a first modification of the connection terminal in the tenth embodiment. Fig. 23 is a perspective view showing a second modification of the connection terminal in the tenth embodiment. Fig. 24 is a perspective view showing a third modification of the connection terminal in the tenth embodiment. Fig. 25 is a perspective view showing a fourth modification of the connection terminal in the tenth embodiment. Fig. 26 is a perspective view showing a fifth modification of the connection terminal in the tenth embodiment. [Description of main component symbols] 10. . . . . . . . . Piezo oscillator -37- 200522504 (35) 12 ... • ... pin 14 for installation ... •… Semiconductor Integrated Circuit (1C) Wafer 16… ·,. • ... Conductive connection material 18… ·. . … Piezoelectric vibrator 22… ·,. . . . . Wafer pads 2 4…. . … Install terminal 28… ·.  , •… adjust terminal 30… ·.  . •… connect terminal 40… ·.  . • ... resin hermetically sealed package 7 4… ·,, •… 1C crystal 丨 sheet 7 6… ·.  . • ... piezoelectric vibrator 78… ·.  . ··· Soldering pad 80… ·.  . • ... pin 82 for installation ...  . . ... adjust the terminal 84 ... • ... connect terminal 88… · _. . . . . Piezoelectric Oscillator

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Claims (1)

200522504 (1) X. Patent application scope 1. A piezoelectric oscillator characterized by having a plurality of mounting pins, which are formed by a pin holder and have mounting terminals connected to a mounting substrate; electronic parts , Which is electrically connected to the plurality of mounting pins; a piezoelectric vibrator, which has external terminals, is electrically connected to the electronic component; and a connecting means, which is electrically connected to the piezoelectric vibrator. The external terminal and a connection terminal provided on the electronic component; the exposed terminal of at least the plurality of mounting pins is exposed; and a molding material is used to seal the lead frame and the surroundings of the electronic component. The connection portion of the external terminal of the piezoelectric vibrator is formed inside the outer shape of the electronic component. 2. The piezoelectric oscillator according to the first item of the patent application, wherein the connection means is a metal ball, and the connection terminal provided on the electronic component and the external terminal of the piezoelectric vibrator are connected via the metal ball. 3. The piezoelectric oscillator according to item 丨 of the application, wherein the above-mentioned connection means is a connection terminal formed on the pin holder and a wire bonding, and the wire connection is used to connect the connection terminal of the electronic component and the pin holder. The connection terminal connects the connection terminal of the leg holder and the external terminal of the piezoelectric vibrator. 4. The piezoelectric oscillator according to any one of claims 1 to 3, wherein the electronic component and the piezoelectric vibrator are interposed -39 · 200522504 (2) a heat conducting member. 5. The piezoelectric oscillator according to any one of claims 1 to 3, wherein the electronic component is a semiconductor integrated circuit, and further includes: formed by a lead frame, and placed on the semiconductor integrated circuit. Wafer pads on the circuit surface side of the circuit. 6. The piezoelectric oscillator according to item 5 of the patent application, wherein the semiconductor integrated circuit and the wafer bonding pad are connected by an insulating adhesive, and the wafer bonding pad is formed to prevent the insulating adhesive from flowing out. To the outflow prevention means for bonding wires and bonding pads formed in the semiconductor integrated circuit described above. [7] Such as the piezoelectric oscillator in the scope of patent application No. 3, wherein the electronic component is a semiconductor integrated circuit, and further includes: The formed semiconductor pad is placed on the circuit surface side of the semiconductor integrated circuit, and the semiconductor integrated circuit and the wafer bonding pad are connected by an insulating adhesive, and the wafer bonding pad and / or the bonding pad are connected to each other. The connection terminal of the tripod is formed as an outflow prevention means for preventing the insulating adhesive from flowing out to the wire bonding pads formed on the semiconductor integrated circuit. 8. The piezoelectric vibrator according to any one of claims 1 to 3, wherein a pull-out prevention means is formed on the mounting terminal. 9. The piezoelectric vibrator according to any one of claims 1 to 3, wherein the periphery of the piezoelectric vibrator is sealed with a molding material. 1 〇 The piezoelectric -40-200522504 described in any one of claims 1 to 3 in the scope of the patent application (3) An oscillator in which an adjustment terminal is provided on the above-mentioned stand, and the adjustment terminal and the electronic component are electrically connected. 11. An electronic device characterized by being equipped with the piezoelectric oscillator described in any one of claims 1 to 3 of the scope of patent application. 12. A method for manufacturing a piezoelectric oscillator, characterized in that: a lead frame is connected to the circuit surface side of a semiconductor integrated circuit, and the semiconductor integrated circuit and the lead frame are connected and connected by wire bonding, The tripod is connected to an external terminal that conducts the piezoelectric vibrator. 13. A method of manufacturing a piezoelectric oscillator, characterized in that: an electronic component is connected to a lower leg holder having a mounting pin, and an upper side provided with a connection means for a piezoelectric vibrator is connected to the electronic component; The lead frame is connected between the lower leg frame and the electronic component, and the upper leg frame and the electronic component are connected by wire bonding, and the electronic component and the piezoelectric component are connected and connected through the connecting means. Vibrator.