TW518925B - Print circuit board and method for manufacturing the same - Google Patents
Print circuit board and method for manufacturing the same Download PDFInfo
- Publication number
- TW518925B TW518925B TW091106863A TW91106863A TW518925B TW 518925 B TW518925 B TW 518925B TW 091106863 A TW091106863 A TW 091106863A TW 91106863 A TW91106863 A TW 91106863A TW 518925 B TW518925 B TW 518925B
- Authority
- TW
- Taiwan
- Prior art keywords
- copper
- circuit board
- printed circuit
- hole
- oxygen
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 88
- 229910052802 copper Inorganic materials 0.000 claims abstract description 85
- 239000010949 copper Substances 0.000 claims abstract description 85
- 239000000463 material Substances 0.000 claims abstract description 43
- 239000000758 substrate Substances 0.000 claims abstract description 17
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000007747 plating Methods 0.000 claims description 43
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 6
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- 239000011574 phosphorus Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 abstract description 7
- 239000001301 oxygen Substances 0.000 abstract description 7
- 229910052760 oxygen Inorganic materials 0.000 abstract description 7
- 238000001816 cooling Methods 0.000 abstract description 6
- 239000007943 implant Substances 0.000 abstract 3
- 229920001721 polyimide Polymers 0.000 description 15
- 238000004080 punching Methods 0.000 description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000000956 alloy Substances 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 229910001316 Ag alloy Inorganic materials 0.000 description 7
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- UZLVCMCALLIHEI-UHFFFAOYSA-N [P].[Cu]=O Chemical compound [P].[Cu]=O UZLVCMCALLIHEI-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229910000597 tin-copper alloy Inorganic materials 0.000 description 3
- 239000005751 Copper oxide Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- SYUHGPGVQRZVTB-UHFFFAOYSA-N radon atom Chemical compound [Rn] SYUHGPGVQRZVTB-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 241001124569 Lycaenidae Species 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 235000014987 copper Nutrition 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 150000002466 imines Chemical group 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 229910052704 radon Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001074861 | 2001-03-15 | ||
| JP2001108381A JP3560334B2 (ja) | 2001-03-15 | 2001-04-06 | プリント回路板及びその製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW518925B true TW518925B (en) | 2003-01-21 |
Family
ID=26611378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091106863A TW518925B (en) | 2001-03-15 | 2002-04-04 | Print circuit board and method for manufacturing the same |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP3560334B2 (ja) |
| TW (1) | TW518925B (ja) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010021400A (ja) * | 2008-07-11 | 2010-01-28 | Mitsui Mining & Smelting Co Ltd | 放熱特性に優れたプリント配線基板 |
| WO2014199456A1 (ja) * | 2013-06-12 | 2014-12-18 | 株式会社メイコー | 放熱基板の製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH053228A (ja) * | 1991-06-25 | 1993-01-08 | Mitsui Mining & Smelting Co Ltd | Ｔａｂおよびその製造方法 |
| US5230632A (en) * | 1991-12-19 | 1993-07-27 | International Business Machines Corporation | Dual element electrical contact and connector assembly utilizing same |
| US5259110A (en) * | 1992-04-03 | 1993-11-09 | International Business Machines Corporation | Method for forming a multilayer microelectronic wiring module |
| JP3250988B2 (ja) * | 1998-10-23 | 2002-01-28 | 株式会社鈴木 | フィルド・ビアを有する樹脂シートの製造方法 |
| JP2000332369A (ja) * | 1999-05-25 | 2000-11-30 | Mitsui Mining & Smelting Co Ltd | プリント回路板及びその製造方法 |
| JP4467659B2 (ja) * | 1999-03-26 | 2010-05-26 | 株式会社東芝 | セラミックス回路基板 |
-
2001
- 2001-04-06 JP JP2001108381A patent/JP3560334B2/ja not_active Expired - Fee Related
-
2002
- 2002-04-04 TW TW091106863A patent/TW518925B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP3560334B2 (ja) | 2004-09-02 |
| JP2002344101A (ja) | 2002-11-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |